JP6535197B2 - Exposure apparatus and exposure method - Google Patents

Description

  The present invention relates to an exposure apparatus and an exposure method, and more specifically, a mask pattern is formed on a work by applying exposure light to a work coated with a photosensitive agent through a mask on which a mask pattern is formed. Apparatus and method for transferring an image.

  Conventionally, a mirror element having a reflective surface that reflects illumination light, and a plurality of drive units that apply a force to the back surface of the mirror element to deform the reflective surface, and the reflective surface can be deformed into various shapes An exposure apparatus having an optical system is disclosed (see, for example, Patent Documents 1 and 2). As shown in FIG. 8, in the exposure apparatus of Patent Document 1, a mirror element 101 having a reflection surface 101 a that reflects the irradiation light IL, a plurality of drive units 102 disposed on the back surface of the mirror element 101, and a mirror element 101. And a holding block 103 for holding the holding portion 101b of the peripheral portion, and the reflecting surface 101a of the mirror element 101 is deformed into various shapes by the plurality of driving units 102, and correction is difficult with a normal imaging characteristic correction mechanism Non-rotationally symmetrical aberration components such as astigmatism on the optical axis.

  In the exposure apparatus of Patent Document 2, the back surface of the flat mirror is supported by the holding frame via the plurality of support members, the ball joint, and the pad, and the support member is driven by the drive device to flatten the workpiece in response to the distortion. By correcting the curvature of the mirror, the pattern of the mask is exposed according to the shape of the region to be exposed of the workpiece.

JP, 2013-161992, A JP 2011-123461 A

  By the way, in the exposure apparatus described in Patent Document 2, when the curvature of the flat mirror is corrected corresponding to the distortion of the work, the illuminance distribution of the exposure light is deteriorated, and therefore it is required to improve the deterioration of the illuminance distribution. .

  The present invention has been made in view of the above-mentioned problems, and an object thereof is to improve the illuminance distribution of the exposure area of the exposure light to improve the exposure accuracy even when the curvature of the reflecting mirror is corrected. An exposure apparatus and an exposure method capable of

The above object of the present invention is achieved by the following constitution.
(1) a work support unit for supporting a work;
A mask support that supports the mask;
An illumination optical system having a light source and a reflecting mirror that reflects exposure light from the light source;
A mirror bending mechanism capable of correcting the curvature of the reflecting mirror;
An exposure apparatus that irradiates exposure light from the light source to the work through the mask to transfer the pattern of the mask onto the work,
It comprises an illuminance meter for measuring the illuminance of exposure light irradiated to the workpiece;
Before exposing the workpiece, the illuminance distribution of the exposure area of the exposure light irradiated to the workpiece through the reflecting mirror is measured using the luminometer.
The illumination optical system comprises a plurality of the reflecting mirrors,
The mirror bending mechanism includes a plurality of mirror bending mechanisms capable of correcting the curvatures of the plurality of reflecting mirrors.
The curvature is corrected by driving the mirror bending mechanism with respect to any one of the plurality of reflecting mirrors,
The other one of the plurality of reflecting mirrors drives the mirror bending mechanism according to the illuminance distribution of the exposure area measured by the illuminance meter in a state where the curvature of any one of the reflecting mirrors is corrected. And correcting the curvature thereof.
(2) An exposure method for transferring the pattern of the mask onto the work by irradiating the work with the exposure light from the light source through the mask using the exposure apparatus according to (1) ,
Correcting the curvature by driving the mirror bending mechanism with respect to any one of the plurality of reflecting mirrors;
Measuring the illuminance distribution of the exposure area of the exposure light irradiated to the work via the any one reflecting mirror whose curvature is corrected by the mirror bending mechanism, using the luminometer;
The other one of the plurality of reflecting mirrors drives the mirror bending mechanism according to the illuminance distribution of the exposure area measured by the illuminance meter in a state where the curvature of any one of the reflecting mirrors is corrected. Correcting the curvature by
An exposure method comprising:

  According to the exposure apparatus and the exposure method of the present invention, an illuminance meter for measuring the illuminance of the exposure light irradiated to the workpiece is provided, and before exposing the workpiece, through the reflecting mirror whose curvature is corrected by the mirror bending mechanism. The illuminance distribution of the exposure area of the exposure light irradiated to the workpiece is measured using a luminometer. Thereby, it is possible to acquire the illuminance distribution of the exposure area, and when it does not reach the target illuminance distribution, drive the mirror bending mechanism of the curvature-corrected reflecting mirror or another reflecting mirror again to obtain the target. By performing fine adjustment so as to reach the illuminance distribution, it is possible to improve the illuminance distribution of the exposure area of the exposure light and to improve the exposure accuracy.

1 is a front view of an exposure apparatus according to the present invention. It is a figure which shows the illumination optical system which concerns on 1st Embodiment of this invention. (A) is a top view which shows the reflective mirror support structure of an illumination optical system, (b) is sectional drawing along the III-III line of (a), (c) is III of (a) It is sectional drawing along an '-III' line. (A)-(d) is the schematic explaining the process of measuring illumination distribution of an exposure area. It is the V section enlarged view of FIG. It is a figure which shows the flowchart of the exposure method of this embodiment. It is a figure which shows the illumination optical system which concerns on 2nd Embodiment of this invention. It is a figure which shows the conventional reflecting mirror support structure.

First Embodiment
Hereinafter, an embodiment of an exposure apparatus according to the present invention will be described in detail based on the drawings. FIG. 1 is a view showing an exposure apparatus of the present invention.
As shown in FIG. 1, the proximity exposure apparatus PE uses the mask M smaller than the workpiece W as a material to be exposed, holds the mask M by the mask stage 1, and works the workpiece W by the workpiece stage (work support portion) 2. The pattern of the mask M is held by irradiating the light for pattern exposure from the illumination optical system 3 onto the mask M while holding and bringing the mask M and the work W close and facing each other with a predetermined exposure gap. Exposure and transfer onto the work W. Further, the work stage 2 is moved stepwise with respect to the mask M in two axial directions of the X-axis direction and the Y-axis direction, and the exposure transfer is performed for each step.

  In order to move the work stage 2 stepwise in the X-axis direction, an X-axis stage feed mechanism 5 is provided on the apparatus base 4 to move the X-axis feed stand 5a stepwise in the X-axis direction. A Y-axis stage feed mechanism 6 is provided on the X-axis feed stand 5a of the X-axis stage feed mechanism 5 to step-move the Y-axis feed stand 6a in the Y-axis direction. It is done. A work stage 2 is installed on the Y-axis feed stand 6 a of the Y-axis stage feed mechanism 6. The workpiece W is held on the upper surface of the workpiece stage 2 in a vacuum-sucked state by a workpiece chuck or the like. In addition, a substrate-side displacement sensor 15 for measuring the height of the lower surface of the mask M is disposed on the side of the work stage 2. Therefore, the substrate side displacement sensor 15 is movable in the X and Y axis directions together with the work stage 2.

  A plurality of (four in the illustrated embodiment) X-axis linear guide guide rails 51 are disposed on the apparatus base 4 in the X-axis direction, and each guide rail 51 is provided with the lower surface of the X-axis feed stand 5a. The slider 52 fixed to is straddled. As a result, the X-axis feed stand 5 a is driven by the first linear motor 20 of the X-axis stage feed mechanism 5, and can reciprocate in the X-axis direction along the guide rail 51. Further, on the X-axis feed stand 5a, guide rails 53 of a plurality of Y-axis linear guides are arranged in the Y-axis direction, and on each guide rail 53, sliders 54 fixed to the lower surface of the Y-axis feed stand 6a. Is straddled. Thus, the Y-axis feed stand 6 a is driven by the second linear motor 21 of the Y-axis stage feed mechanism 6, and can reciprocate in the Y-axis direction along the guide rails 53.

  In order to move the work stage 2 in the vertical direction between the Y-axis stage feed mechanism 6 and the work stage 2, the positioning resolution is relatively high, but the moving stroke and moving speed and movement coarse movement device 7 are relatively coarse. Compared with device 7, positioning is possible with high resolution, and vertical movement and small movement device 8 is installed to finely adjust the gap between the facing surfaces of mask M and workpiece W to a predetermined amount by finely moving work stage 2 up and down .

  The up and down coarse movement device 7 moves the work stage 2 up and down with respect to the fine movement stage 6 b by a suitable drive mechanism provided on the fine movement stage 6 b described later. The coarse stage moving shaft 14 fixed to four places on the bottom surface of the work stage 2 engages with the linear motion bearing 14a fixed to the fine movement stage 6b, and is guided in the vertical direction with respect to the fine movement stage 6b. In addition, as for the up-and-down coarse motion apparatus 7, even if resolution is low, it is desirable that a repeat positioning accuracy is high.

  The vertical fine adjustment device 8 includes a fixed base 9 fixed to the Y-axis feed base 6a, and a guide rail 10 of a linear guide attached to the fixed base 9 with its inner end inclined obliquely downward. A nut (not shown) of a ball screw is connected to a slide body 12 which reciprocates along the guide rail 10 via a slider 11 straddled by the guide rail 10 and an upper end surface of the slide body 12 Is slidably in contact with the flange 12a fixed to the fine adjustment stage 6b in the horizontal direction.

Then, when the screw shaft of the ball screw is rotationally driven by the motor 17 attached to the fixed base 9, the nut, the slider 11 and the slide body 12 integrally move along the guide rail 10 in an oblique direction, , The flange 12a moves up and down slightly.
The vertical movement adjustment device 8 may drive the slide body 12 by a linear motor instead of driving the slide body 12 by the motor 17 and the ball screw.

This vertical movement fine adjustment device 8 is installed one at the one end side (left end side in FIG. 1) of the Z-axis feed stand 6a in the Y-axis direction and two at the other end side. It has become so. Thereby, the vertical movement fine adjustment device 8 finely adjusts the heights of the three flanges 12 a independently based on the measurement result of the gap amount between the mask M and the work W at a plurality of places by the gap sensor 27 to work stage 2 Fine-tune the height and inclination of the
In addition, when the height of the work stage 2 can be sufficiently adjusted by the up and down fine adjustment device 8, the up and down movement device 7 may be omitted.

  Also, on the Y-axis feed stand 6a, a bar mirror 19 facing the Y-axis laser interferometer 18 for detecting the position of the work stage 2 in the Y direction, and an X-axis laser for detecting the position of the work stage 2 in the X-axis direction A bar mirror (both not shown) facing the interferometer is installed. The bar mirror 19 facing the Y-axis laser interferometer 18 is disposed along the X-axis direction on one side of the Y-axis feed stand 6a, and the bar mirror facing the X-axis laser interferometer is the Y-axis feed stand 6a. It is arranged along the Y-axis direction at one end side.

  The Y-axis laser interferometer 18 and the X-axis laser interferometer are supported by the device base 4 so as to always face the corresponding bar mirrors. Two Y-axis laser interferometers 18 are provided separately in the X-axis direction. Two Y-axis laser interferometers 18 detect the Y-axis position and yawing error of the Y-axis carriage 6 a and hence the work stage 2 via the bar mirror 19. Further, the X axis laser interferometer detects the position of the X axis carriage 5a and hence the work stage 2 in the X axis direction via the facing bar mirror.

  The mask stage 1 is inserted into the mask base frame 24 formed of a substantially rectangular frame body and a central opening of the mask base frame 24 through a gap, in the X, Y, θ directions (in the X, Y plane). The mask base frame 24 is held at a fixed position above the work stage 2 by columns 4 a protruding from the apparatus base 4.

  A frame-like mask holder (mask support portion) 26 is provided on the lower surface of the central opening of the mask frame 25. That is, the lower surface of the mask frame 25 is provided with a plurality of mask holder suction grooves connected to a vacuum suction device (not shown), and the mask holder 26 is suctioned to the mask frame 25 through the plurality of mask holder suction grooves. It is held.

  On the lower surface of the mask holder 26, a plurality of mask suction grooves (not shown) for suctioning the peripheral portion where the mask pattern of the mask M is not drawn are opened. The mask M is formed via the mask suction grooves. It is detachably held on the lower surface of the mask holder 26 by a vacuum suction device (not shown).

  As shown in FIG. 2, the illumination optical system 3 of the exposure apparatus PE of this embodiment is a light source for irradiating ultraviolet light, for example, a high pressure mercury lamp 61 and a reflector for condensing light irradiated from the high pressure mercury lamp 61. 62, a multi-lamp unit 60 provided with each of them, a plane mirror 63 for changing the direction of the light path EL, an exposure control shutter unit 64 for opening / closing control of the irradiation light path, and a downstream side of the exposure control shutter unit 64 An optical integrator 65 for emitting the light condensed by the reflector 62 in such a way that the illumination distribution becomes as uniform as possible, and a flat mirror 66 for changing the direction of the optical path EL emitted from the optical integrator 65; A collimation mirror 67 for irradiating the light from the high pressure mercury lamp 61 as parallel light Comprises a plane mirror 68 for irradiating the the parallel light to the mask M, the. A DUV cut filter, a polarization filter, and a band pass filter may be disposed between the optical integrator 65 and the exposure surface. Also, the light source may be a single high pressure mercury lamp, or may be constituted by an LED.

  When the exposure control shutter unit 64 is controlled to open at the time of exposure, light emitted from the multi lamp unit 60 passes through the plane mirror 63, the optical integrator 65, the plane mirror 66, the collimation mirror 67, and the plane mirror 68. The mask M held by the mask holder 26 and the surface of the workpiece W are irradiated as light for pattern exposure, and the exposure pattern of the mask M is exposed and transferred onto the workpiece W.

  Here, as shown in FIG. 3, the flat mirror 68 is made of a glass material formed in a rectangular shape in a front view. The plane mirror 68 is supported by the mirror deformation unit holding frame 71 by a plurality of mirror deformation units (mirror bending mechanisms) 70 provided on the back surface side of the plane mirror 68.

  Each mirror deformation unit 70 includes a pad 72 fixed to the back surface of the flat mirror 68 with an adhesive, a support member 73 fixed at one end to the pad 72, and an actuator 74 which is a drive device for driving the support member 73; Equipped with

  The support member 73 is provided with a ball joint 76 as a bending mechanism that allows bending of ± 0.5 deg or more at a position closer to the pad 72 with respect to the holding frame 71, and the opposite side to the holding frame 71. An actuator 74 is attached to the other end.

  Furthermore, a plurality of contact sensors 81 are attached to the back surface of each position of the flat mirror 68 that reflects the exposure light to the position of the alignment mark (not shown) on the mask side.

  Thereby, the flat mirror 68 drives the actuator 74 of each mirror deformation unit 70 while sensing the displacement amount of the flat mirror 68 by the contact type sensor 81 to change the length of each support member 73, thereby achieving a flat surface. The curvature of the mirror 68 can be locally corrected, and the declination angle of the plane mirror 68 can be corrected.

  At that time, since each mirror deformation unit 70 is provided with a ball joint 76, the portion on the support portion side can be made three-dimensionally rotatable, and each pad 72 is formed on the surface of the plane mirror 68. It can be sloped along. For this reason, while preventing adhesion peeling of each pad 72 and the plane mirror 68, the stress of the plane mirror 68 between each pad 72 from which a movement amount differs is suppressed, and it is a case where it consists of a glass material with small average fracture stress value. Even if the curvature of the plane mirror 68 is locally corrected, the plane mirror 68 can be bent on the order of 10 mm without damaging the plane mirror 68, and the curvature can be largely changed.

  Returning to FIG. 2, in the present embodiment, when the curvature of the flat mirror 68 is corrected, the curvature correction of the flat mirror 68 is appropriately performed on the target displacement amount according to the distortion amount of the workpiece W and the target illuminance distribution. A curvature correction amount detection system 90 is provided to determine whether it has been received. The curvature correction amount detection system 90 irradiates the laser light L as light having directivity from the flat surface 68 (in the present embodiment, in the vicinity of the mask) toward the flat mirror 68 in the light path EL of the light flux of the exposure light. (In the present embodiment, a plurality of (four in the present embodiment) laser pointers 91 as laser light sources, a reflecting plate 92 which is disposed in the vicinity of the optical integrator 65 so as to be retractable from the light path EL of the light beam of exposure light Between the camera 93 and the actuator 74 of the mirror deformation unit 70 of the plane mirror 68, and the camera 93 as an imaging means for imaging the laser light L captured on the reflection plate 92 via the The amount of displacement of the laser light L imaged when the curvature is corrected is detected, and the amount of displacement corresponds to the target amount of displacement. And a control unit 94 for controlling the actuator 74 of the bets 70.

  The laser pointer 91 is attached to the upper portion of a CCD camera (not shown) for detecting alignment, for example, and moves in synchronization with the movement of the CCD camera to a position where the alignment mark on the mask can be visually recognized.

  The reflecting plate 92 is disposed in the vicinity of the integrator which is the most condensed light by being reflected by the collimation mirror 67. Therefore, the four laser pointers reflected by the plane mirror 68, the collimation mirror 67, and the plane mirror 66 The laser beam L from the light source 91 can be captured by the reflector 92 having a relatively small area. In addition, when irradiating the mask M with the light flux of the exposure light from the light source during normal exposure, the reflecting plate 92 is disposed so as to be retractable from the light path EL of the light flux by a drive mechanism (not shown). Furthermore, the visibility of the laser beam L in the camera 93 can be improved by using the reflective plate 92 as a reflective surface with low reflectance.

  The camera 93 is disposed at a position away from the light path EL of the light flux from the light source so as not to affect the light flux of the exposure light.

  Further, the control unit 94 detects the position of the laser light L captured by the camera 93 as a displacement before curvature correction and after curvature correction, and confirms whether the displacement corresponds to the target displacement. A control signal is given to the actuator 74 of the mirror deformation unit 70 of the flat mirror 68.

  As shown in FIG. 1, an illuminance meter 40 for measuring the illuminance of the exposure light irradiated to the work W is further attached to the side of the work stage 2, and the X axis stage feed mechanism 5 and the Y axis stage The feed mechanism 6 horizontally moves with the movement of the work stage 2.

  Specifically, as shown in FIGS. 4A to 4D, the illuminance is moved so that the illuminance meter 40 moves to each vertex of the quadrangle obtained by dividing the exposure area A of the exposure light irradiated to the workpiece W into 16 parts. The total 40 is moved together with the work stage 2 and the illuminance at each vertex is measured by the illuminance meter 40 to acquire the illuminance distribution over the entire exposure area.

As shown in FIG. 5, a drive mechanism 42 for driving a blind (shutter) 41 capable of advancing and retracting above the illuminance meter 40 is provided on the side of the illuminance meter 40. Thereby, except at the time of illuminance measurement, deterioration of the illuminance meter 40 due to the exposure light can be suppressed by shielding the illuminance meter 40 from the exposure light by the blind 41.
Further, the illuminance meter 40 performs the zero point adjustment by blocking the light to the illuminance meter 40 by the blind 41 before the start of the illuminance measurement.

Next, the exposure method of the present embodiment will be described with reference to the flowchart shown in FIG.
First, the workpiece W is transported to the exposure position, and exposure light is emitted (step S1). Next, the illuminance distribution of the entire exposure area A is measured by the illuminance meter 40 (step S3). Here, the mirrors 66, 67, 68 in the initial state are apt to have slight variations in reflectance and curvature, and in that case, the illuminance distribution of the exposure light reflected by the mirrors 66, 67, 68 also varies. It occurs.

  Therefore, the measured illuminance distribution is compared with the target illuminance distribution (step S4). If it is determined in step S4 that the measured illuminance distribution has reached the target illuminance distribution, actual exposure is started (step S5). On the other hand, when the measured illuminance distribution does not reach the target illuminance distribution, the difference calculation is performed (step S6).

  Next, in step S7, the actuator 74 of each mirror deformation unit 70 is drive-controlled based on the difference calculation, and the displacement amount of the flat mirror 68 is confirmed by the contact sensor 81 or the curvature correction amount detection system 90. Correct the curvature of 68.

  Thereafter, steps S3 to S7 are repeated, and the process is repeated until the measured illuminance distribution reaches the target illuminance distribution. As a result, it is possible to improve the illuminance distribution of the exposure area of the exposure light and to improve the exposure accuracy.

  The correction of the illuminance distribution is performed each time the mirror bending offset amount changes. Furthermore, since the offset amount of mirror bending is different for 4 to 8 shots per workpiece, correction of the illuminance distribution is performed each time the offset amount is changed.

  In addition, the curvature correction of the plane mirror 68 may be performed for the first time before measuring the illuminance distribution in step S3 (step S2 '). In this case, the amount of drive of the actuator 74 is based on the amount of deviation of both alignment marks Wa and Ma detected by the plurality of CCD cameras 30 by detecting the alignment marks of the workpiece W and the alignment marks of the mask M. Alternatively, the amount of displacement between the center of the mask M and the center of the work W and the amount of strain of the work W may be separately calculated, and may be determined according to the amount of strain of the work W. In this case, the amount of positional deviation between the center of the mask M and the center of the work W is performed by driving and controlling the alignment mechanism on the mask M side. Further, in this case, the curvature correction of the flat mirror 68 based on the difference calculation in step S7 is performed such that the amount of distortion of the work W after correction is within the allowable range.

  Alternatively, the curvature correction of the flat mirror 68 at the first time in step S2 'is performed by setting the drive amount of the actuator 74 so as to adjust in advance the error inherent to the apparatus in the illumination optical system 3 and the exposure apparatus. May be

  As described above, according to the exposure apparatus PE of the present embodiment, the illuminance meter 40 for measuring the illuminance of the exposure light irradiated to the workpiece W is provided, and the flat mirror 68 is interposed before the workpiece W is exposed. The illuminance distribution of the exposure area A of the exposure light irradiated to the workpiece W is measured using the luminometer 40. Thereby, the illuminance distribution in the exposure area A can be acquired, and when it does not reach the target illuminance distribution, the mirror deformation unit 70 of the flat mirror 68 whose curvature is corrected is driven again to reach the target illuminance distribution. By performing fine adjustment up to the point, it is possible to improve the illuminance distribution of the exposure area A of the exposure light and to improve the exposure accuracy.

The exposure apparatus also includes an X-axis stage feed mechanism 5 and a Y-axis stage feed mechanism 6 that move the work stage 2 so as to move the workpiece W and the mask M relative to each other in the horizontal direction. The feed mechanisms 5 and 6 are driven to move the entire exposure area A. As a result, the number of illuminance meters 40 can be reduced, and the illuminance of the entire exposure area A can be measured.
In the present invention, the number of illuminance meters 40 may be plural, and the illuminance at each position in the exposure area A may be simultaneously measured by the plurality of illuminance meters 40 to shorten the measuring time. .

  Further, according to the exposure method of the present embodiment, the step of measuring the illuminance distribution of the exposure area A of the exposure light irradiated to the work W through the flat mirror 68 by the mirror deformation unit 70 using the illuminance meter 40 And correcting the curvature of the flat mirror 68 by driving the mirror deformation unit 70 according to the illuminance distribution of the exposure area A measured by the illuminance meter 40. Thereby, the illuminance distribution in the exposure area A can be acquired, and when it does not reach the target illuminance distribution, the mirror deformation unit 70 of the flat mirror 68 whose curvature is corrected is driven again to reach the target illuminance distribution. By performing fine adjustment up to the point, it is possible to improve the illuminance distribution of the exposure area A of the exposure light and to improve the exposure accuracy.

Second Embodiment
Next, an exposure apparatus according to a second embodiment of the present invention will be described with reference to FIG. In addition, since the illumination optical system 3 of this embodiment has the same configuration as the illumination optical system of the first embodiment, the same reference numerals as in the first embodiment denote the same or equivalent parts as those in the first embodiment. Omit or simplify.

  In the illumination optical system 3 of the present embodiment, as shown in FIG. 7, the mirror deformation unit 70 is also attached to the back side of the plane mirror 68 and to the back sides of other plane mirrors 66. The curvature of the plane mirror 66 can be locally corrected.

  That is, in the first embodiment, the deterioration of the illuminance distribution caused by the variation of the reflectance and the curvature of each of the plurality of mirrors 66, 67, 68 is suppressed by the curvature correction of one plane mirror 68. However, if the deterioration of the illuminance distribution is suppressed by the curvature correction of the plurality of mirrors 66 and 68 as in the present embodiment, the desired curvature can be obtained for each of the mirrors 66 and 68, which is more easily performed. The illumination distribution can be improved.

  In the flow chart of FIG. 6 of the first embodiment, the curvature correction of the mirrors 66 and 68 in step S7 may be performed by both the mirrors 66 and 68, or any one of the mirrors 66 and 68 The curvature correction of may be performed as appropriate.

  For example, the curvature is corrected by driving the mirror deformation unit 70 with respect to the flat mirror 68 in step S7, and the workpiece W is irradiated via the flat mirror 68 in step S3 of the next step. The illuminance distribution of the exposure area A of the exposure light is measured using the illuminance meter 40, and if it does not reach the target illuminance distribution in step S4, the difference calculation is performed in step S6, and in the next step S7 The other flat mirror 66 corrects the curvature by driving the mirror deformation unit 70 according to the illuminance distribution of the exposure area A measured by the illuminance meter 40 with the curvature of the flat mirror 68 corrected. . Thereby, the illuminance distribution in the exposure area A can be acquired, and when it does not reach the target illuminance distribution, the mirror deformation unit 70 of the other flat mirror 66 is driven to finely adjust until the target illuminance distribution is reached. By doing this, it is possible to improve the illuminance distribution of the exposure area A of the exposure light and to enhance the exposure accuracy.

Therefore, even in the illumination optical system 3 of the present embodiment having the above-described configuration, the curvature of the flat mirror 68 and the other flat mirror 66 is locally corrected for curvature, whereby the declination angle of the exposure light is determined. It can be changed to improve the illuminance distribution.
The mirror deformation unit 70 may also be attached to the back side of the collimation mirror 67.
Other configurations and effects are the same as those of the first embodiment.

  Further, as a modified example of the present embodiment, for example, when the work W is distorted, the mask M is corrected by correcting the curvature with the mirror deformation unit 70 of the flat mirror 68 according to the shape of the exposed area of the work W The exposure distribution of the pattern is accurately transferred, and the deterioration of the illuminance distribution of the exposure light caused by correcting the curvature with the mirror deformation unit 70 of the flat mirror 68 is corrected by changing the curvature of the other flat mirror 66. It is possible to suppress by changing and to improve the illuminance distribution to perform exposure at high resolution.

  The present invention is not limited to the above-described embodiments, and appropriate modifications, improvements, and the like can be made.

1 Mask stage (mask support)
2 Work stage (work support)
3 illumination optical system 5 X axis stage feed mechanism 6 Y axis stage feed mechanism 40 illuminance meter 60 multi lamp unit (light source)
65 Optical Integrators 66, 68 Flat Mirror (Reflecting Mirror with Mirror Bending Mechanism)
70 Mirror deformation unit (mirror bending mechanism)
EL light path M mask PE exposure system W work

Claims (2)

A work support that supports the work;
A mask support that supports the mask;
An illumination optical system having a light source and a reflecting mirror that reflects exposure light from the light source;
A mirror bending mechanism capable of correcting the curvature of the reflecting mirror;
An exposure apparatus that irradiates exposure light from the light source to the work through the mask to transfer the pattern of the mask onto the work,
It comprises an illuminance meter for measuring the illuminance of exposure light irradiated to the workpiece;
Before exposing the workpiece, the illuminance distribution of the exposure area of the exposure light irradiated to the workpiece through the reflecting mirror is measured using the luminometer.
The illumination optical system comprises a plurality of the reflecting mirrors,
The mirror bending mechanism includes a plurality of mirror bending mechanisms capable of correcting the curvatures of the plurality of reflecting mirrors.
The curvature is corrected by driving the mirror bending mechanism with respect to any one of the plurality of reflecting mirrors,
The other one of the plurality of reflecting mirrors drives the mirror bending mechanism according to the illuminance distribution of the exposure area measured by the illuminance meter in a state where the curvature of any one of the reflecting mirrors is corrected. And correcting the curvature thereof. The exposure method according to claim 1 , wherein the exposure light from the light source is applied to the workpiece through the mask to transfer the pattern of the mask onto the workpiece.
Correcting the curvature by driving the mirror bending mechanism with respect to any one of the plurality of reflecting mirrors;
Measuring the illuminance distribution of the exposure area of the exposure light irradiated to the work via the any one reflecting mirror whose curvature is corrected by the mirror bending mechanism, using the luminometer;
The other one of the plurality of reflecting mirrors drives the mirror bending mechanism according to the illuminance distribution of the exposure area measured by the illuminance meter in a state where the curvature of any one of the reflecting mirrors is corrected. Correcting the curvature by
An exposure method comprising:

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