JP6688936B2 - ヒートシンク - Google Patents
ヒートシンク Download PDFInfo
- Publication number
- JP6688936B2 JP6688936B2 JP2019513466A JP2019513466A JP6688936B2 JP 6688936 B2 JP6688936 B2 JP 6688936B2 JP 2019513466 A JP2019513466 A JP 2019513466A JP 2019513466 A JP2019513466 A JP 2019513466A JP 6688936 B2 JP6688936 B2 JP 6688936B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat pipe
- fin group
- pipe
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000005855 radiation Effects 0.000 claims description 118
- 230000017525 heat dissipation Effects 0.000 claims description 98
- 238000010438 heat treatment Methods 0.000 claims description 60
- 238000001816 cooling Methods 0.000 description 52
- 238000009434 installation Methods 0.000 description 9
- 239000000758 substrate Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- -1 copper Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2215/00—Fins
- F28F2215/08—Fins with openings, e.g. louvers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
11 第1のヒートパイプ
11−1 所定の第1のヒートパイプ
11−2 他の第1のヒートパイプ
12 第1のヒートパイプ群
13 第2のヒートパイプ
13−1 所定の第2のヒートパイプ
13−2 他の第2のヒートパイプ
14 第2のヒートパイプ群
20 放熱部
21 第1の放熱フィン
22 第1の放熱フィン群
23 第2の放熱フィン
24 第2の放熱フィン群
25 第3の放熱フィン
26 第3の放熱フィン群
Claims (10)
- 複数の放熱フィンを有する放熱フィン群を複数備え、複数の前記放熱フィン群が積層構造を形成した放熱部と、
発熱体と一方の端部が熱的に接続され、積層構造を形成した複数の前記放熱フィン群の間に設けられた空間に他方の端部が挿入されて前記放熱部と熱的に接続された、複数のヒートパイプと、を備え、
複数の前記ヒートパイプのうち、少なくとも1つの所定のヒートパイプの他方の端部が、前記放熱部の高さ方向において最も高い位置に形成された前記空間に挿入され、
複数の前記ヒートパイプのうち、前記所定のヒートパイプ以外の他のヒートパイプの他方の端部が、前記所定のヒートパイプの他方の端部が挿入された前記空間よりも、前記放熱部の高さ方向において低い位置に形成された前記空間に挿入され、
少なくとも1つの前記所定のヒートパイプの一方の端部が、前記他のヒートパイプの一方の端部よりも、前記発熱体の熱密度の高い領域に熱的に接続されたヒートシンク。 - 前記放熱部が、少なくとも、複数の第1の放熱フィンを有する第1の放熱フィン群と、複数の第2の放熱フィンを有する第2の放熱フィン群と、複数の第3の放熱フィンを有する第3の放熱フィン群と、を有し、
前記第2の放熱フィン群は、前記所定のヒートパイプを介して前記第1の放熱フィン群と対向し、前記第2の放熱フィン群は、前記他のヒートパイプを介して前記第3の放熱フィン群と対向することにより、前記第1の放熱フィン群、前記第2の放熱フィン群及び前記第3の放熱フィン群が積層構造を形成した請求項1に記載のヒートシンク。 - 複数の前記ヒートパイプが、複数の前記放熱フィン間に形成された開口部側から導入されている請求項1または2に記載のヒートシンク。
- 前記所定のヒートパイプが、前記第1の放熱フィン間に形成された開口部側から導入されている請求項2に記載のヒートシンク。
- 前記他のヒートパイプが、前記第2の放熱フィン間に形成された開口部側から導入されている請求項2または4に記載のヒートシンク。
- 複数の前記ヒートパイプの、前記放熱部と熱的に接続された部分に、曲げ部が形成されている請求項1乃至5のいずれか1項に記載のヒートシンク。
- 複数の前記ヒートパイプの、前記放熱部と熱的に接続された部分が、扁平加工されている請求項1乃至6のいずれか1項に記載のヒートシンク。
- 前記所定のヒートパイプの一方の端部と前記他のヒートパイプの一方の端部が、並列配置されることにより、複数の前記ヒートパイプがヒートパイプ群を形成している請求項1乃至7のいずれか1項に記載のヒートシンク。
- 1つの前記ヒートパイプ群が、1つの前記発熱体と熱的に接続される請求項8に記載のヒートシンク。
- 前記ヒートパイプ群が、1つまたは2つ設けられている請求項9に記載のヒートシンク。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018015334 | 2018-01-31 | ||
JP2018015334 | 2018-01-31 | ||
PCT/JP2019/003084 WO2019151291A1 (ja) | 2018-01-31 | 2019-01-30 | ヒートシンク |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2019151291A1 JPWO2019151291A1 (ja) | 2020-02-06 |
JP6688936B2 true JP6688936B2 (ja) | 2020-04-28 |
Family
ID=67478778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019513466A Active JP6688936B2 (ja) | 2018-01-31 | 2019-01-30 | ヒートシンク |
Country Status (4)
Country | Link |
---|---|
US (2) | US11543189B2 (ja) |
JP (1) | JP6688936B2 (ja) |
CN (1) | CN212991086U (ja) |
WO (1) | WO2019151291A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200227880A1 (en) * | 2019-01-10 | 2020-07-16 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6688936B2 (ja) * | 2018-01-31 | 2020-04-28 | 古河電気工業株式会社 | ヒートシンク |
JP1643634S (ja) * | 2018-12-28 | 2020-10-12 | ||
CN111928705B (zh) * | 2019-05-13 | 2022-03-25 | 亚浩电子五金塑胶(惠州)有限公司 | 具有重力型回路热管的散热装置 |
JP1662414S (ja) | 2019-09-12 | 2020-06-29 | ||
US20230102571A1 (en) * | 2020-03-27 | 2023-03-30 | Sony Interactive Entertainment Inc. | Heat radiating device and electronic apparatus |
CN213841858U (zh) * | 2020-11-05 | 2021-07-30 | 亚浩电子五金塑胶(惠州)有限公司 | 热管及具有其的散热结构 |
US20210059073A1 (en) * | 2020-11-05 | 2021-02-25 | Intel Corporation | Heterogeneous heat pipes |
US20220346276A1 (en) * | 2021-04-27 | 2022-10-27 | Asia Vital Components Co., Ltd. | Thermal module |
TWI806099B (zh) * | 2021-07-15 | 2023-06-21 | 奇鋐科技股份有限公司 | 散熱模組 |
US20230013442A1 (en) * | 2021-07-16 | 2023-01-19 | Asia Vital Components Co., Ltd. | Thermal module |
JP7275243B1 (ja) | 2021-12-21 | 2023-05-17 | レノボ・シンガポール・プライベート・リミテッド | 電子機器 |
TWM628143U (zh) * | 2022-01-13 | 2022-06-11 | 華碩電腦股份有限公司 | 散熱裝置 |
JP7269422B1 (ja) * | 2022-07-26 | 2023-05-08 | 古河電気工業株式会社 | ヒートシンク |
TWI860545B (zh) * | 2022-09-16 | 2024-11-01 | 奇鋐科技股份有限公司 | 散熱模組 |
TWM643603U (zh) * | 2023-05-03 | 2023-07-01 | 訊凱國際股份有限公司 | 資料儲存組件及散熱器 |
Family Cites Families (19)
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JP3936308B2 (ja) | 2002-07-12 | 2007-06-27 | 古河電気工業株式会社 | フィン一体型ヒートシンクおよびその製造方法 |
KR100627236B1 (ko) * | 2005-04-11 | 2006-09-25 | 잘만테크 주식회사 | 컴퓨터 부품용 냉각장치 |
WO2006109929A1 (en) * | 2005-04-11 | 2006-10-19 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
JP4719079B2 (ja) * | 2006-05-19 | 2011-07-06 | 株式会社東芝 | 電子機器 |
JP4762120B2 (ja) * | 2006-11-24 | 2011-08-31 | 株式会社東芝 | 電子機器、冷却装置 |
TWM317746U (en) * | 2007-03-01 | 2007-08-21 | Cooler Master Co Ltd | Heat sink with circularly arrayed fins |
US8422218B2 (en) * | 2007-04-16 | 2013-04-16 | Stephen Samuel Fried | Liquid cooled condensers for loop heat pipe like enclosure cooling |
JP4357569B2 (ja) * | 2008-01-31 | 2009-11-04 | 株式会社東芝 | 電子機器 |
US8002019B2 (en) * | 2008-03-20 | 2011-08-23 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
US8020611B2 (en) * | 2008-09-19 | 2011-09-20 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipating device having G-shaped heat pipes and heat sinks |
CN102768568B (zh) * | 2011-05-05 | 2015-09-02 | 华硕电脑股份有限公司 | 散热模块及其散热方法 |
TW201304671A (zh) * | 2011-07-13 | 2013-01-16 | Hon Hai Prec Ind Co Ltd | 散熱器組合 |
CN102970851B (zh) * | 2012-11-16 | 2015-07-22 | 东莞汉旭五金塑胶科技有限公司 | 热管散热器 |
US20160018139A1 (en) * | 2014-07-21 | 2016-01-21 | Phononic Devices, Inc. | Integration of thermosiphon tubing into accept heat exchanger |
JP6117288B2 (ja) * | 2015-07-14 | 2017-04-19 | 古河電気工業株式会社 | 冷却装置 |
US10119759B2 (en) | 2016-03-31 | 2018-11-06 | Hoya Candeo Optronics Corporation | Heat radiating apparatus and light illuminating apparatus with the same |
JP6599379B2 (ja) * | 2016-03-31 | 2019-10-30 | Hoya Candeo Optronics株式会社 | 放熱装置及びそれを備える光照射装置 |
CN113784599B (zh) * | 2016-08-24 | 2024-08-27 | 台达电子工业股份有限公司 | 散热组件 |
JP6688936B2 (ja) * | 2018-01-31 | 2020-04-28 | 古河電気工業株式会社 | ヒートシンク |
-
2019
- 2019-01-30 JP JP2019513466A patent/JP6688936B2/ja active Active
- 2019-01-30 WO PCT/JP2019/003084 patent/WO2019151291A1/ja active Application Filing
- 2019-01-30 CN CN201990000383.9U patent/CN212991086U/zh active Active
-
2020
- 2020-07-21 US US16/935,164 patent/US11543189B2/en active Active
-
2022
- 2022-10-28 US US18/050,895 patent/US11725883B2/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200227880A1 (en) * | 2019-01-10 | 2020-07-16 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
US11570411B2 (en) * | 2019-01-10 | 2023-01-31 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
US11592145B2 (en) | 2019-01-10 | 2023-02-28 | Hisense Laser Display Co., Ltd. | Laser light source and laser projection device |
Also Published As
Publication number | Publication date |
---|---|
CN212991086U (zh) | 2021-04-16 |
JPWO2019151291A1 (ja) | 2020-02-06 |
US11725883B2 (en) | 2023-08-15 |
US20230102800A1 (en) | 2023-03-30 |
US20200355443A1 (en) | 2020-11-12 |
WO2019151291A1 (ja) | 2019-08-08 |
US11543189B2 (en) | 2023-01-03 |
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