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JP6631871B2 - 光加工装置 - Google Patents

光加工装置 Download PDF

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Publication number
JP6631871B2
JP6631871B2 JP2015171212A JP2015171212A JP6631871B2 JP 6631871 B2 JP6631871 B2 JP 6631871B2 JP 2015171212 A JP2015171212 A JP 2015171212A JP 2015171212 A JP2015171212 A JP 2015171212A JP 6631871 B2 JP6631871 B2 JP 6631871B2
Authority
JP
Japan
Prior art keywords
processing
unit
work
suction
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2015171212A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017047436A (ja
Inventor
朋則 田村
朋則 田村
聡一 雜賀
聡一 雜賀
清水 健司
健司 清水
喜久也 中田
喜久也 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP2015171212A priority Critical patent/JP6631871B2/ja
Priority to TW105124451A priority patent/TWI601591B/zh
Priority to KR1020160110743A priority patent/KR20170026295A/ko
Publication of JP2017047436A publication Critical patent/JP2017047436A/ja
Application granted granted Critical
Publication of JP6631871B2 publication Critical patent/JP6631871B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H16/00Unwinding, paying-out webs
    • B65H16/02Supporting web roll
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H16/00Unwinding, paying-out webs
    • B65H16/10Arrangements for effecting positive rotation of web roll
    • B65H16/103Arrangements for effecting positive rotation of web roll in which power is applied to web-roll spindle
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00Winding webs
    • B65H18/02Supporting web roll
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00Winding webs
    • B65H18/08Web-winding mechanisms
    • B65H18/10Mechanisms in which power is applied to web-roll spindle
    • B65H18/103Reel-to-reel type web winding and unwinding mechanisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00Registering, tensioning, smoothing or guiding webs
    • B65H23/04Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/24Registering, tensioning, smoothing or guiding webs longitudinally by fluid action, e.g. to retard the running web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00Article or web delivery apparatus incorporating devices for performing specified auxiliary operations

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
JP2015171212A 2015-08-31 2015-08-31 光加工装置 Expired - Fee Related JP6631871B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2015171212A JP6631871B2 (ja) 2015-08-31 2015-08-31 光加工装置
TW105124451A TWI601591B (zh) 2015-08-31 2016-08-02 光學加工裝置
KR1020160110743A KR20170026295A (ko) 2015-08-31 2016-08-30 광 가공 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015171212A JP6631871B2 (ja) 2015-08-31 2015-08-31 光加工装置

Publications (2)

Publication Number Publication Date
JP2017047436A JP2017047436A (ja) 2017-03-09
JP6631871B2 true JP6631871B2 (ja) 2020-01-15

Family

ID=58278479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015171212A Expired - Fee Related JP6631871B2 (ja) 2015-08-31 2015-08-31 光加工装置

Country Status (3)

Country Link
JP (1) JP6631871B2 (zh)
KR (1) KR20170026295A (zh)
TW (1) TWI601591B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019098355A (ja) * 2017-11-30 2019-06-24 日東電工株式会社 長尺フィルムのレーザ加工方法
KR102148687B1 (ko) * 2019-07-23 2020-08-27 박장봉 방화문용 자동 레이저 용접장치
CN113021459B (zh) * 2021-03-18 2023-05-09 江西和必达高温纤维制品有限公司 一种用于防弹玻纤板的等距切割设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3098398B2 (ja) * 1995-05-19 2000-10-16 日本電気株式会社 ビアホール形成方法及びレーザ光照射装置
JP3662786B2 (ja) * 1999-09-30 2005-06-22 三菱電機株式会社 レーザ加工装置
JP2003205384A (ja) 2002-01-11 2003-07-22 Ricoh Microelectronics Co Ltd レーザ加工装置
WO2004053955A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
JP4849810B2 (ja) * 2005-03-08 2012-01-11 株式会社牧野フライス製作所 ワイヤ放電加工機及びその自動結線方法
US8355116B2 (en) * 2009-06-19 2013-01-15 Nikon Corporation Exposure apparatus and device manufacturing method
WO2012105288A1 (ja) * 2011-01-31 2012-08-09 日産化学工業株式会社 マイクロレンズ形成用感光性樹脂組成物

Also Published As

Publication number Publication date
TWI601591B (zh) 2017-10-11
KR20170026295A (ko) 2017-03-08
JP2017047436A (ja) 2017-03-09
TW201707833A (zh) 2017-03-01

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