JP6571176B2 - Component mounter and component supply method for component mounter - Google Patents

Description

  The present invention relates to a component mounter including a component supply device that uses a supply pallet.

  As equipment for producing a substrate on which a large number of components are mounted, there are a solder printer, a component mounting machine, a reflow machine, a board inspection machine, and the like. It has become common to configure a substrate production line by connecting these facilities. Among these, the component mounting machine includes a substrate transfer device, a component supply device, a component transfer device, and a control device. One type of component supply device is a device that uses a supply pallet that supplies components arranged in a horizontal plane. In the pallet-type component supply device, a wafer pallet on which a dicing sheet with a die (component) attached is stretched, a tray pallet on which a supply tray on which components are mounted, and the like are used. Patent Document 1 discloses a technical example related to a component mounter provided with a pallet type component supply device.

  The mounting machine disclosed in Patent Document 1 has a wafer holding table (supply pallet) that holds wafer parts and can move in the Y-axis direction, and a push-up mechanism that can move in the X-axis direction with a mechanism for pushing the wafer parts from below. An apparatus, a take-out apparatus having a mechanism for sucking the pushed-up wafer part and movable in the X-axis direction, and a head unit (mounting head) for receiving the wafer part from the take-out apparatus and mounting it on a substrate are provided. Further, it is disclosed that an imaging device (component imaging camera) having a mechanism for imaging a wafer part held on a wafer holding table and movable in the X-axis direction is disclosed.

  Further, in the embodiment of Patent Document 1, a push-up device that moves below the wafer holding table, an extraction device and an imaging device that move above the wafer holding table, and a head that moves further above the extraction device An embodiment comprising a unit is disclosed. In this aspect, since each device moves horizontally at three different height positions, interference between devices does not occur. According to this, it is supposed that it can suppress that an apparatus becomes large in an X-axis direction.

JP 2012-23230 A

  By the way, in the technical example of patent document 1, since the mounting nozzle of the head unit (mounting head) and the extraction nozzle of the extraction device are separated and driven separately, the configuration becomes complicated and the cost increases. For this reason, a configuration in which a wafer part is directly collected from a wafer holding table (supply pallet) by a mounting nozzle of the head unit and a take-out device is omitted has been put into practical use. In the configuration in which the take-out device is omitted, the drive mechanism of the head unit and the drive mechanism of the imaging device (component imaging camera) are arranged at substantially the same height above the wafer holding table.

  Here, the head unit (mounting head) has a wide movable range from the wafer holding table to the positioned substrate, and the imaging device (component imaging camera) has a narrow movable range limited to the vicinity of the wafer holding table. Have. Nevertheless, it is necessary to avoid interference between the two in the vicinity of the wafer holding table. For this reason, a standby time until the counterpart device exits or a detour movement that avoids interference with the counterpart device occurs, resulting in a decrease in substrate production efficiency. Furthermore, establishment of interference avoidance control technology has become an issue at the development stage, and performance verification has been required.

  The present invention has been made in view of the above-mentioned problems of the background art, and has a configuration in which a component imaging camera is arranged on the lower side of a supply pallet so that interference with a mounting head having a mounting nozzle does not occur. It is an object to be solved to provide a component mounter that suppresses a decrease in efficiency and a component supply method for the component mounter.

The component mounter of the present invention that solves the above problems includes a supply pallet that supplies a plurality of components arranged in a horizontal plane, and a component supply device that has a pallet conveyance mechanism that pulls the supply pallet out of a storage magazine and conveys the supply pallet to a supply position. A mounting head having a mounting nozzle for picking up the component from above the supply pallet transported to the supply position and mounting it on the positioned substrate, and a component having a head drive mechanism for driving the mounting head in two horizontal directions A component mounting machine comprising: a transfer device, wherein the component supply device is disposed below the supply position and faces upward, and through the supply pallet conveyed to the supply position, the component supply device A component imaging camera that recognizes the position of the component and enables sampling by the mounting nozzle, and the component imaging camera Further have a camera driving mechanism for driving the horizontal two directions, a position below the supply position, can be conveyed downwards imaging position the supply pallet is set by the pallet transfer mechanism, the component imaging camera Is turned upside down and turned downward to pick up an image of the component from above the supply pallet conveyed to the lower image pickup position, or a second component image pickup camera different from the component image pickup camera has the lower image pickup position. The part is imaged from above the supply pallet transported to the surface.

In the component mounter of the present invention, the component imaging camera of the component supply device is disposed below the supply pallet conveyed to the supply position and faces upward, and images the component through the supply pallet. For this reason, the component imaging camera does not interfere with the mounting head having the mounting nozzle that picks up the component from above the supply pallet. Therefore, it was necessary in the prior art to avoid interference between the component imaging camera and the mounting head. No waiting time or detour movement occurs, and a decrease in substrate production efficiency is suppressed. In addition, it is possible to image the part from above the supply pallet conveyed to the lower imaging position.

It is a perspective view which shows the whole structure of the component mounting machine of 1st Embodiment. It is a block diagram which shows the structure of control of the component mounting machine of 1st Embodiment. It is a side view which illustrates typically composition of a parts supply device and a parts transfer device. It is a figure of the operation | movement flow which shows the components supply operation | movement of a components supply apparatus. It is a side view which illustrates typically composition of a parts supply device and a parts transfer device of a conventional component mounting machine. It is the perspective view which illustrated the tray pallet which can be used for a 1st embodiment. It is a side view which illustrates typically composition of a component supply device and a component transfer device of a component mounting machine of a 2nd embodiment. It is a figure of the operation | movement flow which shows the components supply operation | movement of the components supply apparatus of 2nd Embodiment.

(1. Overall configuration of the component mounting machine 1 of the first embodiment)
A component mounter 1 according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing the overall configuration of the component mounter 1 of the first embodiment. FIG. 2 is a block diagram illustrating a control configuration of the component mounter 1 according to the first embodiment. The component mounting machine 1 includes a substrate transfer device 2, a component supply device 3, a component transfer device 4, a component camera 5, a control device 6, and the like. The X-axis direction in FIG. 1 is a direction in which the substrate K is carried in and out, and the Y-axis direction is a direction orthogonal to the X-axis direction in the horizontal plane.

  The substrate transfer device 2 is disposed across the upper surface of the machine base 11 in the X-axis direction. The substrate transport device 2 includes a pair of guide rails arranged in parallel in the X-axis direction, and a pair of conveyor belts that are guided by the guide rails and transport the substrate K placed thereon. The substrate transport device 2 has a backup device that pushes up and positions the loaded substrate K.

  The component supply device 3 is provided at the rear portion in the longitudinal direction of the component mounter 1 (left front side in FIG. 1). The component supply device 3 supplies components to the component transfer device 4 using a supply pallet that supplies a plurality of components arranged in a horizontal plane. The component supply device 3 includes a wafer pallet 7 which is a kind of supply pallet, a storage magazine 31, a pallet transport mechanism 32, a push-up mechanism 33, a component imaging camera 34, a horizontal drive mechanism 35, a control unit 39, and the like.

  The storage magazine 31 is formed by using a substantially vertically long rectangular parallelepiped housing 311. A pallet carry-in part 312 is provided at the upper part of the housing 311, and a pallet discharge part 313 is provided at the lower part of the housing 311. A pallet transfer port 314 (shown in FIG. 3) is opened on the front side of the intermediate height of the housing 311. A pallet stocker 315 is accommodated in the housing 311. The pallet stocker 315 is a generally box-shaped member having a plurality of storage shelves. Each storage shelf stores the wafer pallet 7 so that it can be pulled out to the front side. The pallet stocker 315 is driven by a lifting mechanism (not shown) to move up and down in the housing 311.

  The wafer pallet 7 is loaded from the pallet loading unit 312 and is held on the upper surface of the raised pallet stocker 315. Thereafter, the wafer pallet 7 is once pulled out of the housing 311 by a pallet transport mechanism 32 described later, and then stored in a storage shelf of the pallet stocker 315. The used wafer pallet 7 is held on the lower surface of the descending pallet stocker 315, transferred to the pallet discharging unit 313, and discharged.

  The pallet transport mechanism 32 is provided on the front side of the storage magazine 31. The pallet transport mechanism 32 includes a rectangular parallelepiped machine base 321, a pair of guide rails 322 and 323, a ball screw feed mechanism 324, and the like. The pair of guide rails 322 and 323 extend in the front-rear direction of the upper surface of the machine base 321 and are arranged in parallel to be separated from each other. The guide rails 322 and 323 have rear portions facing the pallet transport port 314 of the storage magazine 31, and a supply position A is set at the front portions.

  The ball screw feed mechanism 324 includes a ball screw 325, a servo motor 326, an engagement member 327, and the like. The ball screw 325 is disposed close to and parallel to the one guide rail 322, and extends in the front-rear direction. The servo motor 326 is coupled to one end of the ball screw 325 and can be switched between forward rotation and reverse rotation. The engaging member 327 has a nut portion that is screwed into the ball screw 325 and a pallet locking portion that detachably locks the wafer pallet 7.

  When the servo motor 326 rotates forward with the engaging member 327 engaging the wafer pallet 7 and the ball screw 325 is driven to rotate, the engaging member 327 is screwed and transports the wafer pallet 7. As a result, the wafer pallet 7 is drawn forward from the pallet stocker 315 through the pallet transfer port 314 and transferred to the supply position A on the guide rails 322 and 323. When the servo motor 326 rotates in the reverse direction to drive the ball screw 325 in the reverse direction, the engaging member 327 is screwed out and transports the wafer pallet 7 in the reverse direction. As a result, the wafer pallet 7 is returned from the supply position A to the pallet stocker 315 through the pallet transfer port 314.

  The push-up mechanism 33, the component imaging camera 34, and the horizontal drive mechanism 35 are disposed inside the machine base 321 and are not visible in FIG. The push-up mechanism 33, the component imaging camera 34, and the horizontal drive mechanism 35 will be described later with reference to FIG.

  The wafer pallet 7 supplies a die D (component) produced by dicing a semiconductor wafer. The wafer pallet 7 includes a pallet frame 71 and an expanding table 72. The pallet frame 71 is a rectangular plate and has a large circular hole in the center. On one side of the pallet frame 71, a locking portion that is locked to the engaging member 327 of the pallet transport mechanism 32 is provided.

  The expand base 72 is an annular member, and is attached to the upper surface around the hole of the pallet frame 71. The expand base 72 holds the periphery of the dicing sheet S that holds a plurality of dies D attached to the upper surface. The dicing sheet S is held by the expanding base 72 and can be expanded and contracted. The dicing sheet S is formed of a transparent or translucent material having optical transparency. Therefore, the position of the die D can be recognized through the dicing sheet S from below. A defective product (bad die) may be contained in the plurality of dies D on the dicing sheet S. The arrangement of defective dies D on the dicing sheet S is notified from the control device 6 to the control unit 39 in the form of a wafer map represented by electronic data.

  The component transfer device 4 is an XY mobile robot type device that can move in the X-axis direction and the Y-axis direction. The component transfer device 4 is disposed from above the substrate transfer device 2 (on the right back side in FIG. 2) to above the supply position A of the component supply device 3. The component transfer device 4 includes a head driving mechanism 41 and a mounting head 42. The head drive mechanism 41 drives the mounting head 42 in the X-axis direction and the Y-axis direction in the horizontal plane. The head drive mechanism 41 can be configured by appropriately adopting various known techniques.

  The mounting head 42 has a nozzle holder 43 and a substrate recognition camera 46. The nozzle holder 43 has a mounting nozzle 44 on the lower side. The mounting nozzle 44 approaches the wafer pallet 7 transferred to the supply position A from above, and sucks and collects the die D using negative pressure. Further, the mounting nozzle 44 is driven to the positioned substrate K to mount the die D at a predetermined mounting coordinate position on the substrate K. The substrate recognition camera 46 images the fiducial mark attached to the substrate K and recognizes the accurate position of the substrate K.

  The component camera 5 is provided upward between the substrate transfer device 2 and the component supply device 3 on the upper surface of the machine base 11. The component camera 5 captures and detects the state of the die D collected at the lower end of the mounting nozzle 44 while the mounting head 42 moves from the component supply device 3 to the substrate K. When the component camera 5 detects an error in the suction position of the die D or a shift in the rotation angle, the control device 6 finely adjusts the component mounting operation as necessary.

  The control device 6 is a computer device having a CPU and operating with software. As shown in FIG. 2, the control device 6 is communicatively connected to the substrate transfer device 2, the component supply device 3, the component transfer device 4, and the component camera 5. The control device 6 issues a command while appropriately exchanging information with these devices 2 to 5 to control the overall operation of the component mounting machine 1. Specifically, the control device 6 carries the substrate K in and out of the substrate transfer device 2, supplies components from the component supply device 3, component extraction operation and component mounting operation of the component transfer device 4, and imaging operation of the component camera 5. Etc. are controlled.

(2. Internal structure of machine base 321 of component supply device 3)
Next, the configuration inside the machine base 321 of the component supply device 3 will be described. FIG. 3 is a side view schematically illustrating the configuration of the component supply device 3 and the component transfer device 4. In FIG. 3, the pallet transport mechanism 32 is simply indicated by a thick arrow (the same applies to FIGS. 5 and 7). As shown in the figure, the push-up mechanism 33, the component imaging camera 34, and the horizontal drive mechanism 35 are disposed inside the machine base 321 below the supply position A where the wafer pallet 7 is pulled out.

  The push-up mechanism 33 drives the push-up pin 331 upward to push up the die D while extending the dicing sheet S of the wafer pallet 7 at the supply position A. As a result, most of the bottom surface of the die D is separated from the dicing sheet S, the sticking force is reduced, and the die D can be collected by the mounting nozzle 44.

  The component imaging camera 34 is disposed below the supply position A and faces upward, and images the bottom surface of the die D through the dicing sheet S having optical transparency. Thereby, the exact position of the die D is recognized, and the push-up position of the push-up pin 331 and the component collecting position of the mounting nozzle 44 are correctly controlled. The imaging of the die D on the dicing sheet S can be performed by the substrate recognition camera 46 of the mounting head 42, but two cameras 34 and 46 are used in combination in order to improve substrate production efficiency.

  The push-up mechanism 33 and the component imaging camera 34 are both attached to the common head 36. The common head 36 is driven in two horizontal directions by the horizontal drive mechanism 35. That is, the horizontal drive mechanism 35 serves as both a mechanism that drives the push-up mechanism 33 in two horizontal directions and a camera drive mechanism that drives the component imaging camera 34 in two horizontal directions. The horizontal drive mechanism 35 can be configured by applying a known XY mobile robot technology.

  The movable range R1 of the mounting head 42 is wide from the wafer pallet 7 at the supply position A to the substrate K positioned from the supply position A. On the other hand, the movable range R2 of the push-up mechanism 33 and the component imaging camera 34 is narrow below the wafer pallet 7 and in the vicinity of the supply position A. The push-up mechanism 33 and the component imaging camera 34 are integrally driven by a horizontal drive mechanism 35. For this reason, when the component imaging camera 34 images a certain die D, the component imaging camera 34 is replaced and the push-up mechanism 33 is driven to the lower side of the die D, and then the die D can be pushed up.

  The control unit 39 of the component supply device 3 is a computer device having a CPU and operating with software. The control unit 39 is communicatively connected to the control device 6 and appropriately controls the component supply operation in accordance with a command from the control device 6. Specifically, the control unit 39 controls the loading and unloading of the wafer pallet 7 to and from the storage magazine 31 and the reciprocating conveyance of the wafer pallet 7 by the pallet conveying mechanism 32. The control unit 39 further controls the movement of the push-up mechanism 33 and the component imaging camera 34 by the horizontal drive mechanism 35, the push-up operation of the push-up mechanism 33, and the imaging operation of the component imaging camera 34. Further, the control unit 39 refers to the above-described wafer map and controls not to supply the defective die D.

(3. Component supply operation and action in component mounter 1)
Next, the component supply operation of the component supply device 3 in the component mounter 1 will be described. FIG. 4 is an operation flow diagram showing the component supply operation of the component supply apparatus 3. This operation flow is mainly executed by commands and control from the control unit 39. It is assumed that a predetermined wafer pallet 7 has already been carried into the storage magazine 31 and stored in the pallet stocker 315 before starting the component supply operation. 4, the pallet transport mechanism 32 transports the wafer pallet 7 to the supply position A based on a command from the controller 39.

  In step S <b> 2, the control unit 39 specifies one specific die D on the wafer pallet 7 and controls the horizontal drive mechanism 35. The horizontal drive mechanism 35 moves the component imaging camera 34 substantially directly below the specific die D. In step S <b> 3, the component imaging camera 34 captures the bottom surface of the specific die D through the dicing sheet S, and acquires component image data. Further, the component imaging camera 34 performs image processing on the component image data and recognizes an accurate position of the specific die D. The obtained position information of the specific die D is transmitted to the control unit 39 and further transmitted to the control device 6. Note that the control unit 39 may receive the component image data and recognize the position of the die D by image processing.

  In step S <b> 4, the control unit 39 specifies the position information of the specific die D and controls the horizontal drive mechanism 35. The horizontal drive mechanism 35 moves the push-up mechanism 33 to place the push-up pin 331 directly below the specific die D. In step S <b> 5, the push-up mechanism 33 drives the push-up pin 331 upward based on a command from the control unit 39 to push up the specific die D while extending the dicing sheet S. Thereby, the specific die D is in a state where it can be collected.

  In step S6, the mounting head 42 is driven above the wafer pallet 7, and the mounting nozzle 44 descends to collect a specific die D. At this time, the head drive mechanism 41 receives the position information of the specific die D from the control device 6, so that the mounting nozzle 44 can be accurately driven to a position directly above the push-up pin 331. Next, the mounting head 42 is driven above the substrate K, and the mounting nozzle 44 mounts the specific die D on the substrate K.

  Thereafter, the control unit 39 sequentially designates the subsequent dies D and repeats the control in steps S2 to S6. In addition, when the dies D are supplied from two or more wafer pallets 7 to one type of substrate K, the loading and unloading of the wafer pallet 7 to and from the supply position A is appropriately performed. The controller 39 repeats the control of steps S1 to S6 every time the wafer pallet 7 is transported to the supply position A.

  Next, the operation of the component mounter 1 according to the first embodiment will be described in comparison with the prior art. FIG. 5 is a side view schematically illustrating the configuration of the component supply device 3U and the component transfer device 4 of the conventional component mounting machine. As shown in the figure, the conventional component transfer device 4 has the same configuration as that of the first embodiment. In the conventional component supply apparatus 3U, unlike the first embodiment, the component imaging camera 34V moves above the wafer pallet 7.

  A conventional parts supply device 3U will be described. The push-up mechanism 33U is disposed below the supply position A and is attached to the push-up head 36U. The push-up head 36U is driven in two horizontal directions by a push-up horizontal drive mechanism 35U. On the other hand, the component imaging camera 34V is disposed on the upper side of the supply position A and is attached to the camera head 36V. The camera head 36V is driven in two horizontal directions separately from the push-up mechanism 33U by the camera horizontal drive mechanism 35V. The component imaging camera 34V faces downward and images the upper surface of the die D on the dicing sheet S.

  In the prior art, both the component imaging camera 34V and the mounting head 42 access the wafer pallet 7 from above the supply position A. For this reason, control for avoiding mutual interference is performed, and a waiting time until the counterpart device leaves or detour movement to avoid interference with the counterpart device occurs. This prolongs the production time per substrate and lowers the production efficiency.

  Furthermore, establishment of interference avoidance control technology has become an issue at the development stage, and performance verification has been required. For example, the suitable timing at which the component imaging camera 34V and the mounting head 42 start moving varies depending on the current position and target position, and in addition, interference with the speed, acceleration, movement path, etc. during movement is avoided. Related to. It took enormous verification time and effort to verify the operation of all patterns combining these factors and establish an excellent interference avoidance method.

  On the other hand, in the first embodiment, the movable range R1 of the mounting head 42 is above the wafer pallet 7, and the movable range R2 of the push-up mechanism 33 and the component imaging camera 34 is below the wafer pallet 7. Therefore, there is no possibility that the push-up mechanism 33 and the component imaging camera 34 interfere with the mounting head 42. Further, the performance verification that has been performed so far to establish the control technique for avoiding interference is not necessary.

  In the first embodiment, a tray pallet 8 may be used instead of the wafer pallet 7, and the wafer pallet 7 and the tray pallet 8 may be used in combination. FIG. 6 is a perspective view illustrating a tray pallet 8 that can be used in the component mounter 1 of the first embodiment. Similar to the wafer pallet 7, the tray pallet 8 is stored in the storage magazine 31 and is transported to the supply position A by the pallet transport mechanism 32.

  The tray pallet 8 is formed including a supply tray 83. The supply tray 83 is formed in a rectangular dish shape using a transparent or translucent resin having optical transparency. The supply tray 83 has a wide outer frame 84 projecting from the outer periphery of the upper surface, and a narrow partition frame 85 projecting in a lattice shape to form a plurality of cavities 86. In the example of FIG. 6, 54 cavities 86 are formed, and parts P (shown with hatching for convenience) are placed in 22 of them. The tray pallet 8 is a frame-like plate material having a rectangular outer shape and having a rectangular hole slightly smaller than the supply tray 83 in the center. On one side of the tray pallet 8, a locking portion 81 that is locked to the engaging member 327 of the pallet transport mechanism 32 is provided.

  The tray pallet 8 is fixed to and held on the upper side of the rectangular hole by pressing two places on both sides extending in the longitudinal direction of the supply tray 83, that is, a total of four places, with the presser fittings 82. Therefore, the component imaging camera 34 can image the component P through the rectangular hole of the tray pallet 8 from below and through the supply tray 83. Note that when the tray pallet 8 is used, the mounting head 42 can also be used by replacing the mounting chuck for picking up the component P with the mounting nozzle 44.

(4. Aspects and effects of the component mounter 1 of the first embodiment)
The component mounter 1 of the first embodiment includes a supply pallet (wafer pallet 7 and tray pallet 8) that supplies a plurality of components arranged in a horizontal plane, and a pallet that pulls the supply pallet from the storage magazine 31 and conveys it to a supply position A. A mounting head having a component supply device 3 having a transport mechanism 32 and a mounting nozzle 44 that picks up components (die D, component P) from above the supply pallet transported to the supply position A and mounts them on the positioned substrate K. 42, and a component transfer device 4 having a head drive mechanism 41 that drives the mounting head 42 in two horizontal directions. The component supply device 3 is provided below the supply position A. When the component is imaged through the supply pallet transported to the supply position A through the supply pallet, the position of the component is recognized and taken by the mounting nozzle 44. Component imaging camera 34 to allow, and further comprises a camera driving mechanism for driving the component imaging camera 34 in the horizontal two directions (horizontal driving mechanism 35).

In the first embodiment, the component imaging camera 34 of the component supply device 3 is disposed below the supply pallet conveyed to the supply position A and faces upward, and images the component through the supply pallet. For this reason, the component imaging camera 34 does not interfere with the mounting head 42 having the mounting nozzle 44 for sampling the component from above the supply pallet. Therefore, in order to avoid interference between the component imaging camera 34V and the mounting head 42 in the prior art. Therefore, the waiting time and detour movement required for the above are not generated, and the reduction in substrate production efficiency is suppressed. In addition, the performance verification that has been carried out in the development stage so far in order to establish the interference avoidance control technology becomes unnecessary.

  Further, the component is a die D produced by dicing a semiconductor wafer, and the supply pallet holds a plurality of dies on the upper surface and holds a dicing sheet S having optical transparency so as to be stretchable. A wafer pallet 7 provided, and the component supply device 3 drives a push-up pin 331 upward to push up the die D while extending the dicing sheet S of the wafer pallet 7 conveyed to the supply position A, and It further has a horizontal drive mechanism 35 that drives the push-up mechanism 33 in two horizontal directions. The component imaging camera 34 images the die D through the dicing sheet S and is driven by the horizontal drive mechanism 35 that also serves as a camera drive mechanism. Is done.

  According to this, in the form in which the die D produced from the semiconductor wafer is supplied, the effect that the reduction in substrate production efficiency is suppressed becomes remarkable. In addition, since the horizontal drive mechanism 35 serves as a mechanism for driving the push-up mechanism 33 in two horizontal directions and a camera drive mechanism, the configuration of the component supply device 3 can be simplified and the cost can be reduced.

  Furthermore, the tray pallet 8 which is a kind of supply pallet includes a supply tray 83 having a plurality of cavities 86 on which the parts P are placed and having optical transparency. According to this, even in the form in which the component P is supplied from the supply tray 83, there is an effect that a reduction in substrate production efficiency is suppressed.

(5. Configuration of the component mounting machine of the second embodiment)
Next, the structure of the component mounting machine of 2nd Embodiment is demonstrated. FIG. 7 is a side view schematically illustrating the configuration of the component supply device 3A and the component transfer device 4 of the component mounter according to the second embodiment. As illustrated, the component transfer apparatus 4 of the second embodiment has the same configuration as that of the first embodiment. Unlike the first embodiment, the component supply apparatus 3A of the second embodiment recognizes a defective die D by an imaging operation instead of the wafer map, unlike the first embodiment.

  A difference between the component supply device 3A of the second embodiment and the first embodiment will be mainly described. In the second embodiment, the lower imaging position B is set further below the push-up mechanism 33 and the component imaging camera 34 below the supply position A. A lower pallet transfer mechanism 37 is disposed in parallel below the pallet transfer mechanism 32 so that the wafer pallet 7 can be transferred to the lower imaging position B. The lower pallet transport mechanism 37 has the same configuration as the pallet transport mechanism 32, and is simply indicated by a thick arrow in FIG. A lower pallet conveyance port 317 is opened near the lower side of the housing 311 so as to face the rear part of the lower pallet conveyance mechanism 37.

  Further, the common head 36A to which the push-up mechanism 33 and the component imaging camera 34 are attached can be turned upside down. That is, the common head 36A is inverted upside down from the normal rotation posture shown in FIG. 3 to the reverse posture shown in FIG. 7 in accordance with the reverse command from the control unit 39. Further, the common head 36 </ b> A returns from the reverse posture to the normal rotation posture in accordance with the normal rotation command from the control unit 39. In the inverted posture of the common head 36A, the component imaging camera 34 can face the lower side and image the upper surface of the die D of the wafer pallet 7 conveyed to the lower imaging position B.

  The recognition of a defective die D is performed based on the availability mark marked on the upper surface of the die D. As an example of the usability mark, a cross mark indicating unusable is marked on the upper surface of the defective die D, and nothing is marked on the upper surface of the good die D. In addition, although the availability mark other than x mark may be used, the marking position is the upper surface of the die D.

(6. Component supply operation in second embodiment and component supply method of component mounter of embodiment)
Next, the component supply operation of the component supply apparatus 3A in the component mounter of the second embodiment will be described. FIG. 8 is an operation flow diagram showing the component supply operation of the component supply device 3A of the second embodiment. This operation flow is mainly executed by commands and control from the control unit 39. The component supply operation of the component supply apparatus 3A corresponds to the component supply method of the component mounter according to the embodiment of the present invention. It is assumed that a predetermined wafer pallet 7 has already been carried into the storage magazine 31 and stored in the pallet stocker 315 before starting the component supply operation.

  In step S11 of the operation flow of FIG. 8, the lower pallet transfer mechanism 37 transfers the wafer pallet 7 to the lower imaging position B based on a command from the control unit 39 (shown by a solid line in FIG. 7). In step S12, the control unit 39 inverts the top and bottom of the common head 36A and turns the component imaging camera 34 downward. In step S <b> 13, the control unit 39 specifies the first die D on the wafer pallet 7 and controls the horizontal drive mechanism 35. The horizontal drive mechanism 35 moves the component imaging camera 34 substantially directly above the first die D.

In step S <b> 14, the component imaging camera 34 captures the component image data by imaging the upper surface of the first die D from above the wafer pallet 7 based on a command from the control unit 39. Further, in step S15, the component imaging camera 34 or the control unit 39 performs image processing on the component image data to determine whether or not an X mark (usability mark) is marked on the upper surface of the first die D. . The control unit 39 determines that the first die D can be used if the x mark is not marked, and determines that the first die D cannot be used if the x mark is marked.

  In step S <b> 16, the control unit 39 determines whether or not all the dies D on the dicing sheet S have been determined. In the first step S16, since the determination is not completed except for the first die D, the control unit 39 returns the execution of the operation flow to step S13. In step S13 for the second time, the control unit 39 specifies the second die D adjacent to the first die D and controls the horizontal drive mechanism 35. Thereafter, step S13 to step S16 are repeatedly executed for the number of dies D.

  When the determination of all the dies D is completed in step S16, the control unit 39 advances the execution of the operation flow to step S17. In step S17, the control unit 39 controls the lower pallet transfer mechanism 37, the lifting mechanism of the pallet stocker 315, and the pallet transfer mechanism 32 to move the wafer pallet 7 to the supply position A (shown by a broken line in FIG. 7). . The wafer pallet 7 is returned from the lower pallet transfer port 317 to the pallet stocker 315, is lifted, and is transferred from the pallet transfer port 314 to the supply position A. In step S <b> 18, the control unit 39 rotates the common head 36 </ b> A forward so that the component imaging camera 34 faces upward. The operations in steps S11 to S18 can be performed in the setup work before the production of the substrate K is started.

  The subsequent operations associated with the production of the substrate K conform to steps S2 to S6 in the operation flow of FIG. 3 described in the first embodiment. However, the component supply device 3A of the second embodiment supplies only the die D determined to be usable in step S15.

  Step S11 in the operation flow of FIG. 8 corresponds to the imaging preparation step of the component supply method for the component mounter of the embodiment. Steps S12 to S14 correspond to an imaging step, and step S15 corresponds to a determination step. Further, step S17 corresponds to a supply preparation step, and step S18 and steps S2 to S5 correspond to a supply step.

In the component mounter of the second embodiment, a lower imaging position B that is a position below the supply position A and that can convey the wafer pallet 7 by the lower pallet conveying mechanism 37 is set. The die D is imaged from above the wafer pallet 7 which is turned upside down and turned downward and conveyed to the lower imaging position B. According to this, even when the wafer map is not used and a usable / unusable mark is marked on the upper surface of the die D, the defective die D can be determined by the imaging operation, and there is no possibility of erroneous supply.

  The component supply method of the component mounter of the embodiment includes an imaging preparation step (step S11) in which the wafer pallet 7 is transported to the lower imaging position B by the lower pallet transport mechanism 37, and an upper part of the wafer pallet 7 by the component imaging camera 34. An imaging step (steps S12 to S14) for capturing the upper surface of the die D from the image and acquiring the component image data, image processing of the component image data, and the die D based on the availability mark marked on the upper surface of the die D A determination step (step S15) for determining whether or not the sheet can be used, a supply preparation step (step S17) for transferring the wafer pallet 7 from the lower imaging position B to the supply position A by the lower pallet transfer mechanism 37 and the pallet transfer mechanism 32; The part imaging camera 34 watermarks the wafer pallet 7 and determines whether it can be used in the determination step. Capturing a D, and comprises a supply step of enabling the collection by mounting the nozzle 44 to recognize the position of the die D (step S18 and step S2 to S5), the. According to this, even when the wafer map is not used and a usable / unusable mark is marked on the upper surface of the die D, the defective die D can be determined by the imaging operation, and there is no possibility of erroneous supply.

(7. Application and modification of embodiment)
In the first embodiment, the component imaging camera 34 sequentially images the bottom surfaces of all the dies D on the dicing sheet S, but the present invention is not limited to this. That is, the component imaging camera 34 may capture the bottom surface of a limited number of dies D to recognize the positions, and the control unit 39 may obtain the positions of the other dies D by calculation. In the second embodiment, the entire common head 36A is inverted up and down, but only the component imaging camera 34 may be inverted up and down. Furthermore, instead of providing the upside down mechanism, a downward second component imaging camera may be additionally provided below the component imaging camera 34. The present invention can have various other applications and modifications.

1: Component mounter 2: Board transport device 3, 3A: Component supply device 31: Storage magazine 32: Pallet transport mechanism 33, 33U: Push-up mechanism 34, 34V: Component imaging camera 35: Horizontal drive mechanism 36, 36A: Common head 37: Lower pallet transport mechanism 39: Control unit 4: Component transfer device 41: Head drive mechanism 42: Mounting head 44: Mounting nozzle 5: Component camera 6: Control device 7: Wafer pallet 8: Tray pallet K: Substrate A: Supply position B: Lower imaging position D: Die (component) S: Dicing sheet P: Component

Claims (4)

A supply pallet for supplying a plurality of parts side by side in a horizontal plane, and a parts supply apparatus having a pallet transfer mechanism for pulling out the supply pallet from a storage magazine and transferring it to a supply position;
A mounting head having a mounting nozzle for picking up the component from above the supply pallet conveyed to the supply position and mounting the component on a positioned substrate, and a component having a head drive mechanism for driving the mounting head in two horizontal directions A component mounting machine comprising a transfer device,
The component supply device includes:
By the disposed below the feed position faces upwards, imaging the parts watermark the supply pallet transported to the supply position, taken by the mounting nozzle and recognize the position of the component Component imaging camera to enable, and
Further have a camera driving mechanism for driving the component imaging camera in the horizontal two directions,
A lower imaging position that is a position below the supply position and capable of conveying the supply pallet by the pallet conveyance mechanism is set,
The component imaging camera is turned upside down and faces downward, and images the component from above the supply pallet conveyed to the lower imaging position, or
A component mounter in which a second component imaging camera different from the component imaging camera images the component from above the supply pallet conveyed to the lower imaging position . The component is a die produced by dicing a semiconductor wafer, and the supply pallet holds and holds a plurality of the dies on the upper surface and stretches a dicing sheet having optical transparency so as to be stretchable. Wafer pallet,
The component supply device drives a push-up pin upward to extend the dicing sheet of the wafer pallet conveyed to the supply position, and pushes up the die while driving the push-up mechanism in two horizontal directions. A drive mechanism;
The component imaging camera, with imaging the die watermark the dicing sheet, wherein the doubling of the camera driving mechanism is driven by the horizontal driving mechanism, the component mounting apparatus according to claim 1. The supply pallet includes a supply tray having an optical transparency and having a plurality of cavities for placing the component, the component mounting apparatus according to claim 1. It is the component supply method of the component mounting machine as described in any one of Claims 1-3 ,
An imaging preparation step of transporting the supply pallet to the lower imaging position by the pallet transport mechanism;
An imaging step of acquiring the component image data by imaging the upper surface of the component from above the supply pallet by the component imaging camera or the second component imaging camera;
A determination step of performing image processing on the component image data and determining whether or not the component can be used on the basis of a usability mark marked on an upper surface of the component;
A supply preparing step of transporting the supply pallet from the lower imaging position to the supply position by the pallet transport mechanism;
And a supply step of enabling said parts watermark the supply pallet by the imaging camera captures the component is judged usable in the determining step, collected by the mounting nozzle and recognize the position of the component A component supply method for a component mounter.

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