JP4989384B2 - Component mounting equipment - Google Patents

Description

  The present invention relates to a component mounting apparatus for mounting a component that is held and transported by a mounting head on a wafer or the like on a member to be mounted.

This type of component mounting apparatus is disclosed in, for example, Patent Document 1, but includes a mounting head having a bonding nozzle that adsorbs a component such as a bare chip, and a wafer (component supply unit) on a mounting table (wafer table). A component such as a chip is recognized by a recognition camera, the recognized component is picked up by a bonding nozzle of the mounting head, the mounting head is moved in the horizontal direction, and the component is mounted on a lead frame which is a mounted member that has been conveyed.
JP 2006-135013 A

  However, in such a conventional component mounting apparatus, since the mounting head is provided with only one component suction portion (suction nozzle), the number of components that can be transported and mounted by reciprocating movement of the mounting head is one. There is a problem that the mounting time is long and the mounting time is long.

  Further, for example, Japanese Patent Application Laid-Open No. 2004-94568 describes a transfer head including a plurality of component suction units. When a plurality of parts are picked up from a wafer at once using such a transfer head and mounted on a member to be mounted, when there are abnormal parts when recognizing a plurality of parts on the wafer The transfer head reciprocates in a state where there is a component suction portion in which a component is not suctioned among a plurality of component suction portions provided in the transfer head, i.e., an empty component suction portion, As a result, there arises a problem that the transfer efficiency of the components is lowered.

  Therefore, the present invention has an object of improving the component mounting efficiency as much as possible by improving the transfer efficiency of components from the component supply unit to the mounted member by the head having a plurality of component holding units, that is, the conveyance efficiency. To do.

For this reason, the first invention includes a component supply device, a transport device that transports the mounted member, and a plurality of component holding portions, holds the component supplied from the component supply device , and moves onto the mounted member. Then, a head for mounting the component, a moving device that relatively moves the head and the component supply device in the horizontal direction, and the number of the component holding units among a plurality of components supplied by the component supply device. A camera that captures a large number of parts, and recognizes images of a plurality of parts that are larger than the number of parts holding parts among the parts captured by the camera, and recognizes whether the parts are non-defective and the position of the parts A recognizing device, a storage device storing the same number of non-defective products recognized by the recognizing device as the number of the component holding units, and the number of non-defective products sequentially recognized by the recognizing device from the number of the component holding units. Little In this case, the position of the non-defective product to be held next is stored in the storage device until the same number as the number of the component holding units, and the head and the moving device are based on the position stored in the storage device. controls, characterized in that a plurality of the non-defective same number of the component holder and a control device for holding by the component holder.

A second invention includes a component supply device, a transport device that transports a mounted member, and a head that includes a plurality of component holding portions and holds the components supplied from the component supply device and mounts them on the mounted member. A moving device that relatively moves the head and the component supply device in a horizontal direction, and a camera that captures a larger number of components than the number of the component holding units among a plurality of components supplied by the component supply device. A recognition device for recognizing images of a plurality of parts imaged by the camera and recognizing positions and non-defective products, and the number of the non-defective products based on the recognition result by the recognition device. And when the number of components recognized as non-defective is less than the number of the component holding units, the component holding unit holds the component at least next to the component imaged this time by the camera. The part is imaged, the position of the part and whether it is a non-defective product are recognized by the recognizing device, and all the parts that have been previously imaged and recognized as non-defective and the positions of the parts that are imaged next and recognized as non-defective are stored in the storage device Until the same number as the number of the component holding parts, and based on the non-defective product position stored in the storage device, the head and the moving device are controlled, and a plurality of the same number as the number of the component holding parts. And a control device for holding the non-defective product by the component holding unit.

  The present invention recognizes the position of a plurality of components to be supplied, and improves the component mounting efficiency as much as possible when the components are held on a plurality of component holding portions provided on the mounting head and mounted on a substrate or the like. Can do.

  Hereinafter, with reference to the accompanying drawings, an embodiment of a component mounting apparatus including an application head such as an adhesive that is a working head according to the present invention and a mounting head will be described. This component mounting apparatus mounts various electronic components on a printed circuit board or a lead frame.

  FIG. 1 is a plan view of a component mounting apparatus. On a component mounting apparatus main body 1, substrates (working members or mounted members) 2 and 3 that are supplied from a supply stocker (not shown) and each component is mounted are placed. The first and second work tables (hereinafter referred to as tables) 4 and 5 are conveyed to the coating and mounting unit 6 in the X-axis direction, and the mounting substrates 2 and 3 after the coating and mounting operations are finished are applied to the coating and mounting unit. First and second transport mechanisms 7 and 8, which are transport means for transporting from 6, are provided.

  The first and second transport mechanisms 7 and 8 are first and second ball screws 13 and 14 and first and second tables 4 and 5 that are rotationally driven by first and second motors 11 and 12, respectively. Nuts (not shown) that are provided on the lower surfaces of the first and second ball screws 13 and 14 and are provided along the first and second ball screws 13 and 14, and the first and second tables 4 and 4. 5 and a plurality of guides 16 for guiding 5.

  Moreover, the board | substrate 2 which is a to-be-mounted member is mounted in the 1st table 4 via the jig | tool 17, as shown in FIG. Two guide pins P are provided on the upper surface of the jig 17 so as to protrude upward at a predetermined interval. A guide hole 19 is formed in the substrate 2 corresponding to the guide pin P, and the guide pin P is the guide hole 19. The substrate 2 is positioned and placed on the jig 17. Similarly to the first table 4, the substrate 3 is placed on the second table 5 via a jig.

  Thus, since the substrate 2 is positioned and placed on the first table 4 via the jig 17 having the guide pins P, a guide hole is previously formed at a position corresponding to the guide pins P of the substrate. Alternatively, by preparing a jig provided with a guide pin corresponding to the guide hole for each substrate model, it is possible to easily cope with a change in the substrate model.

Reference numeral 20 denotes a diced semiconductor wafer (hereinafter referred to as a wafer, and a part such as a bare chip taken out from the wafer is hereinafter referred to as a part). It is a mounting table that is a wafer table that is mounted and supported and movable in the X-axis direction . Reference numeral 22 denotes a moving mechanism that moves the mounting table 21 in the X-axis direction. The moving mechanism 22 is a third ball screw 24 that is rotationally driven by a third motor 23, and a third ball screw that is provided on the lower surface of the mounting table 21. And a plurality of rails 25 that are provided along the third ball screw 24 and guide the mounting table 21.

  Further, 30 is supported by the component mounting apparatus main body 1, and in the Y-axis direction of the coating mounting unit 6, that is, a direction perpendicular to the transport direction of the first and second tables 4 and 5 and the moving direction of the wafer 20. It is the support arm provided in. A coating head 31 as a working head is provided on one side surface of the support arm 30 so as to be slidable in the Y-axis direction by the first linear motor 32, and mounted on the other side surface of the support arm 30. A head (working head) 33 is slidable in the Y-axis direction by a second linear motor 34.

  The coating head 31 is provided with, for example, a coating nozzle 35 that discharges a highly viscous adhesive and a substrate recognition camera 36, and the recognition camera 36 is a substrate placed on the first and second tables 4 and 5. The marks (not shown) provided in 2 and 3 are imaged. Also, the mounting head 33 is provided with a plurality of nozzles 40, for example, four component holders, for sucking and holding components from the wafer 20 with a gap in the moving direction of the mounting head 33, that is, the Y-axis direction. In addition, on the extended line in the direction in which the nozzles 40 are arranged, a wafer recognition camera 41 is provided on the upper surface of the component of the wafer 20 and images a bad mark indicating that the component is defective. Is provided.

  Further, 42 is a nozzle stocker provided on the upper surface of the component mounting apparatus main body 1 and movable in the X-axis direction, and stores a plurality of types of nozzles that can be exchanged with the nozzles 40 provided in the mounting head 33. .

  Reference numeral 43 denotes an electrical box provided on the side of the component mounting apparatus main body 1. The electrical box 43 includes the first and second motors 11 and 12, the third motor 23, and the first linear motor. 32 and the second linear motor 34 are controlled, and a control device 50 that also serves as a recognition device to be described later is provided. This control device 50 includes a CPU (Central Processing Unit) that controls the motor, the motor described above, and the like. A ROM (Read Only Memory) storing a program for controlling operation and a RAM (Random Access Memory) storing a model of a substrate to be transported, a model of a wafer, and the like are mounted.

  Reference numeral 44 denotes an upper part of the component mounting apparatus main body 1, which is a component recognition camera provided below the movement path of the mounting head 33.

  Hereinafter, the operation of the above-described component mounting apparatus will be described.

  In FIG. 1, the component mounting apparatus starts operation, the first table 4 moves in the X-axis direction, and the coating head 31 is placed on a substrate (hereinafter referred to as a first substrate) 2 on the first table 4. An adhesive is discharged from the application nozzle 35 and applied.

In this coating step, first, the first motor 11 is operated based on a signal from the control device, and the first table 4 is guided by the guide 16 and below the coating mounting portion 6, and one of the support arms 30. To the left side (left side in FIG. 1). Further, the operation of the first linear motor 32 causes the coating head 31 to move above the first substrate 2, and the substrate recognition camera 36 positioned above the positioning mark on the first substrate 2 images the positioning mark. Then, the CPU of the control device operates based on the imaging result, and recognizes the pattern position of the first substrate 2. Thereafter, the first motor 11 is operated, the first table 4 is moved in the X-axis direction , that is, the right direction in FIG. 1, and the coating head 31 is moved to the first substrate by the operation of the first linear motor 32. Move above 2. The first table 4 gradually moves in the X-axis direction based on the preset application position and the recognized pattern position of the first substrate 2, and the application head 31 moves in the Y-axis direction, that is, In FIG. 1, it moves up and down and descends, and the application nozzle 35 discharges the adhesive and applies it onto the first substrate 2. Thereafter, the first motor 11 and the first linear motor 32 are operated so that the coating head 31 and the coating nozzle 35 are positioned at the respective coating positions on the first substrate 2, and the first substrate 2 is moved along the X axis. The coating head 31 moves in the Y-axis direction and the coating nozzle 35 moves up and down to sequentially apply the adhesive onto the upper surface of the first substrate 2.

  Further, during the coating operation on the first substrate 2, the third motor 23 is operated based on a signal from the control device, and the mounting table 21 is guided by the guide 25 and moves rightward in FIG. .

  Further, the control device determines whether or not a nozzle necessary for picking up a component from the wafer 20 is attached to the mounting head 33. If the nozzle is attached, the mounting head 33 sends a signal from the control device. By the operation of the second linear motor 34 based on the above, it moves in the Y axis direction, that is, upward of the wafer 20. When the nozzles necessary for picking up components from the wafer 20 are not attached to the mounting head 33, the mounting head 33 moves above the nozzle stocker 42 by the operation of the first linear motor 32, and the mounting is performed. The nozzle 40 attached to the head 33 is accommodated in the nozzle stocker 42 and replaced with a nozzle necessary for picking up components from the wafer 20. After that, the mounting head 33 operates the second linear motor 34 to operate the wafer 20. Move upwards.

  Further, during the coating operation on the first substrate 2, for example, when the coating operation is almost finished, the second motor 12 is operated based on a signal from the control device, and the second substrate 3 is guided to the guide 16. It is below the coating mounting portion 6 and moves to one side of the support arm 30 (see FIG. 2).

  Further, during the coating operation on the first substrate 2, the third motor 23 is operated based on a signal from the control device 50, and the mounting table 21 is guided to the guide 25 and moves rightward in FIG. 1. To do. At least the component picked up on the wafer 20 is positioned on the other side of the support arm 30, and the operation of the second linear motor 34 moves the mounting head 33 above the wafer 2 as described above. Then, by the movement of the mounting head 33 in the Y-axis direction and the movement of the wafer 20 in the X-axis direction, the recognition camera 41 is first positioned above the plurality of components picked up by the wafer 2 and the plurality of components picked up. To collect images.

  Then, based on the imaging result, the control device 50 that also serves as a recognition device recognizes an image in the order in which the components are arranged, that is, in the order in which the components are picked up, and recognizes whether or not a bad mark is attached to the component. Further, the control device 50 recognizes the position of the component with no bad mark, that is, a non-defective product, and the third motor 23 and the second linear motor 34 are operated based on the recognition result. A component to be picked up from the wafer 20 is positioned below the nozzle 40, and the mounting head 33 is moved up and down to hold the electronic component by suction. Thereafter, similarly, the third motor 23 and the second linear motor 34 are operated, and the wafer 20 moves in the X-axis direction, and the mounting head 33 moves in the Y-axis direction. The components to be picked up sequentially are positioned, the mounting head 33 moves up and down, and each nozzle 40 sucks and holds the electronic components in order.

  Hereinafter, the component pick-up operation by the plurality of nozzles 40 provided in the mounting head 33 based on the recognition result of the plurality of components on the wafer 20 will be described in detail based on the flowchart of FIG.

  When the recognition camera 41 takes an image of the parts arranged on the wafer 20, a plurality of parts in the vertical direction, for example, in FIG. The parts 61, 62, 63, 64, 65 and the like to be picked up are in the visual field 51 and can be imaged simultaneously. At this time, in the visual field 51 of the recognition camera 41, five parts to be picked up, which is more than four nozzles 40 provided in the mounting head 33, are captured in the visual field. Further, a part of the part 66 to be picked up next to the part 65 is within the visual field 51.

  First, the control device 50 clears a component (die) position storage memory (hereinafter referred to as a component position memory) on the wafer, which is a part of the RAM. Next, the mounting head 33 moves to the image recognition position on the wafer 20, and the recognition camera 41 images the component. The controller 50 recognizes up to 5 (4 + 1, which is the number of nozzles) images of each component to be picked up based on the imaging result. At this time, as shown in FIG. 7, each component 61, 62, 63, 64 and 65 is not marked with a bad mark, the bad mark of each component is not recognized, and each component is a good product. The control device 50 recognizes the positions of the four components 61, 62, 63 and 64. Then, the recognized positions (coordinates) of the non-defective parts 61, 62, 63, and 64 are stored in the part position memory as shown in FIG.

  Note that the maximum number of components that the controller 50 recognizes after imaging of the components varies depending on, for example, the size of the component. If the size of the component is small and the number of components to be imaged is large, the maximum number of components For example, the number may be a number obtained by adding 2 or more to 4 as the number.

  In this way, the recognition camera 41 captures five pick-up target parts, which is more than the number of nozzles 40 included in the mounting head 33, and recognizes a larger number of parts than the number of nozzles 40. By doing so, the number of imaging can be reduced as much as possible even when a bad mark is attached to the component. Further, the recognition camera 41 images, for example, five parts to be picked up, which is more than four of the nozzles 40 provided in the mounting head 33, and the control device 50 takes the same number of parts as the number of nozzles 40. As a result, if there is a part with a bad mark, the part that has not been image-recognized among the parts that have been imaged may be recognized. By imaging the number of parts larger than the number of nozzles 40 provided in the mounting head 33 by the recognition camera 41, the number of times of imaging by the recognition camera 41 can be minimized.

  Next, the control device 50 determines whether four component coordinates are stored in the component position memory. As described above, since the coordinates of the four good parts are stored in the part position memory, the third nozzle 61, 62, 63 and 64 are sequentially picked up by the four nozzles 40. The motor 23, the second linear motor 34, and the lifting / lowering drive mechanism of the mounting head 33 output signals, and the four nozzles 40 suck and hold the respective components sequentially, pick them up sequentially, and the mounting head 33 moves to the mounting position. Moving.

  Further, when the control device 50 recognizes the respective images of the pickup contrast based on the imaging result, as shown in FIG. 10, only the part 64 among the parts 61, 62, 63, 64 and 65 is marked as bad. When the reference numeral 71 is attached, the control device 50 first recognizes the parts 61, 62, and 63 as non-defective products sequentially based on the image recognition result, and sequentially sets the position (coordinates) of each part to the part position. Save to memory.

  Next, the control device 50 recognizes the component 64 as a defective product and does not store the position of the component 64 in the component position memory, recognizes the component 65 to be picked up next as a non-defective product, and positions (coordinates) of the component 65. Is stored in the part position memory. Then, the control device 50 determines whether four component coordinates are stored in the component position memory. Since the four component coordinates of the components 61, 62, 63, and 65 are stored in the component position memory, the components 61, 62, 63, and 65 are sequentially transferred by the four nozzles 40 as described above. As picked up, signals are output to the third motor 23, the second linear motor 34, and the raising / lowering drive mechanism of the mounting head, and the four nozzles 40 pick up and hold the respective components sequentially, and pick up them sequentially.

  Thus, even when a bad mark is attached to the component 64, the component 65 is recognized and all four nozzles 40 provided on the mounting head 33 are used, and the four components are collectively collected. Since the pickup is performed, as will be described later, it is possible to convey all four components using all the nozzles 40 provided in the mounting head 33 and sequentially mount them on the substrate. The number of reciprocations 33 can be reduced as much as possible, and as a result, the mounting efficiency can be improved. Furthermore, in order to recognize a non-defective product, it is not necessary to move the recognition camera 41 once again to image other components, and the number of times the recognition camera 41 can be moved can be reduced as much as possible.

  Further, when the control device 50 recognizes each of the components picked up based on the imaging result, as shown in FIG. 11, two of the components 61, 62, 63, 64 and 65, the components 63 and 64. If a bad mark is attached to the part, the control device 50 recognizes that the parts 61 and 62 are sequentially non-defective based on the image recognition result, and sequentially positions the parts 61 and 62 in the part position memory. The parts 63 and 64 that have recognized the bad mark are recognized as defective products.

  Next, the control device 50 recognizes that the component 65 which is the next pickup target component of the component 64 is not marked with a bad mark and the component 65 is a non-defective product, and additionally stores the coordinates of the component 65 in the component position memory. . Then, the control device 50 determines whether four component coordinates are stored in the component position memory. Here, since the three component coordinates of the components 61, 62, and 65 are stored in the component position memory, and the four component coordinates are not stored, the control device 50 has images of all the components on the wafer. Determine whether the recognition is complete.

  When the control device 50 determines that the image recognition of all the components on the wafer is not completed, the image pickup position on the wafer, that is, the image recognition position is updated to the position where the next picked-up component is recognized. The Then, the mounting head 33 moves to the next updated image recognition position.

  Thereafter, again, the recognition camera 41 images the part. The control device 50 recognizes each component to be picked up based on the imaging result. At this time, as shown in FIG. 12, the bad mark 71 is not attached to each of the parts 66, 67, 68, 69, and 70 to which X is attached. The positions of the parts 66, 67, 68, 69 and 70 in the order of pickup are sequentially recognized. At this time, the control device 50 stores the non-defective parts 66, 67, 68, 69 and 70 so that four part coordinates are stored together with the three part coordinates already stored in the part position memory. Among them, the coordinates of one component 66 that is the next component to be picked up in the component 65 are additionally stored in the component position memory. In addition, when all the components 66, 67, 68, 69 and 70 are not recognized, and only one component 66, which is a component to be picked up next to the component 65, is recognized, and it is a non-defective product. The other components 67, 68, 69, and 70 may be added to the coordinates of the component 66 in the component position memory without image recognition.

  Next, the control device 50 determines whether four component coordinates are stored in the component position memory. Since the four component coordinates of the components 61, 62, 65, and 66 are stored in the component position memory, the components 61, 62, 65, and 66 are sequentially transferred by the four nozzles 40 as described above. As picked up, signals are output to the third motor 23, the second linear motor 34, and the raising / lowering drive mechanism of the mounting head, and the four nozzles 40 pick up and hold the respective components sequentially, and pick up them sequentially.

  In this way, when the parts 63 and 64 are marked with bad marks and the number of part coordinates stored in the part position memory is three and the number of nozzles 40 is smaller than the number of nozzles 40, the part 66, which is the part to be picked up next, 67, 68, 69 and 70, or only the component 66 is recognized, the component coordinates of the component 66 are added, and all four nozzles 40 provided on the mounting head 33 are used to pick up the four components. Therefore, as will be described later, four components can be sequentially mounted on the substrate by one reciprocating movement of the mounting head 33, and the number of reciprocations of the mounting head 33 accompanying the component mounting operation is minimized. As a result, the mounting efficiency can be improved.

  As described above, after the components are picked up by the nozzles 40 of the mounting head 33 and the application of the adhesive onto the first substrate 2 is completed, the first motor 11 is operated to operate the first substrate 2. Moves to the other side of the support arm 30 (the right side in FIG. 2). Further, the second linear motor 34 is operated, and the mounting head 33 passes above the component recognition camera 44 and moves above the first substrate 2. Then, based on the imaging result of each component imaged by the component recognition camera 44 when the mounting head 33 passes above the component recognition camera 44, that is, based on the position and orientation of the component sucked by each nozzle 40, The first motor 11 and the second linear motor 34 operate, the first substrate 2 moves in the X-axis direction, the mounting head 33 moves in the Y-axis direction, and each nozzle 40 is mounted sequentially. The nozzle 40 is moved up and down each time the component is mounted (bonded) on the first substrate 2 (see FIG. 2).

  When the pickup of all components from the wafer 20 has not been completed, the control device 50 clears the data in the component position memory.

  Thereafter, the mounting head 33 reciprocates between the upper side of the wafer 20 and the upper side of the first substrate 2, and components are mounted on the first substrate 2. During this time, the wafer mounting table 21 moves only in the X-axis direction by the operation of the third motor 23.

Further, the application head 31 is moved above the second substrate 3 by the operation of the first linear motor 32 (see FIG. 2). Then, the second table 5 gradually moves in the X axis direction , that is, in the right direction in FIG. 2, and the coating head 31 moves up and down in FIG. 2 to move up and down, and the first substrate 2 described above. The adhesive is sequentially applied to the upper surface of the second substrate 3 in the same manner as when the adhesive is applied to the upper surface of the second substrate 3.

  Thereafter, when the mounting operation of the components on the first board 2 is completed, the first motor 11 is continuously operated, the first table 4 is moved, and the first board 2 is moved to the first transport mechanism 7. While moving to the board delivery position 45, which is the right end, the second linear motor 34 starts operation, and the mounting head 33 starts moving in the Y-axis direction, that is, downward in FIG. Further, the operation of applying the adhesive to the upper surface of the second substrate 3 is continuously performed (see FIG. 3).

  Next, the first substrate 2 is transferred to a subsequent process at the substrate transfer position 45, and the mounting head 33 moves in the Y-axis direction (see FIG. 4), reaches the upper side of the wafer 20, and reaches each nozzle. After the component 40 has picked up the component, it passes above the component recognition camera 44 and reaches above the second transport mechanism 8. Also during this time, the operation of applying the adhesive onto the upper surface of the second substrate 3 is continued (see FIG. 4).

  Then, by the operation of the first motor 11, the first table 4 moves to the substrate take-in position 46 which is the left end portion of the first transport mechanism 7, and the next substrate 2 from the previous process is moved to the first position at this position. (See FIG. 5).

  Further, by the operation of the second motor 12, the second table 5 moves in the X-axis direction and moves to the other side (right side in FIG. 5) of the support arm 30. Then, as in the component mounting operation on the first substrate 2, the second linear motor 34 is operated, and the mounting head 33 in which each nozzle 40 sucks the component from the wafer 20 becomes the component recognition camera 44. It passes above and moves above the second substrate 3. Then, the control device operates based on the imaging result of each component by the component recognition camera 44, that is, the position and orientation of the component attracted by each nozzle 40, and the second motor 12 and the second linear motor 34 operate. As the second substrate 3 moves in the X-axis direction, the mounting head 33 moves in the Y-axis direction, and each nozzle 40 is positioned above the mounting position specified by the NC data. Ascending and descending, components are mounted on the first substrate 2 (see FIG. 5). Thereafter, the mounting head 33 reciprocates between the upper side of the wafer 20 and the upper side of the first substrate 2, and components are mounted on the first substrate 2. During this time, the wafer mounting table 21 moves only in the X-axis direction by the operation of the third motor 23.

  Thereafter, similarly, an adhesive application operation and a component mounting operation are sequentially performed on the first and second substrates 2 and 3 placed on the first and second tables 4 and 5 in the same manner.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

It is a top view of the component mounting apparatus at the time of the application | coating operation | work to the 1st board | substrate of embodiment of this invention. It is a top view of the component mounting apparatus at the time of component mounting to the 1st board | substrate. It is a top view of the component mounting apparatus when the 1st board | substrate arrives at a board | substrate delivery position and the coating operation is performed to the 2nd board | substrate. It is a top view of the component mounting apparatus when the 1st board | substrate is delivered to a post process and the application | coating operation | work is performed to the 2nd board | substrate. It is a top view of the component mounting apparatus when the component mounting operation | work to the 2nd board | substrate is performed while the 1st board | substrate is delivered from the front process. It is a perspective view of the jig | tool and a board | substrate which show the board | substrate support state on a jig | tool. It is a flowchart explaining the driving | operation of embodiment of this invention. It is explanatory drawing of the preservation | save state of the components position preservation | save memory on a wafer. It is explanatory drawing of an imaging state when all the comparison components of recognition processing are non-defective products. It is explanatory drawing of an imaging state when one component is the inferior goods among the comparison components of recognition processing. It is explanatory drawing of an imaging state when two components are inferior goods among the comparison components of the recognition process of the 1st time. Next, it is explanatory drawing of an imaging state when all the comparison components to be recognized are non-defective.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus main body 2, 3 1st and 2nd board | substrate (member to be mounted)
7, 8 First and second transport mechanisms (second transport means)
20 Wafer 21 Mounting table (wafer table)
22 Movement mechanism (conveyance mechanism)
30 Support arm 31 Coating head (working head)
33 Mounting Head 40 Suction Nozzle 50 Control Device 61 Parts 71 Bad Mark

Claims (2)

A component supply device, a conveying device that conveys a mounted member, and a head that includes a plurality of component holding portions, holds the component supplied from the component supply device , moves onto the mounted member, and mounts the component A moving device that relatively moves the head and the component supply device in a horizontal direction, and a camera that captures a larger number of components than the number of the component holding units among a plurality of components supplied by the component supply device. A recognition device that recognizes images of a plurality of components that are larger than the number of the component holding units among a plurality of components imaged by the camera, and recognizes whether the components are non-defective and the position of the components, and the recognition device A storage device that stores the same number of non-defective products recognized as the number of the component holding units, and the number of non-defective products sequentially recognized by the recognition device is smaller than the number of the component holding units, Retained The position of the non-defective product to be stored is stored in the storage device until the same number as the number of the component holding units, and the head and the moving device are controlled based on the position stored in the storage device, and the component holding unit A component mounting apparatus comprising: a control device that holds the same number of the non-defective products by the component holding unit. A component supply device; a transport device that transports a mounted member; a head that includes a plurality of component holders and that holds components supplied from the component supply device and mounts them on the mounted member; A moving device that moves the component supply device relatively in the horizontal direction, a camera that captures a larger number of components than the number of the component holding units among a plurality of components supplied by the component supply device, and an image captured by the camera A recognition device for recognizing images of a plurality of components and recognizing the position and whether or not it is a non-defective product, and a storage device for storing the same number of non-defective product positions as the number of the component holding units based on the recognition result by the recognition device When the number of components recognized as non-defective is less than the number of the component holding units, the component held by the component holding unit is imaged at least next to the component imaged this time by the camera. The position of the part and whether it is a non-defective product are recognized by the recognition device, and all the parts that have been imaged and recognized as non-defective products and the positions of the parts that have been imaged and recognized as non-defective products are stored in the storage device. Storing the same number as the number of parts, controlling the head and the moving device based on the position of the non-defective product stored in the storage device, and the plurality of non-defective products having the same number as the number of the component holding parts A component mounting apparatus comprising: a control device that is held by a component holding unit.