JP6122066B2 - 高周波超音波圧電素子、その製造方法、及びそれを含む高周波超音波プローブ - Google Patents
高周波超音波圧電素子、その製造方法、及びそれを含む高周波超音波プローブ Download PDFInfo
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- JP6122066B2 JP6122066B2 JP2015126268A JP2015126268A JP6122066B2 JP 6122066 B2 JP6122066 B2 JP 6122066B2 JP 2015126268 A JP2015126268 A JP 2015126268A JP 2015126268 A JP2015126268 A JP 2015126268A JP 6122066 B2 JP6122066 B2 JP 6122066B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000000523 sample Substances 0.000 title description 32
- 239000002131 composite material Substances 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 20
- 239000007921 spray Substances 0.000 claims description 19
- 238000005245 sintering Methods 0.000 claims description 7
- 239000010408 film Substances 0.000 description 108
- 239000000463 material Substances 0.000 description 15
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 9
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000003892 spreading Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- -1 zirconium alkoxide Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/093—Forming inorganic materials
- H10N30/097—Forming inorganic materials by sintering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/13—Tomography
- A61B8/14—Echo-tomography
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
以下、本発明の第1の実施形態に係る高周波超音波圧電素子10の製造方法及びその構成について図1(a)〜(f)及び図2を参照しながら説明する。
次に、本発明の第2の実施形態に係る高周波超音波圧電素子30について図4を参照しながら説明する。なお、本実施形態では、上記第1の実施形態及びその一変形例と同一の点については説明を省略し、異なる点についてのみ詳細に説明する。本実施形態に係る高周波超音波圧電素子30は、第1の実施形態に係る高周波超音波圧電素子10と比較して、特に下部電極としてロッド状の下部電極31を用いること、及び単一の圧電膜32及び上部電極35を形成することが異なる。
11、21、31 下部電極
12、22、32 圧電膜
13 マスク層
14 開口部
15、25、35 上部電極
26、36 凹部
Claims (3)
- 板状であり且つその表面に長さ方向に延びる1つの凹部を有する下部電極を準備するステップと、
前記下部電極の前記凹部の底面に、ゾルゲル溶液と圧電粉末とを含む複合体をスプレー法により塗布し、前記塗布された複合体を焼結して圧電膜を形成するステップと、
前記圧電膜の上に、前記凹部が延びる方向に沿って整列するように配置された複数の上部電極を形成するステップとを備え、
前記凹部の表面は曲面状であることを特徴とする高周波超音波圧電素子の製造方法。 - 板状であり且つその表面に長さ方向に延びる1つの凹部を有する下部電極を準備するステップと、
前記下部電極の前記凹部の底面に、ゾルゲル溶液と圧電粉末とを含む複合体をスプレー法により塗布し、前記塗布された複合体を焼結して圧電膜を形成するステップと、
前記圧電膜の上に上部電極を形成するステップとを備え、
前記圧電膜を形成するステップにおいて、前記下部電極の前記凹部の底面に、該凹部が延びる方向に沿って整列するように配置された複数の圧電膜を形成し、
前記凹部の表面は曲面状であることを特徴とする高周波超音波圧電素子の製造方法。 - ロッド状であってその端面に1つの凹部を有する下部電極を準備するステップと、
前記下部電極の前記凹部の底面に、ゾルゲル溶液と圧電粉末とを含む複合体をスプレー法により塗布し、前記塗布された複合体を焼結して圧電膜を形成するステップと、
前記圧電膜の上に上部電極を形成するステップとを備え、
前記圧電膜は前記凹部の内側にのみ形成されていることを特徴とする高周波超音波圧電素子の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015126268A JP6122066B2 (ja) | 2015-06-24 | 2015-06-24 | 高周波超音波圧電素子、その製造方法、及びそれを含む高周波超音波プローブ |
PCT/JP2016/067395 WO2016208425A1 (ja) | 2015-06-24 | 2016-06-10 | 高周波超音波圧電素子、その製造方法、及びそれを含む高周波超音波プローブ |
TW105119414A TWI693731B (zh) | 2015-06-24 | 2016-06-21 | 高頻超音波壓電元件、其製造方法以及包含該高頻超音波壓電元件的高頻超音波探頭 |
Applications Claiming Priority (1)
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JP2015126268A JP6122066B2 (ja) | 2015-06-24 | 2015-06-24 | 高周波超音波圧電素子、その製造方法、及びそれを含む高周波超音波プローブ |
Publications (3)
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JP2017011144A JP2017011144A (ja) | 2017-01-12 |
JP2017011144A5 JP2017011144A5 (ja) | 2017-02-16 |
JP6122066B2 true JP6122066B2 (ja) | 2017-04-26 |
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Country Status (3)
Country | Link |
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JP (1) | JP6122066B2 (ja) |
TW (1) | TWI693731B (ja) |
WO (1) | WO2016208425A1 (ja) |
Families Citing this family (1)
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KR101965171B1 (ko) * | 2018-08-24 | 2019-08-13 | (주)비티비엘 | 초음파센서의 제조방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH071920Y2 (ja) * | 1988-05-10 | 1995-01-18 | 東レ株式会社 | 超音波トランスデューサ |
JP2002008939A (ja) * | 2000-04-13 | 2002-01-11 | Fujitsu Ltd | 選択的コーティングによるセラミック体の製造方法 |
JP4759117B2 (ja) * | 2000-06-22 | 2011-08-31 | 日本特殊陶業株式会社 | 金属酸化物膜付き基板及び金属酸化物膜付き基板の製造方法 |
JP2004111835A (ja) * | 2002-09-20 | 2004-04-08 | Canon Inc | 圧電体素子の製造方法、圧電体素子及びインクジェット式記録ヘッド |
JP2005327919A (ja) * | 2004-05-14 | 2005-11-24 | Seiko Epson Corp | デバイスの製造方法及びデバイス、電気光学素子、プリンタ |
US7449821B2 (en) * | 2005-03-02 | 2008-11-11 | Research Triangle Institute | Piezoelectric micromachined ultrasonic transducer with air-backed cavities |
JP2012011024A (ja) * | 2010-07-01 | 2012-01-19 | Konica Minolta Medical & Graphic Inc | 超音波探触子、および超音波診断装置 |
JP5540361B2 (ja) * | 2011-06-07 | 2014-07-02 | 日立Geニュークリア・エナジー株式会社 | 超音波センサ及びその製造方法 |
JP2013168573A (ja) * | 2012-02-16 | 2013-08-29 | Mitsubishi Heavy Ind Ltd | 超音波厚みセンサの製造方法 |
JP2013207155A (ja) * | 2012-03-29 | 2013-10-07 | Mitsubishi Materials Corp | 強誘電体薄膜の製造方法 |
JP6132337B2 (ja) * | 2013-04-24 | 2017-05-24 | 国立大学法人電気通信大学 | 超音波診断装置及び超音波画像構築方法 |
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2015
- 2015-06-24 JP JP2015126268A patent/JP6122066B2/ja active Active
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2016
- 2016-06-10 WO PCT/JP2016/067395 patent/WO2016208425A1/ja active Application Filing
- 2016-06-21 TW TW105119414A patent/TWI693731B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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TWI693731B (zh) | 2020-05-11 |
WO2016208425A1 (ja) | 2016-12-29 |
JP2017011144A (ja) | 2017-01-12 |
TW201705560A (zh) | 2017-02-01 |
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