JP6018962B2 - Manufacturing method of crystal unit - Google Patents

Description

  The present invention relates to a method for manufacturing a crystal resonator used in an oscillation circuit such as a mobile phone.

  In the quartz crystal manufacturing method using the wet etching method, a wafer dedicated to frequency measurement is created for each lot as a method for managing the etching time to obtain the external dimensions that match the desired vibration frequency. There is a method of measuring the vibration frequency later and calculating the remaining etching time.

  In addition, as a method that does not use a dedicated wafer for frequency measurement, a dummy pattern for dimension measurement is placed on the same wafer as the crystal unit, and the external dimensions of the dummy pattern are measured, so that the desired crystal vibration can be obtained. There is a method of calculating the remaining etching time until the outer dimension of the child is obtained (see, for example, Patent Document 1).

  Also known as crystal resonators are tuning fork crystal resonators with grooves on the vibrating arms, and inverted mesa-type thickness-slip resonators with thin vibrating portions and thick support portions. In general, the outer shape of the vibrator and the concave portion such as a groove or a thin vibrating portion are performed in different processing steps, and a corrosion resistant film made of a Cr film or an Au film, or a resist film is applied to a quartz wafer. The desired crystal resonator is formed by patterning into a predetermined shape.

Japanese Patent No. 4482203

  When the crystal wafer is etched to form the external shape of the crystal unit and then etched again to form the recess, the crystal form is also etched again by the etching that forms the recess. Instead, it is necessary to calculate the etching conditions including the outer dimensions.

  In the method of measuring the external dimensions of the dummy pattern on the wafer, when the quartz wafer is etched multiple times, the Au film cannot be correlated with the actual size of the underlying quartz crystal due to the influence of side etching due to the illumination effect. Therefore, even if the dimension of the resist film or Au film part of the dummy pattern is measured, it cannot be used to calculate the etching rate or the remaining etching time.

  Although there is a method to measure the size of the crystal resonator on the dummy wafer by etching the dummy wafer at the same time and peeling off the resist film and corrosion resistant film, it takes man-hours and wafer cost to remove the resist film and corrosion resistant film. .

  The present invention provides a method for manufacturing a crystal resonator that enables easy and high-precision etching by calculating the etching time of a crystal wafer from the dimensions of a corrosion-resistant film of a dimension measuring unit provided on the crystal wafer. For the purpose.

A method of manufacturing a crystal resonator in which a plurality of crystal resonators are formed on a crystal wafer by wet etching, wherein the crystal resonator includes at least one recess, and the crystal wafer has a plurality of crystal resonators on the crystal wafer. A dimension measuring unit is provided, and the dimension measuring unit is provided with a corrosion-resistant film made of an upper Au film and a lower Cr film, and an outer shape etching step for forming the outer shape of the crystal resonator, and a recess in the crystal resonator. A recess etching step to be formed , and before the recess etching step, a step of removing the Au film on the Cr film provided in the dimension measuring portion, and a Cr film of the dimension measuring portion at the start of the recess etching in the recess etching step A step of measuring the size of the film, a step of measuring the size of the Cr film of the dimension measuring portion after a predetermined time has elapsed in the recess etching step, and at the time of starting the recess etching and etching the recess From the dimensional change of Cr film of dimension measuring unit after a predetermined time in the extent, to calculate an etching rate, to determine the recess etching time.

  Since the size of the Cr film, which is a corrosion-resistant film, has a correlation with the size of the underlying crystal, the size of the current crystal can be predicted by measuring the size of the Cr film in the dimension measuring section, It is possible to easily calculate the etching rate that varies depending on factors such as temperature and the remaining etching time up to the target dimension. In addition, since a measurement-dedicated wafer is not used, the crystal unit can be manufactured without losing the crystal unit member.

  According to the present invention, it is possible to provide a method for manufacturing a crystal resonator, which can easily calculate the etching time of a crystal wafer.

The figure for demonstrating the manufacturing method of the crystal oscillator of this invention. Diagram for explaining the outer shape etching process The figure for demonstrating a recessed part etching process

  In this embodiment, a process of manufacturing a plurality of grooved tuning fork type crystal resonators from a quartz wafer will be described as an example. FIG. 1 is a diagram for explaining a method for manufacturing a crystal resonator according to the present invention, and is an enlarged view showing a crystal resonator and a dimension measuring unit at the start of a recess etching process. FIG. 2 is a diagram for explaining the outer shape etching process. FIG. 3 is a diagram for explaining the recess etching process. 2 and 3 are image views of the AA cross section of the dimension measuring unit shown in FIG.

  First, a quartz wafer 9 is prepared. The quartz wafer 9 is cut out from the quartz raw stone with a predetermined cut angle, and is adjusted to a thickness of about 100 μm, for example.

  Corrosion-resistant films made of Au film 6 and Cr film 7 are formed on the front and back surfaces of quartz wafer 9. The Cr film 7 serves as a binder for bringing the Au film 6 and the crystal into close contact. In order to pattern the corrosion resistant film, a resist film 8 is formed on the front and back surfaces of the quartz wafer 9 on which the corrosion resistant film is formed. See FIG. 2 (a).

  Next, the resist film 8 is exposed and developed using an exposure mask for forming a tuning fork type crystal resonator shape, a frame portion shape, a dimension measuring portion shape, and the like on the quartz wafer. The portions of the Au film 6 and the Cr film 7 exposed by patterning the resist film 8 are etched to obtain a predetermined shape. See FIG. 2 (b).

  In the outer shape etching process, a crystal wafer 9 on which a corrosion-resistant film having a predetermined shape is formed is put into a crystal etching solution, and the outer shape of the tuning fork type crystal resonator 1, the frame portion 5, the dimension measuring portion 2, etc. Form. The dimension measuring unit 2 is formed with the same width as the vibrating arm 4.

  After the outer shape etching step, as shown in FIG. 1, a resist film 8 is formed using an exposure mask to form a groove (concave portion) 10 for increasing electric field efficiency on the vibrating arm 4 of the tuning fork type crystal resonator 1. Expose and develop. At that time, patterning for forming an equivalent groove (recess) 10 in the resist film 8 of the dimension measuring unit 2 and patterning for measuring the dimension of the Cr film 7 of the dimension measuring unit 2 are performed. Refer to FIG.

  The Au film 6 exposed by patterning of the resist film 8 is etched. Refer to FIG. When etching the Au film 6, not only the groove forming part but also the side part of the Au film 6 is etched. Therefore, in order to correlate with the dimensions of the tuning fork crystal resonator 1, the corrosion-resistant Cr film 7 It is desirable to use dimensions. Before the groove etching step, the width dimension W1 of the Cr film 7 of the dimension measuring unit 2 is measured.

  In the groove etching step, the exposed Cr film 6 and the quartz crystal are etched to form the groove (recess) 10 in the vibrating arm 4, and at the same time, the side surface of the vibrating arm 4 not covered with the corrosion resistant film and the base 3. The side surfaces and the like are simultaneously etched. The dimension measuring part is etched in the same manner. When a predetermined time, for example, 10 minutes elapses, the dimension W2 of the Cr film of the dimension measuring unit 2 is measured. Refer to FIG. The etching rate in the width direction is calculated from the difference from the width dimension W1 measured before the groove etching step, and the remaining etching time for obtaining the desired grooved tuning fork crystal resonator shape is determined.

  The groove etching process is restarted and etching is performed with the necessary remaining etching time. Refer to FIG.

  After the groove etching step, the resist film 8, the Au film 6, and the Cr film 7 are removed, and a plurality of grooved tuning fork type crystal resonator shapes are formed on the crystal wafer 9. Refer to FIG. Note that the resist film 8 may be removed before the groove etching step.

  According to the method for manufacturing a crystal resonator of the present invention, a dimension measurement unit that uses the remaining etching time for calculation in the same plane as the crystal wafer that forms the crystal resonator is provided, and from the dimensional change amount of the corrosion-resistant film, It is possible to calculate an etching rate and an etching time that vary depending on factors such as the concentration and temperature of the etching solution. Further, it is possible to manufacture a crystal resonator without requiring a dummy wafer in each lot, without wasting a member, and without losing a manufacturing waiting time.

As described above, the embodiment of the crystal resonator of the present invention has been described in detail. However, the present invention is not limited to such an embodiment, and the gist of the present invention is described in detail configuration, shape, material, and the like. Any change, addition, or deletion can be made without departing from the scope. For example, since the width of the dimension measurement part is used to calculate the etching rate and the remaining etching time, if the width is such that it is not etched by the etching time required to form a desired shape, the crystal vibration It does not have to be the same width as the child's vibrating arm.
Further, the underlying corrosion-resistant film may not be Cr but may be a material such as Ni.

Further, although the tuning fork type crystal resonator has been described as an example of the crystal resonator, it goes without saying that a thickness-shear resonator may be used.

DESCRIPTION OF SYMBOLS 1 Crystal oscillator 2 Dimension measurement part 3 Base part 4 Vibrating arm 5 Frame part 6 Au film 7 Cr film 8 Resist film 9 Quartz wafer 10 Groove (concave part)

Claims (1)

A method of manufacturing a crystal resonator in which a plurality of crystal resonators are formed on a crystal wafer by wet etching, wherein the crystal resonator includes at least one concave portion, and the plurality of crystal resonators are provided on the crystal wafer. A dimension measuring part is provided together with the vibrator, and the dimension measuring part is provided with a corrosion-resistant film made of an upper Au film and a lower Cr film, and forms an outer shape of the crystal vibrator, A recess etching step for forming the recess in the crystal resonator , and before the recess etching step, removing the Au film on the Cr film provided in the dimension measurement unit; and the recess etching step A step of measuring the size of the Cr film of the dimension measuring unit at the start of the recess etching in front of the dimension measuring unit after a predetermined time in the recess etching step Measuring a dimension of the Cr film, the dimensional change of the Cr film of the size measurement unit after the passage of the predetermined time in the recess etching step and during the recess etch initiation to calculate an etching rate, the recess etching time And a step of determining the crystal resonator.

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