JP5603621B2 - シート状モールド位置検出装置、転写装置および転写方法 - Google Patents
シート状モールド位置検出装置、転写装置および転写方法 Download PDFInfo
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- JP5603621B2 JP5603621B2 JP2010050452A JP2010050452A JP5603621B2 JP 5603621 B2 JP5603621 B2 JP 5603621B2 JP 2010050452 A JP2010050452 A JP 2010050452A JP 2010050452 A JP2010050452 A JP 2010050452A JP 5603621 B2 JP5603621 B2 JP 5603621B2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0003—Discharging moulded articles from the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/006—Handling moulds, e.g. between a mould store and a moulding machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
- B29C33/303—Mounting, exchanging or centering centering mould parts or halves, e.g. during mounting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
- B29C33/405—Elastomers, e.g. rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/04—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
- B29C2059/023—Microembossing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
ここで、平板状のシート状モールドMAにおける光の透過率を用いたシート状モールド位置検出手段191について詳しく説明する。
3 シート状モールド移送位置決め装置
5 転写装置
7 引き剥がし装置
27、27a シート状モールド作成装置
29 移送・転写・引き剥がしユニット
31 押圧体
33 被成型品設置体
35 緩衝材
37 基材
39 モールド接触材
183 シート状モールド位置検出装置
191 シート状モールド位置検出手段
AE1 転写パターン形成領域
AE2 転写パターン非形成領域
L1 エッジライン
M,MA シート状モールド
M1 微細な転写パターン
M3 マーク
MB モールド原反
S1 ラミネートフィルム
W 被成型品
Claims (3)
- 微細な転写パターンが形成されているシート状モールドを所定の方向に移送して位置決めするときに使用されるシート状モールド位置検出装置において、
前記シート状モールドにおける光の透過率または反射率を検出することによって、前記シート状モールドの所定部位を検出するシート状モールド位置検出手段を有し、
前記シート状モールド位置検出手段は、前記シート状モールドの表面を測定可能なように、ベース部材に固定して配置されていることを特徴とするシート状モールド位置検出装置。 - 請求項1に記載のシート状モールド位置検出装置を備えていることを特徴とする転写装置。
- 請求項1に記載のシート状モールド位置検出装置を用いてシート状モールドを位置決めする位置決め工程と、
前記位置決め工程で位置決めがされた前記シート状モールドから被成型品に微細な転写パターンを転写する転写工程と、
を有することを特徴とする転写方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010050452A JP5603621B2 (ja) | 2010-03-08 | 2010-03-08 | シート状モールド位置検出装置、転写装置および転写方法 |
EP11753206.9A EP2546048B1 (en) | 2010-03-08 | 2011-02-24 | Apparatus for detecting position of sheet-like mold, transfer apparatus and transfer method |
US13/583,191 US9649787B2 (en) | 2010-03-08 | 2011-02-24 | Sheet-shaped mold position detection device, transfer device and transfer method |
KR1020127026142A KR101413346B1 (ko) | 2010-03-08 | 2011-02-24 | 시트 형상 몰드 위치 검출 장치, 전사 장치 및 전사 방법 |
PCT/JP2011/054138 WO2011111546A1 (ja) | 2010-03-08 | 2011-02-24 | シート状モールド位置検出装置、転写装置および転写方法 |
TW100107162A TWI454368B (zh) | 2010-03-08 | 2011-03-03 | A sheet-like mold position detecting device, a transfer device, and a transfer method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010050452A JP5603621B2 (ja) | 2010-03-08 | 2010-03-08 | シート状モールド位置検出装置、転写装置および転写方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011183641A JP2011183641A (ja) | 2011-09-22 |
JP5603621B2 true JP5603621B2 (ja) | 2014-10-08 |
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Application Number | Title | Priority Date | Filing Date |
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JP2010050452A Active JP5603621B2 (ja) | 2010-03-08 | 2010-03-08 | シート状モールド位置検出装置、転写装置および転写方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9649787B2 (ja) |
EP (1) | EP2546048B1 (ja) |
JP (1) | JP5603621B2 (ja) |
KR (1) | KR101413346B1 (ja) |
TW (1) | TWI454368B (ja) |
WO (1) | WO2011111546A1 (ja) |
Families Citing this family (9)
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CN104704425B (zh) | 2012-09-06 | 2019-12-03 | Ev 集团 E·索尔纳有限责任公司 | 用于压印的结构印模、装置以及方法 |
JP6092561B2 (ja) * | 2012-10-01 | 2017-03-08 | 東芝機械株式会社 | 被成形体組立体、被成形体組立体の製造装置および被成形体組立体の製造方法 |
US20160141187A1 (en) * | 2014-11-14 | 2016-05-19 | Infineon Technologies Ag | Method of manufacturing an integrated circuit with imprint, integrated circuit with imprint, device for forming an integrated circuit with imprint and verification system for an integrated circuit with imprint |
CN104555405B (zh) * | 2014-12-23 | 2017-06-20 | 中国计量学院 | 翅片收集器 |
US10549494B2 (en) * | 2016-04-20 | 2020-02-04 | Himax Technologies Limited | Imprinting apparatus and imprinting method |
JP2017130678A (ja) * | 2017-03-09 | 2017-07-27 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | 型押し加工のための構造体スタンプ、装置および方法 |
KR20180105433A (ko) * | 2017-03-15 | 2018-09-28 | 주식회사 기가레인 | 임프린트 장치 및 임프린트 방법 |
JP6878117B2 (ja) * | 2017-04-25 | 2021-05-26 | 川崎重工業株式会社 | シート搬送装置及びシート搬送方法 |
KR102206491B1 (ko) * | 2019-11-04 | 2021-01-22 | 주식회사 기가레인 | 전사 장치 및 이를 이용한 전사된 기판의 생산 방법 |
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2010
- 2010-03-08 JP JP2010050452A patent/JP5603621B2/ja active Active
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2011
- 2011-02-24 EP EP11753206.9A patent/EP2546048B1/en active Active
- 2011-02-24 WO PCT/JP2011/054138 patent/WO2011111546A1/ja active Application Filing
- 2011-02-24 US US13/583,191 patent/US9649787B2/en active Active
- 2011-02-24 KR KR1020127026142A patent/KR101413346B1/ko active IP Right Grant
- 2011-03-03 TW TW100107162A patent/TWI454368B/zh active
Also Published As
Publication number | Publication date |
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EP2546048A1 (en) | 2013-01-16 |
KR101413346B1 (ko) | 2014-06-27 |
EP2546048A4 (en) | 2017-11-01 |
US9649787B2 (en) | 2017-05-16 |
EP2546048B1 (en) | 2023-12-20 |
WO2011111546A1 (ja) | 2011-09-15 |
TWI454368B (zh) | 2014-10-01 |
TW201213099A (en) | 2012-04-01 |
JP2011183641A (ja) | 2011-09-22 |
KR20120130246A (ko) | 2012-11-29 |
US20120326346A1 (en) | 2012-12-27 |
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