JP5361007B2 - 光学フィルム製造用金型の製造方法 - Google Patents
光学フィルム製造用金型の製造方法 Download PDFInfo
- Publication number
- JP5361007B2 JP5361007B2 JP2010546709A JP2010546709A JP5361007B2 JP 5361007 B2 JP5361007 B2 JP 5361007B2 JP 2010546709 A JP2010546709 A JP 2010546709A JP 2010546709 A JP2010546709 A JP 2010546709A JP 5361007 B2 JP5361007 B2 JP 5361007B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- optical film
- dimensional structure
- manufacturing
- lens
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000012788 optical film Substances 0.000 title claims description 91
- 238000004519 manufacturing process Methods 0.000 title claims description 28
- 238000012545 processing Methods 0.000 claims description 26
- 239000011324 bead Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910010293 ceramic material Inorganic materials 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 28
- 230000000052 comparative effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 230000007547 defect Effects 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 241000135309 Processus Species 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002493 microarray Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/00009—Production of simple or compound lenses
- B29D11/00278—Lenticular sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/16—Surface shaping of articles, e.g. embossing; Apparatus therefor by wave energy or particle radiation, e.g. infrared heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/26—Alloys of Nickel and Cobalt and Chromium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2011/00—Optical elements, e.g. lenses, prisms
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S425/00—Plastic article or earthenware shaping or treating: apparatus
- Y10S425/808—Lens mold
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Health & Medical Sciences (AREA)
- Ophthalmology & Optometry (AREA)
- Toxicology (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Optical Elements Other Than Lenses (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Description
[比較例1]
[比較例2]
Claims (9)
- レーザを用いて、光学フィルムに突起が形成されるように立体構造を金型の表面に重ねて加工するステップを含み、
前記金型の表面が凸凹面であり、
前記立体構造は、平均直径をD、平均高さをH、隣接した前記立体構造間の平均間隔をPとするとき、80×H1/3≦P≦200×H1/3及び0.1×D≦H≦Dを満たすように前記凸凹面の凹面に加工されることを特徴とする光学フィルム用金型の製造方法。 - 前記立体構造は、光学フィルムの幅方向に沿ってレーザの初期位相を変化させながら加工されることを特徴とする請求項1に記載の光学フィルム用金型の製造方法。
- 前記光学フィルムに凸レンズ状が形成されるように他の立体構造が前記凸凹面の凸面に重ねて加工されることを特徴とする請求項1または2に記載の光学フィルム用金型の製造方法。
- レーザを用いて、前記立体構造を金型の表面に重ねて加工するステップ以前にバイト加工またはビーズサンディングを通じて凸レンズ状の立体構造を陰刻するステップをさらに含むことを特徴とする請求項1から3の何れか1項に記載の光学フィルム用金型の製造方法。
- レーザを用いて、前記立体構造を金型の表面に重ねて加工するステップは、2回以上実施されることを特徴とする請求項1から4の何れか1項に記載の光学フィルム用金型の製造方法。
- 前記金型は、平板形状、キャタピラ型またはドラム型であることを特徴とする請求項1から5の何れか1項に記載の光学フィルム用金型の製造方法。
- 前記金型は、ニッケル、クロムまたはセラミックス材質であることを特徴とする請求項1から6の何れか1項に記載の光学フィルム用金型の製造方法。
- 前記金型は、ポリマーまたはシリカコーティングされたポリマー材質であることを特徴とする請求項1から6の何れか1項に記載の光学フィルム用金型の製造方法。
- 前記凸凹面は、前記光学フィルムにレンチキュラーレンズ、プリズム、マイクロレンズアレイまたはフレネルレンズ形状が形成される形状を有することを特徴とする請求項1に記載の光学フィルム用金型の製造方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20080019812 | 2008-03-03 | ||
KR10-2008-0019812 | 2008-03-03 | ||
PCT/KR2009/001049 WO2009110737A2 (en) | 2008-03-03 | 2009-03-03 | Process of making mold for optical film |
KR1020090018177A KR100958290B1 (ko) | 2008-03-03 | 2009-03-03 | 광학 필름 제작용 금형의 제조 방법 |
KR10-2009-0018177 | 2009-03-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011511724A JP2011511724A (ja) | 2011-04-14 |
JP5361007B2 true JP5361007B2 (ja) | 2013-12-04 |
Family
ID=41295149
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010546709A Active JP5361007B2 (ja) | 2008-03-03 | 2009-03-03 | 光学フィルム製造用金型の製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7985358B2 (ja) |
EP (1) | EP2247431B1 (ja) |
JP (1) | JP5361007B2 (ja) |
KR (1) | KR100958290B1 (ja) |
CN (1) | CN101939156B (ja) |
WO (1) | WO2009110737A2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2369515T3 (es) * | 2005-02-23 | 2011-12-01 | Flooring Industries Ltd. | Método para la fabricación de paneles de suelo, así como panel de suelo obtenido por medio de dicho método. |
KR100988463B1 (ko) * | 2008-03-03 | 2010-10-20 | 주식회사 엘지화학 | 광학 필름 및 그 제조 방법 |
JP5685770B2 (ja) * | 2009-10-20 | 2015-03-18 | 日産自動車株式会社 | 物品の表面構造 |
CN102452239A (zh) * | 2010-10-22 | 2012-05-16 | 韩国科学技术院 | 图案转印方法和图案转印装置以及利用该方法制造的产品 |
TWI439359B (zh) * | 2011-02-23 | 2014-06-01 | Chunghwa Picture Tubes Ltd | 製作模仁之方法及利用模仁製作光學膜的方法 |
KR101253557B1 (ko) * | 2012-11-12 | 2013-04-11 | 신화인터텍 주식회사 | 복합 광학 시트, 이를 포함하는 광원 어셈블리 및 액정 표시 장치 |
KR101470175B1 (ko) | 2013-06-26 | 2014-12-08 | 현대자동차주식회사 | 금형의 외관 레이저가공 방법 |
TWI527677B (zh) * | 2013-08-01 | 2016-04-01 | Lg化學股份有限公司 | 液晶透鏡用之對準膜及用於製造彼之模具 |
US9474327B2 (en) | 2013-08-19 | 2016-10-25 | Nike, Inc. | Sole structure masters, sole structure molds and sole structures having indicia and/or texture |
KR20150026167A (ko) * | 2013-09-02 | 2015-03-11 | 인스콘테크(주) | 뉴턴링 개선 복합 광학 필름 및 그 제조방법 |
CN106466926A (zh) * | 2015-08-19 | 2017-03-01 | 普昱光电股份有限公司 | 光学元件制造方法 |
GB201709379D0 (en) | 2017-06-13 | 2017-07-26 | Univ Leuven Kath | Humanised ADAMTS13 binding antibodies |
US12035489B2 (en) | 2021-09-23 | 2024-07-09 | Samsung Electronics Co., Ltd. | Electronic device including housing |
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IE883230L (en) * | 1988-10-25 | 1990-04-25 | Provost Fellows Ans Scholars O | Laser profiling of lenses |
JPH0747232B2 (ja) * | 1989-04-03 | 1995-05-24 | 大阪府 | 金属表面のレーザ加工方法 |
JP2673623B2 (ja) * | 1991-10-01 | 1997-11-05 | 旭化成工業株式会社 | 合成樹脂の成形法 |
JP2732173B2 (ja) * | 1992-09-17 | 1998-03-25 | 株式会社エンプラス | 導光体成形用金型の加工法 |
JP3343178B2 (ja) * | 1995-03-17 | 2002-11-11 | 株式会社荏原製作所 | 微細加工方法および微細加工装置 |
US6132652A (en) | 1995-11-02 | 2000-10-17 | Sanyo Electric Co., Ltd. | Method of producing lightguide plate for surface light source, lightguide plate for surface light source and surface light source using the same |
JPH09155875A (ja) * | 1995-12-04 | 1997-06-17 | Asahi Chem Ind Co Ltd | 樹脂導光板成形用金型及び該金型を用いた樹脂導光板の成形法 |
JP2001325821A (ja) * | 2000-05-19 | 2001-11-22 | Daiwa:Kk | 面光源装置用導光板及びその製造方法 |
JP4306940B2 (ja) * | 2000-09-19 | 2009-08-05 | 三菱レイヨン株式会社 | 光学シート製造用円筒形状型の洗浄方法 |
CN2447161Y (zh) * | 2000-10-25 | 2001-09-12 | 铼德科技股份有限公司 | 具可产生任何图样的母板之模具 |
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TWI275878B (en) | 2004-05-13 | 2007-03-11 | Nano Prec Corp | Method for manufacturing a light guiding plate and a light guiding plate with wrinkled patterns |
JP2006053371A (ja) * | 2004-08-12 | 2006-02-23 | Sumitomo Chemical Co Ltd | 防眩フィルム、その製造方法、そのための金型の製造方法、及び表示装置 |
JP2006168260A (ja) * | 2004-12-17 | 2006-06-29 | Kofu Casio Co Ltd | 導光板成形用金型の製造方法、導光板成形用金型、および導光板 |
JP5076334B2 (ja) * | 2006-03-08 | 2012-11-21 | 住友化学株式会社 | 表面に微細な凹凸形状を有する金型、その金型の製造方法及びその金型を用いた防眩フィルムの製造方法 |
JP2007298911A (ja) | 2006-05-08 | 2007-11-15 | Akito Inamura | 液晶表示用導光板 |
US20070281129A1 (en) * | 2006-06-06 | 2007-12-06 | Chi Kwong Chan | Diffuser films and methods for making and using the same |
JP2007328117A (ja) * | 2006-06-07 | 2007-12-20 | Sony Corp | レンチキュラーレンズシートおよびその製造方法、透過型スクリーンならびに背面投射型の画像表示装置 |
JP2008020532A (ja) * | 2006-07-11 | 2008-01-31 | Fujifilm Corp | 光学機能性シート及び表示装置 |
-
2009
- 2009-03-03 WO PCT/KR2009/001049 patent/WO2009110737A2/en active Application Filing
- 2009-03-03 JP JP2010546709A patent/JP5361007B2/ja active Active
- 2009-03-03 KR KR1020090018177A patent/KR100958290B1/ko active IP Right Grant
- 2009-03-03 EP EP09717520.2A patent/EP2247431B1/en not_active Not-in-force
- 2009-03-03 US US12/747,827 patent/US7985358B2/en active Active
- 2009-03-03 CN CN2009801042403A patent/CN101939156B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101939156B (zh) | 2013-07-10 |
US7985358B2 (en) | 2011-07-26 |
KR20090094778A (ko) | 2009-09-08 |
CN101939156A (zh) | 2011-01-05 |
WO2009110737A2 (en) | 2009-09-11 |
EP2247431A2 (en) | 2010-11-10 |
JP2011511724A (ja) | 2011-04-14 |
KR100958290B1 (ko) | 2010-05-19 |
EP2247431A4 (en) | 2011-10-19 |
EP2247431B1 (en) | 2014-08-06 |
WO2009110737A3 (en) | 2009-11-26 |
US20100276844A1 (en) | 2010-11-04 |
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