JP5190105B2 - LED lamp - Google Patents

Description

  The present invention relates to an LED lamp.

  Various LED lamps that can be used in place of light bulbs have been proposed as measures to save energy in lighting fixtures. The LED lamp includes a light source unit including an LED element. Patent Document 1 describes a light bulb-shaped LED lamp having a metal outer member for dissipating heat generated in an LED element. A concave portion is formed in the outer member of the LED lamp, and a power supply circuit for lighting the LED element is accommodated. In order to perform electrical insulation and thermal insulation for the outer shell member, an insulating member is provided between the inner surface of the recess and the power supply circuit.

JP 2006-313731 A

  As in Patent Document 1, by providing an insulating member between the inner surface of the recess and the power supply circuit, it is possible to electrically insulate the outer member touched by the user. However, since the insulating member is provided in the space for accommodating the power supply circuit, the accommodating space is narrowed accordingly. Since the accommodation space necessary for accommodating the power supply circuit must be secured in the lamp, the result is that the miniaturization of the lamp is hindered.

  An object of this invention is to provide the LED lamp which can achieve size reduction through ensuring heat dissipation and enlarging the accommodation space in a lamp | ramp.

  An LED lamp of the present invention for achieving the above object is formed of a base for power supply, a light source unit including an LED element, a power supply circuit for lighting the LED element, and a resin member, and the light source unit and A main body part in which a housing space for housing the power supply circuit is formed, a metal member, an attachment part for attaching the light source part, and heat generated in the light source part is conducted from the attachment part. A heat conducting plate including a conductive portion; a connection portion formed on one end side of the main body portion for connecting the base; and a translucent plate that is attached to the other end side of the main body portion and covers the light source portion. A cover, and a support portion provided in the main body portion and supporting the power supply circuit. The heat conducting plate is insert-molded when the body portion is formed from the resin member, and the heat conducting portion is provided integrally with the body portion. And, the heat generated in the light source part is conducted to the body part through the heat conduction part of the heat conducting plate and radiated, and the heat generated in the power supply circuit is sent to the body part. The second heat radiation route for conducting heat to heat and radiating heat is formed separately.

  The LED lamp has a main body portion formed from a resin member and a heat conduction plate formed from a metal member and insert-molded in the main body portion, and the heat generated in the light source portion is the heat of the heat conduction plate. Conducted to the main body through the conduction section and dissipated to the atmosphere (first heat dissipation route), and heat generated in the power supply circuit was conducted directly to the main body without passing through the heat conduction plate and dissipated to the atmosphere. (Second heat dissipation route). The distance that must carry the heat generated in the light source unit is the distance from the light source unit to the surface of the resin member that is the part that is finally released to the atmosphere. Most of this distance is constituted by a heat conducting plate formed from a metal member having a higher thermal conductivity than the resin member. The resin member with which the heat conducting portion of the heat conducting plate comes into contact has a lower thermal conductivity than the metal member, but the distance from the inner surface of the resin member to the surface of the resin member, that is, the thickness of the main body is relatively thin. Therefore, the heat generated in the light source part is quickly conducted from the mounting part of the heat conduction plate to every corner of the heat conduction part, and is conducted only for a short distance of the resin member constituting the main body part. Radiates heat to the atmosphere. The heat generated in the power supply circuit can be transmitted from the portion in contact with the main body portion to the main body portion at a short distance, and heat dissipation of the power supply circuit can be easily performed. In addition, since the first heat radiation route for radiating the heat generated in the light source unit and the second heat radiation route for radiating the heat generated in the power supply circuit are formed separately, the heat generated in the light source unit, and Each heat generated in the power supply circuit can be efficiently radiated. Therefore, even if it is a resin-made main-body part, heat dissipation can be ensured. Furthermore, by forming the main body part, which is a part that is touched by the user, from a resin member, safety can be ensured without providing other members having electrical insulation. It is not necessary to provide another electrically insulating member between the power supply circuit accommodated in the main body and the main body, and a large accommodating space can be secured in the main body. Conversely, if the size of the power supply circuit is the same, the size of the main body can be reduced, and as a result, the LED lamp can be reduced in size. Moreover, since it has the connection part for connecting a nozzle | cap | die formed in the one end side of a main-body part, it can be set as the form which connects a nozzle | cap | die directly to resin-made main-body parts. Therefore, according to the present invention, it is possible to provide an LED lamp that can ensure downsizing through ensuring heat dissipation and increasing the accommodation space in the lamp.

It is a perspective view which shows the LED lamp which concerns on 1st Embodiment. It is a schematic end view which shows an LED lamp. It is a disassembled perspective view which shows an LED lamp. It is a disassembled perspective view which shows a mode that the 1st division body and 2nd division body which comprise a main-body part are fastened. It is a perspective view which shows each of a 1st division body and a plate for heat conduction. 6A is a perspective view showing a state in which the heat conducting plate is provided in the first divided body from the inner surface side, and FIG. 6B is an end view taken along line 6B-6B in FIG. 6A. It is. FIG. 7A is a perspective view showing a state in which the power supply circuit is provided in the second divided body from the inner surface side, and FIG. 7B shows an enlarged portion indicated by reference numeral 7B in FIG. 7A. FIG. It is a perspective view which shows the modified example of the plate for heat conduction. It is a perspective view which shows the LED lamp which concerns on 2nd Embodiment. It is a disassembled perspective view which shows an LED lamp. It is a perspective view which shows the LED lamp which concerns on 3rd Embodiment. It is a disassembled perspective view which shows an LED lamp.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted. The dimensional ratios in the drawings are exaggerated for convenience of explanation, and are different from the actual ratios. Moreover, the end on the side where the base 20 is connected among both ends along the axial direction of the main body 50 is referred to as “one end 50 a”, “one end 120 a”, and “one end 220 a”, and the end on the side where the cover 90 covering the light source unit 30 is attached. These parts are referred to as “the other end 50b”, “the other end 120b”, and “the other end 220b”.

(First embodiment)
With reference to FIG. 1 and FIG. 2, the LED lamp 10 which concerns on 1st Embodiment has the external appearance shape similar to a general incandescent lamp, ie, a light bulb shape. In general, the LED lamp 10 is formed of a base 20 for power supply, a light source unit 30 including an LED element 31, a power supply circuit 40 for lighting the LED element 31, and a resin member. A main body 50 in which an accommodation space for accommodating the circuit 40 is formed, a heat conduction plate 80 provided in the main body 50, and a connection for connecting the base 20 formed on the one end 50 a side of the main body 50. Part 51, translucent cover 90 attached to the other end 50b side of main body part 50 and covering light source part 30, and support leg 75 (corresponding to a support part) provided in main body part 50 and supporting power supply circuit 40 And have. The heat conducting plate 80 is formed of a metal member, and includes a mounting portion 81 for mounting the light source unit 30 and a heat conducting unit 82 through which heat generated in the light source unit 30 is conducted from the mounting unit 81. The heat conducting plate 80 is insert-molded when the main body portion 50 is formed from a resin member, and the heat conducting portion 82 is provided integrally with the main body portion 50. In the LED lamp 10, the heat generated in the light source unit 30 is conducted to the main body unit 50 through the heat conducting unit 82 of the heat conducting plate 80 and radiated, and the heat generated in the power supply circuit 40. Is separated from the second heat radiation route for conducting heat to the main body portion 50 for heat radiation. Details will be described below.

  The power supply base 20 is connected to a socket portion of a lamp (not shown). The base 20 can be applied to other types of bases such as a screw type as well as a screw type.

  The light source unit 30 includes an LED element 31 and a substrate 32 on which the LED element 31 is mounted. The LED element 31 is, for example, a white LED.

  The power supply circuit 40 includes a plurality of electronic components 41 and a substrate 42 on which the electronic components 41 are mounted. The electronic component 41 includes a rectifier circuit component, a resistor, a semiconductor, and the like.

  The main body 50 has a trumpet shape whose outer diameter increases from the one end 50a side toward the other end 50b side. Since the main body 50 is touched by the user, the main body 50 is formed of an electrically insulating resin member. The resin member is not particularly limited, and an appropriate material can be applied as long as it has electrical insulating properties and can secure strength as a light bulb. For example, PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), ABS (acrylonitrile-butadiene-styrene), PC (polycarbonate), etc., or other materials for increasing the thermal conductivity (for example, ceramic) Can be mentioned. The main body 50 is formed by injection molding. The thickness of the main body 50 is not particularly limited, but is preferably relatively thin from the viewpoint of heat dissipation after satisfying the required strength. The thickness of the main body 50 is, for example, about 1.5 mm.

  The main body 50 is a part that is touched by the user in the state of a finished product, and since the main body 50 is formed of a resin member, safety is ensured without providing other electrically insulating members. Can do.

  Further, since the main body 50 is formed of a resin member, it is not necessary to provide another member having electrical insulation between the power supply circuit 40 accommodated in the main body 50 and the main body 50. For this reason, a large accommodation space can be secured in the main body 50, and the degree of freedom in design related to the size, configuration, arrangement form, and the like of the power supply circuit 40 is increased. If the size of the power supply circuit 40 is the same, the size of the main body 50 can be reduced, and as a result, the LED lamp 10 can be reduced in size. For example, according to JIS C 7501 conforming to the provisions of ICE 60630, the maximum outer diameter of the most commonly used incandescent bulb with an E26 / E25 size base and power consumption of 56 W or less is 56 mm or less, and its overall length is 104 mm or less. It is prescribed. A light bulb-shaped LED lamp 10 can be manufactured in a size conforming to the JIS standard.

  Since a resin molded product can be applied to the main body 50, the weight can be reduced and the manufacturing cost can be reduced compared to a metal main body. Through this, the LED lamp 10 can be reduced in weight and cost.

  Referring also to FIG. 3, the main body 50 includes a plurality of divided bodies 60 and 70 divided along a dividing line 52 extending from one end 50 a to the other end 50 b, that is, a plurality of vertically divided divided bodies 60. , 70. In the illustrated example, it is divided into two divided bodies 60 and 70. By configuring the main body 50 from the plurality of divided bodies 60 and 70, the degree of freedom in design is increased. In addition, since the mounting surface is largely opened rather than incorporating the components into the cylindrical shape, the mounting operation of the light source unit 30, the power supply circuit 40, and the heat conducting plate 80 is facilitated. The assembling workability of the lamp 10 can be greatly improved. For convenience of explanation, the two divided bodies 60 and 70 are respectively referred to as “first divided body 60” and “second divided body 70”.

  The first divided body 60 has a peripheral portion 61 and a disc portion 62 provided near the other end 50b. The disk portion 62 is formed with a window portion 63 that faces the mounting portion 81 of the heat conducting plate 80. The second divided body 70 has a peripheral portion 71. The second divided body 70 is assembled to the first divided body 60 with the disc portion 62 of the first divided body 60 interposed therebetween. The joint surface of the first divided body 60 and the joint surface of the second divided body 70 are provided with concave and convex portions 64 and 72 that are engaged by fitting when the first divided body 60 and the second divided body 70 are assembled. It has been. A holding groove 73 that holds the disc portion 62 of the first divided body 60 by fitting is provided near the other end 50b of the second divided body 70.

  Referring to FIG. 4, first divided body 60 and second divided body 70 are fixed by bolt fastening. Bolt holes 66 for inserting bolts 65 are formed on the outer surface of the peripheral portion 61 of the first divided body 60. Referring to FIG. 3, a holding cylinder portion 67 that holds a bolt 65 inserted from a bolt hole 66 is formed on the inner surface of the peripheral portion 61 of the first divided body 60. On the inner surface of the peripheral portion 71 of the second divided body 70, a fastening cylinder portion 74 for fastening the tip end portion of the bolt 65 is formed at a position facing the holding cylinder portion 67. The concave and convex portions 64 and 72 on the joint surface are engaged by fitting. In addition to fastening with the bolt 65, the concave and convex portions 64 and 72 may be joined by an adhesive, ultrasonic welding, or laser welding.

  Referring to FIG. 4, the bolt hole 66 is obscured by a blindfold plate 68. The blindfold plate 68 is provided with a leg portion 69 to be inserted into the holding cylinder portion 67. An engaging claw 69 a that engages with an engaging hole 67 a formed in the holding cylinder portion 67 is formed at the tip of the leg portion 69. By engaging the engagement claw 69a with the engagement hole 67a, the blindfold plate 68 is attached to the first divided body 60 (see FIG. 2).

  Referring to FIGS. 2 and 7A, a plurality of support legs 75 that support the substrate 42 of the power supply circuit 40 are formed on the inner surface of the peripheral portion 71 of the second divided body 70. The substrate 42 is attached so as to be in direct contact with the inner surface of the resin member constituting the main body 50. In order to increase the contact area with the main body 50 and increase heat conduction, a coating agent such as silicon oil having good heat conductivity may be filled between the substrate 42 and the inner surface of the resin member. The contact between the substrate 42 of the power supply circuit 40 and the main body 50 is ensured, and the heat generated in the power supply circuit 40 is efficiently conducted directly to the second divided body 70 without passing through the heat conducting plate 80. Because you can. “Directly” includes a case where the heat generated in the power supply circuit 40 is conducted to the second divided body 70 via the coating agent. Reference numeral 77 in FIG. 2 indicates a recess that holds the injected coating agent in a suppressed state. Silicon oil may also be applied between the substrate 42 and the support legs 75. This is because the contact between the substrate 42 of the power supply circuit 40 and the support leg 75 is ensured, and the heat generated in the power supply circuit 40 can be efficiently conducted to the second divided body 70 via the support leg 75 as well. .

  5 and 6A and 6B, the heat conducting plate 80 has a curved shape along the shape of the mounting portion 81 having a flat plate shape and the peripheral portion 61 of the first divided body 60. The heat conduction part 82 which has. The heat conducting plate 80 receives the heat generated in the light source unit 30 at the mounting unit 81 and conducts the heat to the heat conducting unit 82. For this reason, the attachment part 81 and the heat conduction part 82 are integrally formed so that there is no thermal resistance between them. In order to enhance heat conduction, the heat conduction plate 80 is formed of a metal member. The metal member is not particularly limited, and an appropriate material can be applied as long as it has good heat conduction and can secure the strength for attaching the light source unit 30. For example, aluminum (thermal conductivity 200 W / m · k) can be given.

  The heat conducting plate 80 is provided in the main body 50 with the mounting portion 81 facing the window 63 of the first divided body 60 and in contact with the main body 50 with at least a part of the heat conducting portion 82 and an area as large as possible. ing. The heat generated in the light source part 30 is conducted from the attachment part 81 to the heat conducting part 82, further conducted to the main body part 50, and radiated from the main body part 50 to the atmosphere.

  Processing for improving heat dissipation and improving the entanglement and adhesion of the first divided body 60 with the resin member to the surface facing the first divided body 60 of both surfaces of the heat conducting portion 82 of the heat conducting plate 80. May be applied. For example, you may give the process which raises an emissivity. This is because the amount of heat released by radiation from the heat conducting portion 82 to the first divided body 60 can be increased, and more heat can be transferred to the first divided body 60. An example of the process for increasing the emissivity is an alumite treatment. As will be described later, the heat conduction plate 80 is insert-molded. However, by anodizing, it is possible to improve the entanglement and adhesion between the alumite layer on the surface of the heat conduction portion 82 and the resin to be injected. On the other hand, it is preferable that the inner surface side of the heat conducting portion 82 is made of aluminum cloth so that heat is not radiated as much as possible inside the lamp where the power supply circuit 40 is installed. This is because the temperature rise inside the lamp can be suppressed. As a process for improving heat dissipation and improving the entanglement and adhesion of the first divided body 60 with the resin member, a method of painting only on one side in addition to the alumite treatment described above may be used. By coating, the entanglement and adhesion between the coating film on the surface of the heat conducting portion 82 and the resin to be injected can be improved, and heat dissipation is also improved.

  In the first embodiment, the heat conduction plate 80 is insert-molded when the first divided body 60 is formed from a resin member, and is provided integrally with the first divided body 60. This is because the heat conducting portion 82 of the heat conducting plate 80 can be brought into close contact with the first divided body 60, and heat conduction from the heat conducting plate 80 to the first divided body 60 can be improved. Moreover, manufacture becomes easy compared with the form which attaches the plate 80 for heat conduction to the 1st division body formed previously. In order to regulate the position in the mold of the heat conducting plate 80 at the time of insert molding, two set holes 83 are formed in the heat conducting portion 82 of the heat conducting plate 80. Further, in order to fix the heat conducting plate 80 by insert molding, the heat conducting portion 82 is formed with three holes 84 for entrapping the resin. As shown in FIG. 6 (B), resin is entangled around the heat conducting portion 82 by insert molding to form a locking portion 61a, and the heat conducting plate 80 is fixed to the first divided body 60. The By forming the locking portion 61 a, the heat conducting portion 82 of the heat conducting plate 80 is peeled off from the peripheral portion 61 of the first divided body 60 even when lighting (temperature rise) and light extinguishing (temperature fall) are repeated. There is nothing. For this reason, it is possible to prevent the adhesion between the heat conducting plate 80 and the first divided body 60 from deviating for a long time.

  As described above, by applying alumite treatment or coating to one surface of the heat conducting portion 82 of the heat conducting plate 80, the entanglement and adhesion between the heat conducting portion 82 and the resin to be injected can be improved, and heat radiation is also good. Become.

  The heat conducting portion 82 of the heat conducting plate 80 extends from the attachment portion 81 toward the one end 50 a of the main body 50 in a partial region of the main body 50 in the circumferential direction. The reason why the heat conducting portion 82 is extended in a partial region in the circumferential direction of the main body 50 is to form a region in the main body 50 where the heat conducting portion 82 is not disposed. Further, the heat conducting part 82 extends from the attachment part 81 toward the one end 50a of the main body part 50 because the heat generated in the light source part 30 is transferred to the other end 50b of the main body part 50 where the attachment part 81 is located. This is because heat is transferred over a wide area from the side toward the one end 50a side to enhance heat dissipation. And the power supply circuit 40 is attached to the main-body part 50 in the area | region where the heat conduction part 82 of the plate 80 for heat conduction is not arrange | positioned (refer FIG. 2 and FIG. 7 (A)). The heat generated in the power supply circuit 40 can be transmitted to the main body 50 at a short distance, and the heat dissipation of the power supply circuit 40 can be easily performed. As described above, the LED lamp 10 includes the first heat radiation route for radiating heat generated in the light source unit 30 through the heat conduction part 82 of the heat conduction plate 80 to the main body part 50 and the power supply circuit 40. The second heat radiation route for conducting the generated heat to the main body portion 50 to dissipate the heat is separated. Separating the first heat radiation route that carries heat from the light source unit 30 and radiates heat and the second heat radiation route that carries heat from the power supply circuit 40 and radiates heat, thereby improving the heat radiation performance of the LED lamp 10 as a whole. Can do.

  In particular, in the illustrated example, the divided body in which the heat conduction plate 80 is insert-molded is different from the divided body in which the power supply circuit 40 is supported. That is, the heat conducting plate 80 is insert-molded in the first divided body 60, and the power supply circuit 40 is supported by the second divided body 70 (see FIG. 2). Although the 1st division body 60 and the 2nd division body 70 are fitted and joined, the junction location between both becomes thermal resistance. Thereby, the first heat radiation route and the second heat radiation route can be further separated. The heat generated in the light source unit 30 is mainly transported through the first heat dissipation route and radiated from the first divided body 60, and the heat generated in the power supply circuit 40 is mainly transmitted through the second heat dissipation route. It is carried and radiated from the second divided body 70.

  The connecting portion 51 formed on the one end 50a side of the main body portion 50 has a screw shape for screwing and connecting the base 20. Since the main body 50 is formed of an electrically insulating resin member, the base 20 can be directly connected. In the case of the metal main body, an electrically insulating member must be provided between the base and the opening area on one end side of the metal main body is reduced by that amount. Parts such as a power supply circuit must be stored in the metal main body through a small opening area, so that the storage parts need to be miniaturized, etc., the degree of freedom in design is reduced, and the assembly workability is also reduced. On the other hand, according to the embodiment in which the base 20 is directly connected to the resin-made main body 50 as in the present embodiment, the number of components can be reduced because an electrically insulating member is not required. The opening area on the one end 50a side of the main body 50 can be increased. Accordingly, since the parts such as the power supply circuit 40 can be stored in the resin main body 50 through a relatively large opening area, there are few restrictions such as downsizing of the storage parts, the degree of freedom in design is increased, and assembly work is performed. Also improves.

  With reference to FIGS. 7A and 7B, a recess 53 for folding and arranging the wiring cable 43 connected to the power supply circuit 40 is provided on the joint surface in the connection portion 51. The recess 53 is formed by a rib 76 formed in the second divided body 70. The rib 76 is provided with a convex portion 76 a that forms substantially the same surface as the valley in the thread shape of the connecting portion 51. When the wiring cable 43 is folded back from the main body 50 and disposed in the recess 53, the range in which the wiring cable 43 protrudes from the thread of the connecting portion 51 can be limited to the range in which the convex portion 76a is provided. As a result, the wiring cable 43 can be prevented from being damaged when the base 20 is screwed into the connecting portion 51. The electrical connection between the wiring cable 43 and the base 20 can be performed only by screwing the base 20. In the present embodiment, the tip 43a of the wiring cable 43 is further folded and soldered onto the screwed base 20. If comprised in this way, the electrical connection with the wiring cable 43 and the nozzle | cap | die 20 can be performed in two places, and both electrical connection can be maintained over a long period of time.

  The translucent cover 90 has a hemispherical shape and is formed from a translucent resin material. The cover 90 is attached by fitting an opening edge portion to the other end 50 b side of the main body 50.

  The action of heat dissipation in the first embodiment will be described.

  In the LED lamp 10, each of the light source unit 30 and the power supply circuit 40 generates heat with use. The heat generated in the light source part 30 is received by the attachment part 81 of the heat conducting plate 80 and is conducted from the attachment part 81 to the heat conduction part 82. Further, the heat is conducted from the heat conducting portion 82 to the main body portion 50 and is radiated from the main body portion 50 to the atmosphere (first heat radiation route). On the other hand, the heat generated in the power supply circuit 40 is directly conducted to the main body 50 without passing through the heat conducting plate 80 in a region where the heat conducting portion 82 of the heat conducting plate 80 is not disposed. Heat is radiated from the portion 50 to the atmosphere (second heat dissipation route).

  The distance that must carry the heat generated in the light source unit 30 is the distance from the light source unit 30 to the surface of the resin member that is the part that is finally released to the atmosphere. Most of this distance is constituted by a heat conducting plate 80 formed of a metal member having a higher thermal conductivity than that of the resin member. The resin member with which the heat conducting portion 82 of the heat conducting plate 80 contacts has lower thermal conductivity than the metal member, but the distance from the inner surface of the resin member to the surface of the resin member, that is, the thickness of the main body 50 is relatively Thin (for example, about 1.5 mm). Therefore, the heat generated in the light source unit 30 is quickly conducted from the mounting portion 81 of the heat conducting plate 80 to every corner of the heat conducting unit 82 and conducted only for a short distance of the resin member constituting the main body unit 50. The heat is radiated from the surface of the resin member to the atmosphere. The heat generated in the power supply circuit 40 can be transmitted from the portion in contact with the main body portion 50 to the main body portion 50 at a short distance, and heat dissipation of the power supply circuit 40 can be easily performed. Further, since the first heat radiation route for radiating the heat generated in the light source unit 30 and the second heat radiation route for radiating the heat generated in the power supply circuit 40 are formed separately, the first heat radiation route generated in the light source unit 30 is generated. Each of the heat and the heat generated in the power supply circuit 40 can be efficiently radiated. Therefore, even if it is the resin-made main-body part 50, heat dissipation can be ensured.

  In particular, since the heat conduction plate 80 is insert-molded into the first divided body 60 and the power supply circuit 40 is supported by the second divided body 70, the first heat radiation route and the second heat radiation route are further separated. Has been. The heat generated in the light source unit 30 is mainly transported through the first heat dissipation route and radiated from the first divided body 60, and the heat generated in the power supply circuit 40 is mainly transmitted through the second heat dissipation route. It is carried and radiated from the second divided body 70.

  Since the heat generated in the light source unit 30 can be efficiently dissipated, the temperature rise of the LED element 31 can be suppressed, the decrease in light emission efficiency can be prevented, and the life can be extended. Since the heat generated in the power supply circuit 40 can also be efficiently dissipated, the temperature rise of the power supply circuit 40 can be suppressed, the operation reliability of the power supply circuit 40 can be maintained, and the life can be further extended.

  As described above, according to the LED lamp 10 of the first embodiment, the main body portion 50 formed of a resin member and the heat conduction plate 80 formed of a metal member are included, and heat is generated by insert molding. The heat conduction part 82 of the conduction plate 80 is provided integrally with the main body part 50, and the heat generated in the light source part 30 is conducted to the main body part 50 via the heat conduction part 82 of the heat conduction plate 80 to dissipate heat. The first heat dissipation route is separated from the second heat dissipation route that conducts the heat generated in the power supply circuit 40 to the main body 50 and dissipates the heat. For this reason, the heat generated in the light source section 30 is conducted to the main body section 50 through the heat conducting plate 80 and radiated to the atmosphere, and the heat generated in the power supply circuit 40 is also conducted to the main body section 50 and radiated to the atmosphere. be able to. Further, since the first heat radiation route for radiating the heat generated in the light source unit 30 and the second heat radiation route for radiating the heat generated in the power supply circuit 40 are formed separately, the first heat radiation route generated in the light source unit 30 is generated. Each of the heat and the heat generated in the power supply circuit 40 can be efficiently radiated. Therefore, even if it is the resin-made main-body part 50, heat dissipation can be ensured. Furthermore, by forming the main body 50, which is a part that is touched by the user, from a resin member, safety can be ensured without providing other members having electrical insulation. There is no need to provide another electrically insulating member between the power supply circuit 40 accommodated in the main body 50 and the main body 50, and a large accommodating space can be secured in the main body 50. In other words, if the size of the power supply circuit 40 is the same, the size of the main body 50 can be reduced, and as a result, the LED lamp 10 can be downsized. Moreover, since it has the connection part 51 for connecting the nozzle | cap | die 20 formed in the one end 50a side of the main-body part 50, it can be set as the form which connects the nozzle | cap | die 20 to the resin-made main-body part 50 directly. Therefore, according to the first embodiment, it is possible to provide the LED lamp 10 that can ensure the heat dissipation and can be downsized through the large accommodation space in the lamp.

  Since the main body 50 is composed of a plurality of divided bodies 60 and 70 divided along a dividing line 52 extending from one end 50a to the other end 50b, the degree of freedom in design increases, and the LED lamp 10 is assembled. Workability can be improved.

  Since the divided body (first divided body 60) in which the heat conduction plate 80 is insert-molded is different from the divided body (second divided body 70) in which the power supply circuit 40 is supported, heat radiation from the light source unit 30 is performed. The route and the heat dissipation route from the power supply circuit 40 can be further separated, and the heat dissipation performance can be improved.

  Since the LED lamp 10 has a light bulb shape, it is possible to provide an LED lamp that can be used in place of the current incandescent light bulb.

(Modification example of heat conduction plate)
Referring to FIG. 8, the heat conduction plate 100 of the modified example is formed of a metal member, like the heat conduction plate 80, and is generated in the light source part 30 and the attachment part 101 for attaching the light source part 30. And a heat conduction part 102 through which heat is conducted from the attachment part 101. In the heat conducting plate 100, the size of the heat conducting portion 102 is made larger than that of the heat conducting plate 80. If comprised in this way, since the contact area of the main-body part 50 and the heat conductive part 102 increases, the heat dissipation effect which thermally radiates the heat | fever generated in the light source part 30 from the main-body part 50 can be improved significantly.

(Second Embodiment)
FIG. 9 is a perspective view showing the LED lamp 110 according to the second embodiment, and FIG. 10 is an exploded perspective view showing the LED lamp 110. In addition, the same code | symbol is attached | subjected to the member which is common in 1st Embodiment, and the description is abbreviate | omitted in part.

  In the second embodiment, the main body 120 includes a plurality of divided bodies 130 and 140 that are vertically divided, and the main body 50 is composed of only the divided bodies 60 and 70 that are vertically divided. This is different from the first embodiment.

  Similar to the first embodiment, the LED lamp 110 according to the second embodiment has a light bulb shape. The LED lamp 110 is formed of a base 20, a light source unit 30 including an LED element 31, a power supply circuit 40, and a resin member, and a main body unit in which an accommodation space for accommodating the light source unit 30 and the power supply circuit 40 is formed. 120, a heat conducting plate 150 provided on the main body 120, a connection portion 51 for connecting the base 20 formed on one end 120a side of the main body portion 120, and the other end 120b side of the main body portion 120. A light-transmitting cover 90 that covers the light source unit 30 and a support leg 141 that is provided in the main body unit 120 and supports the power supply circuit 40 are provided. The heat conduction plate 150 is formed of a metal member, and includes an attachment part 151 for attaching the light source part 30 and a heat conduction part 152 through which heat generated in the light source part 30 is conducted from the attachment part 151. The heat conducting plate 150 is insert-molded when the main body 120 is formed from a resin member, and the heat conducting portion 152 is provided integrally with the main body 120. Also in this LED lamp 110, the heat generated in the light source unit 30 is generated in the power supply circuit 40 and the first heat dissipation route that conducts heat to the main body 120 through the heat conducting unit 152 of the heat conducting plate 150. A second heat radiation route for conducting heat to the main body 120 to dissipate heat is formed separately.

  The main body 120 includes at least a divided body 140 on the side where the connecting portion 51 is provided (also referred to as “base-side divided body”) and a divided body 130 on which the cover 90 is attached (also referred to as “cover-side divided body”). It is comprised from the some division body 130,140 divided | segmented into (1), ie, the some division body divided | segmented up and down. The cover-side divided body 130 further includes a plurality of vertically divided divided bodies 131 and 132 (two in the illustrated example). By configuring the main body 120 from the plurality of divided bodies 131, 132, and 140, the degree of freedom in design increases. Moreover, since the cover side division body 130 becomes a form where the attachment surface was opened largely, the attachment operation | work of the light source part 30 and the plate 150 for heat conduction becomes easy. Although the base side divided body 140 has a cylindrical shape, the axial dimension is relatively short due to the vertical division, so that the installation work of the power supply circuit 40 is not performed in the long cylindrical shape. Not complicated. Therefore, the assembly workability of the LED lamp 10 can be greatly improved. For convenience of explanation, the two divided bodies of the cover-side divided body 130 are referred to as “first cover-side divided body 131” and “second cover-side divided body 132”, respectively.

  The 1st cover side division body 131 has the surrounding part 133 and the semicircular disk part 134 provided near the other end 120b. The semicircular disc portion 134 is formed with a notch portion 135 that allows the mounting portion 151 of the heat conducting plate 150 to face. Similarly, the second cover side divided body 132 has a peripheral portion 136 and a semicircular disc portion 137 provided near the other end 120b. The semi-disc portion 137 is formed with a notch portion 138 that allows the attachment portion 151 of the heat conducting plate 150 to face. The first cover side divided body 131 and the second cover side divided body 132 are fixed by bolt fastening.

  The heat conducting plate 150 is attached to each of the first and second cover side divided bodies 131 and 132. The heat conduction plate 150 includes a mounting portion 151 having a flat plate shape, and a heat conduction portion 152 having a shape curved along the shapes of the peripheral portions 133 and 136. When the first and second cover-side divided bodies 131 and 132 are assembled, the attachment portions 151 are abutted with each other. The light source part 30 is attached so as to straddle the attached attachment part 151. The size of the heat conducting portion 152 in the heat conducting plate 150 is made as large as possible within the size range of the first and second cover side divided bodies 131 and 132. If comprised in this way, since the contact area of the cover side division body 130 and the heat conduction part 152 increases, the heat dissipation effect which thermally radiates the heat generated in the light source part 30 from the cover side division body 130 can be remarkably enhanced. it can.

  The base side divided body 140 has a hollow cylindrical shape and has a peripheral portion 142. A plurality of support legs 141 that support the substrate 42 of the power supply circuit 40 are formed on the inner surface of the peripheral portion 142. The board | substrate 42 is attached in the form which touches the inner surface of the resin member which comprises the main-body part 120 directly. In order to increase the contact area with the main body 120 and increase heat conduction, a coating agent such as silicon oil having good heat conductivity may be filled between the substrate 42 and the inner surface of the resin member. The cover side divided body 130 (the first cover side divided body 131, the second cover side divided body 132) and the base side divided body 140 are fastened and fixed by screws (not shown). In addition to fastening with screws, bonding may be performed by an adhesive, ultrasonic welding, or laser welding.

  In the LED lamp 110, the heat generated in the light source unit 30 is supplied to the cover-side divided body 130 (the first cover-side divided body 131 and the second cover-side divided body 132 through the heat conducting portions 152 of the respective heat conducting plates 150. ) And a second heat radiation route for conducting heat to the base-side divided body 140 to dissipate heat. Separating the first heat dissipation route that carries heat from the light source unit 30 and radiates heat and the second heat radiation route that carries heat from the power supply circuit 40 and radiates heat, thereby improving the heat radiation performance of the LED lamp 110 as a whole. Can do.

  In particular, the divided body in which the heat conduction plate 150 is insert-molded is different from the divided body in which the power supply circuit 40 is supported. That is, the heat conduction plate 150 is insert-molded into the cover side divided body 130 (the first cover side divided body 131 and the second cover side divided body 132), and the power supply circuit 40 is supported by the base side divided body 140. . The cover-side divided body 130 and the base-side divided body 140 are joined, but the joined portion between them becomes a thermal resistance. Thereby, the first heat radiation route and the second heat radiation route can be further separated. The heat generated in the light source unit 30 is mainly carried through the first heat dissipation route and is dissipated from the cover-side divided body 130 (the first cover-side divided body 131 and the second cover-side divided body 132). The heat generated in the circuit 40 is mainly transported through the second heat dissipation route and dissipated from the base side divided body 140.

  As described above, also by the LED lamp 110 of the second embodiment, the heat generated in the light source unit 30 is conducted to the cover-side divided body 130 via the heat conducting plate 150 and radiated to the atmosphere, and the power supply circuit The heat generated in 40 can also be conducted to the base side divided body 140 to be radiated to the atmosphere. Further, since the first heat radiation route for radiating the heat generated in the light source unit 30 and the second heat radiation route for radiating the heat generated in the power supply circuit 40 are formed separately, the first heat radiation route generated in the light source unit 30 is generated. Each of the heat and the heat generated in the power supply circuit 40 can be efficiently radiated. Therefore, even the resin main body 120 can ensure heat dissipation. The advantage of forming the main body 120, which is a part that is touched by the user, from a resin member is the same as that of the LED lamp 10 of the first embodiment. Therefore, according to the second embodiment, it is also possible to provide the LED lamp 110 that can ensure heat dissipation and can be reduced in size through a large accommodation space in the lamp.

  Since the divided body (cover-side divided body 130) in which the heat conduction plate 150 is insert-molded is different from the divided body (base-side divided body 140) in which the power supply circuit 40 is supported, heat dissipation from the light source unit 30 is performed. The route and the heat dissipation route from the power supply circuit 40 can be further separated, and the heat dissipation performance can be improved.

(Third embodiment)
FIG. 11 is a perspective view showing an LED lamp 210 according to the third embodiment, and FIG. 12 is an exploded perspective view showing the LED lamp 210. In addition, the same code | symbol is attached | subjected to the member which is common in 1st Embodiment, and the description is abbreviate | omitted in part.

  In the third embodiment, the main body unit 220 includes a plurality of divided bodies 230 and 240 that are vertically divided, and the main body part 50 is configured by only the divided bodies 60 and 70 that are vertically divided. This is different from the first embodiment. In addition, the shape of the lamp is different from the first and second embodiments.

  Unlike the bulb shape in the first and second embodiments, the LED lamp 210 according to the third embodiment has a thin cylindrical shape. The LED lamp 210 is formed of a base 20, a light source unit 30 including an LED element 31, a power supply circuit 40, and a resin member, and a main body unit in which an accommodation space for accommodating the light source unit 30 and the power supply circuit 40 is formed. 220, a heat conduction plate 250 provided in the main body 220, and a connection portion 51 (not shown in FIGS. 11 and 12) for connecting the base 20 formed on the one end 220a side of the main body 220. , A translucent cover 90 that is attached to the other end 220 b side of the main body 220 and covers the light source unit 30, and support legs 241 that are provided on the main body 220 and support the power supply circuit 40. The heat conducting plate 250 is formed of a metal member, and includes a mounting portion 251 for mounting the light source unit 30 and a heat conducting unit 252 in which heat generated in the light source unit 30 is conducted from the mounting unit 251. The heat conducting plate 250 is insert-molded when the main body 220 is formed from a resin member, and the heat conducting portion 252 is provided integrally with the main body 220. Also in the LED lamp 210, the heat generated in the light source unit 30 is generated in the power supply circuit 40 and the first heat dissipation route that conducts heat to the main body 220 through the heat conducting unit 252 of the heat conducting plate 250. A second heat radiation route that conducts heat to the main body 220 and radiates heat is formed separately.

  The main body 220 includes at least a divided body 240 on the side where the connecting portion 51 is provided (also referred to as “base-side divided body”) and a divided body 230 on which the cover 90 is attached (also referred to as “cover-side divided body”). It is comprised from the some division body 230,240 divided | segmented into (1), ie, the some division body divided | segmented up and down. By configuring the main body 220 from the plurality of divided bodies 230 and 240, the degree of freedom in design is increased. In addition, the cover-side divided body 230 and the base-side divided body 240 are cylindrical, but the dimensions in the axial direction are relatively short due to vertical division, so that the parts are not incorporated into the long cylindrical shape. The light source 30, the power supply circuit 40, and the heat conduction plate 250 can be easily attached, and the assembly workability of the LED lamp 10 can be greatly improved.

  The cover side divided body 230 has a hollow cylindrical shape, and includes a peripheral portion 231 and a top wall portion 232 provided at the other end 220b. A window portion 233 is formed on the top wall portion 232 so that the attachment portion 251 of the heat conducting plate 250 can face.

  The heat conducting plate 250 is attached to the cover side divided body 230. The heat conducting plate 250 has a hollow cylindrical shape, and includes a mounting portion 251 having a disc shape, and a heat conducting portion 252 concentric with the peripheral portion 231. The size of the heat conducting portion 252 in the heat conducting plate 250 is made as large as possible within the range of the size of the cover side divided body 230. If comprised in this way, since the contact area of the cover side division body 230 and the heat conduction part 252 increases, the heat dissipation effect which thermally radiates the heat generated in the light source part 30 from the cover side division body 230 can be remarkably enhanced. it can.

  The base side divided body 240 has a hollow cylindrical shape and has a peripheral portion 242. A plurality of support legs 241 that support the substrate 42 of the power supply circuit 40 are formed on the inner surface of the peripheral portion 242. The substrate 42 is attached so as to be in direct contact with the inner surface of the resin member constituting the main body 220. In order to increase the contact area with the main body 220 and increase heat conduction, a coating agent such as silicon oil having good heat conductivity may be filled between the substrate 42 and the inner surface of the resin member. The cover side divided body 230 and the base side divided body 240 are fastened and fixed by screws (not shown). In addition to fastening with screws, bonding may be performed by an adhesive, ultrasonic welding, or laser welding.

  The LED lamp 210 is generated in the power supply circuit 40 and the first heat radiation route for radiating the heat generated in the light source unit 30 through the heat conducting unit 252 of the heat conducting plate 250 to the cover side divided body 230 and radiating heat. A second heat radiation route for conducting heat to the base side divided body 240 to dissipate heat is formed separately. Separating the first heat radiation route that carries heat from the light source unit 30 and radiates heat and the second heat radiation route that carries heat from the power supply circuit 40 and radiates heat, thereby improving the heat radiation performance of the LED lamp 210 as a whole. Can do.

  In particular, the divided body in which the heat conducting plate 250 is insert-molded is different from the divided body in which the power supply circuit 40 is supported. That is, the heat conduction plate 250 is insert-molded into the cover side divided body 230, and the power supply circuit 40 is supported by the base side divided body 240. The cover-side divided body 230 and the base-side divided body 240 are joined, but the joint location between them becomes a thermal resistance. Thereby, the first heat radiation route and the second heat radiation route can be further separated. The heat generated in the light source unit 30 is mainly conveyed through the first heat dissipation route and radiated from the cover-side divided body 230, and the heat generated in the power supply circuit 40 is mainly transmitted through the second heat dissipation route. It is carried and dissipated from the base side divided body 240.

  As described above, the LED lamp 210 of the third embodiment also conducts heat generated in the light source unit 30 to the cover side divided body 230 via the heat conducting plate 250 and dissipates it to the atmosphere. The heat generated in 40 can also be conducted to the base side divided body 240 and released to the atmosphere. Further, since the first heat radiation route for radiating the heat generated in the light source unit 30 and the second heat radiation route for radiating the heat generated in the power supply circuit 40 are formed separately, the first heat radiation route generated in the light source unit 30 is generated. Each of the heat and the heat generated in the power supply circuit 40 can be efficiently radiated. Therefore, even if it is the resin-made main-body part 220, heat dissipation can be ensured. The advantage of forming the main body 220, which is a part that is touched by the user, from a resin member is the same as that of the LED lamp 10 of the first embodiment. Therefore, according to the third embodiment, it is also possible to provide the LED lamp 210 that can ensure the heat dissipation and can be downsized through the large accommodation space in the lamp.

  Since the divided body (cover-side divided body 230) in which the heat conduction plate 250 is insert-molded is different from the divided body (base-side divided body 240) in which the power supply circuit 40 is supported, heat radiation from the light source unit 30 is performed. The route and the heat dissipation route from the power supply circuit 40 can be further separated, and the heat dissipation performance can be improved.

(Other modifications)
Although the embodiment in which the main body portions 50, 120, and 220 are configured by combining a plurality of divided bodies has been described, the present invention is not limited to this case. The main body portion may not be formed by combining the divided bodies, but may be formed integrally.

(test)
Next, the test which confirmed the improvement of the heat dissipation performance of the LED lamp by this invention is demonstrated.

  The light bulb shaped LED lamp in the first embodiment was used for the test. Three types of resin members constituting the main body were used: general ABS resin, nylon-based high thermal conductivity resin, and LCP (liquid crystal polymer) -based high thermal conductivity resin. A general ABS resin has a thermal conductivity of 0.2 to 0.3 W / m · k, and a high thermal conductivity resin has a thermal conductivity of about 3 W / m · k for both a nylon base and an LCP base. The plate for heat conduction was manufactured from aluminum (thermal conductivity 200 W / m · k). In Examples 1 to 3, the heat conduction plate was insert-molded when the main body portion was formed from the three types of resin members, and the heat conduction portion was provided integrally with the main body portion. In Comparative Examples 1-3, the heat conducting plate was not insert-molded, and only the metal plate for attaching the light source part was attached in the main body part.

  After measuring the ambient temperature (room temperature), the LED was lit for a certain period of time, and the cathode temperature was measured as the reference point temperature. The LED power consumption was about 3 W of 9.8 V × 0.302 A = 2.96 W. For each of Examples 1 to 3 and Comparative Examples 1 to 3, the temperature increase ΔT at the reference point was measured. The measurement results are shown in Table 1 below.

  As shown in Table 1, in the example, the temperature increase ΔT at the reference point is smaller than the proportionality. Therefore, it has been confirmed that the heat dissipation is improved by insert molding the heat conducting plate and integrally providing the heat conducting portion on the main body. In particular, in Example 1 in which the main body portion is configured from a general ABS resin, the temperature rise ΔT at the reference point is smaller than in Comparative Examples 2 and 3 in which the main body portion is configured from a high thermal conductive resin. Therefore, it was confirmed that the heat dissipation was improved without using a high thermal conductive resin that is more expensive than a general ABS resin.

10, 110, 210 LED lamp,
20 clasp,
30 light source section,
31 LED element,
40 power circuit,
50, 120, 220 body,
50a, 120a, 220a, one end of the main body,
50b, 120b, 220b The other end of the main body,
51 connections,
52 dividing line,
60 1st division body (division body, division body in which the plate for heat conduction is insert-molded),
70 second divided body (divided body, divided body where the power supply circuit is supported),
75, 141, 241 Support leg (support part),
80, 100, 150, 250 plate for heat conduction,
81, 101, 151, 251 mounting part,
82, 102, 152, 252 heat conduction part,
90 translucent cover,
130, 230 Cover side divided body (divided body on which the cover is attached, divided body on which the heat conduction plate is insert-molded),
131 1st cover side division body,
132 second cover side divided body,
140, 240 Base side divided body (divided body on which the divided body power supply circuit on the side where the connecting portion is provided is supported).

Claims (5)

A power base, and
A light source unit comprising an LED element;
A power supply circuit for lighting the LED element;
A main body portion formed of a resin member, in which an accommodation space for accommodating the light source portion and the power supply circuit is formed,
A plate for heat conduction formed of a metal member and provided with an attachment part for attaching the light source part, and a heat conduction part in which heat generated in the light source part is conducted from the attachment part;
A connection part for connecting the base formed on one end side of the main body part;
A translucent cover attached to the other end of the main body and covering the light source;
A support part that is provided in the main body part and supports the power supply circuit;
The heat conducting plate is insert-molded when the body portion is formed from the resin member, and the heat conducting portion is provided integrally with the body portion,
Conducting heat generated in the light source section to the main body through the heat conducting section of the heat conducting plate to dissipate heat, and conducting heat generated in the power supply circuit to the main body And an LED lamp formed separately from the second heat radiation route for heat radiation.   2. The LED lamp according to claim 1, wherein the main body portion is composed of a plurality of divided bodies divided along a dividing line extending from the one end to the other end.   2. The LED according to claim 1, wherein the main body portion includes at least a plurality of divided bodies divided into a divided body on the side where the connection portion is provided and a divided body on the side on which the cover is attached. lamp.   The LED lamp according to claim 2 or 3, wherein a divided body in which the heat conducting plate is insert-molded is different from a divided body in which the power supply circuit is supported.   The LED lamp according to claim 1, which has a bulb shape.

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