CN204459933U - Lamp device and lighting device - Google Patents

Abstract

The utility model provides a kind of lamp device and lighting device.Lamp device comprises light emitting module, framework and lamp holder; Light emitting module has substrate and is installed on the light-emitting component of substrate; Framework has the resin portion of thermal diffusion plate and cover heating diffuser plate; Formed in a part for thermal diffusion plate and to expose and the substrate mounting surface faces of installation base plate from resin portion; Lamp holder is arranged at another side of framework.The utility model can realize lightweight and make manufacturing become good while guaranteeing thermal diffusivity.

Description

Light fixtures and lighting fixtures

technical field

Embodiments of the present invention relate to a lamp device using a light emitting element and a lighting device using the lamp device

Background technique

Conventionally, as a lamp device using a light-emitting element, there have been, for example, a flat lamp device using a GX53-type base, a bulb-type lamp device using an E-type base, and the like.

In such a lamp device, a metal frame such as aluminum casting is used, a light emitting module having a light emitting element is disposed on one end of the frame, and a base is disposed on the other end of the frame. In addition, the light-emitting element adopts a heat dissipation structure that transfers heat generated during lighting to the housing and dissipates heat from the housing to the air. Furthermore, in order to improve the heat dissipation from the housing, there is also a configuration in which heat dissipation fins are provided on the outer surface of the housing.

As described above, since the lamp device uses a metal frame in consideration of heat dissipation, there is a problem that it becomes heavy. Furthermore, since the metal surface is exposed on the outer surface of the lamp device, there is a problem that surface processing or painting of the housing is required.

Utility model content

A lamp device according to an embodiment includes: a light emitting module having a substrate and a light emitting element mounted on the substrate; a frame body on which the light emitting module is arranged on one end side; a lamp base provided on the other end side of the frame body; the lamp device The housing includes a thermal diffusion plate and a resin portion covering the thermal diffusion plate, and a substrate mounting surface exposed from the resin portion to mount the substrate is formed on a part of the thermal diffusion plate.

In the above lamp device, the housing includes a substrate mounting portion on which the substrate mounting surface is provided, and an outer peripheral portion formed around the substrate mounting portion, and is continuously connected from the substrate mounting portion to the outer peripheral portion. The thermal diffusion plate and the resin portion are formed.

In the lamp device, the substrate mounting portion has a plurality of mounting holes for mounting the base through the thermal diffusion plate and the resin portion at positions around the substrate mounting surface, and is mounted on the substrate. The inner side of the surface has a bonding portion penetrating through the resin portion of the thermal diffusion plate.

In the lamp device, the joint portion of the resin portion has a concave portion facing the substrate.

In the lamp device, only the substrate mounting surface of the thermal diffusion plate is exposed from the resin portion of the housing.

In the lamp device, a protrusion exposed from the resin part is provided on a part of the thermal diffusion plate, and the board mounting surface is formed on the protrusion.

In the lamp device, the size of the substrate of the light emitting module is larger than the size of the substrate mounting surface of the thermal diffusion plate.

A lighting device according to an embodiment includes the lamp device, and a socket for connecting the base of the lamp device.

[effect of utility model]

According to the present invention, it is expected that weight can be reduced and manufacturability can be improved while ensuring heat dissipation.

Description of drawings

Fig. 1 is a cross-sectional view showing a lamp device according to a first embodiment.

Fig. 2 is a perspective view of an exploded state of the lamp device.

Fig. 3 is a bottom view of the housing and the light emitting module of the lamp device.

Fig. 4 is a perspective view of a lighting device using a lamp device.

Fig. 5 is a cross-sectional view showing a lamp device according to a second embodiment.

Fig. 6 is a cross-sectional view showing a lamp device according to a third embodiment.

Reference signs:

10: Light device

11: frame

12: Lighting module

13: lampshade

14: Lamp holder

15: lighting circuit

20: Substrate mounting part

21: Peripheral part

22: Substrate mounting surface

23: Mounting hole

24: wiring hole

25: wall

26: locking part

28: Thermal diffusion plate

28a: Edge

29: Resin department

30: protrusion

31, 33, 35: through holes

32, 34, 37: junction

36: step department

38, 69: concave part

39: reflective surface

50: Substrate

51: Light emitting element

52: Connector

53: screw

56: claw

60: Lamp body

61: light foot

62: Annulus

63: Fitting part

64: protrusion

65: convex seat

66: screw

67: wedge groove

68: end face

70: Keep Department

71: Large diameter part

75: Circuit board

76: Electronic components

80: Lighting device

81: appliance body

82: lamp holder

83: lamp holder body

84: Through hole

85: connection hole

86: hole

87: Wedge

90: cover

91: Lamp holder

Detailed ways

A lamp device in an embodiment includes a light emitting module, a frame, and a lamp base. The light emitting module has a substrate and a light emitting element mounted on the substrate. The frame body has a thermal diffusion plate and a resin portion covering the thermal diffusion plate. A substrate mounting surface exposed from the resin portion to mount the substrate is formed on a part of the thermal diffusion plate. The lamp head is arranged on the other end side of the frame body.

According to the lamp device of the embodiment, it can be expected that weight can be reduced while ensuring heat dissipation, and manufacturability can be improved.

Hereinafter, a first embodiment will be described with reference to FIGS. 1 to 4 .

1 and 2 show a flat lamp device 10 . In addition, in the following description, one end side of the lamp device 10 is referred to as the front (front side or front surface), and the other end side is referred to as the rear (rear side or rear surface).

The lamp device 10 includes a frame body 11 , a light emitting module 12 and a lamp cover 13 mounted on the front side of the frame body 11 , a base 14 mounted on the rear side of the frame body 11 , and a lighting circuit 15 housed in the base 14 .

First, as shown in FIGS. 1 to 3 , the frame body 11 includes a substrate mounting portion 20 and an outer peripheral portion 21 formed on the outer peripheral portion of the substrate mounting portion 20 . The substrate mounting portion 20 is formed in a flat plate shape. The outer peripheral portion 21 is formed in a cylindrical shape, and protrudes toward the front side of the substrate mounting portion 20 .

At the center of the front surface of the substrate mounting portion 20, a substrate mounting surface 22 on which the light emitting module 12 is mounted is formed. At positions around the substrate mounting surface 22 , a plurality of mounting holes 23 are formed penetrating the substrate mounting portion 20 , and one wiring hole 24 is formed penetrating the substrate mounting portion 20 . A cylindrical wall portion 25 into which the base 14 is fitted protrudes from the rear surface of the substrate mounting portion 20 .

On the inner peripheral surface of the outer peripheral portion 21 , a plurality of locking portions 26 for mounting the lampshade 13 are protrudingly provided.

Furthermore, the housing 11 has a thermal diffusion plate 28 and a resin portion 29 covering the thermal diffusion plate 28 , and a substrate mounting surface 22 exposed from the resin portion 29 to mount the substrate 50 is formed on a part of the thermal diffusion plate 28 . The frame body 11 is integrally formed by, for example, insert forming in which the thermal diffusion plate 28 is covered with the resin portion 29 .

The thermal diffusion plate 28 is formed of, for example, a metal material that has a good thermal diffusion effect. Aluminum is used, for example, as the metal material. In the present embodiment, the thermal diffusion plate 28 is formed in a disk shape, and is disposed on the substrate mounting portion 20 .

At the center of the heat diffusion plate 28 is formed a protrusion 30 protruding toward the front side of the heat diffusion plate 28 and exposed on the front side of the resin portion 29 , and the board mounting surface 22 is formed on the front surface of the protrusion 30 . The substrate mounting surface 22 is formed in a quadrangular shape. In addition, the board mounting surface 22 is formed in a planar shape, and is flush with the front surface of the resin portion 29 around the board mounting surface 22 or slightly protrudes from the front surface of the resin portion 29 .

At the position of each mounting hole 23 , a through hole 31 is formed in the thermal diffusion plate 28 , and a resin portion 29 is formed in a cylindrical shape covering the inside of the through hole 31 (mounting hole 23 ). The resin portion 29 formed inside each mounting hole 23 insulates the thermal diffusion plate 28 and also serves as a bond for bonding the resin portion 29 on the front surface of the thermal diffusion plate 28 to the resin portion 29 on the rear surface of the thermal diffusion plate 28 . Part 32 functions.

A through-hole 33 is formed in the thermal diffusion plate 28 at the position of the wiring hole 24 , and the resin portion 29 is formed in a cylindrical shape to cover the inside of the through-hole 33 (wiring hole 24 ). The resin portion 29 formed inside the through hole 33 insulates the thermal diffusion plate 28 and also serves as a bonding portion for bonding the resin portion 29 on the front surface of the thermal diffusion plate 28 to the resin portion 29 on the rear surface of the thermal diffusion plate 28 . 34 while functioning.

A through hole 35 is formed in the thermal diffusion plate 28 at a position inside the substrate mounting surface 22 , and a step portion 36 is formed around the through hole 35 and on the front surface of the protruding portion 30 . Through-hole 33 and step portion 36 are continuously filled with molten resin from resin portion 29 on the rear surface of thermal diffusion plate 28 .

When the frame body 11 is insert-molded, the thermal diffusion plate 28 is arranged in the mold, the molten resin is filled into the mold to form the resin portion 29, and the thermal diffusion plate 28 is used as a gate for filling the molten resin in the mold. The through hole 35. Since the through hole 35 is located at the center of the board mounting part 20, the molten resin injected into the mold spreads evenly in the outer diameter direction of the board mounting part 20 and the outer peripheral part 21, and the molten resin can be filled in the entire formation area of the resin part 29.

The resin portion 29 filled inside the through hole 35 functions as a bonding portion 37 that bonds the resin portion 29 on the front surface of the thermal diffusion plate 28 (step portion 36 ) and the resin portion 29 on the rear surface of the thermal diffusion plate 28 . . On the front surface of the coupling portion 37, a concave portion 38 is formed by insert molding. In addition, when grease such as silicone is interposed in order to improve the adhesiveness when mounting the light-emitting module 12 on the substrate mounting surface 22 , the grease may be put in the recessed portion 38 in advance.

The resin part 29 is made of an insulating and highly reflective resin, for example, white. On the front surface of the substrate mounting portion 20 of the housing 11 and the inner peripheral surface of the outer peripheral portion 21 , a reflective surface 39 with high reflectivity is formed by the resin portion 29 .

Furthermore, the light emitting module 12 includes a substrate 50 and a light emitting element 51 mounted on the front surface of the substrate 50 . Furthermore, a connector 52 for connecting the light emitting element 51 and the lighting circuit 15 is mounted on the front surface of the substrate 50 .

The substrate 50 is formed in a quadrangular plate shape, for example, from metal such as aluminum having excellent thermal conductivity, ceramics, or the like. The size of the substrate 50 is formed to be any one of the following three types: the same as the substrate mounting surface 22 , larger than the substrate mounting surface 22 , or smaller than the substrate mounting surface 22 . On the front surface of the substrate 50, a wiring pattern is formed through an insulating layer, and the light emitting element 51 and the connector 52 are mounted on the wiring pattern. In addition, a white insulating layer having a high reflectance is formed on the wiring pattern except for mounting portions of the light emitting element 51 and the connector 52 . Moreover, the substrate 50 connects the rear surface of the substrate 50 to the substrate mounting surface 22 of the frame body 11, and through the substrate 50, a plurality of screws 53 are screwed to the protrusions 30 of the heat diffusion plate 28, thereby connecting with the heat diffusion plate. 28 hot connections.

The light-emitting element 51 is, for example, a light-emitting diode (LED). In this embodiment, as the light emitting element 51, a plurality of surface mount device (Surface Mount Device, SMD) packages on which LED chips are mounted are used. The light emitting element 51 emits white illumination light. In addition, the light emitting element 51 can be a chip on board (Chip On Board, COB) module, and other light emitting elements such as electroluminescence (EL) elements can also be used.

Furthermore, as shown in FIGS. 1 and 2 , the globe 13 is made of synthetic resin having translucency and diffusivity, and is formed in a disc shape. The shade 13 covers the lower surface of the frame body 11 , and is fitted and attached inside the outer peripheral portion 21 of the frame body 11 . Claw portions 56 that are attached to the locking portions 26 of the outer peripheral portion 21 are formed on the globe 13 .

Furthermore, the base 14 is, for example, a GX53 type base. The base 14 includes a base body 60 and a pair of lamp pins 61 protruding from the rear surface of the base body 60 (see FIG. 4 ).

The base body 60 is made of insulating resin and is integrally formed. The base body 60 includes an annular portion 62 , a cylindrical fitting portion 63 protruding from the peripheral portion of the annular portion 62 to the front side, and a cylindrical fitting portion 63 protruding rearward from the central region of the annular portion 62 . The protrusion 64. Accordingly, the front surface of the base body 60 is opened, and a space for accommodating the lighting circuit 15 is formed inside the base body 60 .

A plurality of protrusions 65 protrude from the front surface of the annular portion 62 . Furthermore, the fitting portion 63 is fitted to the wall portion 25 of the frame body 11 , and a plurality of screws 66 are screwed to the boss 65 through the mounting holes 23 of the frame body 11 , thereby fixing the frame body 11 and the lamp cap 14 .

A pair of L-shaped wedge grooves 67 are formed on the outer peripheral surface of the protruding portion 64 at positions symmetrical to the center of the base 14 and offset from the positions where the pair of lamp pins 61 are arranged. Moreover, the end surface 68 of the protrusion part 64 is formed in planar shape. In the center of the end surface 68, a concave portion 69 is formed corresponding to the position of the gate when the base body 60 is injection-molded in the mold. Furthermore, a plurality of holding portions 70 holding the lighting circuit 15 are formed on the inner peripheral surface of the protruding portion 64 .

The pair of lamp pins 61 are made of conductive metal, and have a large-diameter portion 71 formed at the tip.

Furthermore, the lighting circuit 15 includes a circuit board 75 and a plurality of electronic components 76 mounted on the circuit board 75 . Among the electronic components 76 , large electronic components 76 having leads are mounted on the front surface of the circuit board 75 , and chip-shaped small electronic components 76 are mounted on the rear surface of the circuit board 75 .

The circuit board 75 is inserted into the protruding portion 64 of the base 14 and is held by the base 14 by the holding portion 70 .

The input portion of the lighting circuit 15 is electrically connected to the pair of lamp pins 61 by electric wires. An electric wire with a connector is connected to an output portion of the lighting circuit 15 , and the electric wire with a connector is electrically connected to the connector 52 of the light emitting module 12 through the wiring hole 24 of the housing 11 . Furthermore, the lighting circuit 15 converts the input AC power into predetermined DC power and supplies it to the light emitting element 51 of the light emitting module 12 .

Next, a lighting device 80 using the lamp device 10 is shown in FIG. 4 . The lighting device 80 is, for example, a downlight. The lighting device 80 includes a fixture body 81 , a lamp holder 82 and the lamp device 10 .

The lower part of the tool body 81 is opened, and is also configured as a reflector.

The lamp holder 82 includes a lamp holder body 83 and terminals accommodated in the lamp holder body 83 . The socket main body 83 is made of insulating resin and formed in a ring shape, and an insertion hole 84 through which the protruding portion 64 of the lamp device 10 is inserted is formed in the center.

On the lower surface of the socket main body 83 , a pair of connection holes 85 into which the respective lamp pins 61 of the lamp device 10 are inserted and rotated are formed at positions symmetrical to the center of the socket 82 . The connection hole 85 is a long hole extending along the circumference of the socket body 83 , and a hole 86 through which the large-diameter portion 71 of the lamp pin 61 can be inserted is formed at one end thereof. Inside each connection hole 85 is accommodated a terminal electrically connected to the lamp pin 61 inserted into the connection hole 85 .

A wedge 87 protrudes from the inner peripheral surface of the socket body 83 , and the wedge 87 is inserted into the outer periphery of the protruding portion 64 formed on the lamp cap 14 as the lamp pin 61 of the lamp cap 14 is inserted into the connecting hole 85 and rotated. The substantially L-shaped wedge groove 67 on the surface supports the base 14 on the base body 83 .

Next, the operation of this embodiment will be described.

When mounting the lamp device 10 on the lamp holder 82, the protruding portion 64 of the lamp cap 14 is inserted into the insertion hole 84 of the lamp holder 82, and each lamp pin 61 of the lamp device 10 is inserted into the connection hole of the lamp holder 82. 85 in. Correspondingly, the wedge grooves 67 of the lamp cap 14 engage in the wedges 87 of the lamp holder 82 .

In the state where the lamp device 10 is pressed to the lamp holder 82, by turning the lamp device 10 in the installation direction, each lamp pin 61 of the lamp device 10 moves in the connection hole 85 of the lamp holder 82 and is arranged in the connection hole. Each terminal inside 85 is electrically connected, and the wedge groove 67 of the base 14 is fitted into the wedge 87 of the socket 82 , so that the lamp device 10 is supported by the socket 82 .

Furthermore, AC power is supplied to the lighting circuit 15 through the terminal of the lamp holder 82 and the lamp pin 61 of the lamp device 10, whereby the lighting circuit 15 converts the AC power into a predetermined DC power and supplies it to the light emitting element 51 of the light emitting module 12, Thus, the light emitting element 51 emits light.

The light from the light emitting element 51 passes through the globe 13 and is irradiated to the lighting space.

The heat generated when the light-emitting element 51 emits light is mainly conducted to the substrate 50 , and is conducted from the substrate 50 to the thermal diffusion plate 28 of the housing 11 . The heat conducted from the substrate 50 is diffused in the radial direction of the thermal diffusion plate 28 at the central portion of the thermal diffusion plate 28 , and the heat is conducted from the thermal diffusion plate 28 to the resin portion 29 over the entire area of the thermal diffusion plate 28 . Thus, the heat conducted to the resin portion 29 is dissipated from the outer surface of the resin portion 29 into the air. Furthermore, it is also conducted from the frame body 11 to the base 14 , is emitted from the base 14 into the air, and is emitted from the base 14 to the socket 82 .

The heat generated by the electronic components 76 of the lighting circuit 15 is mainly dissipated from the base 14 to the air, and is also dissipated from the base 14 to the socket 82 .

Furthermore, according to the lamp device 10 of the present embodiment, the housing 11 is formed by insert molding in which the thermal diffusion plate 28 is covered with the resin portion 29 , so that heat dissipation can be achieved while reducing weight, and it is not necessary to be formed of a metal material. Manufacturability can be improved by surface processing or painting of the entire frame body. In addition, since the outer surface of the frame body 11 is made of resin instead of metal, damage can be reduced even if the frame body 11 touches a certain part when operating the lamp device 10 .

Furthermore, since the resin part 29 is formed of a white highly reflective resin, a reflective surface 39 with high reflectivity can be formed on the front surface of the substrate mounting part 20 of the frame body 11 and the inner peripheral surface of the outer peripheral part 21, so that the reflective surface 39 can be efficiently formed. The light diffusely reflected inside the lamp cover 13 is reflected to the outside by the reflective surface 39 , so that the light extraction efficiency of the lamp device 10 can be improved.

Furthermore, on the substrate mounting portion 20, a plurality of mounting holes 23 for mounting the base 14 are provided at positions around the substrate mounting surface 22 through the thermal diffusion plate 28 and the resin portion 29, and at positions inside the substrate mounting surface 22, Since the bonding portion 37 penetrating the resin portion 29 of the thermal diffusion plate 28 is provided, even if a load is applied to the periphery of the mounting holes 23 due to screwing, the resin portion 29 will not spread heat from the mounting holes 23 between the mounting holes 23. The plate 28 floats so that the bonded state between the thermal diffusion plate 28 and the resin portion 29 can be maintained. Furthermore, when the frame body 11 is insert-molded, the thermal diffusion plate 28 is arranged in the mold, and the molten resin is filled into the mold to form the resin portion 29, but the portion of the bonding portion 37 is used as a gate for filling the molten resin into the mold. , and the molten resin injected into the mold spreads uniformly over the entire formation region of the resin portion 29 , so that the entire formation region of the resin portion 29 can be filled with molten resin.

Furthermore, since only the substrate mounting surface 22 of the thermal diffusion plate 28 is exposed from the resin portion of the frame body 11, even if the substrate 50 of the light emitting module 12 is made of metal and its metal surface is in contact with the substrate mounting surface 22, the outer surface of the frame body 11 is not exposed. No current flows, ensuring insulation without using a special insulating structure.

Moreover, when the size of the board|substrate 50 is larger than the board|substrate mounting surface 22, exposure of the metal surface of the thermal diffusion plate 28 is reduced, and a reflection effect can be improved.

Next, FIG. 5 shows a second embodiment. In addition, the same code|symbol is used for the same structure as 1st Embodiment, and the description about the structure and operation effect is abbreviate|omitted.

A thermal diffusion plate 28 is formed continuously from the substrate mounting portion 20 to the outer peripheral portion 21 of the housing 11 . That is, the cylindrical edge part 28a arrange|positioned at the outer peripheral part 21 is formed around the thermal diffusion plate 28. As shown in FIG.

In this manner, the thermal diffusion plate 28 has the cylindrical edge portion 28 a disposed on the outer peripheral portion 21 of the frame body 11 , thereby enhancing the heat dissipation effect from the outer peripheral portion 21 of the frame body 11 .

Next, FIG. 6 shows a third embodiment. In addition, the same code|symbol is used for the same structure as 1st Embodiment, and the description about the structure and operation effect is abbreviate|omitted.

FIG. 6 shows a lamp device 10 in the form of a light bulb.

The lamp device 10 includes a frame body 11, a light-emitting module 12 installed on the front side of the frame body 11, a dome-shaped lampshade 13, a cover 90 and a lamp cap 91 installed on the rear side of the frame body 11, and a lamp housed in the cover 90. Lighting circuit 15.

The housing 11 and the light emitting module 12 are configured in the same manner as in the first embodiment. The cover 90 is made of insulating synthetic resin, and is attached to the frame body 11 on the front side, and the base 91 is attached to the rear side. The lamp holder 91 is an E-type lamp holder.

In this bulb-shaped lamp device 10, the housing 11 is also formed by insert molding in which the thermal diffusion plate 28 is covered with the resin portion 29. Therefore, it is possible to reduce the weight while ensuring heat dissipation, and it does not need to be formed of a metal material. Manufacturability can be improved by surface processing or painting of the entire frame body.

Although some embodiments of the present invention have been described, these embodiments are merely examples and are not intended to limit the scope of the invention. Actually, these embodiments can be implemented in other various forms, and various omissions, substitutions, and changes can be made to the above-described embodiments without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope or spirit of the invention, and are included in the invention described in the claims and the equivalent scope thereof.

Claims (8)

1. A lamp device (10), characterized in that it comprises: A light emitting module (12), having a substrate (50) and a light emitting element (51) mounted on the substrate (50); a frame (11), the light-emitting module (12) is arranged on one end side; and A lamp holder (14), arranged on the other end side of the frame (11); The lamp device (10) is characterized in that: The frame (11) has a thermal diffusion plate (28) and a resin portion (29) covering the thermal diffusion plate (28), and a part of the thermal diffusion plate (28) is formed with the resin portion ( 29) Exposing the board mounting surface (22) on which the board (50) is mounted. 2. The lamp device (10) according to claim 1, characterized in that: The frame (11) includes a substrate mounting portion (20) provided with the substrate mounting surface (22), and an outer peripheral portion (21) formed around the substrate mounting portion (20). The thermal diffusion plate (28) and the resin part (29) are formed continuously from the mounting part (20) to the outer peripheral part (21). 3. The lamp device (10) according to claim 2, characterized in that: The substrate mounting part (20) has a plurality of lamp caps (14) mounted thereon through the thermal diffusion plate (28) and the resin part (29) at positions around the substrate mounting surface (22). The installation hole (23) has a joint part (37) penetrating through the resin part (29) of the thermal diffusion plate (28) at an inner position of the substrate installation surface (22). 4. The lamp device (10) according to claim 3, characterized in that: The bonding portion (37) of the resin portion (29) has a concave portion (38) facing the substrate (50). 5. The lamp device (10) according to any one of claims 1 to 4, characterized in that: In the frame (11), only the substrate mounting surface (22) of the thermal diffusion plate (28) is exposed from the resin portion (29). 6. The lamp device (10) according to any one of claims 1 to 4, characterized in that: A protrusion (30) exposed from the resin part (29) is provided on a part of the thermal diffusion plate (28), and the substrate mounting surface (22) is formed on the protrusion (30). 7. The lamp device (10) according to any one of claims 1 to 4, characterized in that: The size of the substrate (50) of the light emitting module (12) is larger than the size of the substrate installation surface (22) of the thermal diffusion plate (28). 8. A lighting device (80), characterized by comprising: A lamp device (10) according to any one of claims 1 to 7; and The lamp socket (82) connects the lamp base (14) of the lamp device (10).