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JP6796268B2 - Lamp device and lighting device - Google Patents

Lamp device and lighting device Download PDF

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JP6796268B2
JP6796268B2 JP2018086465A JP2018086465A JP6796268B2 JP 6796268 B2 JP6796268 B2 JP 6796268B2 JP 2018086465 A JP2018086465 A JP 2018086465A JP 2018086465 A JP2018086465 A JP 2018086465A JP 6796268 B2 JP6796268 B2 JP 6796268B2
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housing
housing portion
end side
heat radiating
lamp device
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JP2018116941A (en
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光 寺崎
光 寺崎
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Toshiba Lighting and Technology Corp
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Description

本発明の実施形態は、発光モジュールを用いたランプ装置、およびこのランプ装置を用いる照明装置に関する。 An embodiment of the present invention relates to a lamp device using a light emitting module and a lighting device using the lamp device.

従来、発光モジュールを用いたランプ装置では、金属製で筒状の筐体を備えるものがある。このランプ装置では、筐体の内側に樹脂製のカバーを挿入するとともに固定具で筐体にカバーを固定し、カバー内に点灯回路を挿入し、筐体に発光モジュールが接触するようにカバーに発光モジュールを取り付けている。 Conventionally, some lamp devices using a light emitting module are made of metal and have a tubular housing. In this lamp device, a resin cover is inserted inside the housing, the cover is fixed to the housing with a fixture, a lighting circuit is inserted inside the cover, and the light emitting module is placed in contact with the housing. A light emitting module is installed.

しかしながら、筐体を構成する部品点数が多く、組立工数もかかるため、組立性の向上が望まれている。 However, since the number of parts constituting the housing is large and the assembly man-hours are required, improvement in assembling property is desired.

また、点灯回路に発光モジュールの点灯時の熱が作用するために点灯回路に熱影響が生じたり、点灯回路の熱の放熱性能が低いために点灯回路に熱影響が生じることがある。 In addition, the lighting circuit may be affected by heat because the heat generated when the light emitting module is lit acts on the lighting circuit, or the lighting circuit may be affected by heat because the heat dissipation performance of the lighting circuit is low.

特開2012−74145号公報Japanese Unexamined Patent Publication No. 2012-74145

本発明が解決しようとする課題は、発光モジュールが発生する熱の放熱性を向上させたランプ装置、およびこのランプ装置を用いる照明装置を提供することである。 An object to be solved by the present invention is to provide a lamp device having improved heat dissipation of heat generated by a light emitting module, and a lighting device using the lamp device.

前実施形態のランプ装置は、 内部に一端側および他端側に開口する筒状であるとともに絶縁性を有する第1の筐体部、この第1の筐体部の内側に位置し、前記一端側に平坦状の配置部が周方向に形成された金属材料からなる第2の筐体部、前記第2の筐体部内側の一部を覆うとともに、樹脂からなる第3の筐体部をインサート成形によって一体に形成した筐体と、一端側の面に発光モジュールが配設され、他端側の周辺の面が前記筐体の前記配置部に配置される放熱板と、前記筐体の他端側に配置される給電部と、前記筐体内に配置される点灯回路とを有するランプ装置において、 前記配置部は、第1の筐体及び第3の筐体から露出し、前記放熱板は、前記筐体の一端側から挿入され、前記筐体の一端側からねじによって螺着されることで、前記放熱板の他端側の面が前記金属筐体部の前記平坦状の配置部の上から他端方向に向けて圧接されることを特徴とする。
を具備することを特徴とする照明装置。
The lamp device of the previous embodiment is located inside a first housing portion having a tubular shape and insulating properties that opens to one end side and the other end side inside, and one end thereof. A second housing portion made of a metal material having a flat arrangement portion formed on the side in the circumferential direction, a third housing portion made of resin while covering a part of the inside of the second housing portion. A housing integrally formed by insert molding, a heat radiating plate in which a light emitting module is arranged on one end side surface and a peripheral surface on the other end side arranged in the arrangement portion of the housing, and the housing. In a lamp device having a power feeding unit arranged on the other end side and a lighting circuit arranged in the housing, the arranged portion is exposed from the first housing and the third housing, and the heat radiating plate is exposed. Is inserted from one end side of the housing and screwed from one end side of the housing by a screw so that the other end surface of the heat dissipation plate is the flat arrangement portion of the metal housing portion. It is characterized in that it is pressure-welded from the top to the other end .
A lighting device characterized by comprising.

本発明によれば、発光モジュールが発生する熱の放熱性を向上させることが期待できる。 According to the present invention, it can be expected to improve the heat dissipation of the heat generated by the light emitting module.

一実施形態を示すランプ装置の筐体の断面図である。It is sectional drawing of the housing of the lamp device which shows one Embodiment. 同上ランプ装置の分解状態の斜視図である。It is a perspective view of the disassembled state of the lamp device as above. 同上ランプ装置の斜視図である。It is a perspective view of the same lamp device. 同上ランプ装置を用いた照明装置の断面図である。It is sectional drawing of the lighting apparatus using the same lamp apparatus.

以下、一実施形態を、図1ないし図4を参照して説明する。 Hereinafter, one embodiment will be described with reference to FIGS. 1 to 4.

図2および図3に、ランプ装置10を示す。ランプ装置10は、一般照明用白熱電球用のソケットに装着して使用可能な電球形ランプである。 2 and 3 show the lamp device 10. The lamp device 10 is a light bulb-shaped lamp that can be used by being attached to a socket for an incandescent light bulb for general lighting.

ランプ装置10は、筐体11、筐体11の一端側に配置される放熱板12、放熱板12の一端側の面に配設される発光モジュール13、筐体11内に配置される点灯回路14、筐体11の一端側に取り付けられるグローブ15、および筐体11の他端側に取り付けられる給電部16を備えている。なお、ランプ装置10は、グローブ15から給電部16に亘って仮想の中心軸を有し、その中心軸のグローブ15側を一端側、給電部16側を他端側という。 The lamp device 10 includes a housing 11, a heat radiating plate 12 arranged on one end side of the housing 11, a light emitting module 13 arranged on one end side of the heat radiating plate 12, and a lighting circuit arranged in the housing 11. It includes 14, a glove 15 attached to one end side of the housing 11, and a power feeding unit 16 attached to the other end side of the housing 11. The lamp device 10 has a virtual central axis extending from the globe 15 to the feeding portion 16, and the globe 15 side of the central axis is referred to as one end side and the feeding portion 16 side is referred to as the other end side.

図1ないし図3に示すように、筐体11は、一端側の径が大きく、他端側の径が小さく、一端側から他端側に向けて縮径する筒状に形成されている。筐体11の内部には、一端側および他端側にそれぞれ開口する空洞部20が形成されている。 As shown in FIGS. 1 to 3, the housing 11 is formed in a tubular shape having a large diameter on one end side and a small diameter on the other end side, and the diameter is reduced from one end side to the other end side. Inside the housing 11, a cavity 20 that opens to one end side and the other end side is formed.

筐体11は、第1の筐体部21、この第1の筐体部21の内側に位置する第2の筐体部22、およびこの第2の筐体部22の内側に位置する第3の筐体部23を有している。 The housing 11 has a first housing portion 21, a second housing portion 22 located inside the first housing portion 21, and a third housing portion 22 located inside the second housing portion 22. Has a housing portion 23 of.

第1の筐体部21は、絶縁性を有する樹脂材料によって形成されている。第2の筐体部22は、例えばアルミニウム等の金属材料で、プレス成形によって筒状に形成されている。第3の筐体部23は、絶縁性を有する樹脂材料によって形成されている。 The first housing portion 21 is formed of an insulating resin material. The second housing portion 22 is made of a metal material such as aluminum and is formed into a tubular shape by press molding. The third housing portion 23 is formed of an insulating resin material.

第1の筐体部21、第2の筐体部22および第3の筐体部23は、インサート成形によって一体に形成されている。筐体11を形成するには、まず、プレス成形された第2の筐体部22の内側に第3の筐体部23をインサート成形によって一体に形成し、続いて、その第2の筐体部22の外側に第1の筐体部21をインサート成形によって一体に形成する。 The first housing portion 21, the second housing portion 22, and the third housing portion 23 are integrally formed by insert molding. In order to form the housing 11, first, a third housing portion 23 is integrally formed inside the press-molded second housing portion 22 by insert molding, and then the second housing portion is formed. The first housing portion 21 is integrally formed on the outside of the portion 22 by insert molding.

第2の筐体部22の内側面および外側面は、例えばアルマイト加工やブラスト加工を施し、第3の筐体部23および第1の筐体部21との結合強度および密着性を向上させるようにしてもよい。 The inner and outer surfaces of the second housing portion 22 are subjected to, for example, alumite processing or blast processing so as to improve the bonding strength and adhesion to the third housing portion 23 and the first housing portion 21. It may be.

第1の筐体部21、第2の筐体部22および第3の筐体部23のそれぞれの熱伝導率は異なるとともに、第2の筐体部22の熱伝導率が最も高い関係を有している。 The first housing portion 21, the second housing portion 22, and the third housing portion 23 have different thermal conductivitys, and the second housing portion 22 has the highest thermal conductivity. doing.

熱伝導率の関係は、第2の筐体部22、第1の筐体部21および第3の筐体部23の順に高く、または、第2の筐体部22、第3の筐体部23および第1の筐体部21の順に高い。 The relationship of thermal conductivity is higher in the order of the second housing portion 22, the first housing portion 21, and the third housing portion 23, or the second housing portion 22, the third housing portion, and the third housing portion. The order is higher in the order of 23 and the first housing portion 21.

熱伝導率の関係が第2の筐体部22、第1の筐体部21および第3の筐体部23の順に高い場合、第1の筐体部21の熱伝導率は0.3〜3.0W/(m・K)の範囲が好ましい。ただし、成形性を考えると、1.0W/(m・K)までが望ましい。第3の筐体部23の熱伝導率は、0.15〜0.3W/(m・K)の範囲が好ましい。 When the relationship of thermal conductivity is higher in the order of the second housing portion 22, the first housing portion 21, and the third housing portion 23, the thermal conductivity of the first housing portion 21 is 0.3 to 0.3 to The range of 3.0 W / (m · K) is preferable. However, considering moldability, up to 1.0 W / (m · K) is desirable. The thermal conductivity of the third housing portion 23 is preferably in the range of 0.15 to 0.3 W / (m · K).

熱伝導率の関係が第2の筐体部22、第3の筐体部23および第1の筐体部21の順に高い場合、第1の筐体部21の熱伝導率は、0.15〜0.3W/(m・K)の範囲が好ましい。第3の筐体部23の熱伝導率は、0.3〜3.0W/(m・K)の範囲が好ましい。ただし、成形性を考えると、1.0W/(m・K)までが望ましい。 When the relationship of thermal conductivity is higher in the order of the second housing portion 22, the third housing portion 23, and the first housing portion 21, the thermal conductivity of the first housing portion 21 is 0.15. The range of ~ 0.3 W / (m · K) is preferable. The thermal conductivity of the third housing portion 23 is preferably in the range of 0.3 to 3.0 W / (m · K). However, considering moldability, up to 1.0 W / (m · K) is desirable.

第1の筐体部21および第3の筐体部23は、それぞれ樹脂材料にフィラーを混入して形成されており、フィラーの密度によって所定の熱伝導率に設定されている。 The first housing portion 21 and the third housing portion 23 are each formed by mixing a filler with a resin material, and are set to a predetermined thermal conductivity according to the density of the filler.

筐体11の一端側において、第1の筐体部21および第2の筐体部22が第3の筐体部23よりも突出され、第2の筐体部22の一端側が露出されている。第2の筐体部22の一端側には、放熱板12を配置する配置部25が形成されている。 On one end side of the housing 11, the first housing portion 21 and the second housing portion 22 are projected from the third housing portion 23, and one end side of the second housing portion 22 is exposed. .. An arrangement portion 25 for arranging the heat radiating plate 12 is formed on one end side of the second housing portion 22.

第3の筐体部23には、筐体11の一端側に配置する放熱体12およびグローブ15をねじ止めするためのボス26、および筐体11の一端側から挿入する点灯回路14の後述する回路基板40を保持する回路基板保持部27が形成されている。 In the third housing portion 23, a boss 26 for screwing the heat radiating body 12 and the glove 15 arranged on one end side of the housing 11 and a lighting circuit 14 inserted from one end side of the housing 11 will be described later. A circuit board holding portion 27 for holding the circuit board 40 is formed.

筐体11の他端には、給電部16を取り付けるための取付部28が形成されている。 A mounting portion 28 for mounting the feeding portion 16 is formed at the other end of the housing 11.

また、放熱板12は、例えばアルミニウム等の金属材料で円板状に形成されている。放熱板12は、一端側の面に発光モジュール13が配設され、他端側の面の周辺が筐体11の配置部25に配置される。放熱板12には、ボス26が挿通配置される溝部31が形成されている。 Further, the heat radiating plate 12 is formed of a metal material such as aluminum in a disk shape. In the heat radiating plate 12, the light emitting module 13 is arranged on one end side surface, and the periphery of the other end side surface is arranged on the arrangement portion 25 of the housing 11. The heat radiating plate 12 is formed with a groove 31 into which the boss 26 is inserted and arranged.

また、発光モジュール13は、複数の発光素子34、およびこれら発光素子34を実装する基板35を有している。発光素子34は、例えば、SMD(Surface Mount Device)パッケージのLEDが用いられている。なお、発光素子34としては、COB(Chip On Board)モジュールを用いてもよく、あるいはLED以外の例えば有機ELなどの他の発光素子を用いてもよい。基板35は、複数のねじ36によって放熱板12に締め付け固定され、放熱板12に熱的に結合されている。 Further, the light emitting module 13 has a plurality of light emitting elements 34 and a substrate 35 on which these light emitting elements 34 are mounted. As the light emitting element 34, for example, an LED of an SMD (Surface Mount Device) package is used. As the light emitting element 34, a COB (Chip On Board) module may be used, or another light emitting element other than the LED, such as an organic EL, may be used. The substrate 35 is fastened and fixed to the heat radiating plate 12 by a plurality of screws 36, and is thermally coupled to the heat radiating plate 12.

また、点灯回路14は、給電部16から入力する交流電力を所定の直流電力に変換して発光モジュール13の発光素子34に供給する。点灯回路14は、点灯回路14を構成する複数の電子部品39、およびこれら電子部品39を実装する回路基板40を有している。回路基板40は、筐体11の一端側から、筐体11の一対の回路基板保持部27に挿入される。回路基板40からは接続線41が導出されている。接続線41は、発光モジュール13の基板35に電気的に接続される。そして、点灯回路14の交流電力用の入力部が給電部16に電気的に接続され、直流電力用の出力部に接続線41が電気的に接続されている。 Further, the lighting circuit 14 converts the AC power input from the power feeding unit 16 into a predetermined DC power and supplies it to the light emitting element 34 of the light emitting module 13. The lighting circuit 14 has a plurality of electronic components 39 constituting the lighting circuit 14 and a circuit board 40 on which these electronic components 39 are mounted. The circuit board 40 is inserted into the pair of circuit board holding portions 27 of the housing 11 from one end side of the housing 11. The connection line 41 is derived from the circuit board 40. The connection line 41 is electrically connected to the substrate 35 of the light emitting module 13. Then, the input unit for AC power of the lighting circuit 14 is electrically connected to the power supply unit 16, and the connection line 41 is electrically connected to the output unit for DC power.

また、グローブ15は、光透過性および光拡散性を有し、例えばポリカーボネート等の合成樹脂中に拡散材を混入して白色に形成されている。グローブ15は、筐体11の一端側に取り付けられる第1のグローブ部44、およびこの第1のグローブ部44に取り付けられる第2のグローブ部45を有している。 Further, the glove 15 has light transmission and light diffusivity, and is formed in white by mixing a diffusing material in a synthetic resin such as polycarbonate. The glove 15 has a first glove portion 44 attached to one end side of the housing 11 and a second glove portion 45 attached to the first glove portion 44.

グローブ15は球形に近似した形状に形成され、第1のグローブ部44と第2のグローブ部45とはグローブ15の径寸法が最大となる部分でグローブ15の一端側と他端側とで分割されている。 The glove 15 is formed in a shape similar to a sphere, and the first glove portion 44 and the second glove portion 45 are divided into one end side and the other end side of the glove 15 at the portion where the diameter dimension of the glove 15 is maximized. Has been done.

第1のグローブ部44は、一端側および他端側に開口された筒状に形成され、他端側が筐体11の一端側に取り付けられ、筐体11の外郭部分の形状に連続するように構成されている。第1のグローブ部44の他端側には、筐体11の一端側にねじ46によって取り付けられる取付部47が環状に形成されている。ねじ46は、取付部47および放熱板12の溝部31を通じて筐体11のボス26に螺着され、第1のグローブ部44と放熱板12と筐体11とを共締め固定する。これにより、放熱板12の周辺部が筐体11の第2の筐体部22に圧接し、放熱板12と第2の筐体部22とが熱的に結合される。 The first glove portion 44 is formed in a tubular shape opened on one end side and the other end side, and the other end side is attached to one end side of the housing 11 so as to be continuous with the shape of the outer shell portion of the housing 11. It is configured. On the other end side of the first glove portion 44, a mounting portion 47 attached to one end side of the housing 11 by a screw 46 is formed in an annular shape. The screw 46 is screwed to the boss 26 of the housing 11 through the mounting portion 47 and the groove portion 31 of the heat radiating plate 12, and the first glove portion 44, the heat radiating plate 12, and the housing 11 are fastened and fixed together. As a result, the peripheral portion of the heat radiating plate 12 is pressed against the second housing portion 22 of the housing 11, and the heat radiating plate 12 and the second housing portion 22 are thermally coupled.

第2のグローブ部45は、他端側が開口し、一端側に突出するドーム状に形成されている。第2のグローブ部45の他端側は第1のグローブ部44の一端側に例えば振動溶着等によって固定される。 The second glove portion 45 is formed in a dome shape with the other end side open and projecting toward one end side. The other end side of the second glove portion 45 is fixed to one end side of the first glove portion 44 by, for example, vibration welding.

また、給電部16は、例えばE17やE26等の一般照明電球用のソケットに接続可能な口金50が用いられている。なお、給電部16は、口金50に限らず、ランプ種類によっては一対のピンでもよい。 Further, as the power feeding unit 16, for example, a base 50 that can be connected to a socket for a general lighting bulb such as E17 or E26 is used. The power feeding unit 16 is not limited to the base 50, and may be a pair of pins depending on the type of lamp.

次に、図4に、ランプ装置10を使用する照明装置60を示す。照明装置60は、例えばダウンライトである。照明装置60は、器具本体61を有し、この器具本体61内にソケット62および反射体63が配設されている。ソケット62は、ランプ装置10の口金50が電気的に接続され、ランプ装置10に交流電力を供給する。 Next, FIG. 4 shows a lighting device 60 using the lamp device 10. The illuminating device 60 is, for example, a downlight. The lighting device 60 has an instrument body 61, and a socket 62 and a reflector 63 are arranged in the instrument body 61. In the socket 62, the base 50 of the lamp device 10 is electrically connected to supply AC power to the lamp device 10.

そして、ランプ装置10を照明装置60のソケット62に装着し、ランプ装置10に交流電力を供給すると、点灯回路14で交流電力を所定の直流電力に変換して発光モジュール13に供給し、発光素子34が発光する。発光素子34からの光は、グローブ15を透過し、所定の配光方向に出射される。 Then, when the lamp device 10 is attached to the socket 62 of the lighting device 60 and AC power is supplied to the lamp device 10, the lighting circuit 14 converts the AC power into a predetermined DC power and supplies it to the light emitting module 13 to supply the light emitting element. 34 emits light. The light from the light emitting element 34 passes through the globe 15 and is emitted in a predetermined light distribution direction.

発光素子34が発光時に発生する熱は、主に、放熱板12、第2の筐体部22および第1の筐体部21の順に伝わり、第1の筐体部21の表面から外気中に放熱される。 The heat generated when the light emitting element 34 emits light is mainly transmitted to the heat radiating plate 12, the second housing portion 22, and the first housing portion 21 in this order, and is transferred from the surface of the first housing portion 21 to the outside air. Heat is dissipated.

このとき、筐体11は、第1の筐体部21、第2の筐体部22および第3の筐体部23のそれぞれの熱伝導率が異なるとともに、第2の筐体部22の熱伝導率が最も高い関係を有している。 At this time, the housing 11 has different thermal conductivity of the first housing portion 21, the second housing portion 22, and the third housing portion 23, and the heat of the second housing portion 22 is different. It has the highest conductivity relationship.

熱伝導率の関係が、第2の筐体部22、第1の筐体部21および第3の筐体部23の順に高い場合には、発光モジュール13から第2の筐体部22に伝わる熱を第1の筐体部21に効率よく伝えることができ、発光モジュール13が発生する熱の放熱性を向上できる。さらに、第3の筐体部23により、発光モジュール13から熱が伝わる第2の筐体部22と点灯回路14とを断熱することができる。これにより、点灯回路14の温度は、自身の温度のみがほぼ影響するようになるため、電流等を制御しやすくすることができる。 When the relationship of thermal conductivity is higher in the order of the second housing portion 22, the first housing portion 21, and the third housing portion 23, the heat conductivity is transmitted from the light emitting module 13 to the second housing portion 22. The heat can be efficiently transferred to the first housing portion 21, and the heat dissipation of the heat generated by the light emitting module 13 can be improved. Further, the third housing portion 23 can insulate the second housing portion 22 and the lighting circuit 14 from which heat is transferred from the light emitting module 13. As a result, the temperature of the lighting circuit 14 is almost affected only by its own temperature, so that it is possible to easily control the current and the like.

熱伝導率の関係が、第2の筐体部22、第3の筐体部23および第1の筐体部21の順に高い場合には、点灯回路14が発生する熱を第3の筐体部23から第2の筐体部22に効率よく伝えることができ、点灯回路14が発生する熱を効率よく放熱することができ、点灯回路14の熱影響を低減できる。つまり、調光電源のように温度条件が厳しくなる回路構成において、特に有効な構成である。 When the relationship of thermal conductivity is higher in the order of the second housing portion 22, the third housing portion 23, and the first housing portion 21, the heat generated by the lighting circuit 14 is transferred to the third housing portion. The heat generated by the lighting circuit 14 can be efficiently dissipated from the unit 23 to the second housing unit 22, and the heat effect of the lighting circuit 14 can be reduced. That is, it is a particularly effective configuration in a circuit configuration in which temperature conditions are severe, such as a dimming power supply.

なお、熱伝導率の関係を、第2の筐体部22、第3の筐体部23および第1の筐体部21の順に高くする場合には、第3の筐体部23から第2の筐体部22に効率よく熱を伝えるために、第2の筐体部22の内側面に例えばアルマイト加工やブラスト加工を施し、第2の筐体部22と第3の筐体部23との密着性を高めることが好ましい。 When the relationship of thermal conductivity is increased in the order of the second housing portion 22, the third housing portion 23, and the first housing portion 21, the third housing portion 23 to the second housing portion 23 to the second. In order to efficiently transfer heat to the housing portion 22, for example, the inner surface of the second housing portion 22 is subjected to, for example, alumite processing or blasting, and the second housing portion 22 and the third housing portion 23 are combined. It is preferable to increase the adhesion of.

そして、本実施形態のランプ装置10では、第1の筐体部21、第2の筐体部22および第3の筐体部23をインサート成形によって一体に形成して筐体11を構成しているため、ランプ装置10を組み立てる際、部品点数が少なく、組立工数を削減することができ、組立性を向上できる。しかも、上述のように点灯回路14の熱影響を低減できる。
本発明のいくつかの実施形態を説明したが、これらの実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。これら新規な実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。これら実施形態やその変形は、発明の範囲や要旨に含まれるとともに、特許請求の範囲に記載された発明とその均等の範囲に含まれる。
Then, in the lamp device 10 of the present embodiment, the first housing portion 21, the second housing portion 22, and the third housing portion 23 are integrally formed by insert molding to form the housing 11. Therefore, when assembling the lamp device 10, the number of parts is small, the assembly man-hours can be reduced, and the assembling property can be improved. Moreover, as described above, the thermal influence of the lighting circuit 14 can be reduced.
Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the gist of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

10 ランプ装置
11 筐体
13 発光モジュール
14 点灯回路
16 給電部
20 空洞部
21 第1の筐体部
22 第2の筐体部
23 第3の筐体部
60 照明装置
62 ソケット
10 Lamp device
11 housing
13 Luminous module
14 Lighting circuit
16 Power supply
20 cavities
21 First housing
22 Second housing
23 Third housing
60 Lighting equipment
62 socket

Claims (3)

内部に一端側および他端側に開口する筒状であるとともに絶縁性を有する第1の筐体部、この第1の筐体部の内側に位置し、前記一端側に平坦状の配置部が周方向に形成された金属材料からなる第2の筐体部、前記第2の筐体部内側の一部を覆うとともに、樹脂からなる第3の筐体部をインサート成形によって一体に形成した筐体と;
一端側の面に発光モジュールが配設され、他端側の周辺の面が前記筐体の前記配置部に配置される放熱板と;
前記筐体の他端側に配置される給電部と;
前記筐体内に配置される点灯回路と;
を有するランプ装置において、
前記配置部は、第1の筐体及び第3の筐体から露出し、前記放熱板は、前記筐体の一端側から挿入され、前記筐体の一端側からねじによって螺着されることで、前記放熱板の他端側の面が前記金属筐体部の前記平坦状の配置部の上から他端方向に向けて圧接されることを特徴とするランプ装置。
A tubular and insulating first housing portion that opens to one end side and the other end side inside, and a flat arrangement portion located inside the first housing portion and on the one end side. A housing in which a second housing portion made of a metal material formed in the circumferential direction and a part inside the second housing portion are covered, and a third housing portion made of resin is integrally formed by insert molding. With the body;
With a heat radiating plate in which a light emitting module is arranged on one end side surface and a peripheral surface on the other end side is arranged in the arrangement portion of the housing;
With the power feeding unit arranged on the other end side of the housing;
With the lighting circuit arranged in the housing;
In the lamp device having
The arrangement portion is exposed from the first housing and the third housing, and the heat radiating plate is inserted from one end side of the housing and screwed from one end side of the housing by a screw. , lamp unit and the other end side surface of the heat radiating plate is pressed toward the other end direction from the top of the flat-shaped arrangement of the metal casing.
前記放熱板の外径は、前記金属筐体部の外径よりも小さいことを特徴とする請求項1に記載のランプ装置。 The lamp device according to claim 1, wherein the outer diameter of the heat radiating plate is smaller than the outer diameter of the metal housing portion. ソケットと;
前記ソケットに前記給電部が装着される請求項1または請求項2に記載のランプ装置と;
を具備することを特徴とする照明装置。
With socket;
The lamp device according to claim 1 or 2, wherein the power feeding unit is mounted on the socket;
A lighting device characterized by comprising.
JP2018086465A 2018-04-27 2018-04-27 Lamp device and lighting device Active JP6796268B2 (en)

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