CN204227114U - lamp - Google Patents

Abstract

The utility model provides a lamp, which comprises: a heat sink as a hollow shell with one end open; a substrate with a through hole in the center and arranged on one end of the heat sink; a plurality of semiconductor light-emitting elements at one end of the substrate side and arranged in a circumferential shape along the through hole; the lighting circuit has a circuit board and circuit parts including heat-generating parts mounted on the circuit board, and the heat-generating parts are located in the through-hole when viewing the radiator from one end side The mode in the area is arranged inside the radiator; and the lamp cap is arranged on the other end side of the radiator. The utility model can reduce the temperature of the lighting circuit.

Description

lamp

This application is based on and claims priority and rights to Japanese Patent Application No. 2014-006376 filed on January 17, 2014, the entirety of which is incorporated herein by reference.

technical field

The embodiment of the utility model relates to a lamp.

Background technique

For example, lamps that utilize light emission of semiconductors such as light-emitting diodes are used for lighting or display purposes. The lamp includes a semiconductor light emitting element, a lighting circuit for supplying electric power to the semiconductor light emitting element, a member housing the semiconductor light emitting element or the lighting circuit, and the like.

It is well known that semiconductor light-emitting elements have a long life, so the life of such lamps is longer than that of conventional lamps such as light bulbs. However, since the lighting circuit ends its life earlier than the semiconductor light emitting element, the lamp reaches the end of its life. Since the lifetime of the lighting circuit depends on the temperature of the circuit components of the lighting circuit during lighting, it is desirable that the temperature of the lighting circuit during lighting is low.

Utility model content

[Problem to be solved]

The problem to be solved by the present invention is to provide a lamp capable of reducing the temperature of a lighting circuit.

[means to solve the problem]

In order to achieve the above object, the lamp according to the embodiment includes: a hollow case with an opening on one end side; a substrate having a through hole in the center and provided on one end side of the case; and a plurality of semiconductor light emitting elements on the substrate. One end side of the housing is provided in a circumferential shape along the through hole; the lighting circuit has a circuit board and circuit parts including heat generating parts mounted on the circuit board, and the housing is viewed from one end side. The heat-generating component is disposed inside the housing in such a manner that the heat-generating component is located in the region of the through hole; and the power supply unit is disposed on the other end side of the housing.

The lamp according to claim 1 is characterized in that L/W is 0.6 or more when the size of the through hole is L and the width of the circuit board is W.

The lamp according to claim 1 is characterized in that L/W is 0.75 or more when the size of the through hole is L and the width of the circuit board is W.

The lamp according to claim 1 is characterized in that L/W is 1.4 or less when the size of the through hole is L and the width of the circuit board is W.

The lamp according to claim 1 is characterized in that a substrate provided with the plurality of semiconductor light emitting elements or a radiator plate provided with the substrate is attached to the substrate mounting portion of the hollow case.

The lamp according to technical solution 1 is characterized in that: the substrate is arranged on a heat dissipation plate, and the heat dissipation plate has a through hole in the center, and the through hole of the heat dissipation plate is connected to the through hole of the substrate. The hole is communicated with one end side of the housing.

The lamp according to technical solution 1 is characterized in that: the through hole communicates with the hollow shell.

The lamp according to claim 1 is characterized in that a cover member is provided on the through hole, and the cover member has a protrusion protruding in the direction of the power supply part and positioned at the power supply part. near the above lighting circuit.

The lamp according to claim 8, wherein the circuit board is arranged inside the housing so that the surface on which the circuit components are mounted is along the lamp axis, and the protrusion and the circuit board The distance D is 3 mm or less.

The lamp according to claim 8 is characterized in that the thermal conductivity of the cover member is lower than that of a substrate on which the plurality of semiconductor light emitting elements are provided or a heat sink on which the substrate is provided.

[effect of utility model]

According to the present invention, the temperature of the lighting circuit can be reduced.

Description of drawings

FIG. 1 is a diagram for explaining a lamp according to a first embodiment.

Fig. 2 is a diagram for explaining the appearance of the lamp of the first embodiment.

3A to 3B are diagrams for explaining a state in which the lamp according to the first embodiment is viewed from one end side of the housing. FIG. 3A is a state where the lamp cover, a substrate, and a heat sink are removed, and FIG. 3B is a state where the lamp cover is removed.

4A to 4C are diagrams for explaining temperature differences between the lighting circuit of the lamp of the first embodiment and a conventional lamp.

Fig. 5 is a diagram for explaining the cross section of the lamp according to the first embodiment.

Fig. 6 is a diagram for explaining a lamp of a second embodiment.

7A to 7C are diagrams for explaining temperature changes of the lighting circuit when the shape of the cover member is changed in the lamp of the second embodiment.

FIG. 8 is a diagram for explaining another example of the lamp of this embodiment.

Reference signs:

1: radiator

2: cooling plate

3: Substrate

4: LED

5: lampshade

6: Resin shell (insulation shell)

7: Lighting circuit

9: Cover member

11: Substrate mounting part

12: Perimeter wall

13: protruding wall

14: Slot

15: Incision

16: boss part

17: screw hole

21, 31: protrusion

22, 32: screw

33: Connector support

51: top

52: Basal part

53: Protrusion

61: Main body

62: protrusion

63: Concave

64: facing wall

65: Protrusion

71: Circuit board

72: circuit parts

73: Connector

81: Lamp holder

82: insulating ring

91: Installation Department

92: convex part

721: Heating parts

722: Non-heating parts

A, B: location

D: Distance between convex part and circuit board

L: The size of the through hole

W: Width of the circuit board

Detailed ways

From these circumstances, the present embodiment provides a lamp capable of reducing the temperature of the lighting circuit.

A lamp according to an embodiment includes: a hollow case with one end side open; a substrate having a through hole in the center and provided on one end side of the case; a plurality of semiconductor light emitting elements arranged along one end side of the substrate. The through hole is arranged in a circular shape; the lighting circuit has a circuit board and circuit parts including heat generating parts mounted on the circuit board, and the heat generating parts are arranged when the housing is viewed from one end side. The form located in the region of the through hole is provided inside the housing; and the power supply unit is provided at the other end side of the housing.

(first embodiment)

A first embodiment will be described with reference to FIGS. 1 to 3A and 3B.

1 is a diagram for explaining the lamp of the first embodiment, FIG. 2 is a diagram for explaining the appearance of the lamp of the first embodiment, and FIGS. A diagram of the state of the lamp of the embodiment.

The lamp of this embodiment is a light-emitting diode (light-Emitting Diode, LED) lamp used for lighting or display purposes, including a radiator 1, a radiator plate 2, a substrate 3, an LED 4, a lampshade 5, a resin casing 6 (insulating casing ), lighting circuit 7, lamp cap 81, and insulating ring 82. In addition, in this embodiment, regarding the central axis of the lamp, the direction in which the lamp cover 5 is located when viewed from the base 81 is referred to as one end side, and the direction in which the base 81 is located when viewed from the lamp cover 5 is referred to as the other end side. to explain.

The radiator 1 is a hollow case made of a material having excellent thermal conductivity, such as aluminum, ceramics, resin, etc., and has an opening on one end side. A flat substrate mounting portion 11 is formed around an opening on one end side of the radiator 1 , and a peripheral wall 12 protruding toward one end is formed around the substrate mounting portion 11 . An annular protruding wall 13 protruding toward the inner space direction is formed on the peripheral wall 12 , and an annular groove 14 is formed between the protruding wall 13 and the substrate mounting portion 11 . Further, four notches 15 are formed at intervals of 90 degrees on the protruding wall 13 , and the notches 15 are connected to the annular groove 14 . On the inner space side of the radiator 1, three bosses 16 protruding from the inner wall of the radiator 1 toward the center are formed at intervals of 120 degrees. The boss portion 16 is formed in the same plane as the surface on the one end side of the substrate mounting portion 11 . A screw hole 17 is formed on one end side of the boss portion 16 .

The radiator plate 2 is a thin plate made of a material having excellent thermal conductivity, for example, metal such as aluminum. The radiator plate 2 has a through hole formed in the center, and four protrusions 21 protruding toward the center are formed at intervals of 90 degrees on the inner wall portion of the through hole. Screw holes (not shown) are formed on the protruding portion 21 . In addition, in this radiator plate 2, screw holes (not shown) are formed at positions corresponding to the screw holes 17 of the radiator plate 2, and screws 22 are screwed into these screw holes, whereby the radiator plate 2 can conduct heat. Mounted on the board mounting part 11.

The substrate 3 is a thin plate made of a material excellent in thermal conductivity, such as aluminum or ceramics. A through hole is formed in the center of the substrate 3, and four protrusions 31 protruding toward the center are formed at 90-degree intervals on the inner wall portion of the through hole similarly to the protrusions 21 of the heat sink 2 . On the protruding part 31, corresponding to the screw hole of the protruding part 21 of the heat dissipation plate 2, a cutout (not shown) for screw insertion is formed. By screwing the screw 32 into the cutout and the screw hole, the substrate 3 is installed on the cooling plate 2 in a heat-conducting manner. In addition, a connector support portion 33 is provided on one end side of the substrate 3 . The through holes of the substrate 3 and the heat dissipation plate 2 communicate with the heat dissipation body 1 which is a hollow casing.

The LED 4 is a semiconductor light emitting element called a so-called light emitting diode. Specifically, it is a light-emitting diode in which a light-emitting chip emitting blue light is mounted on a package such as a resin, and a yellow phosphor layer is coated so as to cover the light-emitting chip. In the present embodiment, 27 LEDs 4 are mounted on one end side of the substrate 21 in a circumferential shape at substantially equal intervals along the through-hole.

The shade 5 is a transparent or milky white translucent cover mainly made of polycarbonate. The globe 5 is spherical and joined at its largest diameter. Specifically, the hemispherical top portion 51 and the diameter-expanded base portion 52 are integrated, for example, by ultrasonic welding. On the inner side of the other end side of the base portion 52 of the lampshade 5, four protrusions 53 having a width slightly smaller than the cutout 15 of the radiator 1 are formed at intervals of 90 degrees. The lampshade 5 is held by the radiator 1 by being clamped by the substrate mounting portion 11 and the protruding wall 13 .

The insulating case 6 is, for example, a case made of a material such as polybutylene terephthalate, which is excellent in electrical insulation and lower in thermal conductivity than metal. The insulating case 6 has a main body portion 61 and a protruding portion 62 . The main body portion 61 has three concave portions 63 at intervals of 120 degrees on the inner space side thereof. The concave portion 63 corresponds to the boss portion 16 , that is, the concave portion 63 fits into the boss portion 16 , thereby disposing the main body portion 61 in the inner space of the radiator 1 . Further, the main body portion 61 has a facing wall 64 formed on the inner space side thereof. A pair of facing walls 64 is formed, and a line connecting spaces between the facing walls 64 is deviated from the center of the main body portion 61 . The protruding portion 62 is formed on the other end side of the main body portion 61 and is arranged to protrude outward from the opening on the other end side of the radiator 1 . Helical protrusions 65 are formed on the outer surface portion protruding from the radiator 1 .

The lighting circuit 7 is a circuit for supplying required power to the light emitting module, and is housed in the insulating case 6 . The lighting circuit 7 includes: a circuit board 71 on which predetermined metal wiring is provided on an electrically insulating board such as epoxy resin; a circuit component 72 mounted on the circuit board 71; Connector 73. The circuit components 72 include heat generating components 721 such as switching elements such as transformers (trans) and field effect transistors (Field-Effect Transistor, FET), and non-heat generating components 722 such as capacitors that generate relatively less heat than the heat generating components 721. The lighting circuit 7 holds the circuit board 71 on the pair of facing walls 64 of the insulating case 6 , and is arranged inside the insulating case 6 so that the surface on which the circuit components 72 are mounted is along the lamp axis. At this time, at least the heat generating component 721 is located in the region of the through hole of the substrate 2 when viewing the radiator 1 from one end side.

The base 81 is a power supply unit provided on a lamp socket of a device, is provided at the other end of the lamp, and is electrically connected to the lighting circuit 7 . The lamp cap 81 includes: a helical part that is a spiral metal part formed on the side surface of the lamp cap 81, an eyelet that is a metal part formed on the bottom surface of the lamp cap 81, and an eyelet that is disposed between the helical part and the eyelet and connects them to each other. The electrically insulating part is an insulating part (not shown).

The insulating ring 82 is an annular member including an insulating member, and is provided on the outer peripheral portion of the protruding portion 62 of the insulating case 6 so as to be located between the radiator 1 and the base 81 .

According to the present embodiment, the temperature of the lighting circuit can be reduced.

In the lamp of this embodiment, when AC power is supplied to the base 81 by an external power source, the lighting circuit 7 rectifies and performs DC-DC conversion, and supplies DC power to the LED 4. Thus, the LED 4 is lit, and the LED 4 and the lighting circuit 7 generate heat thereupon. The heat generated by the LED 4 is transferred to the heat sink 1 via the substrate 3 and the heat sink 2 and is dissipated. Since a through hole is provided in the center of the heat sink 2 and the base plate 3, the heat is only transmitted to the outside without Pass in the direction of the center. That is, the heat generating part 721 of the lighting circuit 7 is located in the region of the through hole of the substrate 2 when viewing the radiator 1 from one end side, so that the heat of the LED 4 is not transmitted to the heat generating part 721 via the substrate 3 and the heat sink 2, Accordingly, the temperature rise of the heat generating component 721 can be suppressed. Furthermore, since the temperature of the space inside the globe 5 is relatively low during lighting, the heat-generating parts 721 can be cooled through the through holes. Therefore, the temperature during the lighting of the lighting circuit 7 is lowered, and the lifetime of the lighting circuit 7 can be prolonged.

4A to 4C are diagrams for explaining the difference in temperature between the lighting circuit of the lamp according to the present embodiment and a conventional lamp. Fig. 4A is the existing lamp (existing example 1) that is arranged with the substrate 2 of LED 4 in the central part of the heat dissipation plate 2 without through-hole (existing example 1), and Fig. 4B is arranged on the heat dissipation plate 2 without through-hole. LED 4 is the existing lamp (existing example 2) of the substrate 2 that LED 4 is installed in a circumferential shape, and Fig. 4C is the lamp (example) of this embodiment, and the temperature of the lighting circuit 7 in lighting is represented by the density of dots, and the density Higher means higher temperature. In addition, the number of mounted LEDs and the power supply are the same. Furthermore, the width W of the circuit board 71 in FIGS. 4A to 4C is 45.6 mm, and the size L of the through-hole of the substrate 3 in FIG. 4C is 43 mm.

From the results, it can be seen that the temperature of the lighting circuit 7 during lighting is generally lower in the lamps of the examples than in the lamps of Conventional Example 1 and Conventional Example 2. Specifically, based on the lamp of Conventional Example 1, the temperature at point A on the LED side on the lighting circuit 7 was -0.5°C in Conventional Example 2, which was almost unchanged from that of the lamp of Conventional Example 1. On the other hand, in the lamp of the Example, it was -7.7 degreeC, and the temperature dropped significantly. Furthermore, the temperature at the base side point B on the lighting circuit 7 was -0.2°C in Conventional Example 2, which was almost unchanged from the lamp of Conventional Example 1, whereas it was -0.2°C in the lamp of the Example. 4.7°C, the temperature dropped sharply. This is related to the following: as described above, most of the lighting circuit 7 is located in the area of the through hole of the heat sink 2 and the substrate 3, thereby suppressing the heat of the LED 4 from being transmitted to the lighting circuit 7 via the substrate 3 and the heat sink 2. , and the lighting circuit 7 is exposed in an environment where the temperature inside the lampshade 5 is relatively low, thereby cooling the lighting circuit 7 . In this way, when the radiator 1 is viewed from one end side, the temperature rise of the lighting circuit 7 can be significantly suppressed by arranging the heating component 721 of the lighting circuit 7 in the region of the through hole of the substrate 2 .

Next, the temperature difference of the lighting circuit 7 when the size L of the through holes of the heat sink 2 and the substrate 3 and the width W of the circuit board 71 are changed will be described with reference to FIG. 5 . The temperature difference is based on the temperatures at point A and point B of the lamp in FIG. 4B in which no through-holes are formed on the radiator plate 2 and substrate 3 .

According to the results, it can be seen that the larger the L/W, the lower the temperature of both the point A and the point B. This is because, if L/W is small, heat is easily transmitted to the circuit board 71 via the LED 4, the substrate 3, and the heat sink 2, and the cooling effect caused by the relatively low temperature environment in the lampshade 5 is reduced. If L/W is 0.6 or more, the temperature difference tends to increase further. Therefore, L/W is preferably at least 0.6, more preferably at least 0.75. The larger the L/W, the higher the effect, but if the L/W is too large, it will not be possible to secure a place to arrange the LED 4, or the circuit board 71 will be reduced and the arrangement of the circuit parts 72 will become difficult. Therefore, L/W is ideal. W is 1.4 or less.

In the first embodiment, a through hole is formed in the center of the substrate 3, and a plurality of semiconductor light emitting elements are arranged in a circumferential shape along the through hole on one end side of the substrate 3. When the radiator 1 is viewed from the one end side, By disposing the lighting circuit 7 inside the radiator 1 in such a way that the heat generating parts 721 are located in the area of the through hole, the temperature rise of the lighting circuit 7 can be suppressed, especially the temperature rise of the heat generating parts 721 can be suppressed, wherein the lighting circuit 7 It has a circuit board 71 and a circuit component 72 including a heat generating component 721 mounted on the circuit board 71 . Furthermore, when L (mm) is the size of the through hole and W (mm) is the width of the circuit board 71 , the effect can be further enhanced by setting L/W to 0.6 or more. In addition, even if the heat dissipation plate 2 having the same through hole is inserted between the heat dissipation body 1 and the substrate 3, or even if the heat dissipation plate 2 is omitted and the substrate 3 is directly mounted on the substrate mounting portion 11 of the heat dissipation body 1 with screws or the like, This effect can also be obtained.

(second embodiment)

Fig. 6 is a diagram for explaining a lamp according to a second embodiment of the present invention. The parts of the second embodiment that are the same as those of the first embodiment are denoted by the same symbols, and descriptions thereof are omitted.

In this embodiment, a cover member 9 is provided on the through hole of the substrate 3 . The cover member 9 is a resinous member whose thermal conductivity is lower than that of the radiator plate 2 and the substrate 3 , for example, and whose thermal conductivity is 0.5 W/mK or less. Ideally, it is also highly reflective. Thus, if the heat dissipation plate 2 and the substrate 3 have voids, light loss may occur, but the use efficiency of light can be improved by reflection of the cover member 9, and even if the lamp cap 81 is used in the upward state, foreign objects can be prevented from being turned on. Part of the circuit 7 falls onto the lampshade 5 to prevent light emission.

In this embodiment, the cover member 9 has a mounting portion 91 and a convex portion 92 . The mounting portion 91 has a screw hole and is a portion that is screwed together with the screw holes of the protruding portion 21 of the radiator plate 2 and the protruding portion 31 of the substrate 3 with the screw 32 . Protrusion 92 is a portion protruding from mounting portion 91 toward base 81 , passes through through holes in heat sink 2 and substrate 3 , and has a flat bottom portion near one end of lighting circuit 7 . With this shape, the relatively low temperature environment inside the globe 5 is easily transmitted to the lighting circuit 7 due to the convex portion 92 , so that the temperature rise of the lighting circuit 7 can be suppressed similarly to the first embodiment.

7A to 7C are diagrams for explaining temperature changes of the lighting circuit when the shape of the cover member 9 is changed in the lamp of the second embodiment. 7A shows the case of using a flat cover member 9 , FIG. 7B shows the case of using the cover member 9 protruding toward the globe 5 , and FIG. 7C shows the case of using the cover member 9 protruding toward the cap 81 .

It can be seen from the figure that the temperature of the lighting circuit is lowered in the lamp of FIG. 7C compared with FIGS. 7A and 7B . Compared with the lamp in FIG. 4C, the temperature at point A on the LED side of the lighting circuit 7 is +5°C in FIG. 7A, +4.7°C in FIG. 7B, and +1.8°C in FIG. 7C, and point B on the base side. The temperature is +2.7°C in Figure 7A, +2.7°C in Figure 7B, and +1.7°C in Figure 7C. That is, if it is the shape of FIG. 7C, the temperature rise of the lighting circuit 7 can be suppressed to the same extent as 1st Embodiment. In particular, if the distance D between the convex portion 92 and the circuit board 71 is 3 mm or less, it is preferable to bring the convex portion 92 into contact with the circuit board 71 , so that the temperature of the lighting circuit 7 can be reduced. As the cover member 9, for example, polycarbonate having a thickness of 1 mm is used.

In the second embodiment, since the cover member 9 is provided on the through-hole of the substrate 2, the utilization efficiency of light can be improved, and the adhesion of foreign matter to the globe 5 can be suppressed. The thermal conductivity of the cover member 9 of the present embodiment is lower than that of the substrate 2 .

Furthermore, the cover member 9 is provided with a convex portion 92 so that the convex portion 92 protrudes in the direction of the base 81 and is positioned near the lighting circuit 7, thereby achieving the same degree of effect as that of the first embodiment except for the above-mentioned effects. The temperature rise of the lighting circuit 7 is suppressed as much as possible. Furthermore, by setting the distance D between the convex portion 92 and the circuit board 71 to be 3 mm or less, temperature rise can be further suppressed.

This invention is not limited to the said embodiment, Various deformation|transformation is possible.

For example, the shape of the through hole of the substrate 2 or the heat dissipation plate 3 is not limited to a circle, and may be a polygon.

Silicone resin may be filled in the whole or a part of the inside of the insulating case 6 where the lighting circuit 7 is arranged. Thereby, the temperature rise of the lighting circuit 7 can be further suppressed. As shown in FIG. 8 , by filling the inside of the protruding portion 62 of the insulating case 6 with the silicone resin 74 , an effect that the temperature is lowered by about 5° C. compared to the case of no filling can be expected.

While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the invention. Indeed, these novel embodiments may be embodied in various other forms; furthermore, various omissions, substitutions, and changes in form of the embodiments described herein may be made without departing from the spirit of the invention. The accompanying technical solutions and their equivalent scope are intended to include such forms and modifications that still fall within the scope or spirit of the present invention.

Claims (10)

1. A lamp, characterized in that it comprises: A hollow shell with an open end; a substrate having a through hole in the center and provided on one end side of the housing; a plurality of semiconductor light emitting elements arranged in a circumferential shape on one end side of the substrate and along the through hole; The lighting circuit has a circuit board and circuit parts including heat generating parts mounted on the circuit board, and is provided so that the heat generating parts are located in the region of the through hole when the housing is viewed from one end side. inside the housing; and The power supply unit is provided on the other end side of the casing. 2. The lamp of claim 1, characterized in that: When L is the size of the through hole and W is the width of the circuit board, L/W is 0.6 or more. 3. The lamp of claim 1, wherein: When L is the size of the through-hole and W is the width of the circuit board, L/W is 0.75 or more. 4. The lamp of claim 1, wherein: When L is the size of the through-hole and W is the width of the circuit board, L/W is 1.4 or less. 5. The lamp of claim 1, wherein: A substrate provided with the plurality of semiconductor light emitting elements or a heat dissipation plate provided with the substrate is mounted on the substrate mounting portion of the hollow case. 6. The lamp of claim 1, wherein: The substrate is disposed on a heat dissipation plate, the heat dissipation plate has a through hole in the center, and is disposed at one end of the housing so that the through hole of the heat dissipation plate communicates with the through hole of the substrate. side. 7. The lamp of claim 1, wherein: The through hole communicates with the hollow casing. 8. The lamp of claim 1, wherein: A cover member is provided on the through hole, and the cover member has a convex portion that protrudes toward the power supply unit and is located in the vicinity of the lighting circuit. 9. The lamp of claim 8, wherein: The circuit board is disposed inside the housing such that a surface on which the circuit components are mounted is along the lamp axis, and a distance D between the convex portion and the circuit board is 3 mm or less. 10. The lamp of claim 8, wherein: The thermal conductivity of the cover member is lower than that of the substrate on which the plurality of semiconductor light emitting elements are provided, or the heat dissipation plate on which the substrate is provided.