JP5161192B2 - Power circuit wiring structure - Google Patents

Description

  The present invention relates to a power circuit wiring structure capable of reducing a temperature rise of a printed circuit board pattern on which power circuit components are mounted.

In a printed circuit board on which a power circuit component is mounted, the temperature of the pattern rises due to Joule heat generated when a large current flows through the pattern on the printed circuit board and heat conduction from the electrical component mounted on the printed circuit board. Since the pattern itself on the printed circuit board has a temperature limit (for example, the manufacturer's standard value of 100 ° C.), the current value flowing through the pattern is limited, which is a factor that limits the rated capacity of the control device incorporating this printed circuit board. It was.
In recent years, power semiconductors such as transfer-molded power semiconductor DIPIPM (Dual-In-Line Package Intelligent Power Module) for motor drive systems have been increased for the purpose of energy saving and high performance, and the power semiconductor has been printed. As the current of the power circuit mounted on the substrate is further increased, the importance of measures for reducing the temperature rise of the pattern on the printed circuit board is increasing.
Conventionally, as a measure for reducing the temperature rise of the pattern on the printed circuit board, a method of providing a heat dissipation member on the pattern of the printed circuit board (see Patent Document 1 and Non-Patent Document 1) and the circuit component and the pattern are electrically connected with screws or the like. There is a method (refer to Patent Document 2) in which a heat dissipating member is screwed to a connecting portion.

JP 2007-258539 A (page 3, FIG. 2) JP 2007-214414 A (page 3, FIG. 1)

Japanese Utility Model Publication No. 3-104793 (FIG. 1)

  In the conventional method of reducing the temperature rise of the pattern on the printed circuit board on which power circuit components are mounted, if multiple high-voltage, high-current circuits are mounted on the printed circuit board, it is necessary to install multiple heat dissipation members However, there is a problem that it is difficult to arrange a plurality of heat dissipating members on a printed circuit board pattern while ensuring a safe insulating distance.

  The present invention has been made to solve the above-described problems, and can reduce the temperature rise of the pattern on the printed circuit board on which the power circuit component is mounted, and the heat dissipating portion is provided while ensuring a safe insulation distance. An object is to provide a power circuit wiring structure.

A power circuit wiring structure according to the present invention includes a printed circuit board for mounting a power circuit component, a heat radiation pattern connected to the power circuit component disposed on the printed circuit board for mounting, and a plurality of electrically insulated patterns. A heat radiating member having a heat radiating portion, and a connecting member that thermally couples the heat radiating member to the heat radiation pattern on the printed circuit board for mounting and fixes the heat radiating member to the printed circuit board for mounting. The heat radiation part is a heat radiation pattern, and the heat radiation pattern of the different voltage is arranged opposite to both surfaces of the printed board for heat radiation to form a capacitor .

In the power circuit wiring structure according to the present invention, a heat dissipating member having a plurality of electrically insulated heat dissipating portions is installed on a mounting printed circuit board on which power circuit components are mounted, and the circuit board disposed on the mounting printed circuit board. The heat dissipation pattern and the heat dissipation part are thermally coupled , the heat dissipation member is a heat dissipation printed circuit board, the heat dissipation part is the heat dissipation pattern, and the heat dissipation patterns of different voltages are arranged opposite to both surfaces of the heat dissipation printed circuit board, Since the capacitor is formed, it is possible to reduce the temperature rise of multiple patterns through which high voltage and large current flow with a heat dissipating member having a plurality of heat dissipating parts that secure a safe insulation distance, and a transient bus voltage Variations can be suppressed .

It is the perspective view and sectional drawing which show the structure of the power circuit wiring structure of Embodiment 1 of this invention. It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 2 of this invention. It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 3 of this invention. It is the perspective view and sectional drawing which show the structure of the power circuit wiring structure of Embodiment 4 of this invention. It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 5 of this invention. It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 6 of this invention. It is sectional drawing which shows the structure of the power circuit wiring structure of Embodiment 7 of this invention. It is the perspective view and sectional drawing which show the structure of the power circuit wiring structure of Embodiment 8 of this invention.

Embodiment 1 FIG.
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an overall configuration of a power circuit wiring structure 1 according to Embodiment 1 of the present invention. FIG. 1a is a perspective view, and FIG. 1b is a sectional view showing an AA ′ section.
The power circuit wiring structure 1 is a heat dissipating member having heat dissipating patterns 3, 4, 5 which are a plurality of heat dissipating portions electrically insulated from a printed circuit board 21 for mounting a power circuit component (not shown). The printed circuit board 2 is used. The heat radiation patterns 3, 4, 5 on the heat radiation printed circuit board 2 and the heat radiation patterns 22, 23, 24 on the mounting printed circuit board 21 are thermally connected by connection terminals 6, 7, 8. The connection terminals 6, 7, and 8 thermally couple the heat radiation patterns 3, 4, and 5 to the heat radiation patterns 22, 23, and 24, and also have a function of fixing the heat radiation printed circuit board 2 to the mounting printed circuit board 21. Have. Here, the material of the heat radiation pattern and the heat radiation pattern is copper foil.

  A thermal coupling method and a fixing method using the connection terminals 6, 7, and 8 will be described using the heat radiation pattern 3, the heat radiation pattern 22, and the connection terminal 6 as examples. Since the connection terminal 6 has high thermal conductivity and requires mechanical strength as a fixing member, it is a vertically long metal plate. A connection terminal fixing bolt (hereinafter, referred to as a fixing bolt) 6a is attached to the upper portion of the connection terminal 6 for coupling with the heat dissipation printed circuit board 2, and the lower portion 6c is fixed to the mounting printed circuit board 21. The shape matches the shape of the fixing holes provided in the pattern 22. In FIG. 1, the connection terminal coupling portion 6 c of the connection terminal 6 is coupled to the heat radiation pattern 22 by soldering.

Hereinafter, a procedure for assembling the power circuit wiring structure will be described.
In a separate process, the heat-dissipation printed circuit board 2 and the connection terminals 6, 7, 8 are fixed using fixing bolts 6a, 7a, 8a and connection terminal fixing nuts (hereinafter referred to as fixing nuts) 6b, 7b, 8b. ,assemble. When circuit components are mounted and assembled on the printed circuit board 21 for mounting, the printed circuit board 2 for heat dissipation and the connection terminals 6, 7, and 8 are already assembled. When the mounting printed circuit board 21 is flow-soldered, it is soldered as one component together with other components.

In FIG. 1, although the case where the number of the heat dissipation patterns which are the heat dissipation portions formed on the heat dissipation printed circuit board 2 which is the heat dissipation member is 3 is shown, the number of the heat dissipation patterns may be two or more. The shape is not limited to the illustrated rectangle.
Moreover, although the heat radiation patterns 3, 4, and 5 formed on the heat radiation printed board 2 are single-sided, they may be double-sided. When the heat radiation patterns 3, 4, and 5 are double-sided, they are fixed using fixing bolts 6 a, 7 a, and 8 a and fixing nuts 6 b, 7 b, and 8 b and thermally coupled between the front surface pattern and the back surface pattern.
In FIG. 1, as a method of fixing the connection terminal 6 to the heat dissipation printed circuit board 2, a screwing method for fixing the connection terminal 6 to the heat dissipation printed circuit board 2 using the connection terminal fixing bolt 6 a and the connection terminal fixing nut 6 b. However, as a fixing method for obtaining mechanical strength and good thermal conductivity, a soldering or caulking method can also be adopted. On the other hand, as a method of fixing the heat radiation printed circuit board 2 to the mounting printed circuit board 21, the case where the connection terminals 6 are fixed to the heat radiation patterns 22, 23, and 24 by soldering has been described. As a fixing method for obtaining conductivity, a caulking or screwing method can also be adopted.
Further, in the above description, the connection terminals 6, 7, and 8 are made of metal and shared for fixing and thermal coupling. However, the connection terminal is made of nonmetal (for example, made of synthetic resin) and used only for fixing. In addition, the heat radiation patterns 3, 4, 5 and the heat radiation patterns 22, 23, 24 may be thermally coupled with a metal for thermal coupling.

  The power circuit wiring structure 1 according to the first embodiment includes heat radiation patterns 3, 4, and 5, which are two or more electrically insulated heat radiation portions, on a mounting printed board 21 on which power circuit components are mounted. Since the heat dissipating board 2 which is a heat dissipating member is installed, and the heat dissipating patterns 22, 23 and 24 and the heat dissipating patterns 3, 4 and 5 arranged on the printed circuit board 21 for mounting are respectively thermally coupled. The reduction in temperature rise of the plurality of heat radiation patterns 22, 23, and 24 through which a high voltage and a large current flow can be realized by a heat radiation member having a plurality of heat radiation portions that ensure a safe insulation distance.

Since no circuit current flows through the heat radiation patterns 3, 4, and 5, there is no self-heating due to the circuit current, and the heat radiation effect of the heat radiation patterns 3, 4, and 5 can be utilized to the maximum.
In addition, since the power circuit wiring structure 1 according to the first embodiment has an effect of reducing the temperature rise in the heat radiation patterns 22, 23, and 24, conventionally, to reduce the temperature rise of the pattern on the printed circuit board. There is an effect that it is not necessary to make the pattern thick copper foil, and a general-purpose printed circuit board distributed in the market can be used. As measures other than the thick copper foil of the copper foil pattern, the copper foil pattern is also widened, but the copper foil pattern can be narrowed, and there is an effect that the printed circuit board for mounting can be downsized. By narrowing the copper foil pattern, it is possible to reduce the diameter of the leads of the circuit component and the pitch between the leads, and to reduce the size of the circuit component package.

  The rated capacity of power electronics equipment (hereinafter referred to as power electronics equipment) is usually limited by the temperature rise of circuit components and printed circuit board patterns. Therefore, to increase the rated capacity of equipment, It is necessary to reduce the temperature rise of the printed circuit board pattern. In recent years, power semiconductors for high voltage and high current have been put into practical use, and when the rated capacity of the power electronics device is limited by the temperature of the printed circuit board pattern, the power circuit wiring structure 1 according to the first embodiment is used. By adopting, there is an effect that the rated capacity of the power electronics device can be increased.

Embodiment 2. FIG.
FIG. 2 is a sectional view showing an overall configuration of a power circuit wiring structure 31 according to Embodiment 2 of the present invention. In the figure, the same or corresponding parts as in FIG.
The heat radiation printed circuit board 32 has heat radiation patterns 33a and 33b on both the front and back surfaces, and the heat radiation patterns 33a and 33b are thermally coupled to each other through holes.
Although not shown, the heat radiation printed board 32 has a plurality of heat radiation patterns 34a and 34b and 35a and 35b as in the first embodiment, and the front surface and the back surface pattern are coupled by through holes, respectively. .
Further, the heat radiation printed circuit board 32 is fixed and thermally coupled to the heat radiation pattern 22 of the mounting printed circuit board 21 by connection terminals 6 (connection terminals 7 and 8 are not shown).

  The power circuit wiring structure 31 according to the second embodiment is formed on both surfaces of the heat radiation printed circuit board 32 as compared to the case where both surfaces of the heat radiation printed circuit board are thermally coupled only at the connection terminal 6 without the through hole. The heat conduction between the heat radiation patterns 33a and 33b is improved, the surface temperature of the heat radiation pattern is made uniform, and the heat radiation performance is improved.

Embodiment 3 FIG.
FIG. 3 is a sectional view showing an overall configuration of a power circuit wiring structure 41 according to Embodiment 3 of the present invention. In the figure, the same or corresponding parts as in FIG.
The heat radiation printed circuit board 42 has heat radiation patterns 43a and 43b on both sides and a pattern 43d on the inner layer.
Although not shown, the heat radiation printed circuit board 42 has a plurality of heat radiation patterns 44a and 44b and 45a and 45b as in the first embodiment.
The heat radiation printed circuit board 42 is fixed and thermally coupled to the heat radiation patterns 22, 23, and 24 of the mounting printed circuit board 21 by connection terminals 6 (connection terminals 7 and 8 are not shown). Yes.
The inner layer pattern of the heat radiation printed circuit board 42 may be provided separately for each of the heat radiation patterns 43a and 43b, 44a and 44b, and 45a and 45b, or may be a single inner layer pattern.

In the power circuit wiring structure 41 according to the third embodiment, the heat conduction of the heat radiating printed circuit board 42 is improved, and the surface temperatures of the heat radiating patterns 43a and 43b are made uniform, and the heat radiating property is improved.
Further, since the heat dissipating printed circuit board 42 has the inner layer pattern 43d, it is generated in the heat dissipating printed circuit board 42 when performing the flow soldering described in the assembly procedure of the power circuit wiring structure of the first embodiment. There is an effect that the warpage of the substrate is reduced.

Embodiment 4 FIG.
4 is a diagram showing the overall configuration of a power circuit wiring structure 51 according to Embodiment 4 of the present invention. FIG. 4a is a perspective view, FIG. 4b is a sectional view showing an AA ′ section, and FIG. It is sectional drawing which shows a B 'cross section. In the figure, the same or corresponding parts as in FIG.
In the power circuit wiring structure 51, as in the first embodiment, the connection terminals 6 and 8 thermally couple the heat radiation patterns 3 and 5 and the heat radiation patterns 22 and 24 and mount the heat radiation printed board 2 for mounting. It also has a function of fixing to the printed circuit board 21. The connection terminal 9 thermally couples the heat radiation pattern 4 and the heat radiation pattern 23 and also has a function of fixing the heat radiation printed circuit board 2 to the mounting printed circuit board 21, but the shape of the connection terminal 9 is a vertically long flat plate. Instead, a staircase shape having a horizontal portion with respect to the mounting printed circuit board 21 is employed.
Since the connection terminal 9 has a staircase shape, the positions at which the connection terminals 6, 9, 8 are fixed to the heat radiation patterns 22, 23, 24 of the mounting printed circuit board 21 are not linear but staggered.

  In the power circuit wiring structure 51 according to the fourth embodiment, the positions at which the connection terminals 6, 9, 8 are fixed to the mounting printed board 21 are staggered, so that the self-supporting stability of the heat radiating printed board 2 is improved. At the same time, when the flow soldering described in the first embodiment is performed, a jig for fixing the heat-dissipation printed circuit board 2 is not required, and the soldering operation is facilitated.

Embodiment 5 FIG.
FIG. 5 is a sectional view showing an overall configuration of a power circuit wiring structure 61 according to Embodiment 5 of the present invention. In the figure, the same or corresponding parts as in FIG.
A heat generating component 62 and a non-heat generating component 63, which are power circuit components, are mounted on a mounting printed circuit board. Between the heat generating component 62 and the non-heat generating component 63, the heat dissipation printed circuit board 2 is connected to the connection terminal 6 (connection terminal 7, 8 is not shown).

  In the power circuit wiring structure 61 according to the fifth embodiment, the heat radiation printed circuit board 2 is disposed between the heat generating component 62 and the non-heat generating component 63 that does not generate heat. This can reduce the thermal stress that the non-heat generating component 63 receives. For example, an electrolytic capacitor that shortens the component life when the operating temperature is high can extend the life of the power electronics device by reducing thermal stress.

Embodiment 6 FIG.
FIG. 6 is a sectional view showing an overall configuration of a power circuit wiring structure 71 according to Embodiment 6 of the present invention. In the figure, the same or corresponding parts as in FIG.
The position where the lead terminal 72a of the power circuit component 72 is soldered to the heat radiation pattern 22 on the printed circuit board for mounting is in the vicinity of the soldering position of the connection terminal coupling portion 6c of the connection terminal 6 for fixing the printed circuit board 2 for heat radiation. Provided.

  In the power circuit wiring structure 71 according to the sixth embodiment, when the lead terminal 72a of the power circuit component 72 is soldered, the connection terminal coupling portion 6c is provided in the vicinity of the lead terminal 72a of the power circuit component 72. Since the copper foil pattern in the vicinity of the lead terminal 72a at the time of soldering is heated uniformly over a wide range as compared with the case of only the lead terminal 72a, there is an effect that solderability is improved.

Embodiment 7 FIG.
FIG. 7 is a sectional view showing an overall configuration of a power circuit wiring structure 81 according to Embodiment 7 of the present invention. In the figure, the same or corresponding parts as in FIG.
A semiconductor integrated circuit 83 is mounted on a mounting printed circuit board 87 as a specific example of the noise generating component 82 and a circuit component with low noise tolerance, and the heat dissipation printed circuit board 2 is connected between the noise generating component 82 and the semiconductor integrated circuit 83. It is fixed with a terminal 6 (connection terminals 7 and 8 are not shown).

  When the power circuit component is a power module that switches a large current, noise is emitted to peripheral circuit components during switching operation, but when a semiconductor integrated circuit that is susceptible to noise is mounted on the same printed circuit board, Noise reduction measures are necessary.

  In the power circuit wiring structure 81 according to the seventh embodiment, the printed circuit board 2 for heat dissipation is disposed between the noise generating component 82 and the semiconductor integrated circuit 83 to shield radiation noise, so that the noise generating component 82 and the semiconductor are shielded. There is an effect that the influence of noise on the integrated circuit 83 can be reduced.

Embodiment 8 FIG.
8A and 8B are diagrams showing an overall configuration of a power circuit wiring structure 91 according to Embodiment 8 of the present invention, in which FIG. 8a is a perspective view, FIG. 8b is a cross-sectional view showing a cross section AA ′, and FIG. It is a sectional view showing a section. In the figure, the same or corresponding parts as in FIG.

The heat dissipation printed circuit board 92 has a heat dissipation pattern 93 on one surface and a heat dissipation pattern 94 on the opposite surface. The heat dissipating pattern 93 is electrically connected to the heat dissipating pattern 98 on the mounting print by the metal connection terminals 95 and is thermally coupled. The heat radiation pattern 94 is electrically connected to the heat radiation pattern 99 on the mounting print by the metal connection terminals 96 and is thermally coupled. Since each of the heat radiation patterns 93 and 94 is cut at the lower right end, it does not come into contact with the connecting terminals, fixing bolts, and nuts facing each other, and is electrically insulated from each other.
As described above, the heat radiation patterns 93 and 94 are opposed to each other with an epoxy resin printed board as an insulator interposed therebetween and are electrically insulated, so that a capacitor is formed. Here, the heat radiation patterns 98 and 99 are patterns corresponding to the power supply buses of the power modules constituting the inverter unit or the converter unit of the power conversion circuit.

In the power circuit wiring structure 91 according to the eighth embodiment, the heat radiation patterns 93 and 94 insulated from each other are provided on both surfaces of the heat radiation printed board 92 to form capacitors, thereby forming the temperature of the power bus pattern of the power module. As well as alleviating the rise, there are effects of suppressing a transient bus voltage fluctuation when the power module performs a switching operation.

1, 31, 41, 51, 61, 71, 81, 91 Power circuit wiring structure,
2,32,42,92 Printed circuit board for heat dissipation,
3, 4, 5, 33a, 33b, 43a, 43b, 93, 94 heat radiation pattern,
6, 7, 8, 95, 96 connection terminal, 9 stepped connection terminal,
6a connection terminal fixing bolt, 6b connection terminal fixing nut, 6c connection terminal coupling part,
21, 67, 77, 87, 97 Printed circuit board for mounting,
22, 23, 24, 98, 99 Heat radiation pattern, 33c Through hole,
43d inner layer pattern, 62 heat generating component, 63 non-heat generating component, 72 power circuit component,
72a Power circuit component lead wire, 82 Noise generating component, 83 Semiconductor integrated circuit.

Claims (1)

A printed circuit board for mounting a power circuit component, a heat dissipation pattern disposed on the printed circuit board for connection and connected to the power circuit component, a heat dissipation member having a plurality of electrically insulated heat dissipation portions, A heat dissipating member thermally coupled to the heat dissipation pattern and fixed to the printed circuit board for mounting , the heat dissipating member is a heat dissipating printed circuit board, the heat dissipating part is a heat dissipating pattern, A power circuit wiring structure in which a capacitor is formed by disposing the heat radiation patterns of different voltages on both sides of a printed circuit board .

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