CN217563958U - Board card equipment and multi-board card device - Google Patents

Abstract

An embodiment of the utility model provides a board card equipment, include: the heat-conducting board comprises a board card, an electric element, a fixed shell and heat-conducting glue; the board card is electrically connected with the electric element and fixed on the fixed shell; the electric element is positioned in the fixed shell; the heat-conducting glue wraps the electric element and is filled in the fixed shell. Furthermore, the embodiment of the utility model provides a still provide a multiplate card device. The embodiment of the utility model provides a board card equipment and many integrated circuit board devices for electric elements can in time dissipate the heat that produces when its moves, and then avoid electric elements because the damage that high temperature leads to.

Description

Board card equipment and multi-board card device

Technical Field

The embodiment of the utility model provides a relate to electrical engineering technical field, in particular to board equipment and have many integrated circuit board devices of this board equipment.

Background

With the development and progress of electrical engineering technology, the use of various electronic instruments and devices is also becoming more common. The board card is one of the most important providers of electrical connection in electronic instruments and equipment, and is often electrically connected to various electrical components to achieve electrical connection between the various electrical components. At present, the electrical components attached to the board dissipate the heat generated during operation through the air surrounding the components.

The inventor finds that: because the heat generated by part of the electric elements fixed on the board card during operation is more, the heat generated by the electric elements during operation can not be dissipated in time when the heat is dissipated through the air around the electric elements, and the electric elements are easily damaged due to high temperature.

Therefore, it is desirable to provide a board card device and a multi-board device having the same, so that the heat generated by the electric components during operation can be dissipated in time, and the electric components can be prevented from being damaged due to high temperature.

SUMMERY OF THE UTILITY MODEL

An object of the embodiment of the utility model is to provide a board card equipment and have many integrated circuit board devices of this board card equipment to make the heat that produces when its operation of electric elements accessible time dissipation, and then avoid electric elements because the damage that high temperature leads to.

In order to solve the above problem, an embodiment of the present invention provides a board card device, including: the heat-conducting board comprises a board card, an electric element, a fixed shell and heat-conducting glue; the board card is electrically connected with the electric element and is fixed on the fixed shell; the electric element is positioned inside the fixed shell; the heat-conducting glue wraps the electric element and is filled in the fixed shell.

Furthermore, the embodiment of the utility model provides a still provide a many integrated circuit board device, include: mainboard, at least one foretell integrated circuit board equipment, and fixed part, wherein, fixed casing and the mainboard is fixed on the fixed part.

The embodiment of the utility model provides an above-mentioned integrated circuit board equipment and many integrated circuit board devices is located inside the fixed casing through electric element, and heat-conducting glue parcel electric element and fill inside fixed casing, when the electric element operation of being connected with the integrated circuit board electricity, heat that the heat-conducting glue produced when absorbing electric element operation, with the heat conduction that produces when operating electric element fast to fixed casing, and conduct to external environment via fixed casing, and then avoid electric element because the damage that high temperature leads to.

In addition, the heat-conducting glue can be elastically deformed under the extrusion of the electric element and the fixed shell. Therefore, when the board card equipment is impacted, the fixed shell is impacted firstly, the heat conducting glue is elastically deformed under the extrusion of the fixed shell, so that the impact force transmitted to the electric element from the fixed shell is buffered, and the electric element is prevented from falling off due to overlarge stress.

In addition, the heat-conducting glue is insulating heat-conducting glue. Therefore, the short circuit of the circuit in the electronic instrument and equipment caused by the electric connection of the electric element and other parts through the heat-conducting glue can be avoided.

In addition, the integrated circuit board is provided with a conductive circuit and a conductive hole, and the conductive hole is electrically connected with the electric element through the conductive circuit.

In addition, the fixed part is a radiator. Therefore, in the process of operating the multi-board card device, the heat radiator can further improve the heat radiation efficiency of the electric element.

In addition, the multi-board card device further includes: the mainboard and the board card are electrically connected through the conductive columns. So set up, can avoid mainboard and integrated circuit board to need to be connected through the wire electricity, lead to many integrated circuit board device pencil in disorder.

In addition, the conductive column penetrates through the conductive hole and is electrically connected with the board card.

In addition, the conductive columns are copper studs.

In addition, the number of the conductive columns is eight; the number of the board card devices is two, the board cards of the two board card devices are respectively an inductance board and a filter board, and the inductance board is electrically connected with the main board through the two conductive columns; the filtering plate is connected with the mainboard electricity through six the conductive columns.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

Fig. 1 is a schematic structural diagram of a board card device according to a first embodiment of the present invention;

fig. 2 is an exploded view of a board card device according to a first embodiment of the present invention;

fig. 3 is a schematic structural diagram of a multi-board card device according to a second embodiment of the present invention;

fig. 4 is an exploded view of a multi-board card device according to a second embodiment of the present invention;

fig. 5 is an exploded view of an inductance board device according to a second embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following describes each embodiment of the present invention in detail with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that in various embodiments of the invention, numerous technical details are set forth in order to provide a better understanding of the present application. However, the technical means claimed in the present application can be realized by various changes and modifications of the following embodiments.

The utility model discloses implement one and provide a board equipment. The core of the embodiment is that the electric element is positioned in the fixed shell, and the heat conducting glue wraps the electric element and is filled in the fixed shell, when the electric element electrically connected with the board card runs, the heat conducting glue absorbs heat generated when the electric element runs and dissipates the heat generated when the electric element runs quickly, and further the electric element is prevented from being damaged due to high temperature. The following detailed description of the present embodiments is provided for ease of understanding and is not intended to limit the scope of the present embodiments.

Referring to fig. 1 and fig. 2, a first embodiment of the present invention provides a board card device 10, including: the board card 11, the electric element 12, the heat conducting glue 13 and the fixed shell 14; the board card 11 is electrically connected with the electric element 12 and fixed on the fixed shell 14; the electrical component 12 is located inside the stationary housing 14; the thermal conductive paste 13 wraps the electric component 12 and fills the inside of the fixed case 14.

The integrated circuit board equipment 10 that this embodiment provided is filtering board equipment, it is often used for effectively filtering to the frequency point of specific frequency or the frequency beyond this frequency point in the power cord, obtain the power signal of a specific frequency, or eliminate the power signal behind a specific frequency, wherein, integrated circuit board 11 is filtering board, electrical component 12 includes electric capacity, resistance etc. because electric capacity produces the heat more when the operation, adopt heat conduction glue 13 parcel electrical component 12 (electric capacity promptly) and fill inside fixed casing 14, when electrical component 12 moves, heat that the heat conduction glue 13 absorbed the electrical component 12 and produced when moving, and then avoid electrical component 12 because the damage that high temperature leads to.

Further, in the present embodiment, the electrical component 12 is electrically connected to the board 11 by soldering, the board 11 is fixed to the fixed housing 14 by bonding with the heat conductive adhesive 13, and the electrical component 12 is fixed inside the fixed housing 14 by bonding with the heat conductive adhesive 13. It should be noted that, in other alternative embodiments, the board 11 may also be fixed on the fixed housing 14 by other fixing methods such as screwing, welding, and the like.

Preferably, in order to improve the heat dissipation efficiency of the board card device 10, the fixing housing 14 is made of a material with good heat conductivity, and in this embodiment, the material of the fixing housing 14 is aluminum. In other alternative embodiments, the material of the fixing housing 14 may be silver or copper.

Further, the thermally conductive adhesive 13 may be elastically deformed by the pressing of the electrical component 12 and the fixing case 14. Thus, when the board card apparatus 10 is impacted, the fixing housing 14 is impacted first, and the heat conductive adhesive 13 is elastically deformed under the extrusion of the fixing housing 14, so that the impact force transmitted from the fixing housing 14 to the electric element 12 is buffered, and the electric element 12 is prevented from falling off due to the overlarge stress.

In addition, in the embodiment, since the board 11 is fixed to the fixing housing 14 by the thermal conductive adhesive 13, when the board 11 is subjected to an impact force (for example, when the board 11 collides with another component), the board 11 can press the thermal conductive adhesive 13 to buffer the inertia force of the board 11, thereby preventing the board 11 from being damaged by the impact force.

Furthermore, the heat conductive adhesive 13 is an insulating heat conductive adhesive. In this way, it is avoided that the electrical component 13 is electrically connected with other parts through the thermally conductive paste 12, which may cause short circuits in the electronic instruments and devices.

Specifically, in the embodiment, the heat conducting glue 13 is a heat conducting silica gel, which has good thermal conductivity, elasticity, electrical insulation performance and aging resistance, so as to improve the heat dissipation efficiency of the electrical component 12, improve the inertia force of the electrical component 12 when the buffer board card device 10 is impacted, and improve the service life of the heat conducting glue 13 while avoiding the electrical connection between the electrical component 12 and other components; in addition, the heat-conducting silica gel also has excellent moisture-proof, shock-proof, corona-resistant, electric leakage-resistant and chemical medium-resistant performances, and can be applied to the fields of solar energy, solar energy and the like

The board card apparatus 10 can be used continuously and maintain performance in an environment of (C.: degree) to adapt to more working conditions.

Preferably, the board 11 is provided with a conductive trace 111 and a conductive hole 112, the conductive hole 112 is electrically connected to the electrical component 12 through the conductive trace 111, and the conductive hole 112 is used for electrically connecting to other components, so that the electrical component 12 electrically connected to the board 11 is electrically connected to other components. Specifically, in the present embodiment, the board 11 is a single-layer board, which is provided with a top layer 113 and a bottom layer (not shown) disposed opposite to the top layer 113, wherein the conductive traces 111 are disposed on the top layer 113, and the electric components 12 are located on a side close to the bottom layer of the board 11; the board card 11 is further provided with a through hole 114, and the electric element 12 is electrically connected with the through hole 114 of the board card 11; the conductive via 112 is electrically connected to the via 114 through the conductive trace 111, so that the conductive via 112 is electrically connected to the electrical component 12, and when other components are electrically connected to the conductive via 112, the other components are electrically connected to the electrical component 12 through the conductive trace 111 and the via 114 in sequence.

It should be noted that, in other alternative embodiments, the board 11 is a multi-layer board, which is provided with a top layer 113, a bottom layer (not shown) disposed opposite to the top layer 113, and other conductive layers (not shown) located between the top layer 113 and the bottom layer; the conductive traces 111 are located on any of the top layer 113, the bottom layer, and other conductive layers, the electrical component 12 is electrically connected to the via 114, and the via 114 is electrically connected to the conductive via 112 through the conductive trace 113, such that the conductive via 112 is electrically connected to the electrical component 12.

Further, in the present embodiment, the fixing housing 14 is further provided with a plurality of fixing holes 141, and when the board card device 10 is fixed, a plurality of screws (not shown) are used to penetrate through the plurality of fixing holes 141 to fix the board card device 10 at a position where the board card device 10 needs to be fixed by screwing. In one example, the fixing housing 14 may be fixed by welding at a position where the board clamp apparatus 10 needs to be fixed. In another example, the board card apparatus 10 may be fixed by welding or screwing the board card 11 at a position where the board card apparatus 10 needs to be fixed.

Referring to fig. 3 and 4, a second embodiment of the present invention provides a multi-board card device 20, including: a main board 21, at least one board device 22, and a fixing portion 23.

Specifically, in the present embodiment, the multi-board device 20 is an emergency inverter power supply, which is commonly used when the electric vehicle has an emergency (e.g., a main power failure of the electric vehicle) and cannot supply power to the auxiliary ac equipment (e.g., a fan) on the electric vehicle, and the multi-board device 20 provides a temporary ac power supply for the auxiliary ac equipment on the electric vehicle.

Referring to fig. 2 and 5, the number of the board devices 22 is two, which are the filter board device 10 (i.e., the board device provided in the first embodiment) and the inductance board device 24, respectively. The inductor apparatus 24 is used for raising the supplied lower dc voltage to a desired voltage value, and the inductor apparatus 24 includes: a board card 241, an electric element 242, a heat conductive adhesive 243, and a fixing case 244; the board card 241 is electrically connected to the electric element 242 and fixed to the fixed case 244; the electrical components 242 are located inside a stationary housing 244; the thermal conductive adhesive 243 wraps the electrical component 242 and fills the fixed housing 244, wherein the electrical component 242 of the inductive board device 24 is an inductor.

The stationary housing 14 of the filter board device 10, the stationary housing 244 of the inductance board device 24, and the main board 21 are fixed to the fixing portion 23. Specifically, in the present embodiment, the fixing housing 14 of the filter board device 10, the fixing housing 244 of the inductance board device 24, the main board 21 and the fixing portion 23 are all provided with a plurality of fixing holes 141, and when the fixing housing 14 of the filter board device 10, the fixing housing 244 of the inductance board device 24 and the main board 21 are fixed, a plurality of screws (not shown) are used to pass through the plurality of fixing holes 141 to fix the fixing housing 14 of the filter board device 10, the fixing housing 244 of the inductance board device 24 and the main board 21 on the fixing portion 23.

Thus, when the multi-board device 20 is moved, only the fixing portion 23 needs to be moved, and the main board 21 and the board devices 22 do not need to be fixed separately after the main board 21 and the board devices 22 are detached one by one. In addition, when the board device 22 is repaired or replaced, the board device 22 can be directly removed from the fixing portion 23 and replaced.

In other modified embodiments, the fixed housing 14 of the filter board device 10, the fixed housing 244 of the inductance board device 24, and the main board 21 may be fixed to the fixed portion 23 by welding or other fixing methods.

Preferably, the fixing portion 23 is a heat sink. In this way, the heat sink can improve the heat dissipation efficiency of the electrical components 12 of the filter board apparatus 10 and the electrical components 242 of the inductor board apparatus 24 during the operation of the multi-board card apparatus 20.

Specifically, in the present embodiment, the fixing portion 23 is a heat dissipation fin, which increases the contact area with air to further improve the heat dissipation efficiency, and the material of the fixing portion 23 is aluminum. In other modified embodiments, a fan or a condenser may be added to the fixing portion 23, so as to further improve the heat dissipation efficiency of the fixing portion 23.

In addition, the fixing housing 14 of the filter board device 10, the fixing housing 244 of the inductance board device 24, and the main board 21 are fixed on the same side of the fixing portion 23, so that when the fixing housing 14 of the filter board device 10, the fixing housing 244 of the inductance board device 24, and the main board 21 are installed, the installation can be completed without turning over the fixing portion 23.

Further, the multi-board card device 20 further includes a conductive column 25 disposed on the main board 21, and the main board 21 is electrically connected to the board card 11 of the filter board device 10 and the board card 241 of the inductance board device 24 through the conductive column 25. With the arrangement, the situation that the wiring harnesses of the multi-board device 20 are messy due to the fact that the main board 21 and the board card 11 of the filter board device 10 and the board card 241 of the inductance board device 24 are required to be electrically connected through a plurality of wires can be avoided.

Specifically, in the present embodiment, the number of the conductive posts 21 is eight, and the main board 21 is electrically connected to the board card 11 of the filter board device 10 through six conductive posts 21; the main board 21 is electrically connected to the board 241 of the inductance board device 24 through two conductive columns 21.

In addition, in the present embodiment, the board 241 of the inductance board device 24 is provided with a conductive hole 245 electrically connected to the electrical component 242 through a conductive trace (not shown); the two conductive columns 21 penetrate through the conductive holes 245 of the board 241 to be electrically connected with the board 241; six conductive posts 21 pass through the conductive holes 112 of the board 11.

Preferably, the conductive post 25 is made of a material with better conductivity, so as to reduce the loss of the conductive post 25 when conducting electricity. In the present embodiment, the conductive post 25 is a copper stud. In other alternative embodiments, the conductive post 25 is made of silver.

Further, because wave-soldering can carry out the selective spraying of scaling powder to the point that needs the welding, in this embodiment, it fixes on mainboard 21, the integrated circuit board 11 of filter board equipment 10 and the integrated circuit board 241 of inductance plate equipment 24 to lead electrical pillar 21 to reduce the pollution of scaling powder to mainboard 21, the integrated circuit board 11 of filter board equipment 10 and the integrated circuit board 241 of inductance plate equipment 24, promote the cleanliness of mainboard 21, the integrated circuit board 11 of filter board equipment 10 and the integrated circuit board 241 of inductance plate equipment 24.

It will be understood by those skilled in the art that the foregoing embodiments are specific examples of the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is defined by the appended claims.

Claims (10)

1. A card apparatus, comprising: the heat-conducting board comprises a board card, an electric element, a fixed shell and heat-conducting glue; the board card is electrically connected with the electric element and is fixed on the fixed shell; the electric element is positioned inside the fixed shell; the heat-conducting glue wraps the electric element and is filled in the fixed shell.

2. The board device according to claim 1, wherein the thermally conductive adhesive is elastically deformable under compression of the electrical component with the stationary housing.

3. The board card apparatus of claim 1, wherein the thermally conductive glue is an insulating thermally conductive glue.

4. A card device according to any of claims 1-3, characterized in that the card is provided with conductive tracks and conductive holes, which are electrically connected to the electrical components via the conductive tracks.

5. A multi-board card device, comprising: a main board, at least one board device according to any of claims 1 to 4, and a fixing part, wherein the fixing housing and the main board are fixed to the fixing part.

6. The multi-board card device according to claim 5, wherein the fixing portion is a heat sink.

7. The multi-board card device of claim 5, further comprising: the setting is in lead electrical pillar on the mainboard, the mainboard with the integrated circuit board passes through it connects to lead electrical pillar electricity.

8. The multiple board card device according to claim 7, wherein the board device is the board device of claim 4, and the conductive posts pass through the conductive holes and are electrically connected to the board.

9. The multi-card device of claim 7, wherein the conductive posts are copper studs.

10. The multi-board card device according to any of claims 7-9, wherein the number of conductive posts is eight; the number of the board card devices is two, the board cards of the two board card devices are respectively an inductance board and a filter board, and the inductance board is electrically connected with the main board through the two conductive columns; the filtering board is through six lead electrical pillar with the mainboard electricity is connected.

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