CN119650527A - Heat dissipation structure of power module and power module - Google Patents
Heat dissipation structure of power module and power module Download PDFInfo
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- CN119650527A CN119650527A CN202311201732.2A CN202311201732A CN119650527A CN 119650527 A CN119650527 A CN 119650527A CN 202311201732 A CN202311201732 A CN 202311201732A CN 119650527 A CN119650527 A CN 119650527A
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- heat dissipation
- power module
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- metal
- substrate
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Abstract
The invention discloses a heat dissipation structure of a power module and the power module. The heat dissipation structure comprises a heat conduction substrate and a heat dissipation cover, wherein the heat conduction substrate is provided with a first surface and a second surface for installing a power device, the first surface is provided with a metal heat dissipation layer, the heat dissipation cover is installed on the first surface of the heat conduction substrate, an evaporation cavity for containing cooling working medium is enclosed between the heat dissipation cover and the heat conduction substrate, and the evaporation cavity is provided with a capillary structure arranged on the inner wall of the heat dissipation cover and the metal heat dissipation layer. In the invention, the heat conducting substrate for mounting the power device forms a part of the evaporation cavity, so that the cooling working medium can directly contact with the heat conducting substrate to realize rapid heat dissipation.
Description
Technical Field
The invention relates to a heat dissipation structure of a power module and the power module adopting the heat dissipation structure.
Background
The power module comprising the IGBT chip and/or the MOSFET chip and other power devices is widely applied to various power electronic equipment, and a large amount of heat can be generated when the power device works, and if the power module can not timely emit the generated heat, the work of the power device and peripheral electronic elements thereof can be seriously affected.
In the prior art, a radiator is generally adopted for radiating the heat of the power module. As an improvement, in some prior art, the power module is connected to a temperature plate or heat pipe which is in turn connected to a heat sink to more rapidly conduct heat within the power module to the heat sink through the temperature plate or heat pipe. The temperature equalizing plate or the heat pipe is generally connected to the heat conducting substrate of the power module through a heat conducting medium (such as a heat conducting pad), and heat resistance generated at the connection interface affects heat transfer efficiency from the power module to the temperature equalizing plate or the heat pipe.
Disclosure of Invention
Aiming at the defects of the prior art, the main purpose of the invention is to provide a heat dissipation structure of a power module so as to further improve the heat dissipation performance of the power module.
Another object of the present invention is to provide a power module having the above heat dissipation structure.
In order to achieve the above main object, a first aspect of the present invention discloses a heat dissipation structure of a power module, including:
the heat conducting substrate is provided with a first surface and a second surface for mounting a power device, and the first surface is provided with a metal heat dissipation layer;
the heat dissipation cover is arranged on the first surface of the heat conduction substrate, and an evaporation cavity for containing cooling working medium is enclosed between the heat conduction substrate and the heat dissipation cover, and the evaporation cavity is provided with a capillary structure arranged on the inner wall of the heat dissipation cover and the metal heat dissipation layer.
Further, the heat radiation structure of the power module further comprises a water tank provided with a water inlet and a water outlet, and the heat radiation cover is at least partially accommodated in the water tank. When the power module works, the circulating water flow in the water tank can rapidly take away the heat of the heat dissipation cover, so that better heat dissipation performance is realized.
According to one embodiment of the invention, the heat conducting substrate comprises an insulating substrate and a metal block or a ceramic block arranged in the insulating substrate, wherein the metal block is directly connected to the metal heat dissipation layer, and the ceramic block is directly connected to the metal heat dissipation layer or is connected to the metal heat dissipation layer through a metal foil.
According to another embodiment of the invention, the heat conducting substrate comprises a ceramic core plate, and the metal heat dissipation layer is arranged on the surface of the ceramic core plate.
Further, a supporting structure for supporting the capillary structure is arranged in the evaporation cavity so as to avoid or reduce collapse or falling of the capillary structure.
Further, the bottom wall of the heat dissipation cover is provided with a hollow or non-hollow heat dissipation column so as to increase the heat dissipation area of the heat dissipation cover.
In order to achieve the above another object, a second aspect of the present invention provides a power module including a power device and any one of the heat dissipation structures as described above, the power device being mounted on a second surface of a thermally conductive substrate.
Further, the power module further comprises a packaging body which is arranged on the second surface of the heat conducting substrate and packages the power device inside the packaging body.
Further, a surface of the package body facing away from the heat conducting substrate may be provided with a surface line electrically connected to the power device. Both the power pins and the signal pins of the power module can be arranged in the surface circuit to simplify the external electrical connection structure thereof.
Further, the package includes a multi-layer insulating core board, and an inner conductive circuit disposed on a surface of the insulating core board is disposed inside the package.
In the invention, the heat conducting substrate provided with the power device forms a part of the evaporation cavity, so that the cooling working medium in the evaporation cavity can be directly contacted with the heat conducting substrate, thereby eliminating the heat resistance between the heat conducting substrate and the evaporation cavity, and further improving the heat dissipation performance of the power module.
The objects, technical solutions and advantages of the present invention will be more clearly described below, and the present invention will be further described in detail with reference to the accompanying drawings and the detailed description.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
FIG. 2 is a schematic structural view of embodiment 2 of the present invention;
FIG. 3 is a schematic structural view of embodiment 3 of the present invention;
FIG. 4 is a schematic structural view of embodiment 4 of the present invention;
FIG. 5 is a schematic view of the structure of embodiment 5 of the present invention;
fig. 6 is a schematic structural view of embodiment 6 of the present invention.
Detailed Description
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, it should be understood that the following examples and detailed description are presented for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1-6, the power module of an embodiment includes a thermally conductive substrate 10, one or more power devices 20 (e.g., IGBT chips), and a heat sink 30. The heat conducting substrate 10 has a first surface and a second surface disposed opposite to each other, the heat dissipating cover 30 is connected to the first surface of the heat conducting substrate 10, and the power device 20 is disposed on the second surface of the heat conducting substrate 10.
The connection between the heat dissipation cap 30 and the heat conductive substrate 10 may be a welded connection or a fixed connection by a fastener (e.g., a screw or a bolt), which is not limited by the present invention. The heat dissipation cover 30 and the heat conduction substrate 10 enclose an evaporation cavity 40 for accommodating a cooling working medium, a negative pressure environment is formed in the evaporation cavity 40, and the cooling working medium can be any one or more of water, ethanol, acetone and the like, which is not limited in the invention.
The inner wall of the evaporation chamber 40 is provided with a capillary structure so that heat can be rapidly conducted from the heat conductive substrate 10 to the heat dissipation cap 30. The capillary structure may be a porous metal layer formed by sintering metal powder (such as copper powder), a capillary mesh formed by braiding fiber filaments or metal filaments (such as copper wires), and/or capillary grooves machined in the inner wall of the evaporation chamber 40. The capillary structure may also be made by other known means, as the invention is not limited in this respect.
The first surface of the heat conductive substrate 10 is provided with a first metal layer 11 as a metal heat dissipation layer, the first metal layer 11 may include a copper foil layer with a thickness of 0.2 mm-1.0 mm, and the surface of the copper foil layer may have a corrosion-resistant coating. In a specific embodiment, the capillary structure includes a wire-woven capillary mesh 41a provided on the first metal layer 11 and a porous metal layer 41b provided on the inner wall of the heat dissipation cover 30, and the edges of the wire-woven capillary mesh 41a are in contact with the porous metal layer 41b to form a continuous capillary structure. Wherein the wire braid capillary net 41a may be disposed on the first metal layer 11 by welding.
Preferably, a supporting structure for supporting the capillary structure is provided in the evaporation chamber 40 to avoid or reduce occurrence of collapse or falling-off of the capillary structure. In the illustrated embodiment, the support structure includes a plurality of support posts 42 disposed between the bottom wall 31 of the heat sink housing 30 and the thermally conductive substrate 10. The support structure may also employ other structures capable of supporting the capillary structure, such as a three-dimensional skeleton, a corrugated plate, etc., to which the present invention is not limited.
In the present invention, the bottom wall 31 of the heat radiation cover 30 may be formed in a flat plate shape, or may have a hollow or non-hollow heat radiation column, and the heat radiation area of the heat radiation cover 30 may be increased by providing the heat radiation column. In some embodiments, as shown in fig. 1, 5 and 6, the bottom wall 31 of the heat sink cap 30 is formed in a flat plate shape, in some embodiments, as shown in fig. 2, the bottom wall 31 of the heat sink cap 30 has a plurality of heat dissipation posts 32 that are not hollow (solid structure), and in some embodiments, as shown in fig. 3 and 4, the bottom wall 31 of the heat sink cap 30 has a plurality of heat dissipation posts 32 that are hollow, and the inner walls of the plurality of heat dissipation posts 32 also have a capillary structure.
Preferably, as shown in fig. 1-6, at least a portion of the radiator cover 30 in the embodiment is contained within a water tank 50, and the water tank 50 is provided with a water inlet 51 and a water outlet 52. In operation of the power module, the circulating water flow in the water tank 50 can rapidly take away the heat of the heat dissipating cover 30. The water tank 50 may be fixedly connected with the heat dissipation cover 30 or the heat conductive substrate 10. Optionally, the water tank 50 is fixedly connected with the heat conductive substrate 10, so that the heat dissipation cover 30 is completely contained inside the water tank 50 to provide better heat dissipation performance. The connection between the water tank 50 and the heat conductive substrate 10 may be a welded connection or a fixed connection by a fastener (e.g., a screw or a bolt), which is not limited by the present invention.
In an embodiment, the second surface of the heat conducting substrate 10 is provided with a second metal layer 12 connected with the power device 20, and the second metal layer 12 may include a copper foil layer with a thickness of 0.2 mm-1.0 mm. The second metal layer 12 may have a conductive pattern 121, i.e., may function to transmit current, or may be used only for conducting heat without transmitting current, and may be specifically set according to the structure of the power device 20. The heat conductive substrate 10 has an insulating medium disposed between the first metal layer 11 and the second metal layer 12, which may be a ceramic core or an insulating substrate embedded with a heat conductive element (e.g., a metal block or a ceramic block), to which the present invention is not limited.
In some embodiments, as shown in fig. 1-3 and 5-6, the thermally conductive substrate 10 is a ceramic substrate that includes a ceramic core plate 13a, and the first metal layer 11 and the second metal layer 12 are disposed on two opposite surfaces of the ceramic core plate 13a, respectively. In some embodiments, as shown in fig. 4, the insulating medium between the first metal layer 11 and the second metal layer 12 is an insulating substrate 13b embedded with a ceramic block 131, and two sides of the ceramic block 131 are welded to the first metal layer 11 and the second metal layer 12 through metal foils 132 (e.g., copper foils), respectively. The insulating substrate 13b may be an FR-4 substrate having a laminated structure or a resin substrate having an integrally molded structure, which is not limited in the present invention.
As a variation of the foregoing embodiment, the ceramic block 131 may also be directly connected (e.g., by active metal brazing) to the first metal layer 11 and the second metal layer 12. As another variation of the foregoing embodiment, a metal block (e.g., copper block) may be provided in the insulating substrate 13b as a heat conductive element, and the metal block may be directly connected to the first metal layer 11 and the second metal layer 12, or may form an integrally molded structure with the first metal layer 11 or the second metal layer 12. Among them, a heat conductive member such as a metal block or a ceramic block may form a heat conductive path having a good heat conductive property in the insulating substrate 13b to rapidly conduct heat generated from the power device 20 to the first metal layer 11.
Further, the second surface of the heat conductive substrate 10 is provided with a package body 60, and the package body 60 may be a resin package body having an integrally formed structure or a package body having a laminated structure, which is not limited in the present invention. In some embodiments, as shown in fig. 1-4 and 6, the package 60 is a resin package having an integrally molded structure. In some embodiments, as shown in FIG. 5, the package body 60 has a laminate structure comprising a multi-layer insulating core 601 (e.g., FR-4 core) and a multi-layer adhesive sheet 602 (e.g., cured sheet), and further, the package body 60 may have inner conductive traces (not shown) disposed on a surface of the insulating core 601 therein.
The power device 20 is disposed inside the package body 60, a surface of the package body 60 facing away from the heat conductive substrate 10 is provided with a surface circuit 61 electrically connected with the power device 20, and power pins and signal pins of the power module may be disposed in the surface circuit 61 so as to realize external electrical connection. The electrical connection structure between the power device 20 and the surface line 61 may be designed according to the specific structure of the power device 20, which is not limited in the present invention.
In some embodiments, as shown in fig. 1 and 2, a first surface of the power device 20 is provided with an S pole 211 and a G pole 212, a second surface of the power device 20 is provided with a D pole 213, the S pole 211 and the G pole 212 are electrically connected to a first pin 611 and a second pin 612 of the surface wire 61 through corresponding metallized interconnection holes 631, respectively, the D pole 213 is connected to a conductive pattern 121 in the second metal layer 12, and is further electrically connected to a third pin 613 of the surface wire 61 through a conductive block 62 (e.g. copper block) in the package 60, wherein the first pin 611 and the third pin 613 are power pins connected with larger currents, the second pin 612 is a signal pin connected with smaller currents, and the metallized interconnection holes 631 between the S pole 211 and the first pin 611 are preferably multiple, so as to facilitate the transmission of larger currents and the heat dissipation. As a variation, the conductive pattern 121 may also be electrically connected to the third leg 613 of the surface line 61 through a corresponding metallized interconnect hole.
In some embodiments, as shown in FIG. 6, the S-pole 211 and the G-pole 212 of the power device 20 are electrically connected to the conductive pattern 121 of the second metal layer 12, the S-pole 211 is further electrically connected to the first leg 611 of the surface trace 61 through a conductive bump 62 (e.g., copper bump) within the package body 60, the G-pole 212 is further electrically connected to the second leg 612 of the surface trace 61 through a metallized interconnect hole 632D-pole 213 within the package body 60, and the D-pole 213 is electrically connected to the third leg 613 of the surface trace 61 through a plurality of metallized interconnect holes 631.
In some embodiments, as shown in fig. 3 and 4, the plurality of electrodes of the power device 20 are disposed centrally on a first surface thereof, and a second surface opposite to the first surface thereof is a heat dissipating surface for dissipating heat only. At this time, the plurality of electrodes on the first surface of the power device 20 may be electrically connected to the surface lines 61 through the corresponding metallized interconnection holes 631 or conductive bumps, and the second surface of the power device 20 is thermally connected to only the second metal layer 12, and the second metal layer 12 may have a non-patterned structure correspondingly.
It should be noted that the different embodiments disclosed above may be cited, referred to, or combined with each other, and that the technical features/components of the different embodiments may be combined with and/or replaced with each other, unless contradictory or exclusive situations exist.
Although the present invention has been described by way of examples, the foregoing examples are provided for illustrative purposes only and are not intended to limit the scope of the invention, and equivalent substitutions or modifications by those skilled in the art according to the present invention shall be construed to be encompassed by the scope of the present invention as defined by the appended claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311201732.2A CN119650527A (en) | 2023-09-18 | 2023-09-18 | Heat dissipation structure of power module and power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311201732.2A CN119650527A (en) | 2023-09-18 | 2023-09-18 | Heat dissipation structure of power module and power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119650527A true CN119650527A (en) | 2025-03-18 |
Family
ID=94947854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311201732.2A Pending CN119650527A (en) | 2023-09-18 | 2023-09-18 | Heat dissipation structure of power module and power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN119650527A (en) |
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2023
- 2023-09-18 CN CN202311201732.2A patent/CN119650527A/en active Pending
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