CN211265455U - Intelligent Power Module and Air Conditioner - Google Patents

Abstract

The utility model discloses an intelligent power module and air conditioner. The intelligent power module comprises a substrate, a component, a radiator, pins and a packaging body, wherein the component is arranged on one surface of the substrate, and the radiator is arranged on one surface of the substrate, which is far away from the component; the pin is electrically connected with the component; the package body wraps the substrate, the component and the heat radiator, wherein at least part of the heat radiator and the pins extend out of the package body. One end of the radiator is wrapped in the packaging body of the intelligent power module and connected with the substrate, so that heat generated in the intelligent power module is directly transmitted to one end, located in the packaging body, of the radiator through the substrate, and finally transmitted to outside air through the part, extending out of the packaging body, of the radiator, heat transmission links are few, the radiating effect is good, and the performance and the reliability of the intelligent power module in the working process can be effectively guaranteed.

Description

Intelligent Power Module and Air Conditioner

technical field

The utility model relates to the technical field of electronic circuits, in particular to an intelligent power module and an air conditioner.

Background technique

In the related art, the intelligent power module is a structure completely sealed by the packaging material. During operation, a large amount of heat will accumulate inside the chip and the electrical connection in the module, which will greatly affect the performance and reliability of the intelligent power module. , a heat sink is usually mounted on the outer surface of the package body of the smart power module to dissipate heat, and thermal paste is applied between the heat sink and the package body of the smart power module to improve thermal conductivity. However, in this method, heat is finally transferred to the heat sink for heat dissipation after passing through the substrate, the thermal conductive paste and the package body, and the overall heat dissipation efficiency is low.

Utility model content

The utility model aims to solve at least one of the technical problems existing in the prior art.

Therefore, the present invention proposes an intelligent power module, which has high heat dissipation efficiency and can ensure the performance and reliability of the intelligent power module in the working process.

The utility model also provides an air conditioner with the above-mentioned intelligent power module.

An intelligent power module according to an embodiment of the present invention includes:

substrate;

components, arranged on one side of the substrate;

a heat sink, arranged on the side of the substrate away from the component;

pins, electrically connected with the components;

A package body covers the substrate, the components, the pins and the heat sink, wherein at least part of the heat sink and the pins extend out of the package body.

The intelligent power module according to the embodiment of the present invention has at least the following technical effects: by wrapping one end of the heat sink in the package of the intelligent power module and connecting it to the base plate, the heat generated inside the intelligent power module is directly transferred from the base plate to the base plate. The heat sink is located at one end inside the package, and the heat is finally transferred to the outside air from the part of the heat sink that extends out of the package. There are few heat transfer links, and the heat dissipation effect is good, which can effectively ensure the intelligent power module in the working process. performance and reliability.

According to some embodiments of the present invention, the heat sink includes:

a base, wrapped in the package body, and connected with the substrate;

A plurality of heat sinks are arranged on the base and protrude out of the package body.

According to some embodiments of the present invention, the base is adapted to the shape of the base plate and closely fits.

According to some embodiments of the present invention, a first insulating layer is provided between the base and the substrate.

According to some embodiments of the present invention, a plurality of the heat sinks are arranged in an array.

According to some embodiments of the present invention, a plurality of the heat dissipation fins are arranged in a rectangular array, and transverse and longitudinal ventilation slots are formed between the plurality of the heat dissipation fins.

According to some embodiments of the present invention, the heat sink is an aluminum heat sink.

According to some embodiments of the present invention, a second insulating layer is provided on the side of the substrate on which the components are mounted, a wiring layer is provided on the second insulating layer, and the components are provided on the wiring layer.

According to some embodiments of the present invention, the pins are bent away from the direction of the heat sink.

The air conditioner according to the embodiment of the second aspect of the present invention includes the intelligent power module according to the embodiment of the first aspect of the present invention.

According to the air conditioner according to the embodiment of the present invention, the above-mentioned intelligent power module is adopted, and one end of the heat sink of the intelligent power module is wrapped in the package body of the intelligent power module and connected to the substrate, so that the heat generated inside the intelligent power module is The substrate is directly transferred to the end of the heat sink inside the package, and the heat is finally transferred to the air from the part of the heat sink that extends out of the package. There are few heat transfer links, and the heat dissipation effect is good, which can effectively ensure the operation of the intelligent power module. performance and reliability in the process.

Additional aspects and advantages of the invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or learned by practice of the invention.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

1 is a schematic cross-sectional view of an intelligent power module according to some embodiments of the present invention;

FIG. 2 is a schematic structural diagram of a heat sink of the intelligent power module shown in FIG. 1;

FIG. 3 is a schematic structural diagram of the intelligent power module shown in FIG. 1;

FIG. 4 is a schematic top view of the intelligent power module shown in FIG. 1;

5 is a schematic block diagram of an air conditioner according to an embodiment of the present invention.

Symbol Description:

intelligent power module 100;

substrate 110;

component 120;

radiator 130, base 131, heat sink 132;

package body 140;

the first insulating layer 150;

pin 160;

the second insulating layer 170;

wiring layer 180;

metal wire 190;

Air conditioner 500.

Detailed ways

The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, but should not be construed as a limitation of the present invention.

In the description of the present utility model, it should be understood that the orientation descriptions related to orientations, such as up, down, front, rear, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings, only It is for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

In the description of the present invention, a plurality of means two or more. Above, below, within, etc. are understood to include the number.

In the description of the present invention, unless otherwise clearly defined, words such as setting, installation, connection should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution .

Hereinafter, a specific example of the intelligent power module 100 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 4 .

FIG. 1 is a schematic cross-sectional view of an intelligent power module according to some embodiments of the present invention. As shown in FIG. 1 , an intelligent power module 100 according to an embodiment of the present invention includes a substrate 110 , a component 120 , a heat sink 130 , pins 160 and a package body 140 .

The components 120 are arranged on one side of the substrate 110 , the heat sink 130 is arranged on the side of the substrate 110 away from the components 120 , the pins 160 are electrically connected with the components 120 , and the package 140 covers the substrate 110 , the components 120 and the pins 160 and the heat sink 130 , wherein at least part of the heat sink 130 and the pins 160 protrude to the outside of the package body 140 .

It can be understood that, by wrapping one end of the heat sink 130 into the package body 140 of the smart power module 100 and connecting it to the substrate 110 , when the smart power module 100 operates, the heat generated inside the heat sink 110 is directly transferred to the substrate 110 . The heat sink 130 is located at one end of the package body 140 , and the heat is finally transferred to the outside air from the part of the heat sink 130 extending out of the package body 140 . The performance and reliability of the intelligent power module 100 during operation can be effectively guaranteed.

Encapsulating one end of the heat sink 130 into the package body 140 can also avoid coating the outer surface of the package body 140 with thermally conductive adhesive, thereby effectively controlling the overall thickness of the package body 140 and reducing the volume of the smart power module 100 .

In addition, according to the smart power module 100 according to the embodiment of the present invention, the substrate 110 is completely encapsulated in the package body 140 , moisture does not easily penetrate into the internal electrical circuit of the smart power module 100 , and the smart power module 100 operates stably and reliably.

Specifically, for example, as shown in FIG. 1 , the substrate 110 has upper and lower surfaces, the components 120 are arranged under the substrate 110 , and the heat sink 130 is arranged on the upper surface of the substrate 110 , so that the heat sink 130 is connected with the components The devices 120 are set apart from each other. The package body 140 only covers the bottom portion of the heat spreader 130 , the top of which protrudes above the top of the package body 140 .

A part of the pins 160 is also encapsulated in the package body 140 and fixed at the lower edge of the substrate 110 , and the rest of the pins protrude out of the package body 140 to function as input and output.

In addition, the substrate 110 is a metal substrate, such as an aluminum substrate, which has good thermal conductivity and can better conduct heat to the heat sink 130 .

The package body 140 plays the role of accommodating, sealing and protecting electrical components and electrical connections, and can be made of epoxy resin material.

FIG. 2 is a schematic structural diagram of a heat sink of the intelligent power module shown in FIG. 1 . As shown in FIG. 1 and FIG. 2 , in some embodiments of the present invention, the heat sink 130 includes a base 131 enclosed in the package body 140 and connected to the substrate 110 , and a base 131 disposed on the base 131 and extending to the The plurality of heat sinks 132 on the top of the package body 140 can greatly increase the surface area of the heat sink 130 and improve the heat dissipation effect.

It can be understood that, the base 131 and the heat sink 132 may be integrally formed or separate, that is, the heat sink 130 may be formed by assembling the two.

Wherein, the shape of the base 131 is adapted to the substrate 110 and closely attached to the substrate 110 . For example, the base 131 and the substrate 110 are both rectangular plates, and the bottom surface of the base 131 and the upper surface of the substrate 110 are attached in a planar manner to further improve the heat dissipation efficiency, thereby ensuring the performance and reliability of the intelligent power module 100 during operation.

In some embodiments of the present invention, a first insulating layer 150 is provided between the substrate 110 and the heat sink 130 to ensure the withstand voltage of the substrate 110 and prevent breakdown. In this case, the heat of the substrate 110 is transferred to the heat sink 130 through the first insulating layer 150 , and then dissipated through the heat sink 130 . The first insulating layer 150 can be formed on the substrate 110 by pressing, and the first insulating layer 150 can be made of a resin material such as epoxy resin and the like filled with a filler such as alumina with a high concentration to improve thermal conductivity.

FIG. 3 is a schematic structural diagram of the intelligent power module 100 shown in FIG. 1 , and FIG. 4 is a schematic top view of the intelligent power module 100 shown in FIG. 1 . 2 to 4, in some embodiments of the present invention, a plurality of heat sinks 132 are arranged in an array to improve the heat dissipation effect. For example, a plurality of heat sinks 132 are arranged on the base 131 in a rectangular array, and as many heat sinks 132 are arranged as possible to increase the overall surface area of the heat sink 130 and improve the heat dissipation effect. After the cooling fins 132 are arranged in a rectangular array, horizontal and vertical ventilation slots will be formed between the cooling fins 132. These ventilation slots communicate with the radiator 130 around the radiator 130, which is conducive to airflow through the surface of the cooling fins 132, which can effectively improve heat dissipation. Effect.

In some embodiments of the present invention, the heat sink 130 is an aluminum heat sink, that is, the heat sink 130 is made of aluminum material, for example, 6063 aluminum material can be selected, which has excellent mechanical properties and can be extruded to manufacture various A cross-sectional shape of the radiator. At the same time, the aluminum material has the characteristics of light weight, strong thermal conductivity and non-magnetic properties. In addition, by forming a dense oxide film on the surface of the aluminum material, the corrosion resistance of the radiator 130 can be improved. 130 has the characteristics of light weight, corrosion resistance, strong thermal conductivity and strong anti-interference ability.

As shown in FIG. 1 , in some embodiments of the present invention, a second insulating layer 170 is formed on one side of the substrate 110 on which the components 120 are mounted, a wiring layer 180 is formed on the second insulating layer 170 , and the components 120 are arranged on A predetermined circuit is formed on the wiring layer 180 so that the intelligent power module 100 has various functions.

The second insulating layer 170 may be made of a resin material such as epoxy resin filled with a filler such as alumina with a high concentration, so as to improve thermal conductivity. The wiring layer 180 is composed of a conductive metal, such as copper or aluminum.

As shown in FIG. 1 , FIG. 3 and FIG. 4 , in some embodiments of the present invention, there are multiple pins 160 , which are fixed at the edges of both sides of the substrate 110 . For example, the pins 160 are welded at the edges of the substrate 110 . on the pads to be fixed. In addition, these pins 160 are bent away from the direction of the heat sink, so that the bent parts of the heat sink 130 , the package body 140 and the pins 160 of the smart power module 100 form a top-to-bottom structure, and the smart power module 100 is installed When placed on the circuit board, the heat sink 130 is located on the top of the package body 140 so as to dissipate heat to the surrounding environment. The layout of the entire structure space is reasonable and the heat dissipation effect is good.

The pins 160 are made of conductive metals such as copper and aluminum, and the surfaces of the pins 160 can also be plated with anti-corrosion and solderability-enhancing coatings.

In some embodiments of the present invention, the intelligent power module 100 further includes metal wires 190 , and the components 120 may be electrically connected through the metal wires 190 , or the components 120 and the wiring layer 180 may be electrically connected through the metal wires 190 . The metal wire 190 can be an aluminum wire, a gold wire or a copper wire, and is bonded between the components 120 , between the wiring layers 180 , between the components 120 and the wiring layer 180 , and between the wiring layer 180 and the pins 160 . An electrical connection is established between the component 120 and the pin 160 .

In some embodiments of the present invention, the components 120 include power devices, such as IGBT chips. Of course, the component 120 may also be other active elements such as transistors or diodes, such as HVIC, FRD, etc., and may also be passive elements such as capacitors or resistors.

According to the embodiment of the present invention, the following provides a method for manufacturing the smart power module 100 according to the embodiment of the present invention, which specifically includes:

A second insulating layer 170 and a wiring layer 180 are formed under the substrate 110;

Correctly solder components and pins 160 such as HVIC, IGBT and FRD on the wiring layer 180;

The metal wires 190 are used to communicate between the components and the components, and between the components and the wiring layer 180 to form an electrical connection;

forming the first insulating layer 150 on the substrate 110 by pressing;

The substrate 110 and the heat sink 130 are installed in the corresponding mold for plastic sealing;

Bend and cut the pins;

The intelligent power module 100 is tested to complete the manufacture.

It can be understood that, on the premise of not violating the actual manufacturing logic, the above sequence of steps can be adjusted reasonably.

FIG. 5 is a block diagram of an air conditioner according to an embodiment of the present invention. As shown in FIG. 5 , in some embodiments of the present invention, the air conditioner 500 proposed by the present invention includes the above-mentioned intelligent power module 100, By wrapping one end of the heat sink 130 into the package body 140 of the smart power module 100 and connecting it to the substrate 110 , when the smart power module 100 operates, the heat generated inside the heat sink 130 is directly transferred from the substrate 110 to the heat sink 130 located in the package. One end of the body 140, the heat is then transferred to the outside air by the part of the heat sink 130 extending out of the package body 140, and the heat transfer does not need to go through the package body 140, the heat transfer links are few, and the heat dissipation effect is good, which can effectively ensure intelligent The performance and reliability of the power module 100 during operation can be improved, thereby improving the reliability of the air conditioner 500 .

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The embodiments of the present utility model have been described in detail above in conjunction with the accompanying drawings, but the present utility model is not limited to the above-mentioned embodiments, and within the scope of knowledge possessed by those of ordinary skill in the technical field, the present utility model can also be used without departing from the purpose of the present utility model. make various changes.

Claims (10)

1. An intelligent power module, characterized in that it comprises: substrate; components, arranged on one side of the substrate; a heat sink, arranged on the side of the substrate away from the component; pins, electrically connected with the components; A package body covers the substrate, the component, the pins and the heat sink, wherein at least a part of the heat sink and the pins extend out of the package body. 2. The intelligent power module according to claim 1, wherein the heat sink comprises: a base, wrapped in the package body, and connected with the substrate; A plurality of heat sinks are arranged on the base and protrude out of the package body. 3 . The intelligent power module according to claim 2 , wherein the base and the base plate are adapted in shape and closely fit. 4 . 4 . The intelligent power module according to claim 3 , wherein a first insulating layer is provided between the base and the substrate. 5 . 5 . The intelligent power module according to claim 2 , wherein a plurality of the heat sinks are arranged in an array. 6 . 6 . The intelligent power module according to claim 5 , wherein a plurality of the heat sinks are arranged in a rectangular array, and horizontal and vertical ventilation slots are formed between the plurality of heat sinks. 7 . 7. The intelligent power module according to any one of claims 1 to 6, wherein the heat sink is an aluminum heat sink. 8 . The intelligent power module according to claim 1 , wherein a second insulating layer is provided on the side of the substrate on which the components are mounted, and a wiring layer is provided on the second insulating layer. 9 . , the components are arranged on the wiring layer. 9 . The intelligent power module according to claim 1 , wherein the pins are bent and arranged away from the direction of the heat sink. 10 . 10. An air conditioner, characterized by comprising the intelligent power module according to any one of claims 1 to 9.

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