JP5075214B2 - Electronic component mounting device - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that takes out an electronic component from a component supply device and mounts the electronic component on a printed board that has been positioned.

  This type of electronic component mounting apparatus is disclosed in, for example, Patent Document 1. Generally, an electronic component is stored in each storage portion formed side by side with a gap in the feeding direction on a tape for supplying the electronic component. And the electronic part is not accommodated in the first part of the new reel wound with the tape. For this reason, the reels that have been supplied with the components are removed from the electronic component supply device, and the electronic component supply device with the new reel tape set is attached to the electronic component mounting device, or the electronic component supply with the new reel tape set After connecting the cart loaded with the device to the electronic component mounting device, an operator is provided in advance in the electronic component supply device so that when the electronic component is removed from the tape, no abnormal removal occurs. By operating the tape feed operation button, the tape is fed one pitch at a time, which is the interval of the parts storage part of the tape, or as described in Patent Document 1, for example, the tape is automatically fed one pitch at a time. The cueing operation of electronic parts was performed.

JP 2007-12888 A

  However, as described above, when the operator operates the tape feed button provided in the electronic component supply device to operate the electronic component supply device and feeds the tape one pitch at a time, or described in Patent Document 1 As shown in the figure, at any time when the tape is automatically fed one pitch at a time and the cueing operation of the electronic component is performed, for example, the tape before the new tape feeding pitch (for example, 4 mm) is replaced. If it is larger than the feed pitch (for example, 2 mm), the position of the new tape component storage (hereinafter referred to as pocket) that has been fed and stopped may deviate from the reference position, that is, the electronic component take-out position. It was. Then, it is necessary for the operator to visually confirm whether there is a shift, or to display the pocket captured by the camera on the monitor, which is complicated. Also, if it is misaligned, the tape feed button can be operated to correct the misalignment, but the work is cumbersome, especially for minute parts, it is difficult to see, and the cueing operation of electronic parts is was difficult.

  If the pocket is displaced without confirming the cueing operation, there is a possibility that a suction error may occur when the electronic component is sucked and taken out from the pocket. There is also a problem that the rate decreases.

  In view of the above, an object of the present invention is to reduce the work of an operator such as when a cueing operation of an electronic component supply apparatus is performed, and to maintain a suction rate while avoiding mistakes in taking out components.

For this reason, according to the first aspect of the present invention, an electronic component in which an electronic component is intermittently sent at a set pitch to each of the storage portions formed side by side in the delivery direction, and the electronic component is sent to the component extraction position An electronic component mounting apparatus comprising a mounting head that is detachably provided and includes a mounting head that takes out and moves an electronic component from a tape of the electronic component supplying device that is attached, and mounts the electronic component on a printed circuit board. When the camera for capturing the image and the electronic component supply device are attached, the position of the storage unit is recognized based on the image captured by the camera, and the position of the storage unit that has been recognized is set in advance. If it is determined that the amount of deviation from the predetermined amount is smaller than a predetermined amount of deviation, a component pick-up operation by the mounting head is started, and the electronic component supply is started. When fitted with a device, if it is determined that the recognized or deviation amount of the predetermined amount of the deviation amount is set in advance from the preset to have the position of the position of the housing unit, the setting pitch smaller than the The tape is fed at the minimum pitch of the electronic component supply device, and after the tape feeding, the position of the storage unit is recognized based on the image captured by the camera, and the recognized displacement amount of the storage unit is set in advance. And a control device that starts a component picking-up operation by the mounting head when it is determined that the amount is smaller than the deviation amount .

In the second aspect of the invention, an electronic component supply device that feeds a tape storing electronic components at a set pitch to each storage portion formed side by side in the delivery direction at a set pitch, and sends the electronic components to the component extraction position is attached and detached. In an electronic component mounting apparatus comprising a mounting head that is freely provided and that is mounted on a printed circuit board by taking out an electronic component from the tape of the electronic component supply device that is attached and moving the electronic component on the printed circuit board. A camera that captures the electronic component, and the position of the electronic component relative to the take-out member is recognized based on an image captured by the camera, and the amount of deviation of the recognized position of the electronic component from a preset position is predetermined. When it is determined that the amount is not more than the deviation amount, the tape feeding operation for taking out the next component is started, the electronic component is picked up, and the take-out member is When the camera picks up the electronic component that has been taken out and the amount of deviation of the recognized position of the electronic component from a preset position is determined to be larger than a predetermined amount of deviation, the set pitch The position of the electronic component relative to the take-out member based on the image taken by the camera of the electronic component taken out from the electronic component supply device that has been tape-feeded at the smallest pitch of the smaller electronic component supply device and that has completed the minimum pitch feed Control to stop the electronic component mounting operation of the electronic component mounting apparatus when it is determined that the amount of shift from the preset position of the electronic component is larger than a predetermined shift amount. And an apparatus.

According to a third aspect of the present invention, in the electronic component mounting apparatus according to claim 1 or 2, the minimum pitch of the electronic component supply device smaller than the set pitch is a pitch obtained by dividing the set pitch by an integer. To do.

According to a fourth aspect of the present invention, in the electronic component mounting apparatus according to the second aspect, when the electronic component mounting operation is stopped by the control device, a display device that displays an abnormal stop is provided.

According to a fifth aspect of the present invention, in the electronic component mounting apparatus according to claim 1, 2, or 3, the minimum pitch of the electronic component supply device smaller than the set pitch is a pitch obtained by dividing an interval between adjacent teeth of the sprocket by an integer. It is characterized by

  According to the present invention, it is possible to reduce an operator's pitch feeding operation such as when the cueing operation of the electronic component supply device is performed, and to avoid a component take-out error and maintain the suction rate.

It is a schematic plan view of the electronic component mounting apparatus of an embodiment. It is a control block diagram. It is a front view of a monitor. It is a flowchart which shows the control of pitch feed correction with respect to the electronic component in which pocket recognition is possible. It is explanatory drawing of the tape of the suction position vicinity before pitch feed correction and after correction. It is a figure of the image of the imaged component extraction opening, a tape, a pocket, and the electronic component 48. FIG. It is explanatory drawing of the flowchart which shows control of the pitch feed correction with respect to components in which pocket recognition is impossible.

  A first embodiment of an electronic component mounting apparatus for mounting electronic components on a printed circuit board will be described below with reference to FIGS. 1 to 3. The electronic component mounting apparatus 1 includes a transport apparatus 2 that transports the printed circuit board P in the X direction, and one side of the transport apparatus 2, that is, the rear side (the rear side in the installed apparatus. For example, a component supply device 5 such as a cart in which a plurality of component supply units 13 are detachably arranged, and the other side of the transport device 2, that is, the front side (the front side in the installed device). , Provided in the lower part of FIG. 1 for supplying electronic components, for example, a component supply device 3 such as a cart in which a plurality of component supply units 13 are detachably arranged, and a pair of beams 7 movable in one direction by a drive source , 8 and mounting heads 10, 11 each having a suction nozzle and movable by each drive source in the direction along the beams 7, 8.

  The component supply device 3 is detachable from the main body of the electronic component mounting apparatus 1. When the component supply device 3 on which a plurality of component supply units 13 are mounted is connected to the main body of the electronic component mounting device 1, the component supply unit 13. A tape feed driving device (motor) and a control device (not shown) provided in the electronic device are connected to the power source of the electronic component mounting device main body and the CPU 16 via the component supply device 3.

  The transport device 2 is disposed in an intermediate portion of the electronic component mounting device 1 and is sucked and held by the substrate supply unit that inherits the printed circuit board P from the upstream device and the suction nozzles 101 and 111 of the mounting heads 10 and 11. Positioning unit for positioning and fixing the printed circuit board P supplied from the substrate supply unit for mounting the electronic component, and a discharge unit for inheriting the printed circuit board P on which the electronic component is mounted by this positioning unit and conveying it to the downstream device It consists of.

  Each of the component supply devices 3 and 5 includes a feeder base 12, and a plurality of component supply units 13 are detachably arranged in each lane of each feeder base 12, and various electronic components are taken out of the respective components. One by one is supplied to the part (part suction position).

  A pair of front and rear beams 7 on the one side (component supply device 5 side) and a beam 8 on the other side (component supply device 3 side), which are long in the X direction, are each a Y direction linear motor 9 that is a Y direction drive motor, The slider fixed to each beam slides and moves individually in the Y direction along a pair of left and right guides that are driven by 99. The Y-direction linear motors 9 and 99 are movable to be fixed to a lower portion of a pair of stators fixed along the pair of left and right bases 1A and 1B and mounting plates provided at both ends of the beams 7 and 8, respectively. It is comprised from the child 9a, 99a.

  The beams 7 and 8 are respectively provided with mounting heads 10 and 11 that move along guides in the longitudinal direction (X direction) by X-direction linear motors 23 and 223 (see FIG. 2) that are X-direction drive motors. The X-direction linear motor includes a pair of front and rear stators fixed to the beams 7 and 8, and a mover provided between the stators and provided on the mounting heads 10 and 11, respectively. Consists of

  Accordingly, the mounting heads 10 and 11 are provided inside the beams 7 and 8 so as to face each other, and the printed circuit board P on the positioning portion of the transport device 2 and the component supply units of the component supply devices 3 and 5 (electronic component supply) The apparatus) 13 is moved above the part extraction position.

  Each mounting head 10, 11 is provided with suction nozzles 101, 111 urged downward by, for example, four springs at predetermined intervals on the circumference. It is also possible to take out electronic components simultaneously from a plurality of component supply units 13 arranged in parallel by suction nozzles located at 3 o'clock and 9 o'clock positions. The suction nozzle can be moved up and down by vertical axis motors 25 and 225 (see FIG. 2), and the mounting heads 10 and 11 are rotated around the vertical axis by the θ-axis motors 26 and 226 (see FIG. 2). As described above, the suction nozzles 5 of the mounting heads 10 and 11 can move in the X direction and the Y direction, can rotate around a vertical line, and can move up and down.

  The mounting heads 10 and 11 are provided with board recognition cameras 14 and 14, respectively, for picking up an image of a positioning mark attached to the printed board P being positioned. Further, the component recognition camera 15 captures images of the electronic components sucked and held by the suction nozzles at once.

  Furthermore, monitors 20 and 201 for displaying an operation screen and the like are provided before and after the electronic component mounting apparatus 1. These monitors 20 and 201 are provided with touch panel switches 21 and 211 (see FIG. 2) and operation panels 31 and 32 as input means.

  The operation panels 31 and 32 are configured in the same manner, and are provided at the lower part of the monitor 20 as shown in FIG. 3. The operation panel 31 has a component supply unit preparation (FEEDER READY) button with an interval from the left side to the right side. 51, a power (POWER) button 52, a start (START) button 53, a stop (STOP) button 54, and an operation panel designation (PANEL) button 55 are arranged.

  Each of the buttons 51 to 55 includes a colored cover 61 to 65 and light emitters 71 to 75 such as a light emitting element (LED) provided inside each cover.

  The component supply unit preparation button 51 is pressed by an operator when the component supply unit 13 is replaced. By pressing the component supply unit preparation button 51, the locked state of the component supply unit 3 is released, and replacement is possible. The power button 52 is pressed when the power is turned on or off, and the start switch 53 is pressed when starting the operation of the apparatus after the power is turned on. The stop switch 54 is pressed when stopping the operating device. Further, the operation panel designation button 55 is pressed when designating the touch panel switches 21 and 211 operated by the operator. Of the touch panel switches 21 and 211, the switch of one touch panel switch in which the operation panel designation button 55 is pressed. Only the operator's operation is accepted, and the operation of the touch panel switch of the other monitor is not accepted.

  FIG. 2 is a control block for control related to electronic component mounting of the electronic component mounting apparatus 1 and will be described below. Each element of the electronic component mounting apparatus 1 is centrally controlled by a CPU (Central Processing Unit) 16 which is a control device. A ROM (Read Only Memory) 36 for storing a program related to this control and various types A RAM (Random Access Memory) 17 for storing data is connected via a bus line 18. Monitors 20 and 201 and touch panel switches 21 and 211 are connected to the CPU 16 via an interface 22. The Y-direction linear motor 9 and the like are connected to the CPU 16 via a drive circuit 24 and an interface 22.

  The RAM 17 stores NC data for each type of printed circuit board P (substrate type) to be produced. This NC data is composed of operation data, setup data, mounting data, and the like. The operation data includes NC data name comments, the size of the printed circuit board in the X and Y directions, the thickness of the printed circuit board, the presence / absence of advanced parts, the height of advanced parts, and the board finishing mode. Also, the component supply unit 13 for supplying electronic components to printed circuit boards of a plurality of different types of boards to be produced is mounted on the RAM 17 as much as possible, and even if the type of board to be produced changes, the components of the parts supply devices 3 and 5 Parts arrangement data set in advance so as to avoid the replacement operation of the supply unit 13 as much as possible are stored.

  The RAM 17 also stores component library data representing the characteristics of each electronic component composed of shape data, recognition data, control data, and component supply data.

  The CPU 16 is connected to a timer 33 that counts the time since the start button 53 is pressed.

  A recognition processing device 27 is connected to the CPU 16 via the interface 22. The recognition processing device 27 performs recognition processing of an image captured by the board recognition camera 14 or the component recognition camera 15. The processing result is sent to the CPU 16. That is, the CPU 16 outputs an instruction to the recognition processing device 27 so as to perform recognition processing (calculation of misalignment amount, etc.) on the image captured by the board recognition camera 14 or the component recognition camera 15, and also recognizes the recognition processing result. 27 is received.

The operation of the electronic component mounting apparatus having the above configuration will be described below.
When the printed circuit board P is inherited from the upstream device (not shown) and exists on the supply unit of the transport apparatus 2, the printed circuit board P on the supply unit is moved to the positioning unit, and the plane direction of the printed circuit board P and Position in the vertical direction and fix.

  When the printed circuit board P is positioned, the slider 7 slides in the Y direction along the guide extending in the front-rear direction by driving the Y-direction linear motor 9, and the X-direction linear motor is moved. 23, the mounting head 10 moves in the X direction, moves to above the component extraction position of the component supply unit 13, and the suction nozzle 101 is lowered by driving the vertical axis motor to take out the electronic component from the component supply unit 13. In this case, the plurality of suction nozzles 101 can take out electronic components from the tray 4 by moving and rotating the mounting head 10 in the X direction and further raising and lowering the suction nozzles 101. Similarly to the rear beam 7, the front beam 8 moves in the Y direction along a guide extending forward and backward by driving the Y direction linear motor, and the mounting head 11 is moved in the X direction by the X direction linear motor. It moves to above the component take-out position of the component supply unit 13 and lowers the suction nozzle 111 by driving the vertical axis motor to take out the electronic component from the component supply unit 13. In this case, the plurality of suction nozzles 111 can take out electronic components from the component supply unit 13 by moving and rotating the mounting head 11 in the X direction and further raising and lowering the suction nozzles 111.

  That is, first, in accordance with, for example, the step of the mounting data, four electronic components are sequentially taken out from the component supply unit 13 of the component supply device 5 by the mounting head 10 provided on the back beam 7 and at the same time the components are supplied. Four electronic components are sequentially taken out from the component supply unit 13 of the apparatus 3 by the mounting head 11 provided on the beam 8 on the near side. That is, the four suction nozzles 101 of the mounting head 10 provided on the back beam 7 sequentially take out the electronic components from the component supply unit 13 and at the same time, the 4 of the mounting head 11 provided on the front beam 8. Each of the mounting heads 10 and 11 picks up and picks up four electronic components according to the corresponding steps such that the book suction nozzle 111 takes out the electronic components from the component supply unit 13. At this time, the start of component suction by the mounting head 11 on the front side and the start of component suction by the mounting head 10 on the back side, and the end of suction of all components by the mounting head 11 on the front side and the mounting head on the back side are performed. There is a case where the end of the suction of all the parts by 10 is shifted.

  Further, after the removal, the suction nozzles 101 and 111 of both mounting heads 10 and 11 are raised so that the mounting heads 10 and 11 pass above the component recognition camera 15 and both mounting heads 10 and 11 are moved during this movement. The four suction nozzles 101 and 111 are respectively picked up and picked up by four electronic components, and the recognition processing device 27 recognizes the picked-up images to process the picked-up images. Grasp the misalignment of electronic components.

  Thereafter, the substrate recognition camera 8 provided on the mounting heads 10 and 11 of both beams 7 and 8 is moved above each printed circuit board P, and a positioning mark attached to the printed circuit board P positioned on the transport device 2. The recognition processing device 27 recognizes the captured image and grasps the position of each printed circuit board P. Then, by adding the position recognition result of each printed circuit board P and each component recognition processing result to the mounting coordinates of the mounting data, each suction nozzle 101, 111 corrects the positional deviation, and each electronic component is transferred to each printed circuit board P. Install on top.

  As described above, when an electronic component is mounted on the printed circuit board P, if the component supply unit 13 of the component supply device 3 is out of component, the CPU 20 operates to monitor that the component is out. , 201 and a display device such as an unillustrated indicator lamp provided in the electronic component mounting apparatus 1 blinks to notify the operator. Further, the CPU 16 operates, the motors such as the Y-direction linear motors 9 and 99, the X-direction linear motors 23 and 223 are stopped, and the electronic component mounting operation is stopped. When the operator presses the feeder preparation button 51 of the monitor 20 or the monitor 201, the illuminating body 71 that has been lit is turned off and the feeder preparation button 51 is turned off. Further, the component supply unit 13 can be replaced, and the operator replaces the component supply unit 13 in which the component has run out.

  After the replacement work is completed, first, when the operator presses the feeder preparation button 51, the light emitter 71 is turned on and the feeder preparation button 51 is turned on. Next, when the worker presses the start button 53, the electronic component mounting operation starts.

  Hereinafter, an automatic cueing operation of an electronic component that is performed after the component supply unit 13 is replaced and before the operation of taking out the electronic component from the component supply unit 13 is started will be described based on the flowchart of FIG. To do.

  The CPU 16 determines whether or not pocket recognition is possible for the component supply unit 13 (hereinafter referred to as a suction target component supply unit) 13 before the electronic component suction operation is performed from the component supply unit 13, for example, in the RAM 17. Judgment is made based on data indicating whether or not recognition is possible according to the type of tape described in the stored library data. Then, as described above, the suction target component supply unit 13 is a newly installed component supply unit 13 that has not been set so far, and is replaced as shown in FIG. 5A. The width of the tape 46 storing the components supplied by the supply unit 13 is 8 mm, and the pitch of each pocket 47 which is a component storage portion is 4 mm (the interval between all adjacent pockets, ie, the pitch is 4 mm). In this case, for example, the CPU 16 determines that pocket recognition is possible based on the feeder number (serial number) sent from the control device 13S provided in the suction target component supply unit 13. Further, the tape 46 shown in FIG. 6 is provided with a feed hole 49 which is rotated by being driven by a tape feed motor 13M and into which teeth disposed on the periphery of a sprocket for driving the tape feed are fitted. The spacing between adjacent feed holes 49 is the same as the spacing between adjacent teeth of the sprocket (4 mm in the case of FIG. 6).

  As a result, the CPU 16 outputs a pitch feed signal to the target suction target component supply unit 3, and the suction target component supply unit 13 outputs a predetermined pitch of 1 pitch (for example, 4 mm), that is, an electronic component. The tape is fed by the distance corresponding to the interval between the pockets to be stored (step S1). When this tape feeding operation is completed, the CPU 16 supplies the suction target component among the board recognition cameras 14 and 14 provided in the mounting head 10 or 11 based on the suction target component supply unit 13 and the positions of the mounting heads 10 and 11. A substrate recognition camera 14 close to the unit 13 is selected. Then, the substrate recognition camera 14 selected along with the movement of the mounting head 10 or 11 moves above the component outlet formed in the suppressor that is a tape press provided in the suction target component supply unit 13 (step S2). .

  Then, pocket recognition is executed (step S3). That is, the board recognition camera 14 that has reached the upper side of the component pickup port images the pocket 47 of the tape 46 near the component suction position via the component pickup port 45. Then, the images of the component outlet 45, the tape 46 and the pocket 47 as shown in FIG. 5 are taken into the recognition processing device 27 and subjected to image processing. The image processing result is sent to the CPU 16, and the CPU 16 determines the recognition result (step S4). In the determination of the recognition result, the distance (shift) between the position of the pocket 47 and the suction position is a determination distance set in advance and stored in the RAM, for example, a value smaller than the minimum pitch (pitch shift if set above the minimum pitch). Although it is highly possible that the pitch deviation correction described later will not be performed, a value smaller than the minimum pitch is preferable). The CPU 16 determines whether or not the repair condition is satisfied (step S5).

  When the distance between the position of the pocket 47 and the suction position is equal to or greater than the determination distance and the repair condition is satisfied, the CPU 16 outputs a minimum pitch feed signal to the suction target component supply unit 3 and the suction target component supply unit. 13 is a minimum pitch set in advance and stored in the RAM, for example, 2 mm (see FIG. 5), that is, when the interval between pockets for storing electronic components (equal to the interval between adjacent teeth of a sprocket described later) is 4 mm. Is a pitch smaller than the pitch, and the tape is fed at a value obtained by dividing the pocket pitch by an integer (in this case, 2 mm of a 1/2 pitch) (step S6).

  Here, the minimum pitch is set for each model (feeder number) of the component supply unit 13, and the pitch of the tape pocket storing the electronic components supplied by the component supply unit, that is, the normal tape feed pitch is determined. As described above, the value divided by an integer (not limited to 2 described above, but may be an integer other than 2, for example, an integer such as 4 or 6, or smaller than the set pitch), or the component supply unit is a tape. Is the minimum pitch that can be intermittently fed. Alternatively, the pitch divided by this integer is not necessarily the minimum pitch. Alternatively, the pitch may be sent at a pitch which is smaller than the set pitch and is an integral multiple of the minimum pitch in this feeder obtained by dividing the set pitch by an integer. The component supply unit 13 can send a plurality of types of tapes (pockets for storing components at that pitch are arranged) to be sent at the minimum pitch or a pitch that is an integral multiple of the minimum pitch. Therefore, when a tape with a larger pitch is used after being used after the tape with the smallest pitch is used, depending on the position of the sprocket that is provided in the component supply unit 13 and sent the tape with the smallest pitch last, the suction position and the pocket The position does not match, and even if the feed is continued at the predetermined pitch after that, it will remain misaligned. At this time, the storage pocket can be adjusted to the suction position by feeding the tape several times at least at the minimum pitch. When using a tape having twice the minimum pitch, if there is a deviation, it can be brought to a normal position by feeding once.

  Furthermore, the normal tape feed pitch is the distance between adjacent teeth of the sprocket (that is, the distance between the feed holes 49 of the tape 46 shown in FIGS. 5A and 5B, for example) or a distance (1 / 2 or 1/4), or a distance that is an integral multiple of the distance, and when there are a plurality of pitches that can be fed by the component supply unit 13 (when the feed pitches of a plurality of types of tapes that can be fed are different), The minimum pitch can be the smallest of the plurality of pitches. Furthermore, the component supply unit 13 is not necessarily required to have a pitch that is an integral number or an integral multiple of the interval between adjacent teeth of these sprockets and is an integral fraction of the normal feed pitch of the tape to be fed. A pitch that is not the minimum pitch that can be fed may be used as a feed pitch for restoration.

  When the CPU 16 determines the recognition result, when the distance between the position of the pocket 47 and the suction position is smaller than the determination distance and does not satisfy the repair condition, the CPU 16 operates and sucks via the component outlet 45. The electronic component is picked up and taken out by the nozzle (step S8). Further, for example, “pitch feed normal” is displayed on the monitors 20 and 201.

  After the tape feed at the minimum pitch is performed, the CPU 16 waits for the tape feed to be completed and completed (step S7), and when the tape feed is completed, the CPU 16 captures the previous pocket 47. The imaging signal is output to and pocket recognition (second pocket recognition) is executed again (step S3). That is, as described above, the board recognition camera 14 images the pocket of the tape through the component outlet, and the images of the component outlet 45, the tape 46, and the pocket 47 as shown in FIG. The image is taken into the processing device 27 and subjected to image processing. The image processing result is sent to the CPU 16, and the CPU 16 determines the recognition result (step S4). In the determination of the recognition result, as shown in FIG. 5B, the position of the pocket 47 matches the suction position, or the deviation between the position of the pocket 47 and the suction position is preset and stored in the RAM. When it is smaller than the determined deviation value, the CPU 16 determines that the pitch feed restoration condition is not satisfied (step S5). That is, it is determined that there is no need to repair. Thus, the pitch feed can be automatically repaired by the above-described minimum pitch feed.

  As a result, after that, the CPU 16 operates and the electronic component is picked up and picked up by the suction nozzle through the component pick-up opening 45 (step S8). At this time, as described above, the electronic component can be reliably taken out from the pitch feed pocket 47. Further, by displaying, for example, “pitch feed repair completion” on the monitors 20 and 201 together with the electronic component take-out operation, the operator can confirm that the pitch feed restoration has been performed normally.

  If the CPU 16 determines that the pitch feed restoration condition is satisfied when the second pocket recognition is performed (step S5), the electronic component mounting operation of the electronic component mounting apparatus 1 is stopped. In addition, the monitors 20 and 201 display, for example, an abnormal stop in the pitch feed and the abnormal stop, and the lane number in the component supply device in which the component supply unit in which the pitch feed failure has occurred is mounted. Also, the graphic of the imaged pocket and suction nozzle is displayed on the monitors 20 and 201, and the tape feed switch is operated on the suction position alignment screen where the suction nozzle is moved relative to the pocket and the suction position is aligned. Indicates that the minimum pitch feed to be performed is required.

  In addition, when the suction target component supply unit 13 reduces or eliminates the remaining number of tape components, when a new tape is connected to the old tape, or when the joint between the old tape and the new tape is detected by a detection sensor or the like, By recognizing the pocket as described above and performing the minimum pitch feed operation based on the recognition result, even when the old tape and the new tape are connected, for example, when the pitch is shifted by the minimum pitch, the pitch feed is performed. It is automatically repaired.

  Then, the captured image of the pocket is taken into the recognition processing device 27 and subjected to image processing. The image processing result is sent to the CPU 16, and the CPU 16 determines whether or not there is an electronic component in the pocket. When there is no electronic component, the process returns to step 2 again, and the suction target component supply unit 13 feeds the tape by one pitch. Note that, based on the image captured by the recognition camera 14, the recognition processing device 27 may recognize whether the electronic component is in the pocket and send the result to the CPU 16.

  Thereafter, similarly, until it is determined by the presence / absence determination of the electronic component in step 5 that there is an electronic component, the tape 1 pitch feed from step 2 to step 5, imaging of the pocket, image recognition, presence / absence of the electronic component in the pocket The judgment is repeated.

  And the pocket which accommodated the electronic component reaches | attains the component taking-out port 45, and the board | substrate recognition camera 14 images the pocket of a tape through a component taking-out port. Then, the images of the component outlet 45, the tape 46, the pocket 47, and the electronic component 48 as shown in FIG. 6 are taken into the recognition processing device 27 and subjected to image processing. The image processing result is sent to the CPU 16, and the CPU 16 determines whether or not there is an electronic component in the pocket. When the CPU 16 determines that the electronic component is in the pocket, the cueing process of the electronic component is completed, and the CPU 16 outputs a signal for starting the operation of sucking the electronic component that has been cueed, as described above. Thus, the electronic component is taken out by the mounting head 10. For the component supply unit 13 for which the automatic cueing has been completed, a flag indicating that the cueing has been completed is provided in the RAM 17 and used to determine whether or not the automatic cueing of the component supply unit 13 is necessary thereafter. Also good. Further, the component supply unit 13 for which the automatic cueing has been completed is not replaced by the component supply device. After that, when the production model is changed, the component supply unit 13 is not used for production and is used again when the production model is switched. In this case, the component supply unit 13 is continuously managed by the CPU 16 so as not to perform the automatic cueing operation.

  As described above, when the suction target component supply unit 13 has not been set so far and is a component supply unit 13 that has been replaced and newly attached, the CPU 16 determines that an automatic cueing process is necessary, as described above. Based on the result of imaging the pocket by the substrate recognition camera 14, the tape is fed one pitch at a time until the pocket containing the electronic component reaches the component outlet, and the cueing operation of the electronic component is automatically performed. When the target component supply unit 13 is replaced, the operator does not need to perform a cueing operation. As a result, the preparation work can be simplified and the work time can be shortened. In addition, it is possible to reliably avoid an abnormality in taking out the electronic component that occurs when the cueing work by the operator is insufficient.

  Furthermore, the time required for the preparation work can be shortened, and the non-operating time of the electronic component mounting apparatus 1 can be reduced to increase the operating time.

  Even when the component supply device 3 is newly mounted in an empty lane of the feeder base 12 of the component supply device 3 or 5, when the electronic component is first taken out from the component supply unit 13, or in the electronic component mounting device 1 When the production of one board model is finished and the next board is produced, the electronic component is taken out from each component supply unit 13 even when the component supply device 3 or 5 mounted with the component supply unit 13 is replaced. At the same time, similar to the above-described replacement of the component supply unit 13, it is possible to recognize the pocket and automatically repair the pitch feed to obtain the same effect.

  Hereinafter, the second embodiment of the present application will be described based on the flowchart shown in FIG. 7 with a focus on differences from the first embodiment described above.

  In the first embodiment, the case where the parts are supplied by the tape 46 capable of pocket recognition has been described. However, in the second embodiment, the parts are supplied by the parts supply unit 13 using the tape incapable of pocket recognition. This is an example.

  First, a description will be given of the repair of the pitch feed of the tape when the electronic component is mounted on the board. After the suction nozzle picks up the electronic component, the mounting heads 10 and 11 pass above the component recognition camera 15 and are held by the four suction nozzles 101 and 111 of the mounting heads 10 and 11 during the movement. The four electronic components are picked up collectively, and the picked-up image is recognized by the recognition processing device 27 (step S11), and the positions of the electronic components sucked and held by the suction nozzles 101 and 111 are calculated. (Part recognition result calculation) is performed (step S12).

  Hereinafter, among the electronic components sucked and held by the suction nozzles 101 and 111, the electronic component held by one suction nozzle will be described as a representative. The CPU 16 fetches the component recognition result from the recognition processing device 27, and calculates the pitch deviation correction amount for the electronic component based on the component recognition result (step S13). That is, of the positional deviation of the electronic component with respect to the suction nozzle as the component recognition result, the deviation amount in the tape feeding direction in the component supply unit 13, for example, the Y direction in FIG. 5, is calculated as the pitch deviation correction amount.

  The CPU 16 determines whether or not the calculated pitch deviation correction amount is normal (step S14). That is, a preset pitch deviation determination value (for example, 1.5 mm corresponding to the minimum pitch of 2 mm) is stored in the RAM 17, and the CPU 16 determines that the calculated pitch deviation correction amount is larger than the pitch deviation determination value. Whether it is out of the normal range or in the range. When the pitch deviation correction amount is equal to or greater than the pitch deviation determination value (that is, when it is determined that the pitch deviation correction value is outside the normal range), the CPU 16 sets the first automatic feed of pitch feed (step S15). ) A flag indicating that the setting has been made is stored in the RAM 17. After that, tape feeding is started for taking out the next component in the component supply unit 13 (step S17), and the completion of the tape feeding is awaited (step S18).

  Further, the monitor 20 or 201 may display that the tape feed is automatically repaired, or that the tape pitch is automatically repaired by setting the minimum pitch feed of the tape. The operator can know that the tape feeding is automatically repaired by the electronic component mounting apparatus 1 without performing the tape feeding repair work by himself / herself.

  When the tape feeding is completed, the CPU 16 next determines whether or not the automatic restoration setting is set (step S19). Since automatic restoration is set, the CPU 16 immediately outputs a signal of minimum pitch feed to the component supply unit 3 that has supplied the electronic component recognized as in the case of the pocket recognition described above, and the component supply unit 13 Is set in advance and the tape is fed by the minimum pitch distance (for example, 2 mm) corresponding to the component supply unit 3 stored in the RAM 17 (step S20), and the tape pitch feed is repaired. Thereafter, the CPU 16 waits for completion of the minimum pitch feed in the component supply unit 13 (step 21), and when completed, waits for an electronic component suction operation (step S22).

  When the pitch deviation correction amount is less than the pitch deviation determination value in step S14 (when the pitch deviation correction amount is determined to be within the normal range), the CPU 16 automatically performs the automatic repair setting when the RAM 17 has already stored the setting. The repair setting is initialized (step S16), and then the tape feeding for taking out the next component in the component supply unit 13 is started (step S17), and the completion of the tape feeding is waited (step S18).

  If it is determined in step S19 whether automatic repair is set or not, it is determined that automatic repair is not set, and an electronic component suction operation is awaited without performing minimum pitch feed (step S22).

Thus, based on the result of performing component recognition during the component mounting operation (in the middle of movement of the suction nozzle) when supplying a component by the component supply unit 13 using a tape that cannot be pocket-recognized, Of the positional deviations of the electronic components, the deviation in the tape feeding direction in the component supply unit 13 is calculated as a pitch deviation correction amount. When the pitch deviation correction amount is equal to or greater than the pitch deviation determination value and outside the normal range, the CPU 16 outputs a minimum pitch feed signal to the component supply unit 13, and the component supply unit 13 that has input the signal is described above. As described above, since the tape is fed by the distance of the minimum pitch corresponding to the shift of the minimum pitch that causes the position shift of the electronic component before the next component picking operation, the component supply position in the component supply unit 3 is the minimum pitch. The next time the suction nozzle picks up the electronic component, or when the tape is pitch-fed afterwards, it is possible to avoid the electronic component from being picked up by the suction nozzle and to pick up the component more reliably. be able to.
At this time, if the amount of deviation at the time of component recognition is an integer multiple of the minimum pitch, even if it is not the minimum pitch, a pitch that is an integer multiple of the minimum pitch (smaller than the normal feed pitch) can be changed at a time. Correction may be performed.

  Thereafter, the electronic components are taken out from the component supply unit 13 for which the minimum pitch feed has been completed, and each of the electronic components sucked and held is imaged, and the recognition processing device 27 performs the recognition processing. Then, the CPU 16 again calculates the pitch deviation correction amount for the electronic component based on the component recognition result (step S13), and determines whether the pitch deviation correction amount is normal (step S14).

  When the pitch deviation correction amount is equal to or greater than the pitch deviation determination value and is outside the normal range, the CPU 16 determines that the pitch feed is abnormal because the determination outside the normal range continues for the second time, and the electronic component mounting The electronic component mounting operation of the device 1 is stopped. In addition, the monitor 20 or 201 displays, for example, an abnormal stop in the pitch feed and the abnormal stop, and the lane number in the component supply device in which the component supply unit in which the pitch feed failure has occurred is mounted. Also, the graphic of the imaged pocket and suction nozzle is displayed on the monitors 20 and 201, and the tape feed switch is operated on the suction position alignment screen where the suction nozzle is moved relative to the pocket and the suction position is aligned. Indicates that the minimum pitch feed to be performed is required.

  By displaying in this way, the operator can know that the cause of the abnormal stop may be an abnormality in the tape feed of the component supply unit, and the switch part (tape feed operation of the component supply unit 13) Button) and make a minimum pitch feed to know that repair work is necessary.

  When the pitch deviation correction amount is within the normal range, the CPU 16 initializes the first automatic restoration setting stored in the RAM 17 and erases the flag (step S16). Then, the tape feeding after the component take-out in the component supply unit 13 is started (step S17), and after the tape feeding is completed, there is no automatic restoration setting, so the next electronic component suction operation is waited (step S22).

  Thereafter, for example, when the setting switch (not shown) of the touch panel switches 21 and 211 provided on the monitors 20 and 201 is set to execute the tape pitch feed repair based on the pocket recognition result. As described above, the tape pitch feed is repaired based on the pocket recognition result.

  In addition, when supplying a component by the component supply unit 13 using a tape that cannot be pocket-recognized, whether or not to repair the pitch feed of the tape based on the result of the component recognition, as described above. Can be set by operating a setting switch (not shown) of the touch panel switches 21 and 211 provided on the monitors 20 and 201, for example.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.

DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 2 Conveyance apparatus 3 Component supply apparatus 5 Component supply apparatus 7, 8 Beam 10, 11 Mounting head 13 Component supply unit 16 CPU (control apparatus)
17 RAM (storage device)
20 monitors 47 pockets

Claims (5)

  Removably equipped with an electronic component supply device that intermittently feeds a tape containing electronic components in a set pitch, and sends the electronic components to a component take-out position, with each storage unit formed side by side in the delivery direction. In an electronic component mounting apparatus comprising a mounting head that takes out an electronic component from the attached tape of the electronic component supply device and moves and mounts it on a printed circuit board, a camera that images the storage section at the component extraction position; When the electronic component supply device is attached, the position of the storage unit is recognized based on the image captured by the camera, and the amount of deviation of the recognized position of the storage unit from the preset position is set in advance. When it is determined that the amount of deviation is smaller than the predetermined amount, the component pick-up operation by the mounting head is started and the electronic component supply device is attached. The minimum of the electronic component supply device smaller than the set pitch when it is determined that the amount of deviation of the recognized position of the storage unit from the preset position is greater than or equal to a preset amount of deviation. The tape is fed at a pitch, the position of the storage unit is recognized based on an image captured by the camera after the tape feed, and the recognized shift amount of the position of the storage unit is greater than the preset shift amount. An electronic component mounting apparatus comprising: a control device that starts a component take-out operation by the mounting head when it is determined that the size is small. Removably equipped with an electronic component supply device that feeds electronic components at a set pitch in each storage section formed side by side in the delivery direction at a set pitch, and sends the electronic components to the component extraction position. In addition, in the electronic component mounting apparatus having a mounting head that takes out the electronic component from the tape of the electronic component supply device, moves it, and mounts it on the printed circuit board, the camera picks up the image of the electronic component taken out by the pickup member And the position of the electronic component relative to the take-out member is recognized based on the image captured by the camera, and the amount of deviation of the recognized position of the electronic component from a preset position is equal to or less than a predetermined amount of deviation. If it is determined that the tape feeding operation for taking out the next component is started, the electronic component is picked up by the picking-up operation, and is taken out by the take-out member. In addition, when the camera picks up the electronic component and it is determined that the amount of deviation of the recognized position of the electronic component from a preset position is larger than a predetermined amount of deviation, the smaller than the set pitch. The position of the electronic component relative to the take-out member is recognized based on the image taken by the camera of the electronic component taken out from the electronic component supply device that has been tape-feeded at the minimum pitch of the electronic component supply device and the minimum pitch feed has been completed. A control device for stopping the electronic component mounting operation of the electronic component mounting device when it is determined that the recognized shift amount of the position of the electronic component from a preset position is larger than a predetermined shift amount; An electronic component mounting apparatus comprising the electronic component mounting apparatus.   The electronic component mounting apparatus according to claim 1, wherein a minimum pitch of the electronic component supply device smaller than the set pitch is a pitch obtained by dividing the set pitch by an integer.   The electronic component mounting apparatus according to claim 2, further comprising a display device that displays an abnormal stop when the electronic device mounting operation is stopped by the control device. 4. The electronic component mounting apparatus according to claim 1, wherein the minimum pitch of the electronic component supply device smaller than the set pitch is a pitch obtained by dividing an interval between adjacent teeth of the sprocket by an integer.

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