JP5808160B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that includes a bulk feeder and mounts an electronic component supplied by the bulk feeder on a substrate.

  Generally, in an electronic component mounting apparatus equipped with a bulk feeder, electronic components are accommodated in a bulk shape in a cassette of the bulk feeder, and are conveyed while being aligned in a component supply path by appropriate conveying means such as vibration and pressurized air. Is supplied to the position. 2. Description of the Related Art Conventionally, as an electronic component mounting apparatus provided with a bulk feeder, for example, one described in Patent Document 1 is known.

JP 2008-41731 A

  In this type of electronic component mounting apparatus, sometimes there are cases where only a marginal number of electronic components are accommodated with respect to the planned production number so that the electronic components accommodated in the cassette are used up to the end.

  For example, for a planned production quantity of a certain board type, a cassette containing the number of parts required for production plus a margin is prepared, or the required number is received from a customer who has requested board production. Are often provided with cassettes that are stored. In addition, when producing these same board types, the same parts used are of the same standard as well as the same manufacturer, and the same lots are also used from the viewpoint of traceability. It is desired.

  However, due to the characteristics of the bulk feeder, when supplying electronic components from the bulk feeder, if the number of electronic components remaining in the cassette decreases, the electronic components may not be smoothly fed to the component supply path. If there is a large amount of parts in stock, it is sufficient to supply electronic parts to the bulk feeder.However, as described above, if the number of parts is marginal to the planned production quantity, production can be continued due to the stagnation of the feed. There is a fear that the electronic components cannot be used up to the end.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus that enables smooth feeding of components in a bulk feeder by supplying dummy components into a cassette, and allows regular electronic components to be used up. It is.

In order to solve the above-mentioned problem, a feature of the invention according to claim 1 is that the electronic component and the dummy component accommodated in the cassette are arranged in the component supply path and are provided with a bulk feeder for supplying the component to the component extraction position. In the electronic component mounting apparatus that mounts the electronic component supplied to the component supply path by the feeder with a suction nozzle provided on the component mounting head, and requests the dummy component in the cassette of the bulk feeder. Guiding means for giving guidance, discriminating means for discriminating whether the component sucked from the component pick-up position by the suction nozzle is a regular electronic component or a dummy component, and the discriminating means Only when it is determined, it has a mounting control means for mounting the electronic component on the board.

  The invention according to claim 2 is characterized in that, in claim 1, the guide means replenishes dummy parts based on a decrease in the number of regular electronic parts remaining in the cassette of the bulk feeder. It is to come to demand.

  A feature of the invention according to claim 3 is that in claim 1 or claim 2, when the discriminating means discriminates a dummy part, the dummy part is collected in the collecting unit. .

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the dummy component is different in color or shape from a regular electronic component, and is a regular electronic component or a dummy component. This determination is performed by image processing.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the bulk feeder supplies the electronic component to the component supply path by at least one action of vibration and air. It is that.

According to the invention according to claim 1 configured as described above, the guide means for issuing a guide requesting a dummy part in the cassette of the bulk feeder, and the part sucked from the part picking position by the suction nozzle are regular electronic parts. And a dummy control part, and a mounting control means for mounting the electronic component on the substrate only when the determination means determines that the electronic component is a regular electronic component. By supplying the dummy parts to the component storage cassette, the components in the component storage cassette can be smoothly sent to the component supply path.

  According to the second aspect of the present invention, the guide means requests replenishment of dummy parts based on the fact that the number of regular electronic parts remaining in the parts storage cassette of the bulk feeder is reduced. Therefore, due to the characteristics of the bulk feeder, it is possible to suppress stagnation of parts due to a small amount of parts remaining in the parts storage cassette.

  According to the third aspect of the present invention, when the discriminating means discriminates the dummy component, the dummy component is collected in the collecting unit, so that the dummy component is erroneously mounted on the board. In addition, the dummy parts can be reused by collecting the dummy parts.

  According to the invention of claim 4, since the dummy component has a color or a shape different from that of the regular electronic component, and whether the dummy component is a regular electronic component or a dummy component is determined by image processing. It is possible to reliably determine whether it is a regular part or a dummy part by processing.

  According to the fifth aspect of the present invention, the bulk feeder is configured to supply the electronic component to the component supply path by at least one action of vibration and air. Can be supplied to the parts supply path.

It is a perspective view which shows the electronic component mounting apparatus which shows embodiment of this invention. It is a side view which shows the bulk feeder which concerns on embodiment. It is a schematic diagram which shows the components supply path of a bulk feeder. It is a figure which shows the control apparatus which concerns on embodiment. It is a figure which shows the flowchart which supplies the dummy components which concern on embodiment. It is a figure which shows the flowchart which discriminate | determines whether it is a regular component or a dummy component which concerns on embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1, the electronic component mounting apparatus 10 includes a component supply device 20, a board transfer device 30, and a component transfer device 40.

  As an example, the component supply apparatus 20 includes a configuration in which a plurality of feeders 21 are arranged in parallel on the base 11 of the electronic component mounting apparatus 10. The feeder 21 is juxtaposed in the X direction so as to be detachable from a device table 22 installed on the base 11. The feeder 21 includes a supply reel 23, and electronic parts housed at a constant pitch interval on a tape wound around the supply reel 23 are pitch-fed by a motor (not shown) built in the feeder 21, thereby The components can be sequentially supplied to the component extraction position P1 provided at the tip.

  At least one of the plurality of feeders 21 includes a bulk feeder 21A shown in FIG. 2, and the bulk feeder 21A includes a component storage cassette 25 that stores electronic components P (see FIG. 3) in a bulk shape. . As shown in FIG. 3, the component storage cassette 25 includes a component supply path 26 that supplies the electronic components P stored in the component storage cassette 25 in alignment with the component extraction position P1. The bulk feeder 21 </ b> A is provided with a vibration device 27 that vibrates the component storage cassette 25 and an air supply device 28 that supplies pressurized air into the component storage cassette 25. Due to the vibration action and the action of pressurized air supplied from the air supply device 28, the electronic parts P accommodated in a bulk shape in the part accommodation cassette 25 are aligned one by one in the part supply path 26, and the part removal position P1 is supplied.

  In the component storage cassette 25 of the bulk feeder 21A, a predetermined number of regular electronic components P (hereinafter abbreviated as regular components P) mounted on the circuit board B are substantially used up according to the production plan of the circuit board B. It is determined to the number that can be. In other words, the component storage cassette 25 stores a number of regular components P that are slightly larger than the predetermined number required for production of the circuit board B in consideration of defective products.

  On the component housing cassette 25, a dummy cassette 29 housing dummy components is detachably attached. As will be described later, the dummy parts accommodated in the dummy cassette 29 can be supplied into the parts accommodation cassette 25 when the number of regular parts P in the parts accommodation cassette 25 decreases. That is, when the number of regular parts P in the part storage cassette 25 decreases, the probability that the regular parts P are guided to the part supply path 26 tends to decrease due to the characteristics of the parts feeding method of the bulk feeder 21A. Is appropriately supplied into the component storage cassette 25 so that the components can be smoothly fed.

  Note that the dummy parts are substantially the same in shape and different in color from the regular parts P or slightly different in shape, and can be discriminated by image processing to be described later.

  The board conveying device 30 conveys the circuit board B in the alignment direction (X-axis direction) of the electronic component mounting apparatus 10, and as an example, as shown in FIG. 1, two rows of conveying means 31 and 32 are arranged in parallel. It consists of a double conveyor type. Each transport means 31, 32 has a pair of guide rails 33, 34 arranged in parallel on the base 11 so as to face each other in parallel. A pair of conveyor belts that support and convey the circuit board B guided by the guide rails 33 and 34 are arranged in parallel on the conveying means 31 and 32.

  The component transfer device 40 is composed of an XY robot, is mounted on the base 11, is disposed above the component supply device 20 and the substrate transfer device 30, and extends along the guide rail 41 in the Y axis perpendicular to the X axis direction. A Y-axis moving table 43 that is movable in the direction is provided. The movement of the Y-axis moving table 43 in the Y-axis direction is controlled by a Y-axis servo motor 44 via a ball screw. An X-axis moving table 45 is guided and supported on the Y-axis moving table 43 so as to be movable in the X-axis direction, and movement of the X-axis moving table 45 in the X-axis direction is controlled by an X-axis servo motor 46 via a ball screw. .

  A component mounting head 47 and a board camera 48 for imaging a reference mark (not shown) provided on the circuit board B are attached to the X-axis moving table 45. In the component mounting head 47, as shown in FIG. 4, a suction nozzle 50 for sucking regular components P (including dummy components) can be moved up and down in the Z-axis direction (vertical direction) perpendicular to the X-axis and Y-axis directions. And supported so as to be rotatable around the Z-axis. The suction nozzle 50 is controlled to move and rotate in the Z-axis direction by a Z-axis servomotor 51 and a θ-axis servomotor 52 (see FIG. 4).

  A component camera 53 is provided between the component supply device 20 and the substrate transport device 30 to image the regular component P and the dummy component sucked by the suction nozzle 50 from below. By performing image processing on the image data captured by the component camera 53, it is possible to determine whether the regular component P is attracted and whether the regular component P is a dummy component.

  The electronic component mounting apparatus 10 is controlled by the control apparatus 60 shown in FIG. The control device 60 has a CPU, a ROM, a RAM, and an input / output interface. In the control device 60, the Y-axis and X-axis servo motors 44 and 46 that move the component mounting head 47 in the Y-axis and X-axis directions, and the suction nozzle 50 that moves in the Z-axis direction via the input / output interface. An axis servo motor 51 and a θ-axis servo motor 52 that rotates the suction nozzle 50 about the Z-axis are connected to each other. The control device 60 is connected to an image processing device 61 that performs image processing on image data picked up by the component camera 53. In FIG. 4, reference numeral 63 denotes a collection box as a collection unit that collects the dummy parts sucked by the suction nozzle 50, and the collection box 63 is a predetermined position of the electronic component mounting apparatus 10, for example, near the component supply apparatus 20. Is installed.

  Next, a flow chart for supplying dummy parts into the part accommodating cassette 25 of the bulk feeder 21A will be described with reference to FIG. A predetermined number of regular components P are accommodated in the component accommodation cassette 25 of the bulk feeder 21A. The regular part P accommodated in the part accommodation cassette 25 is aligned and conveyed in the part supply path 26 and is supplied to the part extraction position P1. In step 100, the regular component P supplied to the component extraction position P1 is sucked by the suction nozzle 50 provided in the component mounting head 47 and transported toward the circuit board B. The camera 53 detects a misalignment with respect to the center of the suction nozzle 50 and an angular misalignment around the Z axis. Thereafter, the regular part P sucked by the suction nozzle 50 is mounted at a predetermined coordinate position on the circuit board B in a state where the misalignment with respect to the center of the suction nozzle 50 and the angular deviation around the Z axis are corrected. The

  Each time the regular part P is taken out from the bulk feeder 21A, the remaining number of regular parts P is managed in step 102. That is, every time the regular part P is taken out from the bulk feeder 21A, the remaining number of regular parts P stored in the RAM of the control device 60 is subtracted. In step 104, it is determined whether or not the remaining number of regular parts P is less than N1, and if the remaining number of regular parts P is N1 or less (if the determination result is YES), the next step 106 is determined. Then, a dummy parts replenishment guide is instructed and notified to the operator by a lamp or buzzer. When the remaining number of regular parts P is greater than N1 (when the determination result is NO), the program is returned.

  Based on the dummy component supply guide, the worker supplies a predetermined number of dummy components having colors and the like different from those of the regular component P into the component storage cassette 25 from the dummy cassette 29 storing the dummy components. As a result, the number of components (regular components P and dummy components) accommodated in the component accommodation cassette 25 of the bulk feeder 21A is increased, and the components in the component accommodation cassette 25 are smoothly supplied to the component supply path 26 without stagnation. become able to. In this case, after supplying the dummy parts, the regular parts P and the dummy parts are conveyed to the parts supply path 26 in a mixed state. At this time, when the specific gravity of the dummy component to be supplied is lighter than that of the regular component P, the regular component P is transported in advance, and the dummy component often stays in the component storage cassette 25.

  Next, a flowchart for determining whether a component sucked by the suction nozzle 50 of the component mounting head 47 is a regular component P or a dummy component will be described with reference to FIG. The regular component P and the dummy component accommodated in the component accommodation cassette 25 of the bulk feeder 21A are conveyed through the component supply path 26 and supplied to the component extraction position P1 in the same manner as described above. It is sucked by 47 suction nozzles 50. The component sucked by the suction nozzle 50 is picked up by the component camera 53 while being transported to the circuit board B (step 202), and a grayscale image is acquired. Next, in step 204, the grayscale image is binarized by image processing by the image processing device 61, and in the subsequent step 206, the binarized data is compared with a threshold value, and the component sucked by the suction nozzle 50 is a regular component. It is discriminated whether it is P or a dummy part.

  If it is determined in step 206 that the component is a regular component P, the process moves to step 208, and a component mounting operation for mounting the regular component P sucked by the suction nozzle 50 on the circuit board B is executed. On the other hand, if it is determined in step 206 that the part is a dummy part, the process proceeds to step 210, and a recovery process for recovering the dummy part sucked by the suction nozzle 50 in the recovery box 63 (see FIG. 4) is executed. The

  The above-described step 106 constitutes the guiding means in the claims, the steps 204 and 206 constitute the determining means in the claims, and the step 208 constitutes the mounting control means in the claims.

  According to the above-described embodiment, the guide means (step 106) for issuing a guide requesting a dummy component in the component storage cassette 25 of the bulk feeder 21A, and whether the component sucked by the suction nozzle 50 is the regular component P. Discriminating means for discriminating whether the part is a dummy part (steps 204 and 206) and mounting control means for mounting the part P on the circuit board B only when the discriminating part discriminates it as a regular part P (step 208). Therefore, even if the number of regular components P in the component storage cassette 25 is reduced, the components in the component storage cassette 25 can be smoothly sent to the component supply path 26 by supplying dummy components. Thus, the regular part P can be used up to the end. Here, the guidance means is the display on the operation screen of the component mounting apparatus, the blinking of the lamp, etc. of the signal tower or the bulk feeder 21A itself, or the LED lamp of the device base 22 to which the corresponding bulk feeder 21A is attached. The aspect which is notified by blinking etc. is also included. Further, the guide means includes a mode that is issued from a control device included in each feeder itself or from a control device 60 that performs overall control of the feeder. Therefore, for example, a mode in which the dummy cassette 29 is automatically opened based on these signals and the dummy parts are automatically supplied to the component housing cassette 25 is also possible.

  Moreover, even if the dummy part is transported to the part supply path 26 and sucked by the suction nozzle 50, it is determined whether it is a regular part P or a dummy part by the discriminating means (steps 204 and 206). Since it is mounted only on the circuit board B, it is possible to reliably prevent the dummy component from being mounted on the circuit board B by mistake.

  Further, when the part sucked by the suction nozzle 50 is determined as a dummy part, the dummy part is collected in the collection box 63, so that the collected dummy part can be reused.

  In the above-described embodiment, the parts (regular parts and dummy parts) housed in the parts housing cassette 25 of the bulk feeder 21A are sent to the parts supply path 26 by the action of vibration and pressurized air. The component can be sent by at least one of vibration and air, or the component can be transported by other transport means using magnetic force or the like.

  In the above-described embodiment, the dummy cassette 29 is detachably attached to the component storage cassette 25 attached to the bulk feeder 21A, and the dummy component stored in the dummy cassette 29 is supplied to the component storage cassette 25. However, it is also possible to supply the dummy parts directly to the component storage cassette 25 without providing the dummy cassette 29.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention described in the claims. Of course, it is possible.

  The electronic component mounting apparatus according to the present invention is suitable for use in an apparatus equipped with a bulk feeder that supplies electronic components accommodated in a cassette in alignment with a component supply path.

  DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting apparatus, 20 ... Component supply apparatus, 21A ... Bulk feeder, 25 ... Component accommodation cassette, 26 ... Component supply path, 27 ... Excitation apparatus, 28 ... Air supply apparatus, 29 ... Dummy cassette, 47 ... Component mounting head, 50 ... Suction nozzle, 53 ... Component camera, 60 ... Control device, 61 ... Image processing device, 63 ... Collection unit (collection box), 106 ... Guiding means, 204, 206 ... Determination means, 208 ... Mounting control means.

Claims (5)

A bulk feeder for aligning electronic components and dummy components housed in a cassette with a component supply path and supplying them to a component take-out position is provided, and the electronic component supplied to the component supply path by the bulk feeder is used as a component mounting head. In an electronic component mounting apparatus that is sucked by a suction nozzle provided and mounted on a substrate,
Guidance means for providing guidance requesting dummy parts in the cassette of the bulk feeder;
A discriminating means for discriminating whether a component sucked from the component pick-up position by the suction nozzle is a regular electronic component or a dummy component;
Mounting control means for mounting the electronic component on the substrate only when the determination means determines that the electronic component is a legitimate electronic component;
An electronic component mounting apparatus comprising:   2. The guide device according to claim 1, wherein the guide means requests replenishment of dummy parts based on a decrease in the number of regular electronic parts remaining in the cassette of the bulk feeder. Electronic component mounting device.   3. The electronic component mounting apparatus according to claim 1, wherein when the discriminating means discriminates a dummy component, the dummy component is collected in a collecting unit.   4. The method according to claim 1, wherein the dummy component is different in color or shape from a regular electronic component, and whether the dummy component is a regular electronic component or a dummy component is determined by image processing. An electronic component mounting apparatus.   5. The electronic component according to claim 1, wherein the bulk feeder supplies the electronic component to the component supply path by at least one action of vibration and air. Mounting device.

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