CN109661161B - Mounting device and mounting method - Google Patents
Mounting device and mounting method Download PDFInfo
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- CN109661161B CN109661161B CN201811189846.9A CN201811189846A CN109661161B CN 109661161 B CN109661161 B CN 109661161B CN 201811189846 A CN201811189846 A CN 201811189846A CN 109661161 B CN109661161 B CN 109661161B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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Abstract
本发明提供安装装置及安装方法，其能够对生产节拍降低进行抑制，并且与部件尺寸、部件种类等无关地实施起始寻找动作。安装装置(1)将从供给器供给的部件(P)通过安装头进行拾取而安装于基板，该安装装置(1)构成为，具有：部件检测部(35)，其对由安装头拾取到的部件进行检测；以及第1判定部(41)，其与部件检测部的检测结果相对应地对拾取是否成功进行判定，在拾取成功的情况下，通过安装头将部件安装于基板，在拾取失败的情况下，直至拾取成功为止反复进行通过供给器实现的部件的送出动作。
The present invention provides a mounting device and a mounting method capable of suppressing a reduction in tact time and performing a start finding operation regardless of component size, component type, and the like. A mounting device (1) picks up a component (P) supplied from a feeder by a mounting head and mounts it on a board, and the mounting device (1) includes a component detection unit (35) for picking up a component (P) by the mounting head. and a first judging unit (41), which judges whether the pickup is successful according to the detection result of the component detection unit, and in the case of successful pickup, mounts the component on the substrate by the mounting head, and then picks up the component. In the case of failure, the feeding operation of the components by the feeder is repeated until the pickup succeeds.
Description
Technical Field
The present invention relates to a mounting apparatus and a mounting method for mounting a component on a substrate.
Background
Generally, a plurality of feeders are arranged in a horizontal direction in the mounting device, and each feeder feeds out a component toward a feeding position corresponding to the mounting head. If the feeder of the mounting device is replaced, the initial component is sent out to the feeding position, and the initial search of the component is automatically performed. Conventionally, as such a mounting apparatus, a mounting apparatus that performs initial component search by image recognition is known (for example, see patent document 1). In the mounting device described in patent document 1, the camera is positioned at the supply position until the component is recognized by the camera, and the component is sent out in units of 1 pitch, thereby performing initial search for the component.
Patent document 1: japanese patent laid-open publication No. 2011-155051
However, in the start seek operation described in patent document 1, it is necessary to move the camera to the supply position of each feeder, and it takes time until the start seek operation is completed, and a reduction in tact occurs. In addition, in the initial seek operation by image recognition, the number of components is limited to the size of the image frame that can be captured by the camera, and the size of the components, the type of the components, and the like that can perform the initial seek operation are limited.
Disclosure of Invention
The present invention has been made in view of the above problems, and an object thereof is to provide a mounting apparatus and a mounting method capable of performing a start seek operation regardless of a component size, a component type, and the like while suppressing a reduction in tact time.
A mounting device according to an aspect of the present invention is a mounting device for mounting a component fed from a feeder to a substrate by picking up the component by a mounting head, the mounting device including: a detection unit that detects the component picked up by the mounting head; and a 1 st determination unit that determines whether or not the pickup is successful in accordance with a detection result of the detection unit, and in a case where the pickup is successful, the mounting head mounts the component on the substrate, and in a case where the pickup is failed, the feeding operation of the component by the feeder is repeated until the pickup is successful.
A mounting method according to an aspect of the present invention is a mounting method for mounting a component supplied from a feeder to a substrate by picking up the component by a mounting head, the mounting method including: detecting, by a detecting portion, a component picked up by the mounting head; determining whether or not the pickup is successful in correspondence with a detection result of the detection section; mounting a component to a substrate by the mounting head in a case where the pickup is successful; and repeating, in the case of a failed pick, the component feeding operation by the feeder until the successful pick.
According to these configurations, in the case where the pickup of the component by the mounting head fails, the component is initially sought by feeding out the component by the feeder until the pickup succeeds. That is, the initial seek operation is performed by the component feeding operation in the pick-up operation. Since it is not necessary to move the substrate imaging unit for component recognition and the height measurement sensor to the component supply position, the moving time can be shortened and the reduction in tact can be suppressed. Further, since the initial seek operation is performed depending on whether or not the pickup of the component is successful, the component capable of performing the initial seek operation is not limited by the component size, the component type, and the like.
In the above-described mounting device, in the case where the pickup is successful, the start seek information is set to start seek completion, and the component is mounted on the substrate by the mounting head. According to this structure, whether or not the start seek is completed can be managed as the start seek information corresponding to whether or not the pickup is successful.
In the above mounting apparatus, the 2 nd determination unit determines whether or not the initial seek is completed based on the initial seek information before the feeding operation in the case of a pickup failure, notifies of a component end-up in the case of the completion of the initial seek, and performs the feeding operation of the component in the case of the non-completion of the initial seek. According to this configuration, it is possible to distinguish whether the cause of the failure in pickup is caused by the component exhaustion or by the non-implementation of the initial seek. Thus, when the component runs out and the pickup fails, the operator is notified of the component running out without repeating the feeding of the component.
In the mounting apparatus described above, the mounting apparatus includes an identification unit that identifies the component to be fed to the feeding position for the mounting head, and the component is fed by the feeder before the production is started until the component is identified by the identification unit. According to this structure, the component is not picked up until the component is recognized by the recognition portion and the component is sent out by the feeder to perform the initial search. Thereby, problems caused by pickup before the start of production can be prevented.
In the above mounting apparatus, the mounting apparatus includes a pair of feeder containers in which a plurality of feeders are arranged in a lateral direction, and when a component is exhausted from any one of the feeders in one of the feeder containers in the non-stop production, the one feeder container can be replaced by switching the feeding of the component to the feeder in the other feeder container. According to this configuration, even if the start seek information of the plurality of feeders is reset by the replacement of the feeder holder, the feeder that has performed the start seek operation can be switched to the mounting operation without performing the component feeding operation. This makes it possible to significantly reduce tact loss without performing a start seek operation for each feeder during continuous production.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the present invention, by utilizing the component feeding operation in the picking operation, the start seek operation can be performed regardless of the component size, the component type, and the like while suppressing the tact loss.
Drawings
Fig. 1 is a schematic view showing the entire mounting device of the present embodiment.
Fig. 2 is a schematic view showing the periphery of the mounting head of the present embodiment.
Fig. 3 is an explanatory diagram showing a change in the start search information according to the present embodiment.
Fig. 4 is an explanatory diagram of the initial seek operation of the comparative example.
Fig. 5 is a block diagram of the mounting device of the present embodiment.
Fig. 6 is an explanatory diagram of the feeding operation of the present embodiment.
Fig. 7 is a flowchart of an installation method of the comparative example.
Fig. 8 is a flowchart of the mounting method of the present embodiment.
Description of the reference numerals
1: mounting device
12: feeder holder
13: feeding device
30: mounting head
34: height measuring sensor (identification part)
35: component detecting part (detecting part)
38: base plate shooting part (recognition part)
41: 1 st determination unit
42: storage unit
44: the 2 nd judging unit
46: notification part
P: component part
W: substrate
Detailed Description
Next, the mounting device of the present embodiment will be described with reference to the drawings. Fig. 1 is a schematic view showing the entire mounting device of the present embodiment. Fig. 2 is a schematic view showing the periphery of the mounting head of the present embodiment. Fig. 3 is an explanatory diagram showing a change in the start search information according to the present embodiment. Fig. 4 is an explanatory diagram of the initial seek operation of the comparative example. The mounting device of the present embodiment is merely an example, and can be modified as appropriate.
As shown in fig. 1, the mounting apparatus 1 is configured to mount a component P (see fig. 2) supplied from a supplier 13 at a predetermined position on a substrate W by a mounting head 30. A substrate conveying unit 11 for conveying the substrate W in the X-axis direction is disposed on the base 10 of the mounting device 1. The substrate transfer unit 11 carries in and positions the substrate W before component mounting from one end side in the X axis direction below the mounting head 30, and carries out the substrate W after component mounting from the other end side in the X axis direction to the outside of the apparatus. A feeder container 12 is detachably connected to both sides of the substrate conveying section 11, and a plurality of feeders 13 are arranged in the feeder container 12 in a lateral direction in the X-axis direction.
A reel 14 is detachably loaded on the feeder 13, and a carrier tape in which a large number of components P are packaged is wound around the reel 14. The feeder 13 sequentially feeds out the components P toward a feeding position where the components P are picked up by the mounting head 30 by rotation of a sprocket in the apparatus. At the supply position of the mounting head 30, the outer tape on the surface is peeled off from the carrier tape, and the component P in the pocket of the carrier tape is exposed to the outside. In the present embodiment, a tape feeder is exemplified as the feeder 13, but another feeder may be provided.
The base 10 is provided with a moving mechanism 20 for horizontally moving the pair of mounting heads 30 in the X-axis direction and the Y-axis direction. The moving mechanism 20 includes: a pair of Y-axis drive units 21 extending in the Y-axis direction and an X-axis drive unit 22 extending in the X-axis direction. The pair of Y-axis driving units 21 are supported by support portions (not shown) provided upright at four corners of the base 10, and the X-axis driving unit 22 is provided to the pair of Y-axis driving units 21 so as to be movable in the Y-axis direction. The mounting head 30 is movably provided in the X-axis direction on the X-axis driving unit 22, and the mounting head 30 is horizontally moved by the X-axis driving unit 22 and the Y-axis driving unit 21 to mount the component P picked up from the feeder 13 on a desired position of the substrate W.
As shown in fig. 2, the mounting head 30 is configured by providing a plurality of suction nozzles 32 (only 1 in the present embodiment) in a mounting head body 31 supported by the X-axis driving unit 22 (see fig. 1). Each suction nozzle 32 is supported by the mounting head body 31 via a nozzle driving unit 33, and is moved up and down in the Z-axis direction by the nozzle driving unit 33 and rotated about the Z-axis. Each suction nozzle 32 is connected to a suction source (not shown), and holds the component P by a suction force from the suction source. The suction nozzle 32 is provided with a coil spring, and the component P sucked by the suction nozzle 32 is mounted on the substrate W while contracting the coil spring.
The mounting head body 31 is provided with: a height measuring sensor 34 (see fig. 1) for detecting a height from the substrate W, and a component detecting unit 35 (also referred to as a detecting unit) for recognizing a component shape and detecting a suction error. The height measuring sensor 34 (also referred to as a recognition unit) detects the distance from the substrate W to the suction nozzle 32 by reflection of the inspection light, and controls the vertical movement amount of the suction nozzle 32 based on the detection result. In the component detector 35, the light emitter 36 and the light receiver 37 are opposed to each other in the horizontal direction, and the shape of the component, the suction error, and the like are inspected based on the light-shielded state of the light from the light emitter 36 after being shielded by the component P. The component detection unit 35 may emit LED light from the light emitting unit toward the light receiving unit, or may emit LED light from the light emitting unit toward the light receiving unit.
The mounting head body 31 is provided with: a substrate imaging unit 38 (see fig. 1) that images the BOC mark on the substrate W from directly above, and a component imaging unit 39 that images the mounting operation of the component P by the suction nozzle 32 from obliquely above. The substrate imaging unit 38 (also referred to as a recognition unit) recognizes the position, warpage, and the like of the substrate W based on the captured image of the BOC mark, and corrects the mounting position of the component P on the substrate W based on the recognition result. The component imaging section 39 images the components P corresponding to the feeders 13 before and after suction, and also images the components P corresponding to the substrates W before and after mounting. The presence or absence of the component P sucked by the suction nozzle 32 and the presence or absence of the component P mounted on the substrate W are checked by these photographed images.
The mounting apparatus 1 is provided with a control device 40 that centrally controls each unit of the apparatus. The control device 40 is configured by a processor, a memory, and the like that execute various processes. The memory is composed of one or more storage media such as rom (read Only memory) and ram (random Access memory) depending on the application. The memory stores a program for causing the mounting apparatus 1 to execute a mounting method described later, in addition to a control program for the entire mounting apparatus 1. In the mounting device 1 as described above, the component P fed from the feeder 13 is picked up by the mounting head 30 and transported and mounted to an arbitrary position of the substrate W.
As shown in fig. 3A, in the mounting device 1 (see fig. 1), when the feeder 13 is replaced, a start seek operation of sending out the component P (see fig. 2) to the feeding position corresponding to the mounting head 30 is performed. In this case, the start seek information is managed for each feeder 13 of the feeder container 12, and whether the start seek is completed is determined based on the start seek information. If the feeder 13 is replaced due to a component exhaustion or the like, the start seek information is reset, and the replaced feeder 13 automatically feeds out the start component P to the feed position to perform the start seek. By this initial seek operation of the component P, the delivery of the component P from the feeder 13 to the mounting head 30 is smoothly performed.
As shown in fig. 3B, the mounting device 1 is provided with a pair of feeder holders 12, and a plurality of feeders 13 are arranged in a lateral direction in the pair of feeder holders 12, and continuous (non stop) production is performed by the pair of feeder holders 12. In the continuous production, when a component is exhausted from any one of the feeders 13 in one of the feeder pockets 12, the supply of the component P is switched to the feeder 13 of the other feeder pocket 12, and the one feeder pocket 12 can be replaced during the production. That is, while the production is continued by the other feeder holder 12, the replacement work of the feeder 13 with the component used up is performed by disconnecting the one feeder holder 12 from the mounting device 1.
If the feeder container 12 is disconnected from the mounting device 1 and the feeder is discharged, the start seek information of all the feeders 13 loaded in the feeder container 12 is reset. Even if the feeders 13 with the parts running out are replaced and then loaded again, the start seek information of each feeder 13 disappears, and therefore all the feeders 13 need to perform the start seek operation. As described above, in the continuous production, even when part of the feeders 13 runs out, the start seek information of many feeders 13 which do not require the start seek because the feeders are discharged is lost, and therefore, the start seek must be performed for each feeder 13.
As shown in the comparative example of fig. 4A and 4B, in the general start seek operation, the start seek operation is carried out by component recognition by the OCC camera 51, the Height Measurement Sensor (HMS)52, and the like provided at the mounting head 50. In this case, the OCC camera 51 and the like are positioned directly above the feeding position of the feeder 53, and the feeding operation is repeated until the component P is recognized by the OCC camera 51 and the like. In the mounting head 50, the OCC camera 51 and the like are separated from the suction nozzles 54, and therefore, in order to pick up the component P from the feeder 53 after the start-finding operation, it is necessary to move the mounting head 50 so that the position of the OCC camera 51 and the like and the position of the suction nozzles 54 are exchanged.
When the start seek operation of 1 feeder 53 is performed by the OCC camera 51 or the like, although a large tact reduction is not caused, the above-described continuous production in which the feeders are removed causes a large tact reduction when the start seek operation is performed for all the feeders 53. In the OCC camera 51 and the height measuring sensor 52, the number of components P that can be searched for at the beginning is limited depending on the size of the components and the type of the components. For example, the OCC camera 51 cannot accurately recognize the component P having a size larger than the image frame size, and is limited to the components P within the image frame size that can be captured. In addition, since the height measurement sensor 52 measures the height using the reflected light, it is not possible to detect a member having a high reflectance or an extremely small member.
Therefore, in the present embodiment, instead of performing the initial search operation by recognizing the component P with the OCC camera or the height measurement sensor, the component P is initially searched by the feeding operation when the component P is picked up by the mounting head 30 (see fig. 6). The amount of movement of the mounting head 30 can be reduced without component recognition by an OCC camera or the like. In particular, even if the start seek information of all the feeders 13 of the feeder container 12 is lost due to the removal of the feeders, only the feeder 13 having failed in the pickup of the parts P performs the start seek, and a significant reduction in the tact time can be prevented. Since the OCC camera or the like is not used in the feeding operation, the component P is not limited by the size of the component, the type of the component, or the like as long as the component P can be picked up.
Next, a control structure of the mounting device will be described with reference to fig. 5 and 6. Fig. 5 is a block diagram of the mounting device of the present embodiment. Fig. 6 is an explanatory diagram of the feeding operation of the present embodiment. In the block diagram of fig. 5, the mounting device is described in a simplified manner, but the mounting device has a configuration that is normally provided.
As shown in fig. 5, a component detection unit 35 is connected to the control device 40, and the component detection unit 35 detects the component P picked up by the mounting head 30 (see fig. 1), and the feeder 13 feeds out the component P in accordance with whether or not the component P is successfully picked up. When the pickup is successful, the mounting operation of the component P is performed, and when the pickup is unsuccessful, the component P is repeatedly sent out until the pickup of the component P is successful, and the start seek is performed. The control device 40 is provided with: a 1 st determination unit 41, a storage unit 42, an attachment control unit 43, a 2 nd determination unit 44, a delivery control unit 45, and a notification unit 46.
In the component detection unit 35, the component P is positioned between the light emitting unit 36 and the light receiving unit 37 by the suction nozzle 32 in a state where the component P is held by the suction nozzle 32. Then, the light having high linearity is emitted from the light emitting unit 36 toward the member P, and the light not blocked by the member P is received by the light receiving unit 37. At this time, the outline of the component P picked up by the mounting head 30 is projected on the light receiving surface of the light receiving unit 37. The component P is not detected when the component P is not projected on the light receiving surface of the light receiving unit 37, and the component P is detected when the component P is projected on the light receiving surface of the light receiving unit 37.
In the 1 st determination unit 41, whether or not the pickup was successful is determined in accordance with the detection result of the component detection unit 35. In this case, if the component P is detected by the component detection section 35, it is determined that the pickup is successful, and if the component P is not detected by the component detection section 35, it is determined that the pickup is failed. In addition, whether or not the seek action needs to be initiated is indirectly determined corresponding to whether or not the pickup is successful. If the pickup is successful, the component P is delivered to the mounting head 30, and therefore it is determined that the initial seek operation is not necessary, and if the pickup is failed, the component P is not delivered to the mounting head 30, and therefore it is determined that the initial seek operation is necessary.
The storage unit 42 stores a start seek flag (start seek information) as start seek information for each feeder 13 (see fig. 1). When the 1 st deciding part 41 decides that the pickup is successful, the start seek flag of the storage part 42 is set to ON. By setting the start seek flag to ON, the start seek operation is prevented from being performed for the feeder 13 whose pickup is successful. When the 1 st determining unit 41 determines that the pickup is successful, the mounting controller 43 controls the mounting operation of the mounting head 30. In this case, the mounting head 30 moves from the feeder 13 to a mounting position of the substrate W (see fig. 1), and mounts the component P held by the suction nozzle 32 on the substrate W.
In the 2 nd determination unit 44, in the case of a pickup failure, it is determined whether or not the initial seek is completed. In this case, the start seek information of the storage unit 42 is referred to before the sending operation, and if the start seek flag is set to ON, it is determined that the start seek is completed, and if the start seek flag is set to OFF, it is determined that the start seek is not completed. When the 2 nd determination unit 44 determines that the initial seek has not been completed, the feeding control unit 45 controls the feeding operation of the component P by the feeder 13. In this case, the feeding operation of the component P by the feeder 13 is repeated until the pickup by the mounting head 30 is successful.
When the 2 nd determination unit 44 determines that the initial seek is completed, the notification unit 46 notifies the feeder 13 of the component depletion. As described above, in the case where the pickup operation fails and the start seek flag is set to ON, it is determined that the pickup failure is not the pickup failure caused by the non-implementation of the start seek but the pickup failure caused by the component exhaustion. Thus, the feeding operation of the component P is not repeated when the component is used up. Note that the notification unit 46 may be any device as long as it can notify the component end, and may be, for example, a sound notification, a light-emitting notification, a display notification, or a notification by a combination of these.
As shown in fig. 6A, when the pickup fails and the start seek flag is set to OFF, the feeder 13 performs the feeding operation of the component P. In this case, at the position where the pickup of the component P failed, the carrier tape is fed out by the feeder 13 at only 1 pitch, and the pickup operation of the component P is retried by the suction nozzle 32. Then, until the component detection unit 35 (see fig. 5) detects the picked-up component P and the component P is successfully picked up by the suction nozzle 32, the pickup operation of the mounting head 30 and the feed-out operation of the feeder 13 are repeated to perform the initial seek on the component P.
Since the initial search of the component P is performed by the feeding in the picking operation, the initial search using the substrate imaging unit (OCC camera) 38 or the like is not necessary. Thus, the movement of the mounting head 30 at the initial search of the component P can be suppressed to the minimum without changing the positions of the board imaging unit 38 and the suction nozzle 32. In particular, even in the case where the start seek information of all the feeders 13 is reset due to the discharge of the feeders in the uninterrupted production, the start seek is performed only for the feeder 13 replaced due to the part exhaustion being a pickup failure. The mounting action is started for the remaining feeders 13 being successfully picked up without making an initial seek.
As described above, even if the start seek information of all the feeders 13 is lost due to the discharge of the feeders, the tact down does not occur in the feeders 13 whose pickup is successful. Here, although the component P is initially searched by the feeding in the pickup operation in the present embodiment, the number of times of repetition of the feeding operation is different from that in the retry in the normal pickup operation. In the present embodiment, the pickup operation and the feed-out operation are repeated more than the predetermined number of times of retries in the normal pickup operation in the case of a pickup failure.
The component P may be picked up by the mounting head 30 without being limited in accordance with the component size and the component type, as in the initial seek operation using the board imaging unit (OCC camera) 38, the Height Measurement Sensor (HMS)34, and the like. For example, the member may be a member having a size larger than the size of the image frame that can be captured by the substrate imaging unit 38, or may be a member having a high reflectance or an extremely small member that cannot be detected by the height measuring sensor 34. Furthermore, the initial search for the component P, preferably by means of a pick-up action, is carried out in production. This is because the picked-up component P must be returned to the pocket of the reel before production starts, and it is difficult to return the component P to the pocket with high accuracy.
Therefore, as shown in fig. 6B, the component P can be initially searched by the component recognition performed by the substrate imaging unit 38 and the height measurement sensor 34 before the production is started. In this case, the component P is sent out by the feeder 13 and the start seek is performed until the component is recognized by the substrate imaging unit 38 and the height measurement sensor 34. Since the positions of the board imaging unit 38, the height measurement sensor 34, and the suction nozzle 32 are separated from each other, the mounting head 30 needs to be moved, but the component P does not need to be picked up, and therefore, problems caused by the pickup operation before the start of production can be prevented. As described above, the component P is initially searched for by the pickup operation during production, and preferably by the component recognition by the substrate imaging unit 38 and the height measurement sensor 34 before the production is started.
A method of mounting components will be described with reference to fig. 7 and 8. Fig. 7 is a flowchart of an installation method of the comparative example. Fig. 8 is a flowchart of the mounting method of the present embodiment. In the description of fig. 7, the reference numerals of the comparative example of fig. 4 are used as appropriate, and in the description of fig. 8, the reference numerals of fig. 6 and 5 are used as appropriate. In fig. 7 and 8, retry of the normal pickup operation and an error at the time of initial seek are omitted.
As shown in fig. 7, if the mounting operation of the comparative example is started, the start search information is confirmed, and whether the start search is completed is determined based ON and OFF of the start search flag (step S01). If it is determined that the start seek has not been completed based on the OFF of the start seek flag (No at step S01), the mounting head 30 moves to position the OCC camera 51 at the feed position of the feeder 53 (step S02). The supply position of the feeder 53 is photographed by the OCC camera 51 to perform component recognition (step S03), and the presence or absence of the component P at the supply position is determined based on the recognition result of the OCC camera 51 (step S04).
When there is No component P at the feeding position of the feeder 53 (No at step S04), the reels are fed out at only 1 pitch (step S05). The process from step S03 to step S05 is repeated until the component P reaches the supply position, and the start seek of the component P is performed. ON the other hand, when the start seek flag is ON and it is determined that the start seek is completed (Yes at step S01) or when there is a component P at the feeding position of the feeder 53 (Yes at step S04), the mounting head 50 is moved to position the suction nozzle 54 at the feeding position of the feeder 53 (step S06).
The mounting head 50 performs a component P pickup operation (step S07), and determines whether or not the pickup is successful according to whether or not the component P is suctioned by the suction nozzle 54 (step S08). In the case where the pickup fails (No at step S08), the operator is notified of the part end (step S09). If the pickup is successful (Yes at step S08), the mounting head 50 moves to the mounting position of the substrate W (step S10), and mounts the component P to the mounting position (step S11). In the mounting operation of the comparative example, an unnecessary movement is generated at the mounting head 50 due to the component recognition by the OCC camera 51, and a reduction in tact occurs.
On the other hand, as shown in fig. 8, if the mounting operation of the present embodiment is started, the mounting head 30 moves to position the suction nozzles 32 at the feeding position of the feeder 13 (step S21). The mounting head 30 performs a pickup operation of the component P (step S22), and the 1 st deciding part 41 decides whether or not the pickup is successful (step S23). In this case, the component detection unit 35 detects the component P held by the suction nozzle 32, and the 1 st determination unit 41 determines whether or not the pickup is successful. Whether or not the seek action needs to be initiated is indirectly determined according to whether or not the pickup by the mounting head 30 is successful.
When the pickup fails (No at step S23), the start seek information of the storage unit 42 is checked and whether the start seek is completed is determined based ON and OFF of the start seek flag (step S24). When the start seek flag is ON and it is determined that the start seek is completed (Yes at step S24), the notifying unit 46 notifies the operator of the component end (step S25). If the start seek flag is OFF and it is determined that the start seek has not been completed (No at step S24), the reel is fed out at only 1 pitch (step S26). The processing from step S22 to step S26 is repeated until the pickup is successful, whereby the start search is performed for the part P.
ON the other hand, if the pickup is successful (Yes at step S23), the start seek flag stored in the storage unit 42 is set to ON (step S27). Then, the mounting head 30 moves to the mounting position of the substrate W (step S28), and mounts the component P at the mounting position (step S29). As described above, in the mounting operation of the present embodiment, since the initial seek is performed by the sending-out of the component P at the time of the pickup operation, the mounting head 30 does not move excessively due to the initial seek operation as in the comparative example (see fig. 7), and a significant reduction in tact does not occur.
As described above, in the mounting device 1 of the present embodiment, when the pickup of the component P by the mounting head 30 fails, the feeder 13 feeds out the component P until the pickup succeeds, and the component P is initially searched. That is, the initial seek operation is performed by the feeding operation of the component P at the time of the pick-up operation. Since it is not necessary to move the substrate imaging unit 38 and the height measuring sensor 34 for component recognition to the supply position of the component P, the moving time can be shortened and the reduction in tact can be suppressed. Further, since the initial seek operation is performed depending on whether or not the pickup of the component P is successful, the component P capable of performing the initial seek operation is not limited depending on the component size, the component type, and the like.
In the present embodiment, the component detection unit in which the light emitting unit and the light receiving unit are opposed to each other is exemplified as the detection unit, but the present invention is not limited to this configuration. The detection unit may be any one that can detect the component picked up by the mounting head, and may be, for example, a pressure sensor that detects the picked-up component according to the magnitude of the vacuum air pressure of the suction nozzle.
In the present embodiment, the start search flag is exemplified as the start search information, but the present invention is not limited to this configuration. The start seek information may be any discrimination information as long as each feeder can discriminate whether or not the start seek is completed.
In the present embodiment, the suction nozzle is exemplified as the nozzle, but the configuration is not limited to this. The suction nozzle may be a suction nozzle as long as it can hold the component, for example.
In the present embodiment, the substrate imaging unit and the height measurement sensor are illustrated as the recognition unit, but the present invention is not limited to this configuration. The recognition unit may recognize the component sent to the supply position corresponding to the mounting head.
In the present embodiment, the feeding operation is repeated until the pickup is successful in the case of the pickup failure, but the limit number of times may be set as the number of times the feeding operation is repeated. Thus, when the picking operation fails due to a problem or the like, the component is not repeatedly fed out.
In the present embodiment, the substrate is not limited to a printed circuit board as long as various components can be mounted thereon, and may be a flexible substrate mounted on a tool substrate.
The program of the present embodiment may be stored in a storage medium. The recording medium is not particularly limited, and may be a nonvolatile recording medium such as an optical disk, a magneto-optical disk, and a flash memory.
In addition, although the embodiment and the modification of the present invention have been described, the above embodiment and the modification may be combined wholly or partially as another embodiment of the present invention.
The embodiment of the present invention is not limited to the above-described embodiments and modifications, and various changes, substitutions, and alterations can be made without departing from the spirit and scope of the technical idea of the present invention. And if the technical idea of the present invention can be implemented in other ways by technical advances or other derived techniques, it can be implemented using this method. Therefore, the claims cover all the embodiments that can be included in the technical idea of the present invention.
In the above embodiment, a mounting device for mounting a component fed from a feeder to a substrate by picking up the component by a mounting head, the mounting device comprising: a detection unit that detects the component picked up by the mounting head; and a 1 st determination unit that determines whether or not the pickup is successful in accordance with a detection result of the detection unit, and in the case where the pickup is successful, the component is mounted on the substrate by the mounting head, and in the case where the pickup is failed, the component feeding operation by the feeder is repeated until the pickup is successful. According to this configuration, in the case where the pickup of the component by the mounting head fails, the component is sent out by the feeder until the pickup succeeds, and the component is initially sought. That is, the initial seek operation is performed by the component feeding operation in the pick-up operation. Since it is not necessary to move a device for recognizing a component such as a camera to a component supply position, the moving time can be shortened and the reduction in tact can be suppressed. Further, since the initial seek operation is performed depending on whether or not the pickup of the component is successful, the components capable of performing the initial seek operation are not limited depending on the component size, the component type, and the like.
Industrial applicability
As described above, the present invention has an effect that it is possible to perform the start seek operation regardless of the component size, the component type, and the like while suppressing the reduction in tact time, and is particularly suitable for a mounting apparatus and a mounting method which perform uninterrupted production.
Claims (6)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-198106 | 2017-10-12 | ||
| JP2017198106A JP7011441B2 (en) | 2017-10-12 | 2017-10-12 | Mounting device and mounting method |
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| CN109661161A CN109661161A (en) | 2019-04-19 |
| CN109661161B true CN109661161B (en) | 2021-09-03 |
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| CN115551227B (en) * | 2022-11-07 | 2023-07-25 | 哈尔滨工业大学 | Distribution optimization method for feeder of single-acting arm arch type multifunctional chip mounter |
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| CN102640583A (en) * | 2009-12-01 | 2012-08-15 | 松下电器产业株式会社 | Component mounting apparatus and substrate conveyance method in component mounting apparatus |
| JP5075214B2 (en) * | 2010-01-26 | 2012-11-21 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
| CN103314657A (en) * | 2011-02-14 | 2013-09-18 | 富士机械制造株式会社 | Component-mounting machine |
| CN103717057A (en) * | 2012-09-28 | 2014-04-09 | Juki株式会社 | Component detection method and device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4338848B2 (en) | 1999-11-01 | 2009-10-07 | Ｊｕｋｉ株式会社 | Electronic component mounting method and apparatus |
| JP2003218588A (en) | 2002-01-18 | 2003-07-31 | Matsushita Electric Ind Co Ltd | Method and apparatus for supplying component |
| JP2010045291A (en) | 2008-08-18 | 2010-02-25 | Yamaha Motor Co Ltd | Surface mounting machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102640583A (en) * | 2009-12-01 | 2012-08-15 | 松下电器产业株式会社 | Component mounting apparatus and substrate conveyance method in component mounting apparatus |
| JP5075214B2 (en) * | 2010-01-26 | 2012-11-21 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
| CN103314657A (en) * | 2011-02-14 | 2013-09-18 | 富士机械制造株式会社 | Component-mounting machine |
| CN103717057A (en) * | 2012-09-28 | 2014-04-09 | Juki株式会社 | Component detection method and device |
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| JP2019075393A (en) | 2019-05-16 |
| JP7011441B2 (en) | 2022-01-26 |
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