JP4579608B2 - Thread, manufacturing method thereof, and sheet - Google Patents

Description

  The present invention relates to a thread, a manufacturing method thereof, and a sheet that are affixed or inserted into securities, banknotes, and the like and used for authenticity determination.

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread in which an IC chip is bonded to one side of a film cut to a width of about several millimeters is inserted into a paper layer of securities or banknotes, and when using securities or banknotes, an IC is used. By reading the information written on the chip, the authenticity of the securities or bills is determined (for example, see Patent Document 1).
JP 2002-319006 A

  However, in the thread as described above, since the IC chip is bonded to one side of the film cut to a width of about several millimeters, the area where the IC chip is mounted is different from the other area. As a result, the flatness of the thread surface is impaired and the IC chip is easily damaged.

  The present invention has been made in view of the problems of the conventional techniques as described above, and can reduce the possibility of breakage of an IC chip. An object of the present invention is to provide a manufacturing method and a sheet.

In order to achieve the above object, the present invention provides:
On the first sheet base material of the strip, with at least information read capable IC chip is mounted in a non-contact state, to the area where the IC chip is mounted within the first sheet base, said recess as IC chip enters is formed on the entire surface of the front Symbol surface on which the IC chip is mounted in the first sheet base, greater than or equal to minus the depth of the recess from the thickness of the IC chip And a second sheet base material in which a hole is formed so that the IC chip is exposed is laminated , and the first sheet base material and the second sheet base material are A thread adhered by an adhesive applied on a first sheet substrate ,
The IC chip is adhered at least a portion in a state that has entered into the recess is embedded in the adhesive so as to be covered by the adhesive to the first sheet base.

Also, a method for manufacturing the thread,
Forming the recess in a region where the IC chip is mounted on the first sheet substrate;
Applying the adhesive on the first sheet base material in which the concave portion is formed;
On the first sheet base material coated with the adhesive, the second sheet base material is laminated so that the hole is disposed in the region where the concave portion is formed, and the first sheet base material is laminated. Bonding the material and the second sheet base material by melting the adhesive;
On the first sheet base material on which the second sheet base material is laminated, the IC chip is mounted by being inserted into the concave portion through the hole, and the adhesive is remelted by the remelting. A step of embedding an IC chip in the adhesive and adhering to the first sheet base material.

  In the present invention configured as described above, when the IC chip is mounted on the first sheet base material in which the concave portion is formed, the IC chip is inserted into the concave portion by the adhesive in the first sheet. Bonded to the substrate. At this time, the IC chip is exposed from the hole formed in the second sheet base material laminated on the first sheet base material, but the thickness of the second sheet base material is equal to that of the IC chip. Since the thickness is equal to or greater than the value obtained by subtracting the depth of the recess, the area where the IC chip is mounted does not protrude from other areas, thereby reducing the possibility of damage to the IC chip. If the thickness of the second sheet substrate is made substantially equal to the value obtained by subtracting the depth of the recess from the thickness of the IC chip, the flatness of the surface on which the second sheet substrate is laminated can be improved. improves.

  As described above, in the present invention, in a thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material, A concave portion is formed in the region where the IC chip is mounted, and the IC chip is mounted by being bonded to the first sheet base material with an adhesive in a state of entering the concave portion. A hole having a thickness equal to or greater than the thickness obtained by subtracting the depth of the recess from the thickness of the IC chip was formed on the entire surface of the substrate on which the IC chip was mounted, and the IC chip was exposed. Since the second sheet base material is laminated, the area where the IC chip is mounted does not protrude relative to other areas, thereby reducing the possibility of the IC chip being damaged. If the thickness of the second sheet substrate is made substantially equal to the value obtained by subtracting the depth of the recess from the thickness of the IC chip, the flatness of the surface on which the second sheet substrate is laminated is improved. Can be made.

  Further, in the case where at least a part of the IC chip is covered with an adhesive, the IC chip can be further protected and the IC chip can be prevented from falling off.

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing an embodiment of a thread according to the present invention, in which FIG. 1A is a top view and FIG. 1B is a cross-sectional view taken along line A-A ′ shown in FIG.

  In this embodiment, as shown in FIG. 1, the IC chip 10 is placed in a region where the concave portion 22 is formed on the resin layer 20 that is the first sheet base material by a hot melt layer 30 that is a hot melt that is an adhesive. The paper layer 50, which is a second sheet base material in which a hole 51 is formed on the resin layer 20 so as to expose the IC chip 10, is mounted and bonded in a covered state. ing. The resin layer 20 is made of strip-shaped PET, and is bonded to the paper layer 50 by a hot melt layer 30. Further, the depth of the concave portion 22 formed in the resin layer 20 is deeper than the thickness of the IC chip 10, and the thickness of the paper layer 50 is from the thickness of the IC chip 10 to the depth of the concave portion 22. It becomes more than the value which subtracted. Further, the size of the hole 51 and the recess 22 is obtained by subtracting the volume of the IC chip 10 from the volume formed by the hole 51 and the recess 22 when the paper layer 50 is laminated on the resin layer 20. The volume of the hot melt layer 30 in the region facing the portion 51, that is, the amount of hot melt applied to the region facing the hole 51 on the resin layer 20 is greater than the volume. Further, the IC chip 10 can write and read information in a non-contact state, and is written in the IC chip 10 by being brought close to an information writing / reading device provided outside. Information is read or information is written to the IC chip 10.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes. Therefore, if one side of the thread is a paper layer 50 or a layer made of non-woven fabric and this side is used as a surface to be affixed to securities or banknotes, the adhesiveness between the threads and securities or banknotes can be improved. it can. On the other hand, when the first sheet base material on which the paper layer 50 is laminated is the resin layer 20 made of a material such as PET as described above, the mechanical strength of the thread can be improved. The first and second sheet base materials to be laminated have the effects described above by being limited to the resin layer 20 and the paper layer 50, but the present invention is not limited to these.

  When a securities or banknote with a thread attached is brought close to the above-described information writing / reading device, for example, information written in the IC chip 10 is read, and based on the read information, the valuable information is read. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 10, as described above, when the authenticity determination is performed only by the information written in the IC chip 10, the information written in the IC chip 10 may be read out in a non-contact state. It is not necessary to have a configuration in which information is written in a non-contact state.

  It is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 1 to the securities or banknotes. In that case, for example, a paper machine manufactured from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and a thread is placed between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. In addition, it is also conceivable to use a securities or banknotes in which a plurality of papers are laminated with a thread sandwiched between the laminated papers.

  It is also conceivable that a recess is formed in securities, bills or the like, and a thread as shown in FIG. 1 is fitted into the recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  The thread as shown in FIG. 1 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like one as described above, punched, sandwiched, Alternatively, it is used by being incorporated in a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, the region of the resin sheet 21 that becomes the resin layer 20 by cutting is irradiated with laser light to form a recess 22 into which the IC chip 10 enters (FIG. 2A). . The shape of the exposed surface of the recess 22 is preferably substantially the same as that of the IC chip 10 in order to prevent the IC chip 10 from being displaced in the recess 22. In addition, the formation of the recess 22 is not limited to that by laser light irradiation, and it is sufficient that the predetermined recess 22 can be formed by an existing technique.

  Next, the hot melt layer 30 is laminated on the resin sheet 21 by applying hot melt to the entire surface of the resin sheet 21 on which the recesses 22 are formed (FIG. 2B).

  Next, a paper layer 50 as a second sheet base material is laminated on the resin sheet 21 on which the hot melt layer 30 is laminated, and the paper layer 50 and the resin sheet 21 are heated by the hot melt layer 30 by heating and pressing. And glue. Here, the paper layer 50 is laminated on the resin sheet 21, and when the IC chip 10 is mounted on the resin sheet 21 later, a hole 51 is formed in a region facing the IC chip 10. (FIG. 2 (c)). Further, the thickness of the paper layer 50 is equal to or greater than the value obtained by subtracting the depth of the recess 22 from the thickness of the IC chip 10. Further, the shape of the exposed surface of the hole 51 is preferably substantially the same as that of the IC chip 10 in order to prevent the positional displacement of the IC chip 10 in the hole 51, but the hot melt flows out to the surface. In order to prevent this, it is formed wider than the recess 20 in this embodiment.

  Next, the IC chip 10 is mounted on the resin sheet 21 on which the paper layer 50 is laminated so that the IC chip 10 enters the hole 51 formed in the paper layer 50 (FIG. 2D). As a result, the IC chip 10 is exposed from the hole 51 formed in the paper layer 50.

  When the IC chip 10 is heated and pressed when the IC chip 10 is mounted on the resin sheet 21, the portion of the hot melt layer 30 that contacts the IC chip 10 and its surroundings are melted, thereby causing the IC chip 10 to be hot. The IC chip 10 is embedded in the recess 22 on the resin sheet 21 by being embedded in the melt layer 30 and entering the recess 22, and then the hot melt layer 30 is cured. 2 (e)). As a method for heating the IC chip 10, for example, it is conceivable to use a chip mounting machine having heat, and it is also possible to heat the peripheral part of the hole 51 into which the IC chip 10 enters as necessary. . At this time, the hot melt layer 30 applied in the hole portion 51 is melted, and wraps around the IC chip 10 in the hole portion 51 to cover the surface of the IC chip 10. Depending on the amount of hot melt layer 30 applied, the surface of IC chip 10 may not be covered by hot melt layer 30. At this time, since the thickness of the paper layer 50 is not less than the value obtained by subtracting the depth of the recess 22 from the thickness of the IC chip 10, the IC chip 10 entering the recess 22 and bonded to the resin sheet 21 is It will not protrude beyond the surface of the paper layer 50. Further, a portion of the hot melt layer 30 that is melted by heating and pressurizing the IC chip 10 flows around the IC chip 10 in the hole 51 formed in the paper layer 50. The value obtained by subtracting the volume of the IC chip 10 from the volume composed of the hole 51 and the recess 22 is equal to or larger than the amount of hot melt applied to the region facing the hole 51. Therefore, the flowing hot melt does not leak out of the hole 51.

  Thereafter, the resin sheet 21 and the paper layer 50 may be heated while being pressed by a heat roller as necessary, and in that case, the hot melt layer 30 is melted again. Then, when the IC chip 10 is covered with the hot melt layer 30, the surface of the hot melt layer 30 is flattened. When the IC chip 10 is not covered with the hot melt layer 30, the resin sheet 21 and The hot melt layer 30 between the paper layer 50 flows into the hole 51, wraps around the IC chip 10, and covers the surface of the IC chip 10.

  FIG. 3 is a diagram showing a state in which the IC chip 10 is mounted and bonded on the resin sheet 21 on which the paper layer 50 is laminated in the thread manufacturing process shown in FIG. It is omitted.

  As shown in FIG. 3, when the IC chip 10 is mounted on the resin sheet 21 on which the paper layer 50 is laminated, the IC chip 10 mounted and bonded on the resin sheet 1 is formed on the paper layer 50. The hole 51 is exposed.

  Thereafter, the paper layer 50 is laminated, and the resin sheet 21 on which the IC chip 10 is mounted and bonded is cut into a strip shape, thereby completing a thread roll.

  FIG. 4 is a diagram illustrating a state in which the resin sheet 21 on which the paper layer 50 is laminated is cut into a strip shape in the thread manufacturing process illustrated in FIG. 1.

  As shown in FIG. 4, when the resin sheet 21 on which the paper layer 50 is laminated is cut into a strip shape, a thread roll in which the IC chips 10 are linearly arranged is formed on the resin sheet 21, and this thread roll Is wound up and then cut into units to be pasted (for example, one IC chip 10 is included) when pasted on securities or banknotes, as shown in FIG. A thread is formed.

  In the thread manufactured by the manufacturing process described above, the exposed surface of the IC chip 10 can be protected, and the IC chip 10 can be prevented from falling off.

  In the present embodiment, the case where the entire exposed surface of the IC chip 10 is covered with the hot melt layer 30 has been described as an example, but the amount of the applied hot melt layer 30 and the degree of heating and pressurization. Thus, it is possible to cover only a part of the exposed surface of the IC chip 10 with the hot melt layer 30, and in this case, the IC chip 10 can be prevented from falling off.

  In the present embodiment, the resin layer 20 made of PET is used. However, the present invention is not limited to this, and for example, one made of PET-G or PVC can be considered. It is also conceivable to use a resin layer made of PET, PET-G or PVC instead of the paper layer 50. When a resin layer 20 made of PET-G or PVC is used and a resin layer made of PET-G or PVC is used instead of the paper layer 50, these are bonded to each other by heating. Therefore, the hot melt layer 30 may be laminated only in the region of the resin sheet 21 where the IC chip 10 is mounted.

  Further, in the thread manufacturing method shown in FIG. 1, as described above, the resin sheet 21 that becomes the resin layer 20 by being cut, the paper layer 50 is laminated on the resin sheet 21, and further the IC chip 10. Is not limited to manufacturing a thread by cutting the substrate, and the hot melt layer 30 is substantially laminated on the belt-shaped resin layer 20 and the paper layer 50 is formed on the resin layer 20. Then, the IC chip 10 may be mounted on and adhered to the resin layer 20 by the hot melt layer 30.

  Further, the IC chip 10 is bonded to the resin layer 20 without being limited to the hot melt layer 30, for example, a layer made of an ultraviolet curable adhesive may be used. In that case, when the IC chip 10 is mounted on the resin sheet 21, ultraviolet rays are irradiated from the surface of the resin sheet 21 opposite to the surface on which the IC chip 10 is mounted, whereby an ultraviolet curable adhesive is obtained. Then, the IC chip 10 is bonded onto the resin sheet 21 by curing the adhesive. Further, when a layer made of an ultraviolet curable adhesive is used instead of the hot melt layer 30 as an adhesive for the resin layer 20 and the paper layer 50, the resin sheet 21 and the paper layer 50 are bonded. Then, ultraviolet rays are irradiated from the surface of the resin sheet 21, thereby melting the ultraviolet curable adhesive, and then the adhesive is cured to bond the resin sheet 21 and the paper layer 50. In these cases, the resin sheet 21 needs to be made of a material that transmits ultraviolet rays.

  Further, in this embodiment, by using the resin layer 20 as the first sheet base material, it is possible to prevent twisting or breaking of the sheet being conveyed when it is rubbed into another paper layer or bonded. When the paper layer 50 is used as the second sheet base material, the adhesiveness is improved and the film is difficult to peel off when the paper layer 50 is rubbed into another paper layer or bonded. Accordingly, by using one of the two sheet base materials to be laminated, one of which is made of resin and the other is made of paper, the sheet can be prevented from being twisted or broken, and has an effect of improving adhesion and being difficult to peel off. . As described above, the laminated structure is not limited to the present embodiment, and the same structure is possible even if the resin layer 20 that is the first sheet base material and the paper layer 50 that is the second sheet base material are reversed. Needless to say, it produces an effect. Furthermore, when only the improvement in adhesiveness is required, it is conceivable that the two sheet base materials to be laminated are made of paper, and in order to improve the mechanical strength 2 One sheet base material may be made of resin.

It is a figure which shows one Embodiment of the thread | sled of this invention, (a) is a top view, (b) is A-A 'sectional drawing shown to (a). It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. FIG. 2 is a diagram showing a state in which an IC chip is mounted and bonded on a resin sheet on which a paper layer is laminated in the thread manufacturing process shown in FIG. It is a figure which shows the state which cut the resin sheet on which the paper layer was laminated | stacked in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG.

Explanation of symbols

10 IC chip 20 Resin layer 21 Resin sheet 22 Recessed part 30 Hot melt layer 50 Paper layer 51 Hole

Claims (3)

On the first sheet base material of the strip, with at least information read capable IC chip is mounted in a non-contact state, the region where the IC chip is mounted within the first sheet base, said recess as IC chip enters is formed on the entire surface of the front Symbol surface on which the IC chip is mounted in the first sheet base, greater than or equal to minus the depth of the recess from the thickness of the IC chip And a second sheet base material in which a hole is formed so that the IC chip is exposed is laminated , and the first sheet base material and the second sheet base material are A thread adhered by an adhesive applied on a first sheet substrate ,
The IC chip is at least partially bonded to said first sheet base is embedded in the adhesive so as to be covered by the adhesive threads in a state that has entered into the recess. It is a manufacturing method of the thread according to claim 1 ,
Forming the recess in a region where the IC chip is mounted on the first sheet substrate;
Applying the adhesive on the first sheet base material in which the concave portion is formed;
On the first sheet base material coated with the adhesive, the second sheet base material is laminated so that the hole is disposed in the region where the concave portion is formed, and the first sheet base material is laminated. Bonding the material and the second sheet base material by melting the adhesive;
On the first sheet base material on which the second sheet base material is laminated, the IC chip is mounted by being inserted into the concave portion through the hole, and the adhesive is remelted by the remelting. And a step of embedding an IC chip in the adhesive and adhering the chip to the first sheet base material. A sheet in which the thread according to claim 1 is incorporated.

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