JP2005242971A - Thread, method of manufacturing it, and sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce possibility of breakage of an IC chip even when it is used while being affixed to securities, bank bill, etc. <P>SOLUTION: A thread is configured to mount an IC chip 10 capable of reading out at least information in a noncontact condition onto a belt-like resin layer 20. The IC chip 10 is held between the resin layer 20 and a paper layer 50 in a state that the IC chip 10 is bonded to the resin layer 20 by a hotmelt layer 30. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a thread, a manufacturing method thereof, and a sheet that are affixed or inserted into securities, banknotes, and the like and used for authenticity determination.

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread in which an IC chip is bonded to one side of a film cut to a width of about several millimeters is inserted into a paper layer of securities or banknotes. By reading the information written on the chip, the authenticity of the securities or bills is determined (for example, see Patent Document 1).
JP 2002-319006 A

  However, in the technique as described above, since the IC chip is only bonded to one side of the film cut to a width of about several millimeters, the thread is attached to the securities or banknotes with the film side as the pasting surface. When it is used by being attached, there is a problem that the IC chip is exposed to the outside, and there is a high possibility that the IC chip is damaged.

  The present invention has been made in view of the problems of the conventional techniques as described above, and the IC chip is damaged even when it is used by being affixed to securities or banknotes. It is an object of the present invention to provide a thread that can reduce the possibility and a manufacturing method thereof.

In order to achieve the above object, the present invention provides:
An IC chip capable of reading at least information in a non-contact state is mounted between the belt-shaped first sheet base material and the belt-shaped second sheet base material.

A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
The IC chip is mounted by being adhered to the first sheet base material by an adhesive applied on the first sheet base material,
A second sheet base material is laminated on the first sheet base material so as to cover at least the IC chip.

  Further, the first sheet base material and the second sheet base material are made of different materials.

  Further, at least one of the first and second sheet base materials is made of paper.

  The paper is water-soluble paper.

In addition, the thread is a thread formed by mounting an IC chip capable of reading at least information in a non-contact state on the first sheet base material in a strip shape,
The IC chip is mounted on the first sheet substrate by being bonded to the first sheet substrate so as to be embedded in an adhesive applied thicker than the thickness of the IC chip.
A second sheet base material is laminated on the first sheet base material so as to cover at least the IC chip.

In addition, the thread manufacturing method,
Applying the adhesive on the first sheet base material thinner than the thickness of the IC chip;
Mounting and pressing the IC chip on the first sheet base material coated with the adhesive, and bonding the IC chip to the first sheet base material with the adhesive;
Laminating the second sheet substrate on the first sheet substrate to which the IC chip is bonded, and bonding the first sheet substrate and the second sheet substrate. .

  Moreover, by sandwiching the first sheet base material and the second sheet base material with elastic members in a state where the second sheet base material is laminated on the first sheet base material. The first sheet and the second sheet are adhered to each other.

  In the present invention configured as described above, in a thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped sheet base material, the IC chip is first bonded by an adhesive. Since it is sandwiched between the first sheet base material and the second sheet base material in a state of being bonded to the sheet base material, the IC chip can be used regardless of the direction in which this thread is attached to securities or banknotes. Is not exposed, and the possibility that the IC chip is damaged is reduced.

  Further, if at least one of the first and second sheet base materials is made of paper, the adhesiveness is improved when the thread is rubbed into another paper layer or bonded, and it is difficult to peel off. .

  In addition, if the paper is water-soluble paper, when this thread is squeezed into another paper layer, the sheet base material made of water-soluble paper will melt, and the adhesiveness will be further improved. It leads to thinning.

  Further, when manufacturing this thread, if the adhesive applied on the first sheet base material for bonding the first sheet base material and the IC chip is made thinner than the thickness of the IC chip, the IC chip When the IC chip is mounted on the first sheet and pressed, the adhesive does not adhere to the chip mounting head for mounting and pressing the IC chip on the first sheet substrate. In addition, when the first sheet base material and the second sheet base material are bonded using this adhesive, the adhesive agent is used when the first sheet base material and the second sheet base material are bonded. Therefore, the mounting position of the IC chip is not shifted due to the fluidity.

  In addition, when the first sheet base material and the second sheet base material are bonded, the first sheet base material and the second sheet base material are sandwiched between members having elasticity, so that the first sheet base material and the second sheet base material are sandwiched. If the sheet base material and the second sheet base material are bonded together, the IC chip sandwiched between the first sheet base material and the second sheet base material will not be damaged.

  Further, the IC chip is mounted on the first sheet base material by being adhered to the first sheet base so as to be embedded in the adhesive applied thicker than the thickness of the IC chip. If the second sheet base material is laminated on the material so as to cover at least the IC chip, the IC chip is sandwiched between the first and second sheet base materials and the adhesive, and a further protective effect of the IC chip is obtained. It is done.

  As described above, in the present invention, in a thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-like first sheet base material, the IC chip is the first sheet base. Since this material is sandwiched between the material and the second sheet base material, the IC chip is not exposed and the IC chip is damaged no matter what direction the thread is attached to the securities or banknotes. The possibility can be reduced.

  Further, when at least one of the first and second sheet base materials is made of paper, the adhesiveness is improved when the thread is rubbed into another paper layer or bonded, and it is difficult to peel off. Can do.

  In addition, in the case where the paper is water-soluble paper, when the thread is rubbed into another paper layer, the sheet base material made of water-soluble paper is melted, and the adhesiveness can be further improved, Other paper layers can be made thinner.

  Further, when this thread is manufactured, an adhesive for bonding the first sheet base material and the IC chip is applied on the first sheet base material to be thinner than the thickness of the IC chip. When the chip is mounted on the first sheet, it is possible to prevent the adhesive from adhering to the chip mounting head for mounting the IC chip on the first sheet base material. Further, when the first sheet base material and the second sheet base material are bonded using this adhesive, the IC chip is used when bonding the first sheet base material and the second sheet base material. Can be prevented from shifting the mounting position.

  In addition, when the first sheet base material and the second sheet base material are bonded, the first sheet base material and the second sheet base material are sandwiched between members having elasticity, so that the first sheet base material and the second sheet base material are sandwiched. In the case where the sheet base material and the second sheet base material are bonded, the IC chip sandwiched between the first sheet base material and the second sheet base material is prevented from being damaged. Can do.

  Further, in a thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material, the IC chip is mounted on the first sheet base material. Adhered to and mounted on the first sheet base material so as to be embedded in the adhesive applied thicker than the thickness, and the second sheet base material is laminated on the first sheet base material so as to cover at least the IC chip. In what has been done, the IC chip is sandwiched between the first and second sheet base materials and the adhesive, and a further protective effect of the IC chip can be obtained.

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing an embodiment of a thread according to the present invention. FIG. 1A is a diagram showing a stacked state, and FIG. 1B is a diagram showing an internal configuration.

  In this embodiment, as shown in FIG. 1, an IC chip 10 is mounted on and adhered to a resin layer 20 that is a first sheet base material by a hot melt layer 30 that is a hot melt that is an adhesive. A paper layer 50 as a second sheet base material is laminated. The resin layer 20 is made of strip-shaped PET, and is bonded to the paper layer 50 by a hot melt layer 30. Further, the IC chip 10 can only write and read information or read information in a non-contact state. For example, the IC chip 10 has a size of 500 μm □ and a thickness of 70 μm. The IC chip 10 is bonded to the resin layer 20 by the hot melt layer 30 in a state of being embedded in the hot melt layer 30.

  2A and 2B are diagrams showing an example of the securities to which the thread shown in FIG. 1 is attached, in which FIG. 2A is a top view and FIG. 2B is a cross-sectional view taken along line A-A ′ shown in FIG.

  As shown in FIG. 2, the thread 1 as shown in FIG. When the securities 2 are used, when the securities 2 are brought close to an information writing / reading device capable of reading the information written on the IC chip 10, the information written on the IC chip 10 is read and read. Based on the issued information, the authenticity of the securities 2 is determined.

  3A and 3B are diagrams showing another example of the securities to which the thread shown in FIG. 1 is attached. FIG. 3A is a top view, and FIG. 3B is a cross-sectional view taken along line AA ′ shown in FIG. is there.

  As shown in FIG. 3, it is also conceivable to use the thread 1 by inserting it into the paper layer of the securities 2 instead of attaching the thread 1 as shown in FIG. 1 to the securities 2. In that case, for example, a paper machine manufactured from at least two paper layers using a multi-tank type net paper machine is used as the securities 2, and the thread 1 is inserted between the paper layers when the securities 2 are manufactured. . The securities and banknotes in which the thread 1 is inserted in this way are also used in the same manner as described above. Moreover, it is also conceivable to use a thread 1 sandwiched between stacked papers in securities, banknotes, and the like in which a plurality of papers are stacked.

  4A and 4B are diagrams showing another example of the securities to which the thread shown in FIG. 1 is attached, wherein FIG. 4A is a top view, and FIG. 4B is a cross-sectional view taken along line AA ′ shown in FIG. is there.

  As shown in FIG. 4, it is also conceivable to form a recess 2a in the securities 2 and fit the thread 1 as shown in FIG. 1 into the recess 2a. As described above, the securities and bills in which the thread 1 is inserted are used in the same manner as described above.

  The thread 1 as shown in FIG. 1 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like object, or is inserted or pinched as described above. Alternatively, it is used by being incorporated in a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 5 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, the hot melt layer 30 is laminated on the resin sheet 21 by applying hot melt to the entire surface of the resin sheet 21 that becomes the resin layer 20 by cutting (FIG. 5A). Note that the thickness of the hot melt layer 30 is set to be thinner than the thickness of the IC chip 10 to be mounted on the resin sheet 21 later.

  Next, the IC chip 10 is mounted on the resin sheet 21 on which the hot melt layer 30 is laminated (FIG. 5B), and when the IC chip 10 is heated and pressurized, it contacts the IC chip 10 of the hot melt layer 30. The portion to be melted and the periphery thereof are melted, whereby the IC chip 10 is embedded in the hot melt layer 30, and then the hot melt layer 30 is cured, so that the IC chip 10 is bonded onto the resin sheet 21. (FIG. 5C). At this time, the IC chip 10 is conveyed onto the resin sheet 21 while being sucked by a chip mounting head (not shown) from the tray on which the IC chip 10 is mounted, and is mounted on the resin sheet 21. At this time, the suction force in the chip mounting head is released, and the chip mounting head is heated and pressurized. However, since the hot melt layer 30 is thinner than the IC chip 10, the IC When the portion in contact with the chip 10 and its periphery are melted, the melted hot melt does not adhere to the chip mounting head.

  FIG. 6 is a diagram showing a state in which the IC chip 10 is bonded onto the resin sheet 21 in the thread manufacturing process shown in FIG.

  As shown in FIG. 6, in the thread manufacturing process shown in FIG. 1, the IC chip 10 is mounted and bonded in a matrix on the resin sheet 21.

  Next, a paper sheet 51 to be a paper layer 50 is laminated on the resin sheet 21 on which the IC chip 10 is mounted and adhered, and when heated and pressurized, the hot melt layer 30 is melted, As the hot melt layer 30 is cured, the resin sheet 21 and the paper sheet 51 are bonded to each other (FIG. 5D). Here, with respect to heating and pressurization of the resin sheet 21 and the paper sheet 51, for example, two rollers each having at least a surface having elasticity such as silicon rubber are disposed so as to face each other. For example, it is conceivable to insert the resin sheet 21 and the paper sheet 51 laminated on each other between the two rollers while heating the two rollers to 120 ° C. to 190 ° C., for example. Thus, when the resin sheet 21 and the paper sheet 51 are bonded to each other by adhering the resin sheet 21 and the paper sheet 51 stacked on each other by a member having elasticity, the resin sheet 21 and the paper sheet 51 are bonded to each other. It is possible to prevent the IC chip 10 mounted on the IC from being damaged. At this time, since the thickness of the hot melt layer 30 is thinner than the thickness of the IC chip 10, the IC chip 10 is fixed by the resin sheet 21 and the paper sheet 51. When the hot melt layer 30 is melted, the IC chip 10 is not moved and the mounting position of the IC chip 10 is not shifted.

  Thereafter, the resin sheet 21 and the paper sheet 51 adhered to each other are cut into a strip shape according to the mounting position of the IC chip 10 on the resin sheet 21 to complete the thread roll.

  FIG. 7 is a diagram illustrating a state in which the resin sheet 21 and the paper sheet 51 are cut into a strip shape in the thread manufacturing process illustrated in FIG. 1.

  As shown in FIG. 7, when the resin sheet 21 and the paper sheet 51 adhered to each other are cut into a strip shape according to the mounting position of the IC chip 10 on the resin sheet 21, the IC chip 10 is linearly formed on the resin sheet 21. A thread roll is formed, and this thread roll is wound up, and then attached to securities, banknotes, etc., for each unit to be attached (for example, one IC chip 10 is included) As shown in FIG. 1, a thread as shown in FIG. 1 is formed.

  In this embodiment, the paper layer 50 having the same shape as the resin layer 20 is bonded to the surface of the resin layer 20 on which the IC chip 10 is mounted by the hot melt layer 30, but the paper layer 50 is at least an IC. It is only necessary that the chip 10 is laminated and bonded on the resin layer 20 so as to cover the chip 10 and a part of the chip 10 is bonded to the resin layer 20.

  In the present embodiment, the resin layer 20 made of PET is used. However, the present invention is not limited to this, and for example, one made of PET-G or PVC can be considered. Further, when the resin layer 20 is made of PET-G or PVC, and instead of the paper layer 50, those made of PET-G or PVC are bonded to each other by heating. Therefore, the hot melt layer 30 may be laminated only in the region of the resin sheet 21 where the IC chip 10 is mounted. Moreover, although the mechanical strength of the thread can be improved by using the resin layer 20, for example, if a layer made of paper or nonwoven fabric is used instead of the resin layer 20, the mechanical strength is reduced. Then, when this thread is affixed to securities, banknotes, etc., the adhesiveness with securities, banknotes, etc. can be improved. Further, if a water-soluble paper base material is used as the paper layer 50, when the thread is inserted into the securities 2 as shown in FIG. Etc. can be integrated, combined, or entangled with each other to further improve the adhesiveness with securities, banknotes, etc., and can reduce the thickness of securities, banknotes, etc. .

  In the thread manufacturing method shown in FIG. 1, as described above, the resin sheet 21 that becomes the resin layer 20 by being cut and the paper sheet 51 that becomes the paper layer 50 by being cut, After the IC chips 10 are mounted in a matrix on the resin sheet 21 and bonded to each other and cut, the hot melt layer 30 is substantially laminated on the belt-shaped resin layer 20. The IC chip 10 may be mounted and bonded on the resin layer 20 by the hot melt layer 30, and the paper layer 50 may be laminated on the resin layer 20 and bonded to each other by the hot melt layer 30.

  Further, the IC chip 10 is bonded to the resin layer 20 without being limited to the hot melt layer 30, for example, a layer made of an ultraviolet curable adhesive may be used. In that case, when the IC chip 10 is mounted on the resin sheet 21 by the chip mounting head, ultraviolet light is irradiated from the surface of the resin sheet 21 opposite to the surface on which the IC chip 10 is mounted. The IC chip 10 is bonded onto the resin sheet 21 by melting the curable adhesive and then curing the adhesive. Further, when a layer made of an ultraviolet curable adhesive is used instead of the hot melt layer 30 as an adhesive for the resin layer 20 and the paper layer 50, the resin sheet 21 and the paper sheet 51 are bonded. In addition, ultraviolet rays are irradiated from the surface of the resin sheet 21, thereby melting the ultraviolet curable adhesive, and then the adhesive is cured to bond the resin sheet 21 and the paper sheet 51. In these cases, the resin sheet 21 needs to be made of a material that transmits ultraviolet rays.

  Further, in this embodiment, the thickness of the hot melt layer 30 laminated on the resin sheet 21 is made thinner than the thickness of the IC chip 10, whereby the IC chip 10 is mounted on the resin sheet 21. In addition to preventing the hot melt from adhering to the chip mounting head, the mounting position of the IC chip 10 is prevented from shifting when the resin sheet 21 and the paper sheet 51 are heated and pressurized. However, the hot melt layer 30 is laminated by applying a hot melt thicker than the thickness of the IC chip 10 to at least a region where the IC chip 10 is mounted on the surface of the resin sheet 21 on which the IC chip 10 is mounted, If the IC chip 10 is mounted on the resin sheet 21 so that the IC chip 10 is embedded in the hot melt layer 30, the IC chip 1 There resin sheet 21 becomes a structure which is sandwiched between the paper sheet 51 and the hot melt layer 30, it is possible to obtain a further protective effect of the IC chip 10.

  Further, in this embodiment, by using the resin layer 20 as the first sheet base material, it is possible to prevent twisting or breaking of the sheet being conveyed when it is rubbed into another paper layer or bonded. When the paper layer 50 is used as the second sheet base material, the adhesiveness is improved and the film is difficult to peel off when the paper layer 50 is rubbed into another paper layer or bonded. Accordingly, by using one of the two sheet base materials to be laminated, one of which is made of resin and the other is made of paper, the sheet can be prevented from being twisted or broken, and has an effect of improving adhesion and being difficult to peel off. . As described above, the laminated structure is not limited to the present embodiment, and the same structure is possible even if the resin layer 20 that is the first sheet base material and the paper layer 50 that is the second sheet base material are reversed. Needless to say, it produces an effect. In addition, when only the improvement in adhesiveness is required, it is conceivable that the two sheet base materials to be laminated are made of paper. In order to improve the mechanical strength, the two sheet base materials to be laminated are considered. It is also conceivable that the material is made of resin. Furthermore, when the two sheet base materials to be laminated are made of paper, if they are made of water-soluble paper, the two sheet base materials can be used when the thread is put into securities or banknotes. Melts, and the thread and securities, banknotes, etc. are integrated, combined, or entangled, so that the adhesiveness with securities, banknotes, etc. can be further improved. Etc. can be reduced in thickness.

It is a figure which shows one Embodiment of the thread | sled of this invention, (a) is a figure which shows a lamination | stacking state, (b) is a figure which shows an internal structure. It is a figure which shows an example of the securities | taste with which the thread | sled shown in FIG. 1 was affixed, (a) is a top view, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows the other example of the securities | taste with which the thread | sled shown in FIG. 1 was affixed, (a) is a top view, (b) is A-A 'sectional drawing shown to (a). It is a figure which shows the other example of the securities | taste with which the thread | sled shown in FIG. 1 was affixed, (a) is a top view, (b) is A-A 'sectional drawing shown to (a). It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. It is a figure which shows the state by which the IC chip was adhere | attached on the resin sheet in the manufacturing process of the thread | thread shown in FIG. It is a figure which shows the state by which the resin sheet was cut | judged in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thread 2 Securities 2a Concave part 10 IC chip 20 Resin layer 21 Resin sheet 30 Hot melt layer 50 Paper layer 51 Paper sheet

Claims (9)

  A thread in which an IC chip capable of reading at least information in a non-contact state is mounted between a belt-like first sheet base material and a belt-like second sheet base material. A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
The IC chip is mounted by being adhered to the first sheet base material by an adhesive applied on the first sheet base material,
A thread in which a second sheet substrate is laminated on at least the IC chip on the first sheet substrate. The thread according to claim 1 or 2,
The thread, wherein the first sheet base material and the second sheet base material are made of different materials. The thread according to any one of claims 1 to 3,
At least one of the first and second sheet base materials is made of paper. The thread of claim 4,
The thread is characterized in that the paper is water-soluble paper. A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
The IC chip is mounted on the first sheet substrate by being bonded to the first sheet substrate so as to be embedded in an adhesive applied thicker than the thickness of the IC chip.
A thread in which a second sheet substrate is laminated on at least the IC chip on the first sheet substrate. It is a manufacturing method of the thread according to claim 2,
Applying the adhesive on the first sheet base material thinner than the thickness of the IC chip;
Mounting and pressing the IC chip on the first sheet base material coated with the adhesive, and bonding the IC chip to the first sheet base material with the adhesive;
Laminating the second sheet substrate on the first sheet substrate to which the IC chip is bonded, and bonding the first sheet substrate and the second sheet substrate. Thread manufacturing method. In the manufacturing method of the thread according to claim 7,
The first sheet base material and the second sheet base material are sandwiched by elastic members in a state where the second sheet base material is laminated on the first sheet base material. A method for manufacturing a thread, comprising: adhering one sheet and the second sheet.   A sheet in which the thread according to any one of claims 1 to 6 is incorporated.

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