JP2005209067A - Thread, and its manufacturing method, and sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce possibility of breaking an IC chip, and to prevent the mounting position of the IC chip from being deviated when the IC chip is mounted on a sheet base material. <P>SOLUTION: A thread is obtained by mounting the IC chip 10 for reading at least information in a noncontact state on a belt shape resin layer 20a. A recess 22a where the IC chip 10 is housed is formed in an area on which the IC chip 10 is mounted in the resin layer 20a. The IC chip 10 is mounted on the resin layer 20a by being housed in a first recess. A resin layer 20b is laminated on the resin layer 20a so as to cover the IC chip 10, and then, the resin layers 20a and 20b are mutually stuck together. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a thread, a manufacturing method thereof, and a sheet that are affixed or inserted into securities, banknotes, and the like and used for authenticity determination.

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread in which an IC chip is bonded to one side of a film cut to a width of about several millimeters is inserted into a paper layer of securities or banknotes. By reading the information written on the chip, the authenticity of the securities or bills is determined (for example, see Patent Document 1).
JP 2002-319006 A

  However, in the thread as described above, since the IC chip is only bonded to one side of the film cut to a width of about several millimeters, the thread is attached to the securities, bills, etc. with the film side as the pasting surface. When it is used by being attached, there is a problem that the IC chip is exposed to the outside, and there is a high possibility that the IC chip is damaged. Further, when manufacturing such a thread, when an IC chip is mounted on a film, the IC chip is displaced before the liquid adhesive is cured, and the IC chip mounting position is slightly shifted. There is a fear.

  The present invention has been made in view of the problems of the conventional techniques as described above, and can reduce the possibility that the IC chip will be damaged. It is an object of the present invention to provide a thread, a manufacturing method thereof, and a sheet in which the mounting position of an IC chip is not shifted when mounting.

In order to achieve the above object, the present invention provides:
A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
A first recess is formed so that the IC chip enters the area of the first sheet base material where the IC chip is mounted.
The IC chip enters the first recess and is mounted on the first sheet base material,
A second sheet base material is laminated on at least an area where the IC chip is mounted on the first sheet base material.

  Further, the second sheet base material is characterized in that a second recess is formed in a region facing the IC chip so that the IC chip enters.

Also, a thread manufacturing method,
Forming the first recess in a region where the IC chip is mounted on the first sheet substrate;
Mounting the IC chip on the first sheet substrate on which the first recess is formed, so as to enter the first recess;
On the first sheet base material on which the IC chip is mounted, the second sheet base material is laminated so as to cover the IC chip, and the first sheet base material, the second sheet base material, Adhering.

  In the present invention configured as described above, the IC chip mounted on the first sheet base material enters the first recess formed in the first sheet base material and enters the first sheet base material. Since the second sheet base material is stacked thereon and the second sheet base material is laminated thereon, the possibility that the IC chip is damaged is reduced.

  Further, if the second sheet base material laminated on the first sheet base material is also provided with a second concave portion that allows the IC chip to enter, the IC chip is connected to the first concave portion and the second concave portion. A state in which the IC chip is sandwiched by the recesses is further reduced, and the possibility that the IC chip is damaged is further reduced.

  Further, when manufacturing such a thread, the IC chip is mounted on the first sheet base so as to enter the first recess, and therefore when the IC chip is mounted on the first sheet base. The IC chip position shift is prevented by the wall surface of the recess, and the IC chip mounting position is not slightly shifted.

  As described above, in the present invention, in a thread in which an IC chip capable of reading at least information in a non-contact state is mounted on the first sheet base material, the IC chip of the first sheet base material Is formed in the region where the IC chip enters, and the IC chip enters the first recess and is mounted on the first sheet substrate. Since the second sheet base material is laminated at least in a region where the IC chip is mounted, the possibility that the IC chip is damaged can be reduced.

  In addition, in the case where the second recess is formed in the region facing the IC chip of the second sheet base material so that the IC chip enters, the second sheet base material is formed on the first sheet base material. Is stacked, the IC chip is sandwiched between the first recess and the second recess, thereby further reducing the possibility of the IC chip being damaged.

  Further, in the thread manufacturing method as described above, since the IC chip is mounted on the first sheet base so as to enter the first recess, the IC chip is mounted on the first sheet base. In addition, the IC chip position shift is prevented by the wall surface of the recess, and the IC chip mounting position is not deviated slightly.

  Embodiments of the present invention will be described below with reference to the drawings.

(First embodiment)
1A and 1B are diagrams showing a first embodiment of a thread according to the present invention. FIG. 1A is a diagram showing a stacked state, and FIG. 1B is a diagram showing an internal configuration.

  In this embodiment, as shown in FIG. 1, the IC chip 10 is inserted and mounted in the region where the first recess 22 a is formed on the resin layer 20 a that is the first sheet base material, and further, the resin layer 20 a. A resin layer 20b as a second sheet base material is laminated on the IC chip 10 so as to cover it. The resin layers 20a and 20b are made of a material that adheres by heating and pressurizing, such as belt-shaped PET-G and PVC, and are bonded to each other by heating and pressurizing. Further, the IC chip 10 can write and read information in a non-contact state, and is written in the IC chip 10 by being brought close to an information writing / reading device provided outside. Information is read or information is written to the IC chip 10.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes.

  When a securities or banknote with a thread attached is brought close to the above-described information writing / reading device, for example, information written in the IC chip 10 is read, and based on the read information, the valuable information is read. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 10, as described above, when the authenticity determination is performed only by the information written in the IC chip 10, the information written in the IC chip 10 may be read out in a non-contact state. It is not necessary to have a configuration in which information is written in a non-contact state.

  It is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 1 to the securities or banknotes. In that case, for example, paper made from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and threads are made between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. Moreover, it is also conceivable to use a securities or banknotes in which a plurality of papers are stacked with a thread sandwiched between the stacked papers.

  It is also conceivable that a recess is formed in securities, bills or the like, and a thread as shown in FIG. 1 is fitted into the recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  The thread as shown in FIG. 1 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like one, as described above, punched, sandwiched, Alternatively, it is used by being incorporated into a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 2 is a diagram for explaining a method of manufacturing the thread shown in FIG.

  First, by cutting, a laser beam is irradiated to a region where the IC chip 10 of the resin sheet 21a to be the resin layer 20a is mounted, thereby forming a recess 22a into which the IC chip 10 enters (FIG. 2A). . Here, the depth of the recess 22a may be such that at least a part of the IC chip 10 enters. The shape of the exposed surface of the recess 22a is preferably substantially the same as that of the IC chip 10 in order to prevent the IC chip 10 from being displaced in the recess 22a. Further, the formation of the recess 22a is not limited to that by laser light irradiation, and it is sufficient that the predetermined recess 22a can be formed by an existing technique.

  Next, the IC chip 10 is mounted on the resin sheet 21a having the recess 22a so as to enter the recess 22a (FIG. 2B). At this time, since the IC chip 10 is mounted on the resin sheet 21a so that the IC chip 10 enters the recess 22a, the mounting position with respect to the resin sheet 21a is not shifted. Further, if the depth of the recess 22a formed in the resin sheet 21a is set to be equal to or greater than the thickness of the IC chip 10, the IC chip 10 does not protrude from the recess 22a. When the thickness exceeds the thickness and the size of the recess 22a is larger than the size of the IC chip 10, when the resin sheet 21b is laminated on the resin sheet 21a and bonded together, In order to fix the IC chip 10 in the recess 22a, for example, it is necessary to apply an adhesive in the recess 22a. Further, if the depth of the recess 22a is made equal to the thickness of the IC chip 10, it is not necessary to use an adhesive as described above, and the flatness of the surface of the resin sheet 21b to be laminated on the resin sheet 21a later is improved. Can be secured.

  FIG. 3 is a diagram showing a state in which the IC chip 10 is mounted on the resin sheet 21a in which the recess 22a is formed in the thread manufacturing process shown in FIG.

  As shown in FIG. 3, on the resin sheet 21a, recesses 22a are formed in a matrix, and the IC chip 10 is mounted so as to enter each of the recesses 22a.

  Next, on the resin sheet 21a on which the IC chip 10 is mounted, a resin sheet 21b that becomes the resin layer 20b is laminated by cutting, and the resin sheet 21a and the resin sheet 21b are bonded to each other by heating and pressing. Adhere (Fig. 2 (c)).

  Thereafter, the resin sheet 21a on which the IC chip 10 is mounted is cut into a belt shape together with the resin sheet 21b to complete the thread roll.

  FIG. 4 is a diagram illustrating a state in which the resin sheet 21a on which the IC chip 10 is mounted is cut into a belt shape together with the resin sheet 21b in the thread manufacturing process illustrated in FIG.

  As shown in FIG. 4, when the resin sheet 21a on which the IC chip 10 is mounted is cut into a strip shape together with the resin sheet 21b, a thread roll in which the IC chips 10 are linearly arranged is formed on the resin sheet 21a. The thread roll is wound up and then cut into units to be attached (for example, one IC chip 10 is included) when it is attached to securities, banknotes, etc. A thread as shown in FIG.

(Second Embodiment)
FIGS. 5A and 5B are diagrams showing a second embodiment of the thread of the present invention, wherein FIG. 5A is a diagram showing a stacked state, and FIG. 5B is a diagram showing an internal configuration.

  In this embodiment, as shown in FIG. 5, the IC chip 110 is mounted in a region where the first concave portion 122 a is formed on the resin layer 120 a that is the first sheet base material, and further, the resin layer 120 a. A resin layer 120b, which is a second sheet base material formed with a second recess 122b into which the IC chip 110 enters, is laminated and configured so that the IC chip 110 enters the recess 122b. Yes. The resin layers 120a and 120b are made of a material that adheres by heating and pressurizing, such as belt-shaped PET-G and PVC, and are bonded to each other by heating and pressurizing. Further, the IC chip 110 can write and read information in a non-contact state, and is written in the IC chip 110 by being close to an information writing / reading device provided outside. Information is read or information is written to the IC chip 110.

  In the thread configured as described above, for example, an adhesive (not shown) is applied to one surface, and is used by being affixed to securities or banknotes.

  When the securities or banknotes to which the thread is attached are brought close to the information writing / reading device described above, for example, the information written in the IC chip 110 is read, and the valuable information is read based on the read information. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 110, as described above, in the case where the authenticity determination is performed only by the information written in the IC chip 110, the information written in the IC chip 110 may be read in a non-contact state. It is not necessary to have a configuration in which information is written in a non-contact state.

  Moreover, it is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 5 to the securities or banknotes. In that case, for example, paper made from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and threads are made between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. Moreover, it is also conceivable to use a securities or banknotes in which a plurality of papers are stacked with a thread sandwiched between the stacked papers.

  It is also conceivable that a recess is formed in securities, bills or the like, and a thread as shown in FIG. 5 is fitted into the recess. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  Note that the thread as shown in FIG. 5 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like object, as described above, punched, sandwiched, Alternatively, it is used by being incorporated into a sheet by being fitted.

  Below, the manufacturing method of the thread | sled mentioned above is demonstrated.

  FIG. 6 is a view for explaining a method of manufacturing the thread shown in FIG.

  First, a laser beam is irradiated to a region where the IC chip 110 of the resin sheet 121a to be the resin layer 120a is mounted by cutting, thereby forming a recess 122a into which the IC chip 110 enters (FIG. 6A). . Here, the depth of the concave portion 122a may be such that at least a part of the IC chip 110 enters. In addition, the shape of the exposed surface of the recess 122a is preferably substantially the same as that of the IC chip 110 in order to prevent displacement of the IC chip 110 in the recess 122a. Further, the formation of the recess 122a is not limited to the laser beam irradiation, and it is only necessary that the predetermined recess 122a can be formed by an existing technique.

  Next, the IC chip 110 is mounted on the resin sheet 121a having the recess 122a so as to enter the recess 122a (FIG. 6B). At this time, since the IC chip 110 is mounted on the resin sheet 121a so that the IC chip 110 enters the recess 122a, the mounting position with respect to the resin sheet 121a is not shifted.

  FIG. 7 is a diagram showing a state in which the IC chip 110 is mounted on the resin sheet 121a in which the recess 122a is formed in the thread manufacturing process shown in FIG.

  As shown in FIG. 7, on the resin sheet 121a, concave portions 122a are formed in a matrix, and the IC chip 110 is mounted so as to enter each of the concave portions 122a.

  Next, a recess 122b into which the IC chip 110 enters is formed on the resin sheet 121a on which the IC chip 110 is mounted, and the resin sheet 121b that becomes the resin layer 120b by cutting is formed into the recess 122a and the recess 122b. By stacking the IC chips 110 so as to be sandwiched by heating, and applying heat and pressure, the resin sheet 121a and the resin sheet 121b are bonded to each other (FIG. 6C). If the depths of the recesses 122a and 122b formed in the resin sheets 121a and 121b are made equal to the thickness of the IC chip 110, the flatness of the recesses 122b can be ensured. . Further, when the depth of the recesses 122a and 122b is a value obtained by adding these exceeds the thickness of the IC chip 110, and the size of the recesses 122a and 122b is larger than the size of the IC chip 110. In order to fix the IC chip 110 in the recesses 122a and 122b, for example, it is necessary to apply an adhesive in the recess 122a.

  Thereafter, the resin sheet 121a on which the IC chip 110 is mounted is cut into a strip shape together with the resin sheet 121b to complete the thread roll.

  FIG. 8 is a diagram illustrating a state in which the resin sheet 121a on which the IC chip 110 is mounted is cut into a belt shape together with the resin sheet 121b in the thread manufacturing process illustrated in FIG.

  As shown in FIG. 8, when the resin sheet 121a on which the IC chip 110 is mounted is cut into a strip shape together with the resin sheet 121b, a thread roll in which the IC chips 110 are linearly arranged on the resin sheet 121a is formed. The thread roll is wound up and then cut into units to be pasted (for example, one IC chip 110 is included) when pasted on securities or banknotes. A thread as shown in FIG.

  In the two embodiments described above, the resin layers 20a, 20b, 120a, and 120b are made of materials that are bonded by heating and pressurizing, such as PET-G and PVC. Not limited to this, other resin materials such as PET, and those made of paper are also conceivable. However, in these cases, an adhesive (for example, hot melt) for adhering the first sheet base material and the second sheet base material is applied on the first sheet base material, and this adhesion is performed. It is necessary to bond the first sheet base material and the second sheet base material using an agent. Further, for example, if the second sheet base material is made of paper or non-woven fabric, and this surface is a surface to be affixed to securities or banknotes, the adhesiveness between the thread and the securities or banknotes can be improved. Can do.

  Further, the resin layers 20b and 120b do not necessarily need to cover the entire surface of the resin layers 20a and 120a on which the IC chips 10 and 110 are mounted, but cover at least the region on which the IC chips 10 and 110 are mounted. I just need it.

  Further, in the thread manufacturing method shown in FIGS. 1 and 5, as described above, the IC chips 10 and 110 are arranged in a matrix on the resin sheets 21a and 121a to be the resin layers 20a and 120a by cutting. In addition, the resin sheets 21b and 121b to be the resin layers 20b and 120b are laminated and bonded on the resin sheets 21a and 121a, and then a thread is manufactured by cutting them. However, the present invention is not limited to this, as long as the IC chips 10 and 110 are mounted on the belt-shaped resin layers 20a and 120a, and then the resin layers 20b and 120b are laminated and bonded to the resin layers 20a and 120a. Good.

  In the two embodiments described above, the two resin layers 20a, 20b or 120a, 120b are laminated. At least one of the two resin layers 20a, 20b or 120a, 120b is a resin layer. By so doing, twisting or breaking of the sheet being conveyed can be prevented when it is inserted into another paper layer or bonded. Also, if one of the two resin layers 20a, 20b or 120a, 120b is made of paper or non-woven fabric, it will be compared with a film or the like when it is inserted into another paper layer or bonded. This improves the adhesion and makes it difficult to peel off. Therefore, when one of the two layers to be laminated is made of resin and the other is made of paper or non-woven fabric, the sheet can be prevented from being twisted or broken, and the adhesiveness is improved and it is difficult to peel off. In addition, when only the improvement in adhesiveness is required, it is conceivable that the two layers to be laminated are made of paper or non-woven fabric, and in order to improve the mechanical strength, the two layers are laminated. One layer may be a resin layer as in the embodiment described above.

It is a figure which shows 1st Embodiment of the thread | sled of this invention, (a) is a figure which shows a lamination | stacking state, (b) is a figure which shows an internal structure. It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. FIG. 2 is a diagram illustrating a state in which an IC chip is mounted on a resin sheet having a recess formed in the thread manufacturing process illustrated in FIG. 1. It is a figure which shows the state in which the resin sheet in which the IC chip was mounted was cut | judged in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG. It is a figure which shows 2nd Embodiment of the thread | sled of this invention, (a) is a figure which shows a lamination | stacking state, (b) is a figure which shows an internal structure. It is a figure for demonstrating the manufacturing method of the thread | sled shown in FIG. FIG. 6 is a diagram illustrating a state in which an IC chip is mounted on a resin sheet in which a recess is formed in the thread manufacturing process illustrated in FIG. 5. FIG. 6 is a diagram illustrating a state in which a resin sheet on which an IC chip is mounted is cut into a strip shape in the thread manufacturing process illustrated in FIG. 5.

Explanation of symbols

10, 110 IC chip 20a, 20b, 120a, 120b Resin layer 21a, 21b, 121a, 121b Resin sheet 22a, 122a, 122b Recess

Claims (4)

A thread in which an IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped first sheet base material,
A first recess is formed so that the IC chip enters the area of the first sheet base material where the IC chip is mounted,
The IC chip enters the first recess and is mounted on the first sheet base material,
A thread in which a second sheet base material is laminated on at least an area where the IC chip is mounted on the first sheet base material. The thread of claim 1,
The thread is characterized in that the second sheet base is formed with a second recess into which the IC chip enters in a region facing the IC chip. It is a manufacturing method of the thread according to claim 1 or 2,
Forming the first recess in a region where the IC chip is mounted on the first sheet substrate;
Mounting the IC chip on the first sheet substrate on which the first recess is formed, so as to enter the first recess;
On the first sheet base material on which the IC chip is mounted, the second sheet base material is laminated so as to cover the IC chip, and the first sheet base material, the second sheet base material, A method of manufacturing a thread.   A sheet in which the thread according to claim 1 or 2 is incorporated.

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