JP4504694B2 - Thread manufacturing method, IC chip-containing sheet manufacturing method, and thread and IC chip-containing sheet manufactured thereby - Google Patents

Description

The present invention relates to a thread in which an IC chip is mounted on a sheet substrate and a method for manufacturing an IC chip-containing sheet, and a thread and an IC chip-containing sheet manufactured thereby .

  In the past, counterfeit crimes have frequently occurred in securities such as prepaid cards, various admission tickets, gift certificates and stock certificates because they are widely distributed and can be exchanged relatively easily. In particular, in recent years, with the improvement and popularization of copying machines such as color copiers, counterfeit products that cannot be easily distinguished from genuine products can be manufactured relatively easily, and countermeasures against counterfeiting are required. Yes. Moreover, measures against counterfeiting are required not only for the above-mentioned securities but also for banknotes.

  As one of countermeasures against such counterfeiting, a technique for preventing forgery of securities or banknotes by attaching or inserting a member called a thread on the securities or banknotes is considered. In this technology, a thread formed by cutting a plastic film, thin paper, etc. to a width of about several millimeters is not exposed from the surface of securities or banknotes, or securities such that a part is exposed from the surface. It is inserted into the paper layer of the banknote, and the authenticity of the securities and banknotes is determined by the presence or absence of this thread.

Furthermore, in recent years, a technique for determining the authenticity of securities or bills using a thread on which an IC chip is mounted has been considered. In this technology, a thread made by bonding an IC chip with an adhesive on one side of a film cut to a width of about several millimeters is put into a paper layer of securities or banknotes, and the use of securities or banknotes is performed. Sometimes, authenticity of securities and banknotes is determined by reading information written on the IC chip (see, for example, Patent Document 1).
JP 2002-319006 A

  However, in the above-described thread and the IC chip-containing sheet in which the IC chip is mounted on the sheet base material like this thread, the IC chip is adhered to the sheet base material such as a film by an adhesive, When bonding an IC chip on a sheet substrate, there is a problem that an adhesive adheres to a chip mounting head for mounting the IC chip on the sheet substrate. Here, when a hot melt sheet that is melted by heat is used as such an adhesive, the hot melt sheet is laminated on the sheet base material, and the hot melt sheet is mounted when the IC chip is mounted on the sheet base material. Since the sheet is melted by heating and the IC chip and the sheet base material are bonded, the hot melt sheet has no adhesive force until the IC chip is mounted on the sheet base material. Thereby, there is no possibility that things other than the IC chip adhere to the sheet base material, and it is not necessary to perform management for maintaining the adhesive force. However, when mounting an IC chip on a sheet substrate, the hot melt sheet is melted by heating, and the IC chip is adhered to the sheet substrate by the molten hot melt. Hot melt adheres to the chip mounting head on which the IC chip is mounted.

  Further, when the mounting head is used as described above, it is necessary to stop the sheet base material when mounting the IC chip, and there is a limit to the manufacturing speed.

The present invention has been made in view of the problems of the conventional techniques as described above, and in a case where an IC chip is bonded onto a sheet substrate with an adhesive, a chip mounting head for mounting the IC chip is provided. It is an object of the present invention to provide a method for producing a thread and an IC chip-containing sheet in which an adhesive does not adhere, and a thread and an IC chip-containing sheet produced thereby.

In order to achieve the above object, the present invention provides:
An IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped sheet base material coated with a thermoplastic adhesive, and the IC chip and the sheet base material are bonded to each other by the thermoplastic adhesive. A thread manufacturing method, comprising:
Heating the IC chip ;
Injecting the IC chip onto the surface of the sheet base material coated with the thermoplastic adhesive.

Also, there is provided a method for producing a sheet containing an IC chip, in which an IC chip is mounted on a sheet base material coated with a thermoplastic adhesive, and the IC chip and the sheet base material are bonded by the thermoplastic adhesive. And
Heating the IC chip;
Injecting the IC chip onto the surface of the sheet base material coated with the thermoplastic adhesive.

  In the present invention configured as described above, when the sheet base material to which the thermoplastic adhesive is applied is heated, the thermoplastic adhesive applied to the sheet base material is melted to generate an adhesive force. In this state, when the IC chip is injected onto the surface of the sheet base material to which the thermoplastic adhesive is applied, the injected IC chip is embedded in the molten thermoplastic adhesive by the momentum of injection, and then When the thermoplastic adhesive is cured, the IC chip is bonded onto the sheet base material by the thermoplastic adhesive.

  Thus, in a state where the thermoplastic adhesive applied on the sheet base material is melted, the IC chip is injected onto the sheet base material coated with the thermoplastic adhesive, thereby making the IC chip thermoplastic. Since it is embedded in the adhesive and the IC chip and the sheet base are bonded, the chip mounting head for mounting the IC chip on the sheet base and the sheet base and the thermoplastic adhesive do not contact each other. The IC chip is bonded to the top, so that the adhesive does not adhere to the chip mounting head.

  In addition, when the IC chip mounted on the sheet base material is heated and this IC chip is injected onto the surface of the sheet base material on which the thermoplastic adhesive is applied, the injected IC chip is When it adheres to the surface of the substrate where the thermoplastic adhesive is applied, the area of the thermoplastic adhesive to which the IC chip is attached is melted by the heat of the injected IC chip, and the IC is put into the molten thermoplastic adhesive. Since the chip is embedded and then the thermoplastic adhesive is cured, the IC chip is bonded onto the sheet base material. Even in this case, the chip mounting on which the IC chip is mounted on the sheet base material The IC chip is bonded onto the sheet base material without the head and the sheet base material or thermoplastic adhesive contacting each other, and the adhesive is not attached to the chip mounting head. That.

  Further, if the IC chip is injected from a direction oblique to the surface of the sheet base material to which the thermoplastic adhesive is applied, the IC chip is easily embedded in the thermoplastic adhesive.

  As described above, in the present invention, in a state where the thermoplastic adhesive applied on the sheet base material is melted, by injecting an IC chip onto the sheet base material coated with this thermoplastic adhesive, Since the IC chip is embedded in the thermoplastic adhesive and the IC chip and the sheet base material are bonded, the IC chip is mounted on the sheet base material when the IC chip is bonded to the sheet base material with the adhesive. The IC chip is bonded onto the sheet base material without the chip mounting head and the sheet base material or the thermoplastic adhesive coming into contact with each other, and the adhesive is not attached to the chip mounting head. Furthermore, since the IC chip can be mounted without contact, when the IC chip is continuously mounted on the sheet, it can be manufactured at a high speed.

  In addition, the IC chip to be mounted on the sheet base material is heated, and this IC chip is injected onto the surface of the sheet base material coated with the thermoplastic adhesive. In the thermoplastic adhesive applied to the sheet base material, the region where the injected IC chip is attached is melted by the heat of the IC chip, and the IC chip is embedded in the molten thermoplastic adhesive, and then When the thermoplastic adhesive is cured, the IC chip is bonded onto the sheet substrate. Therefore, when the IC chip is bonded onto the sheet substrate with the adhesive, the IC chip is mounted on the sheet substrate. The IC chip is bonded onto the sheet substrate without contacting the chip mounting head with the sheet substrate and the thermoplastic adhesive, and the adhesive adheres to the chip mounting head. Put away, it is no longer. Furthermore, since the IC chip can be mounted without contact, when the IC chip is continuously mounted on the sheet, it can be manufactured at a high speed.

  Further, in the case where the IC chip is injected from a direction oblique to the surface of the sheet base material to which the thermoplastic adhesive is applied, the IC chip can be easily embedded in the thermoplastic adhesive.

  Embodiments of the present invention will be described below with reference to the drawings.

  1A and 1B are diagrams showing an example of a thread manufactured by the thread manufacturing method of the present invention, where FIG. 1A is a top view and FIG. 1B is a cross-sectional view taken along line A-A ′ shown in FIG.

  In this example, as shown in FIG. 1, a hot melt layer 30 made of a hot melt that is a thermoplastic adhesive is laminated on a resin layer 20 that is a belt-shaped sheet base material. An IC chip 10 capable of reading information in a contact state is embedded and configured. In addition, as a material of the resin layer 20, PET, PET-G, PVC, etc. can be considered. Further, in the IC chip 10, information written in the IC chip 10 is read by being brought close to an information writing / reading device provided outside.

  In the thread configured as described above, for example, it is affixed to securities or banknotes by the hot melt layer 30, or an adhesive (not shown) is applied to the other surface, and the securities or banknotes are applied by the adhesive. It is used by being affixed to etc.

  When a securities or banknote with a thread attached is brought close to the above-described information writing / reading device, for example, information written in the IC chip 10 is read, and based on the read information, the valuable information is read. The authenticity of securities and banknotes will be determined. Note that, in the IC chip 10, as described above, when the authentication determination is performed only by the information written in the IC chip 10, the information written in the IC chip 10 may be read in a non-contact state. However, the information may be written in a non-contact state by being brought close to the information writing / reading device.

  It is also conceivable to use the thread by inserting it into the paper layer of the securities or banknotes instead of sticking the threads as shown in FIG. 1 to the securities or banknotes. In that case, for example, a paper machine manufactured from at least two paper layers using a multi-tank type net paper machine is used as securities or banknotes, and a thread is placed between the paper layers when manufacturing securities or banknotes. Keep in mind. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above. In addition, it is also conceivable to use a securities or banknotes in which a plurality of papers are laminated with a thread sandwiched between the laminated papers.

  It is also conceivable that a recess is formed in securities, bills or the like, and a thread as shown in FIG. 1 is fitted into the recess. In this case, it is conceivable that the surface on which the hot-melt layer 30 is laminated is a surface facing a recess such as securities or banknotes, and the thread is bonded to the securities or banknotes in the recess by the hot-melt layer 30. The securities and banknotes in which threads are inserted in this way are also used in the same manner as described above.

  The thread as shown in FIG. 1 is not limited to securities, banknotes, etc. as described above, but is attached to a sheet-like one as described above, punched, sandwiched, Alternatively, it is used by being incorporated in a sheet by being fitted.

(First embodiment)
FIG. 2 is a diagram for explaining the first embodiment of the method for manufacturing the thread shown in FIG.

  First, a hot melt layer 30 made of hot melt, which is a thermoplastic adhesive that is melted by heating, is laminated on the resin sheet 2 that becomes the resin layer 20 by being cut (FIG. 2A). As a result, the thermoplastic adhesive is applied on the resin sheet 20.

  Next, the resin sheet 2 on which the hot melt layer 30 is laminated is heated, thereby melting the hot melt layer 30 (FIG. 2B).

  Next, in a state where the hot melt layer 30 is melted on the resin sheet 2, the IC chip 10 is injected from the chip mounting head 1 onto the surface of the resin sheet 2 on which the hot melt layer 30 is laminated (FIG. 2). (C)). In addition, as a method of injecting the IC chip 10 to the resin sheet 2 in the chip mounting head 1, for example, a method of injecting the IC chip 10 using an elastic force such as rubber or a spring, or a pressure such as air pressure or hydraulic pressure is used. A method of injecting the IC chip 10 can be considered.

  Then, the IC chip 10 injected to the surface of the resin sheet 2 on which the hot melt layer 30 is laminated is embedded in the hot melt layer 30 melted on the resin sheet 2 by the momentum of injection, and then As the hot melt layer 30 is cured, the IC chip 10 is bonded onto the resin sheet 2 (FIG. 2D).

  For example, the IC chip 10 having a size of 500 μm □ and a thickness of 70 μm may be used. In this case, the IC chip 10 is mounted so that the surface of the resin sheet 2 faces 500 μm □. Therefore, when the IC chip 10 is injected to the surface of the resin sheet 2 on which the hot melt layer 30 is laminated, the IC sheet 10 is inclined with respect to the surface of the resin sheet 2 on which the hot melt layer 30 is laminated. When the IC chip 10 is injected from the direction, the IC chip 10 is easily embedded in the thermoplastic adhesive.

  FIG. 3 is a diagram showing a state in which the IC chip 10 is embedded in the hot melt layer 30 in the manufacturing process of the thread shown in FIG.

  As shown in FIG. 3, the IC chip 10 is embedded in a matrix in the hot melt layer 30 laminated on the resin sheet 2, whereby the IC chip 10 is mounted on the resin sheet 2 in a matrix. Become.

  Thereafter, the IC chip 10 is embedded in the laminated hot melt layer 30 to mount the IC chip 10 and the bonded resin sheet 2 is cut together with the hot melt layer 30 into a belt shape to complete a thread roll.

  FIG. 4 is a view showing a state in which the resin sheet 2 on which the IC chip 10 is mounted is cut into a strip shape in the thread manufacturing process shown in FIG.

  As shown in FIG. 4, when the resin sheet 2 bonded by embedding the IC chip 10 in the hot melt layer 30 is cut into a strip shape, the IC chip 10 is placed on the hot melt layer 30 laminated on the resin sheet 2. Is formed in a straight line, the thread roll is wound up, and then applied to securities, banknotes, etc., for each unit (for example, the IC chip 10 is attached). The thread is cut so as to be included one by one, and a thread as shown in FIG. 1 is formed.

  In this embodiment, as described above, the resin sheet 2 that becomes the resin layer 20 by being cut is laminated with the hot melt layer 30 on the resin sheet 2, and an IC chip is formed on the hot melt layer 30. However, the present invention is not limited to this, and the hot melt layer 30 is substantially laminated on the belt-shaped resin layer 20 and the resin layer 20 is heated. In this state, the hot melt layer 30 is melted, and in this state, the IC chip 10 is injected onto the surface of the resin layer 20 on which the hot melt layer 30 is laminated, and the IC chip 10 is melted. What is necessary is just to attach the IC chip 10 to the resin layer 20 by embedding in the resin layer 20. Further, a protective sheet (not shown) may be bonded to the resin sheet 2 by laminating a protective sheet on the hot melt layer 30 side before cutting, and heating and pressing. The protective sheet is not limited to one made of resin, and may be made of paper.

(Second Embodiment)
FIG. 5 is a diagram for explaining a second embodiment of the thread manufacturing method shown in FIG.

  First, a hot melt layer 30 made of hot melt, which is a thermoplastic adhesive that is melted by heating, is laminated on the resin sheet 2 that becomes the resin layer 20 by being cut (FIG. 5A). As a result, the thermoplastic adhesive is applied on the resin sheet 20.

  Next, in the chip mounting head 1 for mounting the IC chip 10 on the resin sheet 20, the IC chip 10 mounted on the resin sheet 20 is heated, and the IC chip 10 is used as the hot melt layer 30 of the resin sheet 2. Is ejected from the chip mounting head 1 onto the surface on which the layers are stacked (FIG. 5B). In addition, as a method of injecting the IC chip 10 to the resin sheet 2 in the chip mounting head 1, for example, a method of injecting the IC chip 10 using an elastic force such as rubber or a spring, or a pressure such as air pressure or hydraulic pressure is used. A method of injecting the IC chip 10 can be considered.

  Then, in the hot melt layer 30 laminated on the resin sheet 2, the region where the injected IC chip 10 is attached is melted by the heat of the IC chip 10. The IC chip 10 is embedded in the melted hot melt layer 30 by the melting force of the hot melt layer 30 and the injection of the IC chip 10, and then the hot melt layer 30 is cured, so that the IC chip 10 becomes a resin sheet. 2 is adhered onto the substrate 2 (FIG. 5C).

  Even in this embodiment, when the IC chip 10 is injected onto the surface of the resin sheet 2 on which the hot melt layer 30 is laminated, the direction oblique to the surface of the resin sheet 2 on which the hot melt layer 30 is laminated. When the IC chip 10 is injected from the chip, the IC chip 10 is easily embedded in the thermoplastic adhesive.

  At this time, in the hot melt layer 30 laminated on the resin sheet 2, the IC chips 10 are embedded in a matrix as shown in FIG. 3, whereby the IC chips 10 are matrixed on the resin sheet 2. It will be mounted in the shape.

  Thereafter, the IC chip 10 is embedded in the laminated hot melt layer 30 to mount the IC chip 10 and the bonded resin sheet 2 is cut together with the hot melt layer 30 into a belt shape to complete a thread roll. This thread roll is wound up and then cut into units to be attached (for example, one IC chip 10 is included) when it is attached to securities or banknotes. A thread as shown will be formed.

  In this embodiment, as described above, the resin sheet 2 that becomes the resin layer 20 by being cut is laminated with the hot melt layer 30 on the resin sheet 2, and an IC chip is formed on the hot melt layer 30. However, the present invention is not limited to this, and the hot melt layer 30 is substantially laminated on the belt-shaped resin layer 20 and heated. Is injected to the surface of the resin layer 20 on which the hot melt layer 30 is laminated, and the region of the hot melt layer 30 to which the injected IC chip is attached is melted by the heat of the IC chip 10 to melt the hot What is necessary is just to attach the IC chip 10 to the resin layer 20 by embedding the IC chip 10 in the melt layer 30. Further, a protective sheet (not shown) may be bonded to the resin sheet 2 by laminating a protective sheet on the hot melt layer 30 side before cutting, and heating and pressing. The protective sheet is not limited to one made of resin, and may be made of paper.

  Moreover, in embodiment mentioned above, although the resin layer 20 which consists of PET, PET-G, PVC, etc. is used as a sheet | seat base material, this invention is not restricted to what uses the resin layer 20 as a sheet | seat base material. For example, it is also possible to use a paper layer made of paper. In this case, the mechanical strength of the entire thread is weakened, but when this thread is affixed to a sheet of securities or banknotes, the adhesiveness to the sheet Can be improved.

  In the above-described embodiment, the thread in which the IC chip 10 is mounted and fixed on the belt-shaped resin layer 20 has been described. However, the IC chip is mounted and fixed on the sheet base material. The sheet can also be manufactured by the same manufacturing method as described above. The IC chip-containing sheet can be used as a single sheet by forming an adhesive or a printing layer on the sheet surface, or can be used by laminating other sheets.

It is a figure which shows an example of the thread | sled manufactured by the manufacturing method of the thread | sled of this invention, (a) is a top view, (b) is A-A 'sectional drawing shown to (a). It is a figure for demonstrating 1st Embodiment of the manufacturing method of the thread | sled shown in FIG. It is a figure which shows the state by which the IC chip was embedded in the hot-melt layer in the manufacturing process of the thread | thread shown in FIG. It is a figure which shows the state in which the resin sheet in which the IC chip was mounted was cut | judged in the strip | belt shape in the manufacturing process of the thread | thread shown in FIG. It is a figure for demonstrating 2nd Embodiment of the manufacturing method of the thread | sled shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip mounting head 2 Resin sheet 10 IC chip 20 Resin layer 30 Hot-melt layer

Claims (4)

An IC chip capable of reading at least information in a non-contact state is mounted on a belt-shaped sheet base material coated with a thermoplastic adhesive, and the IC chip and the sheet base material are bonded to each other by the thermoplastic adhesive. A thread manufacturing method, comprising:
Heating the IC chip;
And a step of injecting the IC chip onto a surface of the sheet base material on which the thermoplastic adhesive is applied.   A thread manufactured by the thread manufacturing method according to claim 1. An IC chip is mounted on a sheet substrate coated with a thermoplastic adhesive, and the IC chip and the sheet substrate are bonded to each other by the thermoplastic adhesive.
Heating the IC chip;
And a step of injecting the IC chip onto the surface of the sheet base material on which the thermoplastic adhesive is applied.   An IC chip-containing sheet produced by the method for producing an IC chip-containing sheet according to claim 3.

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