JP4057968B2 - Electronic equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a communication device such as a mobile phone and a personal computer, and an electronic device incorporated in the electronic device.
[0002]
[Prior art]
Conventionally, an electronic device provided with a high-frequency circuit is used in communication equipment such as a mobile phone.
[0003]
Such a conventional electronic device is shown in FIG. The electronic device 50 has an electronic component element 53 such as an IC element placed on an upper surface of a wiring board 51 having a surface wiring pattern 52 such as a ground wiring pattern or a signal wiring pattern, and is provided on the upper surface of the electronic component element 53. It is known that the connecting electrode 54 and the surface wiring pattern 52 are electrically connected via a fine metal wire 55 and the electronic component element 53 is covered with an insulating resin 56. (For example, refer to Patent Document 1).
[0004]
By the way, an unnecessary electromagnetic wave may be emitted from the electronic device 50. In this case, the insulating resin 56 does not have an electromagnetic shielding function, so that the electromagnetic wave leaks to the outside of the electronic device 50. When such an electronic device 50 is mounted on an electronic device such as a mobile phone, electromagnetic waves leaking from the electronic device 50 have an effect on other electronic devices or circuits of the electronic device disposed in the vicinity. Cause problems such as noise disturbance and changing the oscillation characteristics of the oscillation component. Conversely, when unnecessary electromagnetic waves propagate from the outside to the electronic device 50, the electronic device 50 malfunctions.
[0005]
Therefore, as a countermeasure against the electromagnetic interference as described above, a method of attaching a shield case 30 made of a conductive material such as a metal so as to cover the electronic component element 53 as shown in FIG. There is. The shield case 30 is used to shield the electromagnetic wave generated from the electronic component element 53 or the like or the electromagnetic wave propagating from the outside of the electronic apparatus 50 by holding the electronic apparatus at a ground potential when the electronic apparatus is used. Is. Such a shield case 30 has, for example, a housing-like shape with one surface opened, and is constant between the shield case 30 and the uppermost portion of the metal thin wire 55 so that the shield case 30 and the metal thin wire 55 do not contact each other. Are attached to the wiring board 51 with a distance of (see Patent Document 2, for example).
[0006]
[Patent Document 1]
Utility Model Registration No. 2583242 [0007]
[Patent Document 2]
JP-A-8-17955 (FIGS. 4 and 5)
[0008]
[Problems to be solved by the invention]
By the way, in the above-described conventional electronic device, when the shield case 30 is attached, the shield case 30 may be tilted or the mounting position may vary, so that the fine metal wire 55 and the shield case 30 do not contact each other. The shield case 30 and the fine metal wire 55 need to be designed to have a certain distance. However, if a certain amount of space is provided between the shield case 30 and the thin metal wire 55, an extra space is generated, and the electronic device becomes large.
[0009]
The present invention has been devised in view of the above-described problems, and an object of the present invention is to provide an electronic device that can shield electromagnetic waves satisfactorily without using a shield case and can cope with a reduction in thickness. is there.
[0010]
[Means for Solving the Problems]
In the electronic device according to the present invention, an electronic component element having a plurality of ground electrode terminals and signal electrode terminals is placed on an upper surface of a wiring board having a ground wiring pattern and a signal wiring pattern, and the ground wiring pattern and the ground electrode terminal are mounted. In an electronic device in which the signal wiring pattern and the signal electrode terminal are electrically connected to each other via a loop-shaped fine metal wire for ground, The element , the fine metal wire for ground, and the fine metal wire for signal are covered with an insulating resin material so that only the uppermost part of the fine metal wire for ground is exposed, and the insulating resin material is coated from the upper surface on the element. also it is located within the exposed portion of the grounding metal thin wire toward the upper surface of the wiring board characterized by being coated with a conductive resin material It is.
[0011]
In the electronic device of the present invention, the height of the uppermost portion of the signal metal thin wire is set lower than the height of the uppermost portion of the ground metal thin wire, and the entire signal metal thin wire is insulated. It is characterized by being covered with a conductive resin material.
[0012]
According to the electronic device of the present invention, the electronic component element is covered with the insulating resin material so that the uppermost portion of the fine metal wire for grounding is exposed, and the exposed portion of the insulating resin material and the fine metal wire for grounding is electrically conductive. Since the conductive resin material is coated with the conductive resin material, the conductive resin material can be held at the ground potential via the ground metal fine wire and the ground wiring pattern when the electronic device is used. Electromagnetic waves can be effectively shielded. As a result, shielding of electromagnetic waves emitted from the electronic device can stabilize the circuit characteristics of other electronic devices or electronic devices arranged in the vicinity, and shield electromagnetic waves propagating from the outside of the electronic device. Thus, the electronic device can be operated stably. In addition, in this case, it is not necessary to secure an extra space between the shield case and the thin metal wire as in the conventional electronic device, so that the electronic device can be thinned.
[0013]
According to the electronic device of the present invention, the height of the uppermost portion of the fine metal wire for ground is made higher than the height of the uppermost portion of the fine metal wire for signal, and the uppermost portion is covered with the conductive resin material. Thus, the conductive resin material can be held at the ground potential through the ground metal fine wire and the ground wiring pattern with a simple structure.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
[0015]
FIG. 1 is a top view of an electronic device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA of the electronic device of FIG. In FIG. 1, the insulating resin material 2 and the conductive resin material 3 are not shown.
[0016]
The electronic device 20 shown in the figure is generally composed of a wiring board 1, an electronic component element 2, an insulating resin material 3, and a conductive resin material 4.
[0017]
The wiring board 1 is constituted by a substantially rectangular laminate formed by laminating a plurality of insulating layers in the thickness direction, and a number of circuit wirings are interposed between the insulating layers to insulate these circuit wirings. They are electrically connected to each other via via hole conductors embedded in the layers.
[0018]
As a material of the insulating layer constituting such a wiring board 1, for example, a ceramic material such as glass ceramics is used, and the thickness of each insulating layer is set to 50 μm to 300 μm, for example.
[0019]
When the insulating layer is made of a ceramic material, the wiring board 1 is formed by laminating a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent, organic solvent, etc. to the ceramic raw material powder. The laminate is manufactured by press molding and then firing the laminate at a high temperature and processing the outer shape.
[0020]
Moreover, as a material of the circuit wiring or via-hole conductor provided in the wiring substrate 1, for example, a conductive material mainly composed of silver is preferably used, and the thickness of each circuit wiring is, for example, 5 μm to 50 μm. Is set.
[0021]
On the other hand, a ground wiring pattern 5 and a signal wiring pattern 6 are formed on the main surface of the wiring board 1.
[0022]
The ground wiring pattern 5 is connected to an external connection conductor (not shown) formed on the lower surface or side surface of the wiring board 1 via a via-hole conductor or the like inside the wiring board 1. The external connection conductor is electrically connected to a ground wiring provided on a mother board on which the electronic device 20 is mounted, whereby the ground wiring pattern 5 is held at the ground potential when the electronic device 20 is used. It is like that.
[0023]
The signal wiring pattern 6 is connected to circuit wiring and via-hole conductors inside the wiring board 1 and is a path through which input / output signals and the like flow.
[0024]
These ground wiring pattern 5 and signal wiring pattern 6 contain, for example, an Ag-based powder such as Ag, Ag-Pd, or Ag-Pt, a borosilicate-based low-melting glass frit, an organic binder such as ethyl cellulose, an organic solvent, or the like. The conductive paste is formed by applying and firing on a ceramic green sheet corresponding to the uppermost layer of the wiring substrate 1 by screen printing or the like, and the thickness thereof is set to, for example, 5 μm to 80 μm.
[0025]
In addition, the ground wiring pattern 5 and the signal wiring pattern 6 have a positional relationship with the application region of the insulating resin 3 and the conductive resin material 4 and a ground electrode terminal 7 and a signal electrode formed on the upper surface of the electronic component element 2. The layout is designed in various patterns in consideration of the positional relationship with the terminals 8 and the like. In the present embodiment, the ground wiring pattern 5 is formed over the entire mounting region of the electronic component element 2 so as to perform electromagnetic shielding on the lower surface side of the electronic component element 2.
[0026]
An electronic component element 2 such as an IC element or a semiconductor element is placed on the upper surface of the wiring board 1 and is mechanically fixed to the wiring board 1 via, for example, a die bond material or a conductive resin material.
[0027]
A plurality of ground electrode terminals 7 and a signal electrode terminal 8 are formed on the upper surface of the electronic component element 2, and the ground electrode terminal 7 is connected to the signal electrode terminal via the ground wiring pattern 5 and the ground metal thin wire 9. 8 are electrically connected to each other via the signal wiring pattern 6 and the signal metal thin wire 10.
[0028]
The fine metal wire 9 for ground and the fine metal wire 10 for signal are formed by well-known wire bonding, and the shape thereof is, for example, a loop shape in which the top portion forms a “crest” of a curve. The height of the uppermost part 10 is set lower than the height of the uppermost part of the fine metal wire 9 for ground.
[0029]
The fine metal wire 9 for ground and the fine metal wire 10 for signal are made of a metal material such as Au or Al, and have a diameter of 18 μm to 35 μm.
[0030]
The electronic component element 2 is sequentially covered with an insulating resin material 3 and a conductive resin material 4. However, the insulating resin material 3 covers the entire signal metal thin wire 10 and the uppermost portion of the ground metal thin wire 9 is exposed, and the conductive resin material 4 is composed of the insulating resin material 3 and the ground metal. The electronic component element 2 is covered so as to cover the exposed portion of the thin wire 9.
[0031]
The insulating resin material 3 functions as a protective film that protects the electronic component element 2 from external impact, and prevents the conductive resin material 4 from being short-circuited to the electronic component element 2 and the signal metal thin wire 10. It has a function as an insulating film and a function as a sealing layer for hermetically sealing the electronic component element 2.
[0032]
In addition, such an insulating resin material 3 is obtained by adding and mixing a thermosetting resin such as an epoxy resin with a curing agent, a curing accelerator, and other inorganic fillers if necessary. It is formed by coating the electronic component element 2 and the signal metal thin wire 10 by a method or the like, and then heating and curing, from the top of the signal metal thin wire 10 to the upper surface of the insulating resin material 3. The distance is set to be in the range of 0.10 mm to 0.30 mm, for example.
[0033]
On the other hand, the conductive resin material 4 is electrically connected to the fine metal wire 9 for grounding. When the electronic device is used, the conductive resin material 4 is grounded via the fine metal wire 9 for ground and the ground wiring pattern 5. By maintaining the potential, the electromagnetic wave can be well shielded by the conductive resin material 4. That is, the circuit characteristics of the electronic device on which the electronic device 20 is mounted and the surrounding electronic devices are stabilized by shielding electromagnetic waves emitted from the electronic device 20, and the electronic devices 20 are shielded by shielding electromagnetic waves generated outside the electronic device 20. Can be operated normally. In addition, in this case, it is not necessary to secure an extra space between the shield case and the thin metal wire as in the conventional electronic device, so that the electronic device 20 can be thinned.
[0034]
Such a conductive resin material 4 is, for example, a conductive material such as Au, Ag, or Cu in a resin material similar to the insulating resin material 3 described above, such as an epoxy resin, a silicon resin, or a polyimide resin. In addition, the insulating resin material 3 and the exposed portion of the fine metal wire 9 for grounding are covered by a conventionally known screen printing method or the like by adding and mixing a curing agent, a curing accelerator, and other inorganic fillers if necessary. Thus, it apply | coats and forms by carrying out thermosetting after that, The thickness is set to 0.05 mm-0.50 mm, for example.
[0035]
In addition, content of the said electroconductive particle is set to the range of 75 to 88 weight% with respect to the weight of the whole conductive resin material, for example.
[0036]
Thus, the electronic device described above covers the electronic component element 2 mounted on the wiring board 1 with the insulating resin material 3, and the insulating resin material 3 is covered with the conductive resin material 4. The electromagnetic wave can be satisfactorily shielded by the conductive resin material 4 without being used.
[0037]
In addition, this invention is not limited to the above-mentioned embodiment, A various change and improvement are possible within the range which does not deviate from the summary of this invention.
[0038]
In the embodiment described above, the topmost portion of the ground metal thin wire 9 has a curved shape. Instead, as shown in FIG. 3, the topmost portion of the ground metal thin wire 9 has a flat shape. Also good. As a result, a large number of contact portions between the ground metal thin wire 9 and the conductive resin material 4 can be obtained, and the conductive resin material 4 can be more reliably held at the ground potential. Note that the length of the flat portion is preferably 0.7 mm or more.
[0039]
In the above-described embodiment, the wiring substrate 1 is formed of glass ceramics. Instead, other ceramic materials such as alumina ceramics or composite materials such as glass cloth base epoxy resins are used. The wiring board 1 may be formed.
[0040]
【The invention's effect】
According to the electronic device of the present invention, the electronic component element is covered with the insulating resin material so that the uppermost portion of the fine metal wire for grounding is exposed, and the exposed portion of the insulating resin material and the fine metal wire for grounding is electrically conductive. Since the conductive resin material is coated with the conductive resin material, the conductive resin material can be held at the ground potential via the ground metal fine wire and the ground wiring pattern when the electronic device is used. Electromagnetic waves can be effectively shielded. As a result, by shielding the electromagnetic waves emitted from the electronic device, it is possible to stabilize the circuit characteristics of other electronic devices arranged in the vicinity, or electronic equipment, and to propagate the electromagnetic waves from the outside of the electronic device. The electronic device can be stably operated by shielding the signal. In addition, in this case, it is not necessary to secure an extra space between the shield case and the thin metal wire as in the conventional electronic device, so that the electronic device can be thinned.
[0041]
According to the electronic device of the present invention, the height of the uppermost portion of the fine metal wire for ground is made higher than the height of the uppermost portion of the fine metal wire for signal, and the uppermost portion is covered with the conductive resin material. Thus, the conductive resin material can be held at the ground potential through the ground metal fine wire and the ground wiring pattern with a simple structure.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic device according to an embodiment of the present invention.
2 is a cross-sectional view taken along line AA of the electronic device of FIG.
FIG. 3 is a cross-sectional view of an electronic device according to another embodiment of the present invention.
FIG. 4 is a cross-sectional view of a conventional electronic device.
FIG. 5 is a cross-sectional view of a conventional electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... Electronic component element 3 ... Insulating resin material 4 ... Conductive resin material 5 ... Ground wiring pattern 6 ... Signal wiring pattern 7 ··· Ground electrode terminal 8 ··· Signal electrode terminal 9 ··· Ground metal wire 10 · · · Signal metal wire

Claims (2)

An electronic component element having a plurality of ground electrode terminals and signal electrode terminals is placed on an upper surface of a wiring board having a ground wiring pattern and a signal wiring pattern, and the ground wiring pattern and the ground electrode terminal are used for a loop-shaped ground. In an electronic device in which the signal wiring pattern and the signal electrode terminal are electrically connected to each other via a loop-shaped signal metal wire through a thin metal wire,
The electronic component element , the ground metal wire and the signal metal wire are covered with an insulating resin material so that only the uppermost part of the ground metal wire is exposed, and the insulating resin material is coated with the insulating resin material . An electronic device, wherein the exposed portion of the fine metal wire for ground is located inside from the upper surface to the upper surface of the wiring board and is covered with a conductive resin material.   The height of the uppermost portion of the signal metal thin wire is set lower than the height of the uppermost portion of the metal thin wire for ground, and the entire signal metal thin wire is covered with the insulating resin material. The electronic device according to claim 1.

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