JP3872378B2 - Electronic equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a high-frequency electronic device incorporated in a communication device such as a mobile phone or a personal computer.
[0002]
[Prior art]
Conventionally, an electronic device provided with a high-frequency circuit is used in communication equipment such as a mobile phone.
[0003]
As such a conventional electronic device, for example, as shown in FIG. 5, a metal shield case 12 is attached on a ceramic multilayer wiring board 11 having a high-frequency circuit therein so as to cover the upper surface thereof. The structure of the high-frequency circuit is stabilized by holding the shield case 12 at the reference potential (GND) and shielding the noise from the outside during use. .
[0004]
The shield case 12 is configured to electrically connect the joint legs 13 erected on the outer periphery of the shield case 12 to the ground wiring of the multilayer wiring board 11, specifically, electrically connect the joint legs 13 to the ground wiring. Is inserted into the end face through hole of the multilayer wiring board 11 connected in general and is soldered to the end face through hole electrode 14 so as to be held at the reference potential when the electronic device is used. Further, the shield case 12 is attached and fixed to the multilayer wiring board 11 by this solder bonding.
[0005]
[Problems to be solved by the invention]
However, in the above-described conventional electronic device, the end face through-hole electrode 14 is formed on the end face of the multilayer wiring board 11 in order to solder the joining legs 13 of the shield case 12 to the multilayer wiring board 11. In order to provide such an end face through-hole electrode 14 on the multilayer wiring board 11, an extremely complicated manufacturing process such as drilling for penetrating the multilayer wiring board 11 and deposition / formation of an electrode on the inner surface of the through-hole is required. Since it is necessary, the number of steps for manufacturing the electronic device is increased, and there is a disadvantage that the productivity is lowered.
[0006]
Further, in the above-described conventional electronic device, when assembling, the joining leg portion 13 of the shield case 12 formed in an elongated shape must be inserted into a small end surface through hole having a diameter of about 0.4 mm to 0.8 mm. Therefore, the workability is extremely poor, and when the joining leg 13 collides with the multilayer wiring board 11 as the joining leg 13 is inserted, the joining leg 13 is bent or the shield case 12 is folded into the multilayer wiring board. In some cases, a problem such as being attached in a state of being tilted with respect to 11 may occur, and this also induces a disadvantage that leads to a decrease in productivity of the electronic device.
[0007]
The present invention has been devised in view of the above drawbacks, and an object of the present invention is to provide a highly productive electronic device that can simplify the entire structure and the manufacturing process.
[0008]
[Means for Solving the Problems]
Electronic device of the present invention, a plurality of insulating layers are laminated, the high-frequency circuit in a multilayer wiring board ground wiring to these insulating layers are interposed provided a metal shield that covers the upper surface of the front Symbol multilayer wiring board In an electronic device having a case attached thereto, a plurality of notches are formed in at least an uppermost layer of the insulating layer to expose a part of the ground wiring, and an outer periphery of the ground wiring is formed on the multilayer. The wiring board is arranged at a predetermined distance inside the outer peripheral edge of the wiring board, and the lower end of the joint leg part standing on the outer peripheral part of the shield case is brought into contact with the ground wiring exposed in the notch. It is characterized by being joined.
[0009]
The electronic device of the present invention having the above structure, and wherein the lower end of the joint legs bent inward Tei Rutotomoni, conductive adhesive for bonding the upper and lower sides of the bent portion is disposed To do.
[0010]
Furthermore the electronic apparatus of the present invention having the above structure, the multilayer wiring board Ri rectangular der, and the notch is characterized in that it is arranged at four corners of the multilayer wiring board.
[0012]
Furthermore the electronic apparatus of the present invention having the above structure, before Kise' Goashi unit is characterized in that it is contact with an end face of the insulating layer facing the cutout.
[0013]
According to the electronic device of the present invention, a plurality of notches are formed in at least the uppermost layer of the insulating layer constituting the multilayer wiring board to expose a part of the ground wiring provided inside the multilayer wiring board. In addition, since the joining legs of the outer periphery of the shield case are joined to the ground wiring exposed in the notch, the necessary processing on the multilayer wiring board side prior to joining with the shield case is as follows: It is an easy task just by punching ceramic green sheets etc. laminated on the upper part of the multilayer wiring board into a predetermined shape, and it is necessary to form end face through-hole electrodes etc. at the joint part on the multilayer wiring board side like the conventional electronic device Absent. This eliminates the need for complicated manufacturing processes such as drilling in connection with the formation of end-face through-hole electrodes and attaching electrodes to the inner surface of the through-hole, simplifying the manufacturing process of multilayer wiring boards and increasing the productivity of electronic devices. It becomes possible to improve.
[0014]
According to the electronic device of the present invention, the lower end of the joint leg of the shield case is joined in contact with the ground wiring exposed on the upper surface of the multilayer wiring board, and the length of the joint leg is long. Since the length of the insulating layer constituting the multilayer wiring board may be a short length corresponding to the thickness of one layer to several layers, when the shield case is mounted on the multilayer wiring board, the joint legs are formed in the multilayer wiring board. There is almost no inconvenience such as bending when touching the board or attaching the shield case in a tilted state with respect to the multilayer wiring board, and the work for attaching the shield case to the multilayer wiring board becomes simple and good. This can also be used to improve the productivity of the electronic device.
[0015]
Furthermore, according to the electronic device of the present invention, the cutouts are arranged at the four corners of the multilayer wiring board, and the joint legs of the shield case are joined at these four locations, so that the shield case is more stable. Can be attached on top.
[0016]
Furthermore, according to the electronic device of the present invention, the outer peripheral edge of the ground wiring exposed in the notch is arranged at a predetermined distance inside the outer peripheral edge of the multilayer wiring board, thereby providing a multilayer wiring board. When cutting a large number of substrates, it is effectively prevented that the cutting cutter contacts the ground wiring when dividing or cutting a large substrate. There is no inconvenience of peeling, and this can also improve the productivity of the electronic device.
[0017]
Furthermore, according to the electronic device of the present invention, the shield case is attached to the multilayer wiring board in a state where the joint leg portion of the shield case is in contact with the end surface of the insulating layer facing the notch, thereby providing the multilayer wiring board. The shield case can be positioned more accurately and easily, and the productivity and reliability of the electronic device can also be improved.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
1 is an exploded perspective view of an electronic device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the electronic device of FIG. 1, and the electronic device shown in FIG. It consists of a case 5.
[0019]
The multilayer wiring board 1 is constituted by a substantially rectangular laminated body formed by laminating a plurality of insulating layers 1a, and a large number of wirings 2 including ground wirings 2c are interposed between these insulating layers. The wiring 2 is electrically connected to each other through a via-hole conductor 2b embedded in the insulating layer 1a.
[0020]
As a material of the insulating layer 1a constituting such a multilayer wiring board 1, for example, a ceramic material such as glass ceramics is used, and the thickness of each insulating layer 1a is set to 50 μm to 300 μm, for example.
[0021]
When the insulating layer 1a is made of a ceramic material, the multilayer wiring board 1 is formed by laminating a plurality of ceramic green sheets obtained by adding and mixing an appropriate organic solvent, organic solvent, etc. to the ceramic raw material powder. The laminate is manufactured by press molding and then firing the laminate at a high temperature and processing the outer shape.
[0022]
On the other hand, as the material of the wiring 2 and via-hole conductor 2b provided in the multilayer wiring board 1 or on the upper surface, for example, a conductive material mainly composed of silver is preferably used, and the thickness of each wiring 2 is, for example, 5 μm. It is set to ˜20 μm.
[0023]
When the multilayer wiring board 1 is manufactured by the above-described manufacturing method, the wiring 2 is formed with a predetermined pattern on the surface of each ceramic green sheet by screen printing or the like using a conductive paste containing silver powder before the ceramic green sheets are laminated. It is formed by printing and coating on the substrate, and simultaneously firing the ceramic green sheet at the time of firing.
[0024]
The via-hole conductor 2b is formed by applying and filling a conductive paste by screen printing or the like in a through-hole previously provided in the ceramic green sheet, and simultaneously firing the ceramic green sheet at the time of firing. Is done.
[0025]
In addition, a strip line, a chip-like semiconductor element, a piezoelectric element, a capacitor, and an inductor are provided as a high-frequency circuit inside or on the upper surface of the multilayer wiring board 1.
[0026]
When the high-frequency circuit is configured by a strip line or the like, the high-frequency circuit is formed using the wiring 2 or the insulating layer 1a described above, and in this case, a dielectric material having a high dielectric constant is used as the insulating layer 1a. .
[0027]
On the other hand, when the high-frequency circuit is composed of a chip-like semiconductor element, a piezoelectric element, or the like, it is mounted on a multilayer wiring board by conventionally known face-down bonding or wire bonding, and a conductive adhesive such as solder or the like Bonding is performed to the corresponding wiring 2 of the multilayer wiring board through a thin metal wire made of Au or the like.
[0028]
Furthermore, the multilayer wiring board 1 described above is provided with a plurality of notches 4 in at least the uppermost layer among the plurality of insulating layers 1a constituting the substrate, and a part of the ground wiring 2c is provided inside the notches 4. It is exposed.
[0029]
The notch 4 is for exposing the surface of the ground wiring 2c to which the joining leg 6 of the shield case 5 described later is joined, and the insulating layer 1a located above the exposed part is all the same. A notch is formed. For example, when the ground wiring 2c is provided between the uppermost layer of the insulating layer 1a and the second layer (the second insulating layer from the top), the notch is provided only in the uppermost insulating layer 1a, When the ground wiring 2c is provided between the second layer and the third layer of the insulating layer 1a, a notch 4 penetrating the uppermost layer and the second insulating layer 1a is provided.
[0030]
The end surface of the insulating layer 1a facing the notch 4 is preferably processed into a concave curved surface having a curvature radius of 0.2 mm to 0.4 mm, for example. It is possible to effectively prevent the occurrence of cracks and the like starting from the notches 4 in the multilayer wiring board 1 when firing 1 or the like.
[0031]
A shield case 5 covering the upper surface of the multilayer wiring board 1 is attached on the multilayer wiring board 1 described above.
The shield case 5 is formed of a metal such as iron, white or phosphor bronze so as to have a substantially rectangular shape, and has a relatively short length at the outer periphery, specifically, at four corners. The leg 6 is erected downward.
[0032]
Each joint leg 6 of the shield case 5 is soldered in a state where its lower end is bent inward and in contact with exposed portions of the ground wiring 2c provided at the four corners of the multilayer wiring board 1, As shown in FIG. 3, a part of the solder 7 for joining is accommodated on the bent part of the joining leg part 6 and is arranged on both the upper and lower sides with respect to the bent part.
[0033]
As described above, since the lower end of the joining leg portion of the shield case 5 is brought into contact with the ground wiring 2c exposed on the upper surface of the multilayer wiring board 1, both are joined. As the processing required on the multilayer wiring board 1 side in advance, it is a simple work of simply punching a ceramic green sheet or the like laminated on the upper part of the multilayer wiring board 1 into a predetermined shape. It is not necessary to form an end face through-hole electrode or the like at the junction on the one side. Accordingly, complicated manufacturing processes such as drilling in connection with the formation of the end face through-hole electrode and electrode deposition on the inner surface of the through-hole are not required, and the manufacturing process of the multilayer wiring board 1 is simplified to increase the productivity of the electronic device. Can be improved.
[0034]
The shield case 5 is joined in a state in which the lower end of the joint leg 6 is in contact with the ground wiring 2c exposed on the upper surface of the multilayer wiring board 1, and the length of the joint leg 6 is increased. Can be a short length corresponding to the thickness of one to several layers of insulating layers constituting the multilayer wiring board 1, so that when the shield case 4 is mounted on the multilayer wiring board 1, the joint legs 6 However, there is almost no inconvenience such as being bent when hitting the multilayer wiring board 1 or being attached in a state where the shield case 5 is tilted with respect to the multilayer wiring board 1, and this can also contribute to improving the productivity of the electronic device. .
[0035]
In addition, it is preferable that the length of the joining leg portion 6 is slightly longer than the total thickness of the insulating layer 1a provided with the notches 4, for example, when the thickness of the notch portion is 150 μm. The length of the leg portion 6 is set to about 200 μm.
[0036]
Further, the cutouts 4 are respectively arranged at the four corners of the multilayer wiring board 1, and the joining legs 6 of the shield case 5 are joined at the four corners of the multilayer wiring board 1. It can be attached to the multilayer wiring board 1 in a more stable state.
[0037]
Further, in this case, if the outer peripheral edge of the ground wiring 2 c exposed in the notch 4 is arranged at a predetermined distance from the outer peripheral edge of the multilayer wiring board 1, the multilayer wiring board 1 is manufactured. However, even when the large substrate is divided and "many pieces are taken", the ground wiring 2c and the cutting cutter do not come into contact with each other when the large substrate is divided and cut. There is no inconvenience that the edge of the substrate peels off from the base as it is cut, and this also has the advantage that the productivity of the electronic device can be improved. Therefore, it is preferable that the outer peripheral edge of the ground wiring 2 c exposed in the notch 4 is arranged at a predetermined distance away from the outer peripheral edge of the multilayer wiring substrate 1.
[0038]
Furthermore, if the joint leg 6 of the shield case 5 is attached to the multilayer wiring board 1 in contact with the end surface of the insulating layer 1a facing the notch 4, the shield case for the multilayer wiring board 1 can be obtained. Can be more accurately and easily aligned, which also improves the productivity and reliability of the electronic device. Therefore, it is preferable to attach the shield case 5 to the multilayer wiring board 1 in a state where the joint leg portion 6 of the shield case 5 is in contact with the end surface of the insulating layer 1a facing the notch 4.
[0039]
Thus, when the electronic device described above is used, the shield case 5 is held at the reference potential (ground potential) via the joint legs 6 and the ground wiring 2c, thereby shielding noise from the outside. The case 5 can be shielded satisfactorily, and high-frequency electromagnetic waves supplied to the high-frequency circuit of the multilayer wiring board 1 are effectively prevented from adversely affecting other devices and other electronic devices.
[0040]
In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible within the range which does not deviate from the summary of this invention.
[0041]
For example, in the above-described embodiment, solder is used as the conductive adhesive for bonding the joint legs of the shield case and the ground wiring of the multilayer wiring board. Instead of this, other than solder such as conductive resin, etc. You may join both using a conductive adhesive.
[0042]
In the above embodiment, the multilayer wiring board is formed of glass ceramics. Instead, the multilayer wiring board is formed using other materials such as alumina ceramics or glass cloth base epoxy resin. It doesn't matter if you do.
[0043]
【The invention's effect】
According to the electronic device of the present invention, a plurality of notches are formed in at least the uppermost layer of the insulating layer constituting the multilayer wiring board to expose a part of the ground wiring provided inside the multilayer wiring board. In addition, since the joining legs of the outer periphery of the shield case are joined to the ground wiring exposed in the notch, the necessary processing on the multilayer wiring board side prior to joining with the shield case is as follows: It is an easy task just by punching ceramic green sheets etc. laminated on the upper part of the multilayer wiring board into a predetermined shape, and it is necessary to form end face through-hole electrodes etc. at the joint part on the multilayer wiring board side like the conventional electronic device Absent. This eliminates the need for complicated manufacturing processes such as drilling in connection with the formation of end-face through-hole electrodes and attaching electrodes to the inner surface of the through-hole, simplifying the manufacturing process of multilayer wiring boards and increasing the productivity of electronic devices. It becomes possible to improve.
[0044]
According to the electronic device of the present invention, the lower end of the joint leg of the shield case is joined in contact with the ground wiring exposed on the upper surface of the multilayer wiring board, and the length of the joint leg is long. Since the length of the insulating layer constituting the multilayer wiring board may be a short length corresponding to the thickness of one layer to several layers, when the shield case is mounted on the multilayer wiring board, the joint legs are formed in the multilayer wiring board. There is almost no inconvenience such as bending when touching the board or attaching the shield case in a tilted state with respect to the multilayer wiring board, and the work for attaching the shield case to the multilayer wiring board becomes simple and good. This can also be used to improve the productivity of the electronic device.
[0045]
Furthermore, according to the electronic device of the present invention, the cutouts are arranged at the four corners of the multilayer wiring board, and the joint legs of the shield case are joined at these four locations, so that the shield case is more stable. Can be attached on top.
[0046]
Furthermore, according to the electronic device of the present invention, the outer peripheral edge of the ground wiring exposed in the notch is arranged at a predetermined distance inside the outer peripheral edge of the multilayer wiring board, thereby providing a multilayer wiring board. When cutting a large number of substrates, it is effectively prevented that the cutting cutter contacts the ground wiring when dividing or cutting a large substrate. There is no inconvenience of peeling, and this can also improve the productivity of the electronic device.
[0047]
Furthermore, according to the electronic device of the present invention, the shield case is attached to the multilayer wiring board in a state where the joint leg portion of the shield case is in contact with the end surface of the insulating layer facing the notch, thereby providing the multilayer wiring board. The shield case can be positioned more accurately and easily, and the productivity and reliability of the electronic device can also be improved.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of an electronic device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of an electronic device according to an embodiment of the present invention.
FIG. 3 is an enlarged view of a main part of FIG. 2;
FIG. 4 is a plan view showing a positional relationship between an outer peripheral edge of an exposed portion of a ground wiring and an outer peripheral edge of a multilayer wiring board.
FIG. 5 is a perspective view of a conventional electronic device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Multilayer wiring board 1a ... Insulating layer 2 ... Wiring 2c ... Ground wiring 4 ... Notch 5 ... Shield case 6 ... Joining leg 7 ... Solder (conductivity) Adhesive)

Claims (4)

A plurality of insulating layers are laminated, formed by these insulating layers in the high-frequency circuit is provided to the multilayer wiring board ground wiring is interposed, is pre-Symbol attaching the metal shield case covering the upper surface of the multilayer wiring board In electronic devices,
A plurality of notches are formed in at least an uppermost layer of the insulating layer to expose a part of the ground wiring, and an outer peripheral edge of the ground wiring is set at a predetermined distance inside an outer peripheral edge of the multilayer wiring board. An electronic apparatus, wherein the electronic device is arranged so as to be spaced apart from each other and joined by bringing a lower end of a joining leg portion standing on an outer peripheral portion of the shield case into contact with a ground wiring exposed in the notch. Electronic device according to claim 1, characterized in that the lower end of the joint legs bent inward Tei Rutotomoni, conductive adhesive for bonding the upper and lower sides of the bent portion is disposed. The multilayer wiring board Ri rectangular der, and the cutout electronic device according to claim 1 or claim 2, characterized in that arranged at four corners of the multilayer wiring board. Before Kise' Goashi unit, an electronic device according to any one of claims 1 to 3, characterized in that it is contact with an end face of the insulating layer facing the cutout.

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