JP4056504B2 - 冷却装置及びこれを備えた電子機器 - Google Patents
冷却装置及びこれを備えた電子機器 Download PDFInfo
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- JP4056504B2 JP4056504B2 JP2004238176A JP2004238176A JP4056504B2 JP 4056504 B2 JP4056504 B2 JP 4056504B2 JP 2004238176 A JP2004238176 A JP 2004238176A JP 2004238176 A JP2004238176 A JP 2004238176A JP 4056504 B2 JP4056504 B2 JP 4056504B2
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- Prior art keywords
- tank
- reserve tank
- heat
- refrigerant liquid
- radiator
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- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title claims description 71
- 239000007788 liquid Substances 0.000 claims description 101
- 239000003507 refrigerant Substances 0.000 claims description 61
- 239000002826 coolant Substances 0.000 claims description 14
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 2
- 230000036544 posture Effects 0.000 description 30
- 238000010586 diagram Methods 0.000 description 17
- 238000009434 installation Methods 0.000 description 13
- 230000008859 change Effects 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 238000005304 joining Methods 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 4
- 230000014759 maintenance of location Effects 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002528 anti-freeze Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
前記放熱手段が、放熱のための冷媒液循環用水路が形成されたラジエータを有し、
前記タンクが前記ラジエータ上に実装されており、
前記ラジエータの冷媒液循環用水路が、実装された前記タンクの中央位置において、水路幅を狭め、かつ狭小隙間で分断されており、
前記冷媒液循環用水路の前記狭小隙間が形成された部分を挟んだ両側に、実装された前記タンクに内包される大きさの空隙が設けられていることを特徴とする。
図1から図5は、本発明の第1の参考例による冷却装置のリザーブタンク構造を示し、図1はその全体図、図2はその内部構成図、図3はその上面図、図4はその斜視断面図、図5は冷媒液充填時の構成図である。
図9から図13は、本発明の第2の参考例による冷却装置のリザーブタンク構造を示し、図9はその全体図、図10はその内部構成図、図11はその斜視構成断面図、図12はその斜視断面図、図13は動作説明図である。
図14から図18は、本発明の第3の参考例による冷却装置のリザーブタンク構造を示し、図14はその全体図、図15はその内部構成図、図16はその上面図、図17はその斜視構成図、図18はその斜視断面図である。
図22から図25は、本発明の第4の参考例による冷却装置のリザーブタンク構造を示し、図22はその内部構成図、図23はその斜視断面図、図24はタンク内の水路管の詳細図、図25はタンクの動作説明図である。
図26から図29は、本発明の第5の参考例による冷却装置のリザーブタンク構造を示し、図26はその内部構成図、図27はその水平断面図、図28その垂直断面図、図29はタンクの動作説明図である。
図30は、本発明の第1の実施形態による冷却装置のリザーブタンク構造を示し、同図(a)は全体図、同図(b)は図(a)の一部拡大図である。図31は本実施形態の冷却装置を示す平面図、図32はリザーブタンクの動作説明図である。図33の(a)〜(c)はリザーブタンクの各種構成例を示す側面図である。
3d ラジエータ
4e 循環ポンプ
5e、5f、5g、5h、5i リザーブタンク
7d 樹脂チューブ
15a、15b、15c 冷却装置
16c 放熱ファン
17a、17b タンクカバー
18a、18b、18c、18d、18e、18f、18h 本体タンク部
19a、19b、19c、19d チューブ用継手
20a、20b、20c 架橋部
21a、21b、21c、30 冷媒液循環用水路
22a、22b 狭小隙間
23a、23c 断層部
24 冷媒液
25a、25b、25c、25d、25e 滞留空気層
26a、26b、26c 切削部
27a、27b 残留空気の移動用空隙
28 水路溝
29 絞り部
32a、32b 継手管
33 水路管チューブ
34a、34b 貫通孔
43 気泡
Claims (3)
- 内部に冷媒液を貯留するとともに空気層を有するタンクと、発熱部品に接触させて受熱を行う受熱手段と、前記冷媒液が吸収した熱を放熱する放熱手段と、前記冷媒液を前記受熱部材から前記タンク及び前記放熱手段を介して再び前記受熱部材に循環させる循環機構とを有する冷却装置において、
前記放熱手段が、放熱のための冷媒液循環用水路が形成されたラジエータを有し、
前記タンクが前記ラジエータ上に実装されており、
前記ラジエータの冷媒液循環用水路が、実装された前記タンクの中央位置において、水路幅を狭め、かつ狭小隙間で分断されており、
前記冷媒液循環用水路の前記狭小隙間が形成された部分を挟んだ両側に、実装された前記タンクに内包される大きさの空隙が設けられていることを特徴とする冷却装置。 - 前記冷媒液循環用水路の前記狭小隙間が形成された部分に突起部を有する請求項1に記載の冷却装置。
- 請求項1または2に記載の冷却装置が搭載された電子機器。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004238176A JP4056504B2 (ja) | 2004-08-18 | 2004-08-18 | 冷却装置及びこれを備えた電子機器 |
US11/205,110 US7717161B2 (en) | 2004-08-18 | 2005-08-17 | Circulation-type liquid cooling apparatus and electronic device containing same |
US12/216,902 US8118083B2 (en) | 2004-08-18 | 2008-07-11 | Circulation-type liquid cooling apparatus and electronic device containing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004238176A JP4056504B2 (ja) | 2004-08-18 | 2004-08-18 | 冷却装置及びこれを備えた電子機器 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007259911A Division JP4437148B2 (ja) | 2007-10-03 | 2007-10-03 | 冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006059903A JP2006059903A (ja) | 2006-03-02 |
JP4056504B2 true JP4056504B2 (ja) | 2008-03-05 |
Family
ID=35908570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004238176A Expired - Fee Related JP4056504B2 (ja) | 2004-08-18 | 2004-08-18 | 冷却装置及びこれを備えた電子機器 |
Country Status (2)
Country | Link |
---|---|
US (2) | US7717161B2 (ja) |
JP (1) | JP4056504B2 (ja) |
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-
2004
- 2004-08-18 JP JP2004238176A patent/JP4056504B2/ja not_active Expired - Fee Related
-
2005
- 2005-08-17 US US11/205,110 patent/US7717161B2/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
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US8118083B2 (en) | 2012-02-21 |
US20060037739A1 (en) | 2006-02-23 |
JP2006059903A (ja) | 2006-03-02 |
US20080277102A1 (en) | 2008-11-13 |
US7717161B2 (en) | 2010-05-18 |
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