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JP4038632B2 - Method for manufacturing substrate for photosensitive drum - Google Patents

Method for manufacturing substrate for photosensitive drum Download PDF

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Publication number
JP4038632B2
JP4038632B2 JP24425898A JP24425898A JP4038632B2 JP 4038632 B2 JP4038632 B2 JP 4038632B2 JP 24425898 A JP24425898 A JP 24425898A JP 24425898 A JP24425898 A JP 24425898A JP 4038632 B2 JP4038632 B2 JP 4038632B2
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JP
Japan
Prior art keywords
cylindrical
flange
photosensitive drum
gate
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP24425898A
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Japanese (ja)
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JP2000075529A (en
Inventor
宗紀 飯塚
陽一 西室
邦郎 町田
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Bridgestone Corp
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Bridgestone Corp
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Priority to JP24425898A priority Critical patent/JP4038632B2/en
Publication of JP2000075529A publication Critical patent/JP2000075529A/en
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Publication of JP4038632B2 publication Critical patent/JP4038632B2/en
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/114Single butt joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1222Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a lapped joint-segment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/12Joint cross-sections combining only two joint-segments; Tongue and groove joints; Tenon and mortise joints; Stepped joint cross-sections
    • B29C66/122Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section
    • B29C66/1224Joint cross-sections combining only two joint-segments, i.e. one of the parts to be joined comprising only two joint-segments in the joint cross-section comprising at least a butt joint-segment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/01General aspects dealing with the joint area or with the area to be joined
    • B29C66/05Particular design of joint configurations
    • B29C66/10Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/13Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
    • B29C66/131Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/50General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/51Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
    • B29C66/53Joining single elements to tubular articles, hollow articles or bars
    • B29C66/534Joining single elements to open ends of tubular or hollow articles or to the ends of bars
    • B29C66/5344Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially annular, i.e. of finite length, e.g. joining flanges to tube ends
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00General aspects of processes or apparatus for joining preformed parts
    • B29C66/50General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
    • B29C66/61Joining from or joining on the inside
    • B29C66/612Making circumferential joints
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0005Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2015/00Gear wheels or similar articles with grooves or projections, e.g. control knobs
    • B29L2015/003Gears
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/32Wheels, pinions, pulleys, castors or rollers, Rims
    • B29L2031/324Rollers or cylinders having an axial length of several times the diameter, e.g. embossing, pressing or printing
    • B29L2031/326Rollers or cylinders having an axial length of several times the diameter, e.g. embossing, pressing or printing made wholly of plastics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、複写機、ファクシミリ、プリンター等の電子写真装置や静電記録装置等において、画像形成のために静電潜像を表面に形成するための感光ドラム用基体を製造する方法に関する。
【0002】
【従来の技術及び発明が解決しようとする課題】
複写機、ファクシミリ、プリンター等における静電記録プロセスでは、まず、感光ドラムの表面を一様に帯電させ、この感光ドラム表面に光学系から映像を投射して光の当たった部分の帯電を消去することによって静電潜像を形成し、次いで、この静電潜像にトナーを供給してトナーの静電的付着によりトナー像を形成し、これを紙、OHP、印画紙等の記録媒体へと転写することにより、プリントする方法が採られている。
【0003】
このような静電記録プロセスに用いられる感光ドラムとしては、従来、図4に示した構造のものが一般に用いられている。
【0004】
即ち、アルミニウム等の金属や導電性樹脂からなる円筒状基体1の両端に金属や樹脂で形成されたフランジ2a,2bを嵌合固定すると共に、該円筒状基体1の外周面に光導電層3を形成したものが一般に用いられており、通常、この感光ドラムは、図3に示されているように、静電記録装置の本体aに設けられた支持軸4,4が両フランジ2a,2bに設けられた軸孔5,5に挿入されて回転自在に支持され、一方、フランジ2bに形成された駆動用ギア6にモータ等の駆動源と連結されたギア7を歯合させ、回転駆動される。
【0005】
この場合、この感光ドラムの光導電層3を帯電させ、更にこの光導電層3上に露光によって静電潜像を形成するには、感光ドラムの接地が必要であり、このため両フランジ2a,2bを絶縁性の樹脂で形成した場合には、フランジの内面側に円筒状基体1と支持軸5とを導通させるアース用に金属板を取り付け、装置本体aにアースすることが行われている。
【0006】
しかしながら、上記従来の感光ドラムは、円筒状基体1の両端にそれぞれフランジ2a,2bを嵌着固定して組み立てられるため、円筒状基体の両端に各フランジを組み付ける2回の組み付け作業が必要であり、また円筒状基体1と各フランジ2a,2bをそれぞれ別々に形成することとなるので、これら部品をそれぞれ形成する際に高度な加工精度が要求され、これらが製造コストを引き上げる原因になっている。
【0007】
また、上述したアース用の金属板を必要とする場合には、このアース用金属板を組み付ける作業が必要となり、更に製造コストを引き上げることとなる上、ドラムの運転中に金属板が摩耗して支持軸5との間に良好な導通が得られなくなるおそれもあり、その信頼性が必ずしも十分でない。
【0008】
このような課題に対し、本出願人は、外周面に光導電層が形成される円筒状基体の両端面にそれぞれフランジを設けてなり、両フランジを軸支することにより、回転自在に支持される感光ドラムにおいて、上記円筒状基体を導電性樹脂で成形すると共に、同導電性樹脂で一方のフランジを円筒状基体と一体に成形してなることを特徴とする感光ドラムを先に提案した(特願平9−323805号)。この感光ドラムは、円筒状基体の両端に設けられるフランジの一方が円筒状基体を形成する導電性樹脂で一体に成形されたものであるから、フランジの組み付け作業は少なくとも円筒状基体の一方の端部についてのみ行えばよく、また円筒状基体と一体に成形された導電性樹脂からなるこのフランジによって、ドラムを軸支する支持軸と円筒状基体との間に良好な導通を確実に得ることができ、アース用の金属板を用いる必要がない上、高い信頼性も得ることができる。更に、一方のフランジは、円筒状基体と一体に成形されるため、その加工精度にも優れるものである。
【0009】
ところで、上記従来の図4に示す円筒状基体1は、通常、円筒状基体1を成形する円筒状キャビティの外側にゲートを設けたサイドゲート方式による金型を使用して射出成形することにより製造されているが、この方法では、成形された円筒状基体1の外周面にゲート跡が残るという問題があり、また円筒状キャビティに樹脂が均一に充填されず、得られた円筒状基体の真直度、真円度等の寸法精度に劣り、結果として感光体の印字、画像特性に影響を与えるという問題がある。この点は、上記の一方のフランジを一体成形した円筒状基体を成形する場合も、サイドゲート方式を用いた金型を使用する場合には同様の問題が生じる。
【0010】
従って、本発明は、上記問題を解決し、寸法精度に優れ、良好な印字画像特性をもたらす感光ドラム用基体の製造方法を提供することを目的とする。
【0011】
【課題を解決するための手段】
本発明は、上記目的を達成するため、導電性樹脂により形成された円筒状本体の一端面内周縁に内方に突出するフランジが一体に突設された感光ドラム用基体を金型により射出成形するに際し、上記金型のフランジ形成用キャビティに連通して3〜6点のピンゲート又はディスクゲートを設け、このピンゲート又はディスクゲートを通って上記フランジ形成用キャビティから円筒状本体形成用キャビティに導電性樹脂材料を射出することを特徴とする感光ドラム用基体の製造方法を提供する。
【0012】
本発明によれば、導電性樹脂材料が円筒状本体形成用キャビティから射出されるものではなく、フランジ形成用キャビティから射出され、樹脂材料はこのフランジ形成用キャビティより円筒状本体形成用キャビティに流れるので、成形された基体は、その円筒状本体の外周部にゲート跡もなく、後述する実験例に示したように、真円度、真直度が良好で、寸法精度に優れたものである。
【0013】
【発明の実施の形態及び実施例】
本発明の感光ドラム用基体の製造方法は、図1に示したような円筒状本体11の一端面内周縁に内方に突出するフランジ12が導電性樹脂により一体成形された円筒状基体10を得る方法である。この基体10は、上記円筒状本体11の他端開口部に別体に形成したフランジ13を嵌着固定し、また円筒状本体11の外周面に光導電層14を形成して、先に説明した図4と同様の態様で使用される。なお、上記両フランジ12,13には、それぞれ軸孔15,15が形成される。
【0014】
上記円筒状本体11及びこれと一体に成形される一方のフランジ12を形成する導電性樹脂は、通常は導電剤を配合して導電性を付与した導電性樹脂が用いられる。この場合用いられる樹脂としては、適度な強度を有し、射出成形法により成形可能なものであればよく、特に制限されるものではないが、ポリカーボネート、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリアミド樹脂(ナイロン6,ナイロン66等)、ポリフェニレンサルファイド(PPS)、ポリアセタールなどが、熱可塑性で成形性に優れ、かつ機械強度、摺動特性等に優れる点から好ましく用いられる。
【0015】
また、導電剤としては、上記樹脂中に均一に分散させることが可能なものであればいずれのものでもよく、特に制限されるものではないが、カーボンブラック、グラファイト、アルミニウム,銅,ニッケル等の金属粉、導電性ガラス粉などの粉体が好ましく用いられる。この導電剤の配合量は、5〜40重量%、特に5〜20重量%程度とすることが好ましく、これにより円筒状基体及びフランジの表面抵抗値を10 Ω/□以下、特に10 Ω/□以下に調整することが好ましい。
【0016】
この導電性樹脂には、補強や増量の目的で各繊維等を充填材として用いることができる。この繊維としては、カーボン繊維、導電性ウィスカー、導電性ガラス繊維等の導電性繊維やウィスカー,ガラス繊維等の非導電性繊維が用いられる。この場合、上記導電性繊維は、導電剤としても作用することができ、導電性繊維を用いることにより、上記導電剤の使用量を減らすことができるが、コスト面を考慮すれば、非導電性繊維を用い、上記導電剤の使用量を多くすることが好ましい。
【0017】
これら充填材の配合量は、樹脂の種類や用いる繊維の長さ、径などに応じて適宜選定され、特に制限されるものではないが、通常は2〜25重量%、特に5〜15重量%程度とすることが好ましい。
【0018】
なお、導電性樹脂には、必要に応じて上記導電剤及び充填材の他に、PTFE(ポリテトラフルオロエチレン)、シリコーン、二硫化モリブデン(MoO )等の公知の添加剤を適量添加することができる。
【0019】
また、光導電層は公知の材料、組成により形成することができる。
【0020】
本発明において、上記本体11と一方のフランジ12が一体成形された基体は、3〜6点のピンゲート方式又はディスクゲート方式を用いた金型で射出成形することによって成形される。
【0021】
図2は、このピンゲート方式による成形法を説明するもので、図中20は、内部に円柱状中空部を有する金型本体21と、この金型本体21の一端面に当接し、上記中空部の一端開口部に閉塞する金型補助部材22と、上記中空部にその他端開口部より軸方向移動可能に挿入される先端部を有するコア23とを具備した金型であり、この金型20には、上記金型本体21内周面とコア23外周面との間に上記基体10の円筒状本体11形成用の円筒状キャビティ24が形成されると共に、上記補助部材22の他端面とコア23の一端面(先端面)との間に、上記円筒状キャビティ24の軸方向一端部と連通して、上記フランジ12形成用のキャビティ25が形成されるものである。なお、上記コア23の先端面中央部には小径円柱部23aが突設され、この小径円柱部23a先端面が上記補助部材22と当接することにより、上記フランジ形成用キャビティ25が略円形リング状に形成されているものである。
【0022】
そして、この金型20にあっては、上記補助部材22に互いに等間隔離間して3〜6本のピンゲート26が設けられ、これらピンゲート26の先端部はそれぞれ上記フランジ形成用キャビティ25に連通していると共に、ピンゲート26の基端部はスプルー27に連結されているものである。なお、28は上記補助部材22に軸方向移動可能に設けられた突出ピンで、基体10を成形し、コア23を金型本体21から抜き出した後に、突出ピン28を突出するように作動させることにより、成形された基体10を金型20から脱型させるためのものである。また、29は冷却水流通孔である。
【0023】
上記金型20を用いて感光ドラム用基体10を成形する場合は、金型20を図2に示す状態にセットし、成形材料(上記導電性樹脂材料)をスプルー27を通って上記3〜6本のピンゲート26よりフランジ形成用キャビティ25に射出する。これにより、樹脂材料はフランジ形成用キャビティ25から上記円筒状キャビティ(円筒状本体形成用キャビティ)24に流れ、円筒状本体11にフランジ12が一体に連設された円筒状基体10が射出成形されるものである。
【0024】
従って、成形された基体は、そのフランジ端面に上記ピンゲート26によるゲート跡が残ることがあっても、円筒状本体の外周面にはかかるゲート跡はなく、従ってこの上に光導電層を形成する場合にゲート跡による問題が生じるおそれがない。また、この方法による場合、上記金型構造によって、成形サイクルの中でゲートカットが自動的に行われるため、後加工工程が省略できる。これにより、サイドゲート方式が個別のゲート加工を必要とするのに比べて生産性が高く、製造コストも低減できるものである。
【0025】
図3は、ディスクゲート方式による成形方法を説明するもので(なお、図3において、図2と同一構成部品については同一の参照符号を付してその説明を省略する)、この例にあっては、上記補助部材22の他端面中央部に円柱状突起22aを一体に突設し、この突起22aを上記金型本体21の中空部に突出させる(上記リング状のフランジ形成用キャビティ25の中空部に突出させる)ようにしたものであり、上記補助部材22に設けたスプルー27をこの円柱状突起22aにまで延出させると共に、このスプルー27先端にディスクゲート26’をこのゲート26’の外周部がフランジ形成用キャビティ25の内周部に連通するように形成したものである。
【0026】
この図3の金型を用いた場合も、導電性樹脂材料がスプルー27を流れ、ディスクゲート26’からフランジ形成用キャビティ25の内周部に射出され、こののフランジ形成用キャビティ25より円筒状キャビティ24に流れて、円筒状基体10が成形されるもので、従ってフランジ内周面にゲート跡が残ることがあっても、円筒状本体外周面にゲート跡が生じるおそれがない。また、このようなディスクゲートを用いた場合は、基体を取り出した後、打抜き加工するだけでスプルー切断が可能であり、生産性の高いものである。
【0027】
上述した射出成形方法によれば、成形材料(導電性樹脂材料)がフランジ形成用キャビティ25から円周方向に均一に流れて円筒状本体形成用キャビティ24に均一に流入し、かつ該キャビティ24の末端まで速やかに充填するので、円筒状本体の真円度、真直度などの寸法精度が向上する。
【0028】
また、上述したようにゲートカット、スプルー切断などの後加工が省略又は簡略化され、生産効率が高いものである。
【0029】
しかも、上記方法によれば、円筒状本体とその一端部に金属シャフト用貫通孔を有するフランジとが一体成形された円筒状基体が得られるので、フランジの取り付け作業が円筒状本体の片側だけになり、その作業が簡略化される。この場合、成形材料として導電性樹脂材料を用いて一体成形していることにより、フランジ及びシャフトとの導通のための金属部品を組み込むことを省略できる。
【0030】
なお、上述した射出成形法によって成形を行う場合、成形温度や射出圧力などの成形条件は、用いる樹脂の種類などに応じた通常の条件とすることができる。
【0031】
次に、実験例により上記成形法による効果を具体的に説明する。
[実験例]
下記組成
ナイロン66 80重量部
カーボン繊維 10重量部
カーボンブラック 10重量部
の導電性樹脂材料を用いて下記条件
成形温度 260〜290℃
射出圧力 500〜900Kg/cm
にて射出し、図1に示すような長さ230mm,外径30mm,内径26mmの円筒状本体の一端にリング状フランジが一体成形された円筒状基体を製造した。
【0032】
この場合、金型としては、図2に示すピンゲート方式(ピン数3本)の金型(本発明例1)、図3に示すディスクゲート方式の金型(本発明例2)、及びサイドゲート方式の金型(比較例)を用いた。なお、サイドゲート方式の金型の場合、円筒状本体形成用キャビティの外周部一端部にサイドゲートを連通し、これにより樹脂材料を射出するように構成したものである。
上記方法で成形された円筒状基体につき、その真円度を真円度測定機を用いて測定し、また真直度をレーザースキャンマイクロメーターを用いて測定した。結果を表1に示す。
【0033】
【表1】

Figure 0004038632
【0034】
以上の結果より、本発明に係る成形法は、真円度、真直度に優れた感光ドラム用の円筒状基体を成形し得ることが認められる。なお、サイドゲート方式の場合、樹脂が最初に流れ込むスプルーは、本発明例のようなパイプ中心部の位置でなく、パイプの側面の位置からの1点で、そこから樹脂が流れ込む構造となる。そのため、本発明例1,2がパイプの周方向に均一に樹脂が充填されるのに対して、サイドゲート方式はパイプ全体に樹脂が充填される過程において充填速度に偏りが見られ、周方向に均一な充填は行われない。また、パイプのゲートと反対側の位置(図でいうパイプの下側全体)に、ウェルドラインが発生してしまう場合がある。ウェルドラインは成形品の強度低下の恐れがあり、またその部分の表面性は位置著しく低下する。
【0035】
【発明の効果】
本発明によれば、真円度、真直度等の寸法精度に優れ、しかもフランジの組み付け作業が簡略化され、アース用の金属板などの取り付け作業を省略し得る感光ドラム用の円筒状基体を生産性よく製造することができる。
【図面の簡単な説明】
【図1】本発明によって製造される基体を用いた感光ドラムの一例を示す概略断面図である。
【図2】本発明で用いるピンゲート方式による金型の一例を示す概略断面図である。
【図3】本発明で用いるディスクゲート方式による金型の一例を示す概略断面図である。
【図4】従来の感光ドラムを示す概略断面図である。
【符号の説明】
11 円筒状本体
12 フランジ
10 円筒状基体(感光ドラム用基体)
26 ピンゲート
26’ ディスクゲート
20 金型
24 円筒状本体形成用キャビティ
25 フランジ形成用キャビティ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a substrate for a photosensitive drum for forming an electrostatic latent image on a surface for image formation in an electrophotographic apparatus such as a copying machine, a facsimile machine, a printer, or an electrostatic recording apparatus.
[0002]
[Prior art and problems to be solved by the invention]
In an electrostatic recording process in a copying machine, facsimile, printer, etc., first, the surface of the photosensitive drum is uniformly charged, and an image is projected from the optical system onto the surface of the photosensitive drum to erase the charged portion. Then, an electrostatic latent image is formed, and then toner is supplied to the electrostatic latent image to form a toner image by electrostatic adhesion of the toner, and this is applied to a recording medium such as paper, OHP, photographic paper, etc. A method of printing by transferring is employed.
[0003]
As a photosensitive drum used in such an electrostatic recording process, a photosensitive drum having the structure shown in FIG. 4 is generally used.
[0004]
That is, flanges 2a and 2b made of metal or resin are fitted and fixed to both ends of a cylindrical base 1 made of a metal such as aluminum or conductive resin, and the photoconductive layer 3 is formed on the outer peripheral surface of the cylindrical base 1. As shown in FIG. 3, this photosensitive drum generally has support shafts 4 and 4 provided on the main body a of the electrostatic recording apparatus, and both flanges 2a and 2b. Is inserted into the shaft holes 5 and 5 provided in the shaft 2 and is rotatably supported. On the other hand, a gear 7 connected to a driving source such as a motor is engaged with a driving gear 6 formed on the flange 2b to rotate. Is done.
[0005]
In this case, in order to charge the photoconductive layer 3 of the photosensitive drum and to form an electrostatic latent image on the photoconductive layer 3 by exposure, it is necessary to ground the photosensitive drum. When 2b is formed of an insulating resin, a metal plate is attached to the inner surface of the flange for grounding to connect the cylindrical substrate 1 and the support shaft 5 and grounded to the apparatus body a. .
[0006]
However, since the conventional photosensitive drum is assembled by fitting and fixing the flanges 2a and 2b to both ends of the cylindrical substrate 1, two assembly operations for assembling the flanges at both ends of the cylindrical substrate are necessary. In addition, since the cylindrical base 1 and the flanges 2a and 2b are formed separately, a high degree of processing accuracy is required when forming each of these parts, which increases the manufacturing cost. .
[0007]
Further, when the above-mentioned ground metal plate is required, it is necessary to assemble the ground metal plate, which further increases the manufacturing cost and wears the metal plate during operation of the drum. There is a possibility that good conduction with the support shaft 5 may not be obtained, and the reliability is not necessarily sufficient.
[0008]
In response to such a problem, the present applicant is provided with flanges on both end surfaces of the cylindrical base body on which the photoconductive layer is formed on the outer peripheral surface, and is supported rotatably by supporting both flanges. The photosensitive drum is characterized in that the cylindrical base is formed of a conductive resin and one flange is formed integrally with the cylindrical base using the same conductive resin. Japanese Patent Application No. 9-323805). In this photosensitive drum, one of the flanges provided at both ends of the cylindrical base is integrally formed of a conductive resin that forms the cylindrical base. Therefore, at least one end of the cylindrical base is attached to the flange. This flange is made of a conductive resin formed integrally with the cylindrical base body, and good conduction between the support shaft supporting the drum and the cylindrical base body can be reliably obtained by this flange. In addition, it is not necessary to use a metal plate for grounding, and high reliability can be obtained. Furthermore, since one flange is integrally formed with the cylindrical base body, its processing accuracy is also excellent.
[0009]
By the way, the conventional cylindrical substrate 1 shown in FIG. 4 is usually manufactured by injection molding using a side gate type mold in which a gate is provided outside the cylindrical cavity for molding the cylindrical substrate 1. However, in this method, there is a problem that a gate mark remains on the outer peripheral surface of the molded cylindrical substrate 1, and the resin is not uniformly filled in the cylindrical cavity, and the obtained cylindrical substrate is straight. There is a problem that the dimensional accuracy such as degree and roundness is inferior, and as a result, the printing and image characteristics of the photosensitive member are affected. In this respect, the same problem occurs when a cylindrical base body in which the one flange is integrally formed is used when a die using the side gate method is used.
[0010]
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for producing a photosensitive drum substrate that solves the above-described problems, has excellent dimensional accuracy, and provides good print image characteristics.
[0011]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a mold for forming a photosensitive drum substrate, which is integrally formed with a flange projecting inwardly on the inner peripheral edge of one end surface of a cylindrical body made of a conductive resin. In this case, three to six pin gates or disk gates are provided in communication with the flange forming cavity of the mold, and the flange forming cavity is electrically conductive from the flange forming cavity through the pin gate or disk gate. A method for producing a substrate for a photosensitive drum, characterized by injecting a resin material.
[0012]
According to the present invention, the conductive resin material is not injected from the cylindrical body forming cavity, but is injected from the flange forming cavity, and the resin material flows from the flange forming cavity to the cylindrical body forming cavity. Therefore, the molded substrate has no trace of the gate on the outer peripheral portion of the cylindrical body, and has good roundness and straightness and excellent dimensional accuracy as shown in the experimental examples described later.
[0013]
BEST MODE FOR CARRYING OUT THE INVENTION
The method for manufacturing a photosensitive drum substrate according to the present invention includes a cylindrical substrate 10 in which a flange 12 projecting inwardly on the inner peripheral edge of one end surface of a cylindrical body 11 as shown in FIG. How to get. The base body 10 has a flange 13 formed separately at the other end opening of the cylindrical main body 11 and is fixed thereto, and a photoconductive layer 14 is formed on the outer peripheral surface of the cylindrical main body 11. Used in the same manner as in FIG. The both flanges 12 and 13 are formed with shaft holes 15 and 15, respectively.
[0014]
As the conductive resin forming the cylindrical main body 11 and the one flange 12 formed integrally with the cylindrical main body 11, a conductive resin imparted with conductivity by blending a conductive agent is usually used. The resin used in this case is not particularly limited as long as it has an appropriate strength and can be molded by an injection molding method. Polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyamide resin (nylon) 6, Nylon 66, etc.), polyphenylene sulfide (PPS), polyacetal and the like are preferably used from the viewpoints of thermoplasticity, excellent moldability, and excellent mechanical strength and sliding properties.
[0015]
Further, the conductive agent may be any as long as it can be uniformly dispersed in the resin, and is not particularly limited, but carbon black, graphite, aluminum, copper, nickel, etc. Powders such as metal powder and conductive glass powder are preferably used. The blending amount of the conductive agent is preferably about 5 to 40% by weight, particularly about 5 to 20% by weight, so that the surface resistance value of the cylindrical substrate and the flange is 10 4 Ω / □ or less, particularly 10 2 Ω. / □ It is preferable to adjust to below.
[0016]
In this conductive resin, each fiber or the like can be used as a filler for the purpose of reinforcing or increasing the amount. As the fibers, conductive fibers such as carbon fibers, conductive whiskers and conductive glass fibers, and nonconductive fibers such as whiskers and glass fibers are used. In this case, the conductive fiber can also act as a conductive agent, and the amount of the conductive agent used can be reduced by using the conductive fiber. It is preferable to use fibers and increase the amount of the conductive agent used.
[0017]
The amount of these fillers is appropriately selected according to the type of resin and the length and diameter of the fibers used, and is not particularly limited, but is usually 2 to 25% by weight, particularly 5 to 15% by weight. It is preferable to set the degree.
[0018]
In addition to the above conductive agent and filler, an appropriate amount of a known additive such as PTFE (polytetrafluoroethylene), silicone, molybdenum disulfide (MoO 2 ) is added to the conductive resin as necessary. Can do.
[0019]
The photoconductive layer can be formed of a known material and composition.
[0020]
In the present invention, the base body on which the main body 11 and the one flange 12 are integrally molded is molded by injection molding with a mold using a pin gate system or a disk gate system of 3 to 6 points.
[0021]
FIG. 2 illustrates a molding method using this pin gate method. In FIG. 2, reference numeral 20 denotes a mold body 21 having a cylindrical hollow portion therein, and one end surface of the mold body 21, and the hollow portion. A mold auxiliary member 22 that is closed at one end opening of the mold and a core 23 having a tip 23 that is inserted into the hollow part so as to be axially movable from the other end opening. A cylindrical cavity 24 for forming the cylindrical main body 11 of the base body 10 is formed between the inner peripheral surface of the mold body 21 and the outer peripheral surface of the core 23, and the other end surface of the auxiliary member 22 and the core are formed. A cavity 25 for forming the flange 12 is formed between one end face (tip face) of the flange 23 and the one end part in the axial direction of the cylindrical cavity 24. A small-diameter cylindrical portion 23a projects from the center of the distal end surface of the core 23. When the distal end surface of the small-diameter cylindrical portion 23a comes into contact with the auxiliary member 22, the flange-forming cavity 25 has a substantially circular ring shape. Is formed.
[0022]
In the mold 20, the auxiliary member 22 is provided with 3 to 6 pin gates 26 which are spaced apart from each other at equal intervals. The tip ends of the pin gates 26 communicate with the flange forming cavity 25. In addition, the base end portion of the pin gate 26 is connected to the sprue 27. Reference numeral 28 denotes a projecting pin provided on the auxiliary member 22 so as to be movable in the axial direction. The projecting pin 28 is operated so as to project after the base 10 is molded and the core 23 is extracted from the mold body 21. Thus, the molded base 10 is removed from the mold 20. Reference numeral 29 denotes a cooling water circulation hole.
[0023]
When molding the photosensitive drum substrate 10 using the mold 20, the mold 20 is set in the state shown in FIG. 2, and the molding material (the conductive resin material) is passed through the sprue 27 and the above 3-6. It is injected from the pin pin 26 into the flange forming cavity 25. As a result, the resin material flows from the flange forming cavity 25 to the cylindrical cavity (cylindrical main body forming cavity) 24, and the cylindrical base body 10 in which the flange 12 is integrally connected to the cylindrical main body 11 is injection-molded. Is.
[0024]
Therefore, in the molded substrate, even if a gate mark due to the pin gate 26 remains on the end face of the flange, there is no gate mark on the outer peripheral surface of the cylindrical main body, and thus a photoconductive layer is formed thereon. There is no risk of problems due to gate traces. Moreover, when this method is used, gate cutting is automatically performed in the molding cycle by the above-described mold structure, so that a post-processing step can be omitted. As a result, the productivity is high and the manufacturing cost can be reduced as compared with the case where the side gate method requires individual gate processing.
[0025]
FIG. 3 illustrates a molding method using a disk gate method (in FIG. 3, the same components as those in FIG. 2 are denoted by the same reference numerals and the description thereof is omitted). Has a cylindrical projection 22a integrally projecting from the center of the other end surface of the auxiliary member 22, and projecting the projection 22a into the hollow portion of the mold body 21 (the hollow of the ring-shaped flange forming cavity 25). The sprue 27 provided on the auxiliary member 22 extends to the columnar protrusion 22a, and a disc gate 26 'is attached to the tip of the sprue 27 and the outer periphery of the gate 26'. This portion is formed so as to communicate with the inner peripheral portion of the flange forming cavity 25.
[0026]
Also in the case of using the mold shown in FIG. 3, the conductive resin material flows through the sprue 27 and is injected from the disk gate 26 ′ to the inner peripheral portion of the flange forming cavity 25, and is cylindrical from the flange forming cavity 25. The cylindrical base 10 is formed by flowing into the cavity 24. Therefore, even if the gate mark remains on the inner peripheral surface of the flange, there is no possibility that the gate mark is generated on the outer peripheral surface of the cylindrical main body. In addition, when such a disc gate is used, sprue cutting is possible only by punching after taking out the substrate, and the productivity is high.
[0027]
According to the above-described injection molding method, the molding material (conductive resin material) uniformly flows in the circumferential direction from the flange forming cavity 25 and uniformly flows into the cylindrical body forming cavity 24. Since it fills up to the end quickly, dimensional accuracy such as roundness and straightness of the cylindrical body is improved.
[0028]
Further, as described above, post-processing such as gate cutting and sprue cutting is omitted or simplified, and the production efficiency is high.
[0029]
Moreover, according to the above method, a cylindrical base body in which the cylindrical main body and a flange having a metal shaft through hole at one end thereof are integrally formed can be obtained, so that the mounting operation of the flange can be performed only on one side of the cylindrical main body. This simplifies the work. In this case, by integrally molding using a conductive resin material as a molding material, it is possible to omit the incorporation of metal parts for conduction with the flange and the shaft.
[0030]
When molding is performed by the above-described injection molding method, molding conditions such as molding temperature and injection pressure can be normal conditions according to the type of resin used.
[0031]
Next, an effect of the above molding method will be specifically described by an experimental example.
[Experimental example]
The following composition nylon 66 80 parts by weight carbon fiber 10 parts by weight carbon black 10 parts by weight of conductive resin material The following conditions molding temperature 260-290 ° C
Injection pressure 500-900Kg / cm 2
1 to produce a cylindrical substrate in which a ring-shaped flange is integrally formed at one end of a cylindrical body having a length of 230 mm, an outer diameter of 30 mm, and an inner diameter of 26 mm as shown in FIG.
[0032]
In this case, as a mold, a pin gate type (three pins) mold (present invention example 1) shown in FIG. 2, a disk gate type mold (present invention example 2) shown in FIG. 3, and a side gate are used. A method mold (comparative example) was used. In the case of the side gate type mold, the side gate is communicated with one end of the outer peripheral portion of the cylindrical body forming cavity, thereby injecting the resin material.
For the cylindrical substrate molded by the above method, the roundness was measured using a roundness measuring machine, and the straightness was measured using a laser scan micrometer. The results are shown in Table 1.
[0033]
[Table 1]
Figure 0004038632
[0034]
From the above results, it can be seen that the molding method according to the present invention can form a cylindrical substrate for a photosensitive drum having excellent roundness and straightness. In the case of the side gate method, the sprue into which the resin flows first is not at the center of the pipe as in the present invention example, but at a single point from the position on the side surface of the pipe. Therefore, while Examples 1 and 2 of the present invention are uniformly filled with resin in the circumferential direction of the pipe, the side gate method shows a bias in the filling speed in the process of filling the entire pipe with resin, and the circumferential direction Uniform filling is not performed. In addition, a weld line may occur at a position on the opposite side of the pipe gate (the entire lower side of the pipe in the figure). The weld line may cause a reduction in strength of the molded product, and the surface property of the portion is significantly lowered.
[0035]
【The invention's effect】
According to the present invention, there is provided a cylindrical substrate for a photosensitive drum which is excellent in dimensional accuracy such as roundness and straightness, which simplifies the assembly work of the flange and can omit the work of attaching a metal plate for grounding. It can be manufactured with high productivity.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view showing an example of a photosensitive drum using a substrate manufactured according to the present invention.
FIG. 2 is a schematic cross-sectional view showing an example of a pin gate type mold used in the present invention.
FIG. 3 is a schematic cross-sectional view showing an example of a disk gate type mold used in the present invention.
FIG. 4 is a schematic sectional view showing a conventional photosensitive drum.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Cylindrical main body 12 Flange 10 Cylindrical base | substrate (base | substrate for photosensitive drums)
26 Pin gate 26 'Disc gate 20 Mold 24 Cylindrical body forming cavity 25 Flange forming cavity

Claims (1)

導電性樹脂により形成された円筒状本体の一端面内周縁に内方に突出するフランジが一体に突設された感光ドラム用基体を金型により射出成形するに際し、上記金型のフランジ形成用キャビティに連通して3〜6点のピンゲート又はディスクゲートを設け、このピンゲート又はディスクゲートを通って上記フランジ形成用キャビティから円筒状本体形成用キャビティに導電性樹脂材料を射出することを特徴とする感光ドラム用基体の製造方法。A cavity for forming a flange of the above-mentioned mold is formed when a base for a photosensitive drum, in which a flange projecting inward is integrally formed on the inner peripheral edge of one end surface of a cylindrical main body formed of a conductive resin, is injection-molded by a mold. 3 to 6 pin gates or disk gates are provided in communication with each other, and a conductive resin material is injected from the flange forming cavities through the pin gates or disk gates into the cylindrical body forming cavities. A method for producing a drum substrate.
JP24425898A 1998-08-31 1998-08-31 Method for manufacturing substrate for photosensitive drum Expired - Fee Related JP4038632B2 (en)

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US20020037465A1 (en) * 1999-12-27 2002-03-28 Munenori Iizuka Mixed resin compound, resin pipe, production of resin pipe, and photosensitive drum
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