JP2573073B2 - Manufacturing method of electrical connection member - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method of manufacturing an electrical connection member for electrically connecting an electric circuit component.

[Conventional technology]

As a method of electrically connecting electric circuit components to each other,
Wire bonding method, TAB (Tape Automated Bondin)
g) The method is known. However, these methods have drawbacks such as an inability to cope with an increase in the number of connection points between the two electric circuit components and an increase in cost. In order to solve such difficulties, it has been proposed to electrically connect electric circuit components to each other by using an electric connection member having a configuration in which a plurality of conductive members are provided insulated from each other in an insulating holder. (JP-A-63-222437, JP-A-63-224235, etc.).

FIG. 3 is a schematic diagram showing an electrical connection between electric circuit components using such an electric connection member, in which 31 is an electric connection member, and 32 and 33 are electric circuit components to be connected. Show.
The electrical connection member 31 includes a plurality of conductive members 34 made of a metal or an alloy, each of which is electrically insulated from each other in a holding body 35 made of an electrically insulating material. The one end 38 of the conductive member 34 is exposed to the one electric circuit component 32 side, and the other end 39 of the conductive member 34 is connected to the other electric circuit component.
It is exposed on the 33 side (FIG. 3 (a)). Then, the connection portion 36 of the one electric circuit component 32 and the one end 38 of the conductive member 34 exposed on the electric circuit component 32 side are alloyed to connect the two, and the connection portion 37 of the other electric circuit component 33 is connected. The two are connected by alloying the other end 39 of the conductive member 34 exposed to the electric circuit component 33 (FIG. 3 (b)).

The electrical connection member having such a configuration has the following advantages and is excellent in practicality.

By miniaturizing the size of the conductive member, the connection portion of the electric circuit component can be reduced in size, the number of connection points can be increased, and high-density connection between the electric circuit components is possible.

Even if the electric circuit components have different thicknesses, the height of the electric circuit components can be kept constant by changing the thickness of the electric connection member, so that multi-layer connection can be easily performed and higher density can be achieved. Implementation is possible.

By increasing the protruding height of the conductive member connected to the connection portion of the electric circuit component, even if the connection portion of the electric circuit component is dropped from the surface, it is possible to perform stable connection, Even an electric circuit component having a complicated shape can be easily connected.

Since the amount of the conductive member used for the electrical connection member is small, the cost is low even when expensive metal is used.

Since the connection portion of the electric circuit component is alloyed via the electric connection member, there is no variation in the contact resistance, and the connection reliability is high.

[Problems to be solved by the invention]

However, an effective method of efficiently and at low cost manufacturing an electrical connecting member having such a configuration and capable of achieving higher density and finer connection between electrical circuit components has not yet been proposed. When manufacturing such an electrical connection member, the biggest issues are to prevent the conductive member from dropping out of the holder and to achieve high reliability of electrical connection with the electric circuit component.

The present invention has been made in view of the above circumstances, and it is possible to realize an electrical connection member that can realize high-density connection between electric circuit components and that can completely prevent a conductive member from being dropped from a holder. It is an object of the present invention to provide a method for manufacturing an electrical connection member.

[Means for solving the problem]

A method for manufacturing an electrical connection member according to the present invention includes a holder made of an electrically insulating material, and a plurality of conductive members provided in the holder in an insulated state from each other. One end is exposed on one surface of the holder,
In a method of manufacturing an electrical connection member in which the other end of each of the conductive members is exposed on the other surface of the holder,
A first layer and a second layer having a higher etching rate than the first layer.
A step of laminating a layer of a photosensitive resin serving as the holding member so as to be in contact with the second layer on a substrate having a layer of the photosensitive resin, and exposing and developing the layer of the photosensitive resin; Forming a plurality of holes in the photosensitive resin layer, exposing the substrate, etching and removing a portion of the exposed substrate, and forming the conductive member in the formed hole. The method includes a step of filling a conductive material and a step of removing a remaining substrate.

[Action]

In the method for manufacturing an electrical connection member according to the present invention,
A substrate is prepared in which a first layer having a high etching rate and a second layer having a high etching rate are laminated. Next, a layer of a photosensitive resin serving as a holder is laminated on the substrate in contact with the second layer, and the photosensitive resin layer is exposed and developed to form a plurality of holes. Next, a part of the exposed substrate is removed by etching. After filling a plurality of holes and the etching removal area with a conductive material to be a conductive member, the remaining base is removed. Then, the filled conductive materials are insulated from each other, and the holding member (photosensitive resin layer) is filled with a plurality of conductive members, and the electrical connection is configured such that both ends of each conductive member are exposed. The component is manufactured.

When a part of the base is removed by etching, the second layer has a higher etching rate than the first layer, so that substantially only the second layer is etched. As a result, it is possible to easily perform etching removal in a range wider than the diameter of the hole, and to control the range by the etching time. In the manufactured electrical connection member, the diameter of the conductive member is increased in a portion exposed from a portion embedded in the photosensitive resin layer (holding member), and the conductive member is not easily dropped from the holding member. Further, in the present invention, the height of protrusion of the conductive member from the holder can be controlled by the thickness of the second layer.

〔Example〕

(Example 1) Hereinafter, the present invention will be specifically described with reference to the drawings showing the examples.

FIG. 1 is a schematic sectional view showing a manufacturing process of the present invention. First, a first Ni layer 2 (2 μm thick) and a second Cu layer 3 (5 μm thick) were formed on a copper foil 1 (70 μm thick).
m) are prepared (FIG. 1 (a)). Prebaking is performed by applying a photosensitive polyimide resin 5 having a thickness of 10 μm on the base 4 (Cu layer 3) (FIG. 1 (b)). Next, after irradiating the polyimide resin 5 with light through a photomask (not shown), development is performed. In this example, the polyimide resin 5 remains in the exposed portion, and in the unexposed portion, the polyimide resin 5 is removed by a development process to form a hole 6 having a diameter of 90 μm (FIG. 1 (c)). Thereafter, the temperature is raised to cure the polyimide resin 5.

Next, the substrate 4 is immersed in FES5000 (a sulfuric acid-hydrogen peroxide-based etching solution manufactured by Mitsubishi Gas Chemical Company) and etched at 20 ° C. for 15 seconds while applying ultrasonic waves.
Here, since the etching rate of the Cu layer 3 is significantly higher than the etching rate of the Ni layer 2, only the Cu layer 3 near the hole 6 is removed by etching, and a concave portion 7 communicating with the hole 6 is formed in the Cu layer 3. (FIG. 1 (d)).

Holes 6, 6 are formed by gold plating using copper foil 1 as a common electrode.
The recess 7 is filled with gold 8 as a conductive material (FIG. 1 (e)). At this time, gold plating is continued until the embedded height becomes 20 μm. Finally, in 42 ゜ Be 'ferric chloride solution at 35 ℃, 30
Then, the substrate 4 is removed by metal etching to manufacture the electrical connection member 31 (FIG. 1 (f)).

In this embodiment, in the manufactured electrical connection member 31, the conductive member 34 is made of gold, and the holder 35 is made of polyimide resin.

FIG. 2 shows the electrical connection member 31 manufactured in this manner.
FIG. 3 is a partially enlarged view of FIG. 3, where d ₁ and d ₂ indicate the height and the diameter of the conductive member 34, respectively, and d ₃ , d ₄ , d ₅ and d ₆ indicate the protruding height and the bottom of the conductive member 34 respectively. Indicates the protruding height, upper protruding width, and lower protruding width. Of these, the upper projection height d ₃ and the lower projection height d _4, which contributes to the stability of the connection between the electric circuit components to be connected, these height is desirably more than 3μm . Further, the upper side projecting width d ₅ and the lower side projecting width d _6, it is involved in the missing prevention of the conductive member 34 during handling,
As long as the insulating property is maintained between the adjacent conductive members, it is better that these widths are large. Also among these, the upper projection height d ₃ and the upper side protrusion width d _5, is controlled by the time for gold plating, it is a lower projection height d ₄ and the lower side projecting width d _6, formed by etching Is determined by the shape of the concave portion 7 to be formed.

In the present invention, the second layer (Cu layer 3) is compared to the first layer (Ni layer 2), because the etching rate is extremely high, the etching depth that defines a lower projection height d ₄ is , Second
(Cu layer 3). Therefore, by adjusting the thickness of the second layer (Cu layer 3), the conductive member 34 is adjusted.
The lower projection height d ₄ of the can be set to a desired value. After the etching has progressed to the surface of the first layer (Ni layer 2), etching in the depth direction hardly progresses, and only etching in the lateral direction progresses. Therefore, by adjusting the etching time, the lower side projecting width d ₆ of the conductive member 34 can be set to a desired value. In order to make the progress of etching in the first layer negligible, it is preferable that the etching rate of the second layer is 10 times or more as compared with that of the first layer.

Example 2 2 μm thick Ni layer 2 and 7 μm thickness on 70 μm thick copper foil 1
Exactly the same conditions as in Example 1 except that the substrate 4 on which the Cu layer 3 was laminated was prepared, the etching time for forming the recess 7 was 20 seconds, and the filling height of the gold 8 was 24 μm. , An electrical connection member 31 was manufactured.

(Example 3) The electrical connection member 31 was manufactured under exactly the same conditions as in Example 2 except that the etching time for forming the concave portion 7 was 25 seconds.

Further, as a comparative example, a substrate consisting of a single layer of copper foil was prepared, the etching time for forming the recess 7 was 10 seconds, and the other manufacturing conditions were the same as in Example 1 to manufacture an electrical connection member. did.

For each electrical connection member manufactured as described above,
The cross-sectional shape was observed using a metallographic microscope. As a result, the upper protrusion height d ₃ , the lower protrusion height d ₄ , the upper protrusion width d ₅ , and the lower protrusion width d ₆ of the conductive member 34 were as shown in Table 1 below.

The surface of each of such electrical connection members was observed using a metal microscope, and the proportion of missing conductive members was investigated. Also, each electrical connection member is connected to a probe (one electrical circuit component) for measuring electrical resistance and a circuit substrate (the other electrical circuit component), and the resistance of the conductive member is measured to determine whether the electrical connection is good or bad. Judged. In addition, after each electric connection member is connected to a semiconductor element (one electric circuit component) and a circuit substrate (the other electric circuit component), and the electric circuit member formed is sealed by using an injection molding method, the IC is then sealed. Operation was confirmed. Furthermore, the operation of the IC after 100 heat cycles (one cycle of leaving at -50 ° C. for 30 minutes and 10 minutes and leaving it at 150 ° C. for 30 minutes and 10 minutes) was confirmed.

 The results of the above four types of experiments are shown in Table 2 below.

As understood from Tables 1 and 2, in the present invention, the width of the downward projection can be increased, and the conductive member can be prevented from dropping from the holder. Further, the upper and lower protruding heights can be set to predetermined values, and the connectivity with the electric circuit components is improved.

〔The invention's effect〕

As described in detail above, according to the present invention, it is possible to easily manufacture an electrical connection member filled with a conductive member with high accuracy so that the diameter of a portion exposed from the holder is larger than the diameter of a portion in the holder. It is possible to reliably prevent the conductive member from being lost, and to improve the product yield. Also, the desired amount of protrusion in the conductive member is ensured,
The present invention has excellent effects, for example, since it can be easily realized, it is possible to obtain an electrical connection member having high reliability of electrical connection between electrical circuit components.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing the steps of the manufacturing method of the present invention,
FIG. 2 is a partially enlarged view of the electrical connection member manufactured by the manufacturing method of the present invention, and FIG. 3 is a schematic view showing an example of use of the electrical connection member. 1 ... copper foil, 2 ... Ni layer, 3 ... Cu layer, 4 ... substrate, 5
... polyimide resin, 6 ... hole, 7 ... recess, 8 ...
Gold, 31: Electrical connection member, 34: Conductive member, 35: Holder

Continuing on the front page (72) Inventor Toyohide Miyazaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Hiroshi Kondo 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Takashi Sakaki ▼ Within Canon Inc. 3- 30-2 Shimomaruko, Ota-ku, Tokyo (72) Inventor Yoshimi Terayama Within Canon Inc. 3- 30-2 Shimomaruko, Ota-ku, Tokyo (72 Inventor Yoichi Tamura 1-3-3 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Takahiro Okabayashi 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) ) Inventor Kazuo Kondo 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Yasuo Nakatsuka 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72 Inventor Yuichi Ikegami 4-5-33 Kitahama, Chuo-ku, Osaka-shi, Osaka Sumitomo Gold In Industry Co., Ltd.

Claims (1)

(57) [Claims] 1. A holder comprising an electrically insulating material, and a plurality of conductive members provided in the holder in a state of being insulated from each other, one end of each of the conductive members being one end of the holder. A method of manufacturing an electrical connection member that is exposed on a surface and the other end of each of the conductive members is exposed on the other surface of the holder, wherein the first layer is etched from the first layer. Speed 2
Laminating a layer of a photosensitive resin serving as the holding member so as to be in contact with the second layer on a substrate having the above layers laminated; and exposing and developing the layer of the photosensitive resin, Forming a plurality of holes in the photosensitive resin layer and exposing the base; etching and removing a portion of the exposed base; forming the formed holes and the conductive member; A method for manufacturing an electrical connection member, comprising: a step of filling a conductive material; and a step of removing a remaining substrate.