JP3096816B2 - Manufacturing method of electrical connection member - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing an electrical connection member used when electrically connecting electric circuit components to each other.

[Conventional technology]

As a method of electrically connecting electric circuit components to each other,
Wire bonding method, TAB (Tape Automated Bondin)
g) The method is known. However, these methods have drawbacks such as an inability to cope with an increase in the number of connection points between the two electric circuit components and an increase in cost. In order to solve such difficulties, it is proposed to electrically connect electric circuit components to each other by using an electric connection member having a configuration in which a plurality of conductive members are buried insulated from each other in an insulating holder. (JP-A-63-2222437, JP-A-63-228726).
JP, JP-A-63-246835, etc.).

FIG. 4 is a schematic diagram showing an electrical connection between electrical circuit components using such an electrical connection member, in which 31 is an electrical connection member, and 32 and 33 are electrical circuit components to be connected. Show.
The electrical connection member 31 is configured by burying a plurality of conductive members 34 made of a metal or an alloy in a holder 35 made of an electrically insulating material by electrically insulating the respective conductive members 34 from each other. One end 38 of the conductive member 34 is connected to one of the electric circuit components 32.
And the other end 39 of the conductive member 34 is exposed to the other electric circuit component 33 (FIG. 4 (a)), and the connecting portion 36 of one electric circuit component 32 and the electric circuit component 32 are exposed. The one end 38 of the conductive member 34 exposed to the side is alloyed to connect the two, and the connecting portion 37 of the other electric circuit component 33 and the other end 39 of the conductive member 34 exposed to the electric circuit component 33 are connected. Both are connected by alloying (FIG. 4 (b)).

The electrical connection member having such a configuration and the electrical connection using the electrical connection member have the following advantages and are excellent in practicality.

By miniaturizing the size of the conductive member, the connection portion of the electric circuit component can be reduced in size, the number of connection points can be increased, and high-density connection between the electric circuit components is possible.

Even if the electric circuit components have different thicknesses, the height of the electric circuit components can be kept constant by changing the thickness of the electric connection member, so that multi-layer connection can be easily performed and higher density can be achieved. Implementation is possible.

By increasing the protruding height of the conductive member connected to the connection portion of the electric circuit component, even if the connection portion of the electric circuit component is dropped from the surface, it is possible to perform stable connection, Even an electric circuit component having a complicated shape can be easily connected.

Since the amount of the conductive member used for the electrical connection member is small, the cost is low even when expensive metal is used.

[Problems to be solved by the invention]

By the way, in an IC package in which an IC chip is sealed with resin, the connection between the outer lead, which is the lead portion exposed outside the resin after sealing, and the conductor of the printed wiring board is generally made by soldering. It is. As a method of connecting both by soldering, after inserting the outer lead into the through hole formed in the printed wiring board, connecting the outer lead to the conductor of the printed wiring board by manual or automatic soldering, or connecting on the wiring board A method is known in which solder paste is pre-printed on the part (wiring pad), an IC connected to the lead is mounted on this part, and the solder paste is reflowed by heating to connect the outer lead to the wiring pad. ing.

However, such a connection method has a problem in that there is a limit in the interval between adjacent outer leads, and it is not possible to cope with an IC chip having a multi-pin configuration.

The present invention has been made in view of such circumstances, and relates to an improvement in a method for manufacturing an electrical connection member, which has been previously filed, for example, connection between an outer lead having a short pitch of an IC package and a conductor of a printed wiring board. It is an object of the present invention to provide a method of manufacturing an electrical connection member that can easily perform the above.

[Means for solving the problem]

The method for manufacturing an electrical connection member according to the present invention includes a sheet-like holding member made of an electrically insulating material, and a plurality of rod-like members that penetrate the holding member in a thickness direction and are insulated from each other. A conductive member, wherein one end of each of the conductive members protrudes on one surface of the holder, and the other end of each of the conductive members protrudes on the other surface of the holder. In the manufacturing method, a resin layer to be the holder is provided on a metal plate, a plurality of holes penetrating the provided resin layer in a thickness direction are formed, and the recesses communicating with each of these holes are formed. A bar-shaped conductive member is formed by plating a solder, a metal to be a conductive member, and a solder in this order on the plurality of holes having the recess as a bottom, provided in a metal plate, and embedded in each hole. And projecting the conductive member to both sides of the resin layer. Parts, characterized in that the coating by solder.

[Action]

In the present invention, a plurality of holes are formed in a resin layer provided on a metal plate, and a concave portion communicating with the bottom of each hole is formed in the metal plate, and then, in these holes, solder, a metal to be a conductive member, By a series of plating processes of plating in the order of solder, a sheet-like holding member made of the resin layer, and a plurality of conductive members made of the metal held through the holding member in a thickness direction and insulated from each other The electrical connection member in which both ends of each conductive member protrude from both sides of the holder and these protrusions are covered with solder can be easily manufactured. When electric circuit components are connected to each other using the electric connection member manufactured in this manner, an electric connection is established between the electric circuit components so that the conductive member corresponds to the connection portion between the electric circuit components. Insert the connecting member,
Heat is applied to reflow the solder to connect the electric circuit components. Then, by reducing the pitch of the conductive members in the electrical connection member, fine soldering that cannot be performed by solder paste printing becomes possible.

〔Example〕

FIG. 1 is a cross-sectional view of an electrical connection member 1 manufactured by a method for manufacturing an electrical connection member according to the present invention. The electrical connection member 1 is provided with a plurality of short conductive rods 2 made of, for example, gold in a holding body 3 made of a polyimide resin such that the conductive members 2 are electrically insulated from each other. It is configured. Both end surfaces of each conductive member 2
As shown in the drawing, 2a and 2b are projected on both surfaces of the holder 3, and both end surfaces 2a of the conductive member 2 projected in this manner.
a, 2b are covered with the solder 4.

Next, an example of a manufacturing method according to the present invention for manufacturing such an electrical connection member will be described with reference to FIG.

First, a polyimide resin 12 serving as a holding body is applied on a prepared copper plate 11 together with an adhesion aid using a spinner (FIG. 2A). Here, the film thickness of the polyimide resin 12 applied in consideration of the decrease in film thickness due to curing is set to be larger than the desired film thickness of the holder in the manufactured electrical connection member.
Next, the polyimide resin 12 is irradiated (exposed) with light through a negative photomask (not shown) having a predetermined pattern, and then developed. In this example, the polyimide resin 12 remains in the exposed portion, and the unexposed portion removes the polyimide resin 12 by a development process to form a hole 13. Thereafter, the temperature is increased to cure the polyimide resin 12 (FIG. 2 (b)).

Next, the copper plate 11 thus treated is immersed in an etching solution to perform etching. This allows each hole
The surface of the copper plate 11 exposed at the bottom of the copper plate 11 is removed by etching, and a concave portion 14 communicating with the hole 13 is formed in the copper plate 11 (second
Figure (c). Using the copper plate 11 as a common electrode,
Electroplating is performed in the order of gold and solder, and solder 16, gold 15, and solder 16 are buried in the hole 13 and the recess 14 in this order (FIG. 2 (d)). Finally, the copper plate 11 is removed by metal etching to manufacture the electrical connection member 1 as shown in FIG.

In this embodiment, in the manufactured electrical connection member 1, the conductive member 2 and the holder 3 are made of gold and polyimide resin, respectively, and the conductive members protruding from both surfaces of the holder 3 are provided. The two end faces 2a, 2b of the second 2 are covered with the solder 4.

FIG. 3 is a schematic view showing an example of use of the electrical connection member of the present invention. In the figure, reference numeral 21 denotes an IC package having a number of outer leads 22, and reference numeral 23 denotes a printed wiring board on which a number of conductors 24 are printed. The conductive member 2 of the electrical connection member 1 is positioned between the outer lead 22 to be connected and the conductor 24, and connects the outer lead 22 and the conductor 24 by soldering by reflow heating. As described above, when the electrical connection member manufactured by the method of the present invention is used, even in an IC package having outer leads with a narrow pitch, connection with a printed wiring board becomes easy, and an IC chip having a multi-pin configuration is used. Implementation becomes possible. In the conventional method, the outer lead pitch is 0.
Although 4 mm was the limit, in the electrical connection member of the present invention,
It is also possible to mount IC packages with outer lead pitches of 0.4 mm or less to printed wiring boards.

〔The invention's effect〕

As described in detail above, in the method for manufacturing an electrical connection member according to the present invention, after forming a plurality of holes in a resin layer provided on a metal plate, a concave portion communicating with the bottom of each hole is formed in the metal plate. , In each hole and recess, solder, metal as a conductive member,
A plurality of conductive members are held on a sheet-shaped holding body by a series of steps of plating in the order of solder, and the ends of each conductive member protruding on both surfaces of the holding body are covered with solder. The members can be easily manufactured,
By using the electric connection member manufactured in this manner, the outer leads have a narrower pitch than before.
IC packages can also be mounted on printed wiring boards.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an electrical connection member manufactured by a method for manufacturing an electrical connection member according to the present invention, FIG. 2 is a cross-sectional view illustrating an example of a method for manufacturing an electrical connection member according to the present invention,
FIG. 3 and FIG. 4 are schematic views showing examples of use of the electrical connection member. DESCRIPTION OF SYMBOLS 1 ... Electrical connection member, 2 ... Conductive member, 3 ... Holder, 4 ... Solder

──────────────────────────────────────────────────続 き Continuing on the front page (72) Takahiro Okabayashi, Inventor, 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Kazuo Kondo, 1-3-1, Otemachi, Chiyoda-ku, Tokyo No. Sumitomo Metal Industries, Ltd. (72) Inventor Yasuo Nakatsuka 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Tetsuo Yoshizawa 3-30-2 Shimomaruko, Ota-ku, Tokyo Within Canon Inc. (72) Inventor Toyohide Miyazaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Hiroshi Kondo 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Takashi Sakaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Yoshimi Terayama Shimomaru, Ota-ku, Tokyo 3-30-2 Canon Inc. (56) References JP-A-62-234804 (JP, A) JP-A-2-68812 (JP, A) JP-A-2-49370 (JP, A) 63-96811 (JP, A) US Patent 4,902,857 (US, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 11/01 H01L 21/60 311 H01R 12/06 H01R 43 / 00

Claims (1)

(57) [Claims] 1. A sheet-like holding member made of an electrically insulating material, and a plurality of rod-shaped conductive members penetrating the holding member in a thickness direction and insulated from each other. One end of each conductive member protrudes on one surface of the holder, and the other end of each conductive member protrudes on the other surface of the holder. A resin layer to be provided is provided on a metal plate, a plurality of holes penetrating the provided resin layer in the thickness direction are formed, and a recess communicating with each of these holes is provided in the metal plate,
In the plurality of holes with the recesses as the bottom, solder, metal to be a conductive member, plating in the order of the solder, forming a rod-shaped conductive member by the metal buried in each hole,
A method for manufacturing an electrical connection member, comprising: projecting portions of the conductive member on both surfaces of the resin layer with solder.