JP3038361B2 - Manufacturing method of electrical connection member - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electric connection member used for electrically connecting electric circuit components.

[0002]

2. Description of the Related Art As a method of electrically connecting electric circuit components to each other, a conventional wire bonding method, TAB (Tape A
The uto-mated bonding method and the like are known. However, all of these methods have the disadvantage that the cost is high, the number of connection points between the two electric circuit components is increased, and if the connection point density is increased, it cannot be handled. In order to solve such difficulties, there is known a technique of electrically connecting electric circuit components to each other by using an electric connection member provided with a plurality of conductive members in an insulating state in an insulating holder. I have. As a method of manufacturing such an electrical connection member, a conventional method is disclosed in Japanese Patent Application Laid-Open No. 2-49385.
There has been proposed in Japanese Patent Publication No. Hereinafter, this manufacturing method will be described with reference to FIG.

FIG. 4 is a schematic cross-sectional view showing the main steps of a conventional method for manufacturing an electrical connection member. First, a metal sheet 51 serving as a base is prepared (FIG. 4 (a)). Then, a photosensitive resin 52 is applied by a spinner and prebaked (FIG. 4B). The photosensitive resin 52 is irradiated with light through a photomask (not shown) having a predetermined pattern, exposed to light, and developed (FIG. 4C). As a result, the photosensitive resin 52 remains in the exposed portion, and the photosensitive resin 52 is removed by a developing process in the unexposed portion, and a hole 53 is formed at the bottom where the surface of the metal sheet 51 is exposed. After the temperature is raised to cure the photosensitive resin 52, these are immersed in an etchant to etch the surface of the metal sheet 51 exposed in the hole 53, thereby forming a concave portion 54 (FIG. 4 ( d)). Then hole 5
3. Gold 55 is filled in the concave portion 54 and gold plating is performed so as to swell to a predetermined height on the surface of the photosensitive resin 52 to form a bump (FIG. 4E). Finally, the metal sheet 51 is removed by etching, and the gold 55 serves as a conductive member and a photosensitive resin.
The electrical connection members 61 each comprising the holder 52 are manufactured (FIG. 4 (f)).

The dimensions of each part of the electrical connection member 61 are such that the thickness of the photosensitive resin 52 is about 10 as shown in FIG.
μm, the diameter of the hole 53 (columnar portion of the gold 55) is about 20 μm, the pitch is about 40 μm, and the protrusion height of the gold 55 is about several μm on both sides. FIG. 5 is a schematic diagram showing an electrical connection mode between electrical circuit components using such an electrical connection member.
(a) In the figure, 61 indicates an electrical connection member, and 62 and 63 indicate electrical circuit components to be connected. The electrical connection member 61 is a photosensitive resin film that is a holder made of an electrically insulating material by electrically insulating a plurality of conductive members 55 made of metal or alloy from each other.
52, one of the electric circuit components 62 facing the side where one end 55a of the gold 55 is exposed, and the other end 55
The other electric circuit component 63 faces the side where b is exposed (FIG. 5 (a)). Then, the connecting portion 66 of the one electric circuit component 62 and one end 55a of the gold 55 are alloyed, and the connecting portion 67 of the other electric circuit component 63 and the other end 55b of the gold 55 are alloyed, so that both are alloyed. Connect (FIG. 5 (b)).

[0005]

In such a conventional method, the so-called bump protruding height, which is a portion of the gold 55 of the photosensitive resin 52 as a holder, is shown in FIG. 5 (b). As described above, it is indispensable as a deformation allowance for ensuring the bondability between the electric circuit components 62 and 63 and the connecting portions 66 and 67, but in the conventional method, the metal sheet in the etching step shown in FIG. The depth is determined by the etching depth with respect to the surface 51, that is, the depth of the concave portion 54, and the height of the raised portion in the gold plating step shown in FIG. However, it takes a long time to increase the etching depth and the height of the swelling, and furthermore, the variability increases, and as the depth and height increase, the lateral spread increases. There is a risk that adjacent bumps may come into contact with each other, and there is a limit to increasing the protruding height of the bumps only by changing the etching conditions and the gold plating conditions.

If the height of the bumps is low, the bumps can be removed as shown in FIG.
(a), as shown in FIG. 5 (b), the amount of bump deformation at the time of contact with other connecting parts 66, 67, etc. is reduced,
If a passivation film is provided to protect the passivation film,
A non-contact state occurs due to a step formed between the bumps and the surface. To prevent this, the contact pressure between the bumps and the connection portions 66 and 67 must be increased, and sufficient reliability is secured. The problem that it is difficult arises. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide an electrical connection member capable of increasing the apparent protrusion height of a bump and securing a sufficient bump deformation allowance. To provide a method for manufacturing the same.

[0007]

According to a first aspect of the present invention, there is provided a method for manufacturing an electrical connection member, comprising: a holder made of an electrically insulating material; and a plurality of conductive members provided in the holder in a state of being insulated from each other. Producing an electrical connection member having one end of each conductive member exposed on one surface of the holder and the other end of each conductive member exposed on the other surface of the holder. A method of laminating a first photosensitive resin film and a second photosensitive resin film constituting a holding body on the conductive surface of the base in this order or in the reverse order; Exposing and developing the first and second photosensitive resin films to form a plurality of holes at the bottom where the conductive surface of the substrate is exposed; and etching the surface of the substrate exposed in the holes to form a recess. Forming a hole, filling a conductive member in the recess and the hole, and forming a conductive material on the hole. Characterized in that it comprises depositing to enliven wood, and removing the substrate and the second photosensitive resin layer.

According to a second aspect of the present invention, there is provided a method for manufacturing an electrical connection member, comprising: a holder made of an electrically insulating material; and a plurality of conductive members provided in the holder in an insulated state from each other.
One end of each of the conductive members is exposed on one surface of the holder, and the other end of each of the conductive members is exposed on the other surface of the holder. A step of laminating a first photosensitive resin film constituting a holding body on a surface having conductivity, and second and third photosensitive resin films sandwiching the first photosensitive resin film; Exposing and developing the first, second, and third photosensitive resin films to form a plurality of holes at the bottom where the conductive surface of the base is exposed;
Etching a surface of the base exposed in the hole to form a concave hole, filling the hole and the concave with a conductive member, depositing the conductive member on the hole so as to swell the conductive member, Removing the second and third photosensitive resin films.

[0009]

According to the present invention, the second material removed by this method
Alternatively, the conductive member protrudes from the surface of the holder by an amount corresponding to the thickness of the third photosensitive resin film, and a sufficient processing allowance can be obtained.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings showing the embodiments. [Embodiment 1] FIG. 1 is a schematic sectional view showing main manufacturing steps of Embodiment 1 of the present invention. First, as a substrate, for example, a copper plate 1 having a tungsten (W) film laminated on its surface is prepared (FIG. 1A), and a polyimide constituting a first photosensitive resin film constituting a holder is formed on the copper plate 1. A resin film 2 is applied to a uniform thickness, prebaked, and a resist 3 constituting a second photosensitive resin film is applied to the surface thereof. After prebaking, the polyimide resin film 2 and the resist 3 are exposed and developed. To form a hole 5 at the bottom where the W film on the surface of the copper plate 1 is exposed,
The polyimide resin film 2 and the resist 3 are hard baked (FIG. 1B). In this state, the surface of the copper plate 1 exposed in the hole 5 by being immersed in an etching solution is etched to form a concave hole 6 therein (FIG. 1C).

A conductive member 7 such as gold is filled in each of the holes 5 and the concave holes 6 by plating using the copper plate 1 as an electrode, and the conductive member 7 rises from the surface of the resist 3 above the holes 5 (FIG. 1). (d)). Then, hard baked resist 3
Is removed by ashing using O ₂ plasma (FIG. 1 (e)) or by selectively etching the copper plate 1 (FIG. 1 (f)), and the conductive member 7 constitutes an electrically conductive material. Then, the polyimide resin film 2 serving as the first photosensitive resin film constitutes a holder, and an electrical connection member in which a part of the conductive member 7 protrudes greatly above the holder is manufactured (FIG. 1 (g)). .
In the first embodiment, by appropriately setting the thickness of the resist 3, which is the second photosensitive resin film, it is possible to arbitrarily set the bump height.

[Embodiment 2] In this embodiment 2, a polyimide resin film 2 which is a first photosensitive resin for forming a holder for the surface side of a copper plate 1 having a tungsten film formed on the surface is formed. The order of lamination with the resist 3 which is the photosensitive resin of No. 2 is reverse to that of the embodiment 1, that is, the resist 3 is first formed on the copper plate 1 and then the polyimide resin film 2 is formed in this order. Other steps are substantially the same as those in the first embodiment. First, a resist 3 is applied to a copper plate 1 having a tungsten (W) film formed on the surface thereof, and after prebaking, a polyimide resin is applied to form a polyimide resin film 2.

Thereafter, exposure is performed from the surface side of the polyimide resin film 2 and development is performed to form a hole 5 at the bottom where the W film on the surface of the copper plate 1 is exposed, and the polyimide resin film 2 and the resist 3 are hard baked ( FIG. 2 (b). After the recesses 6 are formed in the copper plate 1 by plasma etching (FIG. 2C), the conductive members 7 such as gold are filled in the holes 5 and the recesses 6 by plating using the copper plate 1 as electrodes, and The conductive member 7 is raised above the hole 5 from the surface of the polyimide resin film 2. Thereafter, the copper plate 1 and the resist 3 are sequentially removed as shown in FIGS. 2 (d) and 2 (e), and the other end of the conductive member 7 as shown in FIG. 2 (f) projects greatly below the holder. Manufacture electrical connection members.
Also in the second embodiment, it is possible to arbitrarily set the bump height by appropriately setting the thickness of the resist 3.

[Embodiment 3] FIG. 3 is a schematic sectional view showing main steps of Embodiment 3 of the present invention. In the third embodiment, a resist 3 constituting a second photosensitive resin film is first applied on a copper plate 1 having a tungsten film formed on a surface thereof, and the resist 3 is prebaked. A polyimide resin film 2 constituting a film is applied, and a resist 4 constituting a third photosensitive resin film is further applied thereon and prebaked to form a three-layer structure of the photosensitive resin film (FIG. 3
In (a)), exposure is performed from the front side of the resist 4 and development is performed. Other steps are substantially the same as those of the first and second embodiments. That is, after exposing from the surface side of the resist 4 and developing to form a hole 5 at the bottom where the W film on the surface of the copper plate 1 is exposed (FIG. 3 (b)), a spherical shell is formed on the surface of the copper plate 1 by plasma etching. Is formed (FIG. 3 (c)).

Next, a conductive member 7 such as gold is filled in the concave hole 6 and the hole 5 by plating using the copper plate 1 as an electrode.
The conductive member 7 is raised from the surface of the resist 4 (FIG. 3 (d)). Thereafter, the copper plates 1, the resists 3 and 4 are sequentially removed by etching, and the prebaked resists 3 and 4 are further removed.
Is removed by ashing using O ₂ plasma, a conductive member 7 such as gold as shown in FIG. 3 (e) forms an electrically conductive material, and the polyimide resin film 2 forms an electrical connection member which forms a holder. To manufacture.

In the third embodiment, the bumps are formed so as to protrude from both sides of the insulating holder by a length corresponding to the thicknesses of the resists 3 and 4, respectively. This has the effect of increasing the margin for bump deformation.

In Embodiments 1 to 3 described above, the configuration using the copper plate 1 having a W film formed on the surface as the substrate has been described. However, the present invention is not particularly limited thereto.
Instead of W, a high melting point metal such as Mo or Ni which does not alloy even when subjected to heat treatment with a conductive member and which does not generate an intermetallic compound with gold which is a conductive member may be used. Further, the base itself may be composed of these materials, and any material may be used as long as it can remove the holder and the conductive member without etching.

[0018] In addition to the photosensitive polyimide resin, a photosensitive epoxy resin may be used as the holder as an electrical insulating material. In these resins, powder, fiber, plate,
One or more of inorganic materials, metal materials, and alloy materials having a desired shape such as a rod-like body and a spherical body may be dispersed and contained. Au, Ag, Cu, Al, Be, Ca, Mg, Mo, Fe, Ni, Co, M
n, W, Cr, Nb, Zr, Ti, Ta, Zn, Sn, Pb-Sn, etc., and the inorganic materials contained are SiO ₂ , B ₂ O ₃ , Al
₂ O ₃ , Na ₂ O, K ₂ O, CaO, ZnO, BaO, PbO, Sb
₂ O ₃ , As ₂ O ₃ , La ₂ O ₃ , ZrO ₂ , P ₂ O ₅ , TiO
_{2, MgO, SiC, BeO,} BP, BN, AlN, B 4 C, TaC, Ti
Ceramics such as B ₂ , CrB ₂ , TiN, Si ₃ N ₄ and Ta ₂ O ₅ , diamond, glass, carbon, boron and the like can be mentioned.

Further, gold was used as the material of the conductive member, but instead of Cu, Ag, Be, Ca, Mg, Mo, Ni, W, Fe,
Simple metals such as Ti, In, Ta, Zn, Al, Sn, and Pb-Sn or alloys thereof may be used. The cross-sectional shape of the conductive member can be circular, square or any other shape.
A shape without corners is desirable to avoid excessive concentration of stress.

[0020]

As described above, in the method of the present invention, the conductive member has an apparent length corresponding to the thickness of the second and / or third photosensitive resin films from one or both sides of the holder. It becomes an upper protruding state, the deformation allowance of the conductive member is large accordingly, low pressure bonding can be performed at the time of bonding with other electrodes and the like, and an excessive force can be prevented from being applied to the electrodes and the like,
In addition, the present invention has excellent effects such as reliable joining even if the electrodes and the like have warpage, bending, irregularities, etc., and the reliability of the joining property is improved.

[Brief description of the drawings]

FIG. 1 is a schematic cross-sectional view showing main manufacturing steps of a first embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view illustrating main manufacturing steps of a second embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view showing main manufacturing steps of a third embodiment of the present invention.

FIG. 4 is a schematic cross-sectional view showing main manufacturing steps of a conventional method.

FIG. 5 is a schematic sectional view showing a connection mode of an electrical connection member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Copper plate 2 Polyimide resin film 3,4 Resist 5 Hole 6 Concave hole 7 Conductive member

────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Toyohide Miyazaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Inside Canon Inc. (72) Inventor ▲ Takashi Sakaki ▼ 3-30-2 Shimomaruko, Ota-ku, Tokyo Within Canon Inc. (72) Inventor Yoshimi Terayama 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Inventor Yoichi Tamura 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries (72) Inventor Takahiro Okabayashi 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Kazuo Kondo 1-3-1, Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries (72) Inventor Yasuo Nakatsuka 1-3-1 Otemachi, Chiyoda-ku, Tokyo Sumitomo Metal Industries, Ltd. (72) Inventor Yuichi Ikegami Osaka 4-5-33 Kitahama, Chuo-ku Sumitomo Metal Industries, Ltd. (56) References JP-A-63-224235 (JP, A) JP-A-2-49385 (JP, A) JP-A-3-182080 (JP) JP-A-3-192666 (JP, A) JP-A-3-269976 (JP, A) JP-A-3-269977 (JP, A) JP-A-3-283373 (JP, A) JP-A-3-283374 (JP, A) JP-A-3-283375 (JP, A) JP-A-3-283379 (JP, A) JP-A-4-2071 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 11/01 H01R 43/00

Claims (2)

(57) [Claims] 1. A holder comprising an electrically insulating material, and a plurality of conductive members provided in the holder in a state of being insulated from each other, one end of each of the conductive members being one surface of the holder. Wherein the other end of each of the conductive members is exposed to the other surface of the holding member, and wherein the holding member is formed on the conductive surface of the base. A step of laminating a photosensitive resin film and a second photosensitive resin film in this order or in the reverse order, exposing and developing the first and second photosensitive resin films, and Forming a plurality of holes in which the conductive surface of the base is exposed, and forming a recess by etching the surface of the base exposed in the holes;
A step of filling the recess and the hole with a conductive member, depositing the conductive member on the hole so as to rise, and removing the base and the second photosensitive resin film. A method for manufacturing an electrical connection member. 2. A holding body made of an electrically insulating material, and a plurality of conductive members provided in the holding body so as to be insulated from each other, one end of each of the conductive members being one surface of the holding body. Wherein the other end of each of the conductive members is exposed to the other surface of the holding member, and wherein the holding member is formed on the conductive surface of the base. And the second and second photosensitive resin films sandwiching the first photosensitive resin film.
A step of laminating and forming a third photosensitive resin film, and exposing and developing the first, second, and third photosensitive resin films to expose a conductive surface of the base at the bottom. Forming a hole by etching the surface of the substrate exposed in the hole, filling the hole and the recess with a conductive member, and depositing the conductive member on the hole so as to rise. And a step of removing the base and the second and third photosensitive resin films.