JP2019176224A - Vibrator, oscillator, electronic apparatus, and movable body - Google Patents

Abstract

An object of the present invention is to provide a vibrator, an oscillator, an electronic device, and a moving body in which stress applied to a vibrating element transmitted from a package is sufficiently reduced. The vibrator is provided with a vibrating element, a flat plate portion having the vibrating element attached to one main surface thereof, and an upright standing from the flat plate portion on the one main surface side, and a thickness of the flat plate portion. A relay board provided with an upright portion provided outside the vibrating element as viewed from above, and the vibrating element and the relay board are housed, and the relay board is attached at a tip end of the upstanding section. And a package. [Selection diagram] Fig. 1

Description

  The present invention relates to a vibrator, an oscillator, an electronic device, and a moving object.

  For example, Patent Document 1 includes a package main body having openings on the upper and lower surfaces and a stepped portion facing the central portion, a piezoelectric vibration element, and an IC component that forms an oscillation circuit and a compensation circuit. A surface mount piezoelectric oscillator is described. In such a surface-mounted piezoelectric oscillator, an IC component is bonded to the upper surface of the stepped portion, and a piezoelectric vibration element is bonded to the lower surface of the IC component.

JP 2006-87011 A

  In such a surface mount piezoelectric oscillator of Patent Document 1, as described above, since the piezoelectric vibration element is bonded to the package via the IC component, for example, when the piezoelectric vibration element is directly bonded to the package Compared with, the stress from the package is not easily transmitted to the piezoelectric vibration element. However, the surface mount piezoelectric oscillator of Patent Document 1 also has a problem that the stress from the package is transmitted to the piezoelectric vibration element, and the effect is not sufficient.

One embodiment of the present invention includes a vibration element;
A flat plate portion on which the vibration element is attached on one main surface side, and is provided upright on the one main surface side from the flat plate portion and provided outside the vibration element when viewed from the thickness direction of the flat plate portion. A relay board comprising:
And a package in which the vibration element and the relay board are housed and the relay board is attached to a tip of the standing portion.

  In one aspect of the present invention, it is preferable that the standing portion protrudes more than the vibration element in the thickness direction.

In one aspect of the present invention, the flat plate portion is rectangular when viewed from the thickness direction,
The standing portion is preferably provided along a first side of the flat plate portion and a second side facing the first side.

In one aspect of the present invention, the flat plate portion is rectangular when viewed from the thickness direction,
The standing portion is provided along the first side of the flat plate portion,
It is preferable that the attachment position of the vibration element and the flat plate portion is closer to the second side facing the first side than the first side.

In one aspect of the present invention, the vibration element has a vibration substrate and an excitation electrode disposed on the vibration substrate,
The flat plate portion is preferably provided with a through hole at a position overlapping the excitation electrode when viewed from the thickness direction.

  In one aspect of the present invention, it is preferable that the relay substrate has a wiring that is disposed across the flat plate portion and the standing portion and is electrically connected to the vibration element.

In one aspect of the present invention, the inner surface of the standing portion is an inclined surface that forms an obtuse angle with the one main surface,
The wiring is preferably disposed across the one main surface and the inner surface.

  In one aspect of the present invention, it is preferable that the relay substrate and the vibration element have a substrate made of the same material.

  In one aspect of the present invention, the material is preferably quartz.

One embodiment of the present invention includes a vibration element;
A flat plate portion on which the vibration element is attached on one main surface side, and is provided upright on the one main surface side from the flat plate portion and provided outside the vibration element when viewed from the thickness direction of the flat plate portion. A relay board comprising:
A circuit element including an oscillation circuit to which the relay substrate is attached in the upright portion and oscillates the vibration element;
An oscillator having the vibration element, the relay board, and the circuit element, and a package to which the circuit element is attached.

  One embodiment of the present invention is an electronic device including the vibrator of one embodiment of the present invention.

  One embodiment of the present invention is a moving object including the vibrator of one embodiment of the present invention.

1 is a cross-sectional view of a vibrator according to a first embodiment of the present invention. FIG. 2 is a bottom view of a relay substrate included in the vibrator illustrated in FIG. 1. FIG. 3 is a perspective view of the relay board shown in FIG. 2. FIG. 2 is a top view of a vibration element included in the vibrator illustrated in FIG. 1. FIG. 5 is a bottom view of the vibration element shown in FIG. 4. It is a figure explaining the relationship between an AT cut quartz substrate and the crystal axis of quartz. It is a perspective view which shows the relationship of the crystal axis of a relay substrate and a vibration element. It is a perspective view of the relay board which the vibrator concerning a 2nd embodiment of the present invention has. It is a perspective view of the relay substrate which the vibrator concerning a 3rd embodiment of the present invention has. It is a perspective view of the relay board which the vibrator concerning a 4th embodiment of the present invention has. It is sectional drawing which shows the vibrator | oscillator concerning 5th Embodiment of this invention. FIG. 12 is a perspective view of a relay substrate included in the vibrator illustrated in FIG. 11. It is a top view of the relay board which the vibrator concerning a 6th embodiment of the present invention has. It is AA sectional view taken on the line in FIG. It is sectional drawing for demonstrating the frequency adjustment method of a vibration element. It is sectional drawing which shows the oscillator concerning 7th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 8th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 9th Embodiment of this invention. It is a perspective view which shows the electronic device which concerns on 10th Embodiment of this invention. It is a perspective view which shows the mobile body which concerns on 11th Embodiment of this invention.

  Hereinafter, a vibrator, an oscillator, an electronic device, and a moving body of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
First, the vibrator according to the first embodiment of the invention will be described.

  FIG. 1 is a cross-sectional view of a vibrator according to the first embodiment of the present invention. FIG. 2 is a bottom view of the relay substrate included in the vibrator shown in FIG. FIG. 3 is a perspective view of the relay board shown in FIG. FIG. 4 is a top view of the vibration element included in the vibrator illustrated in FIG. 1. FIG. 5 is a bottom view of the vibration element shown in FIG. 4. FIG. 6 is a diagram for explaining the relationship between the AT-cut quartz substrate and the crystal axis of quartz. FIG. 7 is a perspective view illustrating the relationship between the crystal axes of the relay substrate and the vibration element. In the following, for convenience of explanation, the upper side in FIG. 1 is also referred to as “upper” and the lower side is also referred to as “lower”.

  As shown in FIG. 1, the vibrator 1 includes a vibration element 2, a relay substrate 3, and a package 5 that stores them. The vibration element 2 is supported by the relay substrate 3, and the relay substrate 3 is supported by the package 5. As described above, by interposing the relay substrate 3 between the vibration element 2 and the package 5, for example, stress due to thermal deflection or the like of the package 5 is difficult to be transmitted to the vibration element 2. In particular, it is possible to suppress a decrease in frequency characteristics. Hereinafter, each part of the vibrator 1 will be sequentially described in detail.

[package]
As shown in FIG. 1, the package 5 has a storage space S inside, and the vibration element 2 and the relay substrate 3 are stored in the storage space S. Therefore, the vibration element 2 and the relay substrate 3 can be suitably protected from impact, dust, heat, moisture and the like by the package 5. The package 5 includes a base 51 having a recess 511 that opens to the upper surface 51a, and a lid 52 that has a plate shape and is joined to the upper surface 51a of the base 51 so as to close the opening of the recess 511. In this manner, the storage space S is formed by closing the opening of the recess 511 with the lid 52, and the vibration element 2 and the relay substrate 3 are stored in the storage space S. The storage space S is hermetically sealed and is in a reduced pressure state (preferably in a state closer to a vacuum). Thereby, the vibration element 2 can be driven stably. However, the atmosphere of the storage space S is not particularly limited, and may be atmospheric pressure, for example.

  The constituent material of the base 51 is not particularly limited, and for example, various ceramics such as aluminum oxide can be used. In this case, the base 51 can be manufactured by firing a laminate of ceramic sheets. On the other hand, the constituent material of the lid 52 is not particularly limited, but may be a member whose linear expansion coefficient approximates that of the constituent material of the base 51. For example, when the constituent material of the base 51 is ceramic as described above, an alloy such as Kovar is preferable.

  The base 51 has a plurality of internal terminals 53 disposed on the bottom surface of the recess 511 and a plurality of external terminals 54 disposed on the bottom surface 51 b of the base 51. Each internal terminal 53 is electrically connected to a predetermined external terminal 54 via an internal wiring (not shown) formed inside the base 51. The plurality of internal terminals 53 are electrically connected to the relay substrate 3 via the first bonding member 61. The number of the internal terminals 53 is not particularly limited, and can be set as appropriate according to the configuration of the vibration element 2 and the like.

[Relay board]
As shown in FIG. 1, the relay substrate 3 is interposed between the base 51 and the vibration element 2. The vibration element 2 is fixed to the base 51 via the relay substrate 3. Such a relay substrate 3 mainly has a function of making it difficult for stress generated by deformation of the package 5 to be transmitted to the vibration element 2.

  As shown in FIGS. 2 and 3, the relay substrate 3 includes a substrate 31 and a pair of wirings 38 and 39 disposed on the substrate 31. The substrate 31 includes a flat plate portion 32 and a standing portion 33 erected from the flat plate portion. The flat plate portion 32 is rectangular when viewed from the thickness direction thereof, and has opposing sides 32a and 32b and sides 32c and 32d connecting the sides 32a and 32b. In particular, in this embodiment, the flat plate part 32 is a rectangle whose sides 32c and 32d are long sides.

  In the specification of the present application, the term “rectangle” is not limited to a shape that matches the rectangle, but, for example, at least one corner is rounded, part of the corner is missing, or four sides 32a to 32d. It includes a shape in which at least one curved portion or a bent portion is provided, or at least one corner portion is slightly deviated from a right angle. In addition, the shape of the flat plate portion 32 is not particularly limited, and may be, for example, a circle, an oval, an ellipse, a square (rectangle), a quadrilateral other than a rectangle, a pentagon or more polygon.

  A lower surface 321 of the flat plate portion 32 is a joint surface with the vibration element 2. Then, the vibration element 2 and the lower surface 321 are bonded via the first bonding member 61, and thereby the vibration element 2 is fixed to the relay substrate 3. Here, the flat plate portion 32 is larger than the vibration element 2 and includes the entire area of the vibration element 2 when viewed in the thickness direction. That is, the flat plate portion 32 overlaps the entire area of the vibration element 2 when viewed from the thickness direction. However, the present invention is not limited to this. For example, when viewed from the thickness direction of the flat plate portion 32, a part of the vibration element 2 may not overlap the flat plate portion 32.

  Although it does not specifically limit as the 1st joining member 61 which joins the vibration element 2 and the relay substrate 3, For example, various conductive adhesives, various metal brazing materials, various metal bumps, etc. are mentioned. However, among these, it is preferable to use metal bumps as the first bonding member 61. According to the metal bump, outgas from the first joining member 61 is reduced as compared with other materials, and an environmental change in the storage space S, in particular, an increase in pressure can be effectively suppressed. Therefore, it is possible to effectively suppress fluctuations in the vibration characteristics of the vibration element 2 due to environmental changes. In addition, it does not specifically limit as a constituent material of a metal bump, For example, metals, such as gold | metal | money (Au), silver (Ag), copper (Cu), aluminum (Al), platinum (Pt), or its alloy, lead-free solder And leaded solder. Further, the metal bumps can be formed by using, for example, a plating method, a bonding method, and the like, and can be joined by pressure welding, heat pressure, ultrasonic combined heat pressure welding, or the like.

  Further, the standing portion 33 is configured by a convex portion, and is erected so as to protrude downward from the flat plate portion 32, that is, toward the bottom surface of the concave portion 511. The standing portion 33 includes a first standing portion 331 provided along the side 32a of the flat plate portion 32 and a second standing portion 332 provided along the side 32b. The first and second upright portions 331 and 332 are located outside the vibration element 2 when viewed from the thickness direction of the flat plate portion 32, and the vibration element 2 is interposed between the first and second upright portions 331 and 332. Is located. That is, it can be said that the substrate 31 has a concave portion opened on the lower surface thereof, and the vibration element 2 is bonded to the bottom surface of the concave portion via the first bonding member 61. The tip surfaces 331a and 332a, which are the lower surfaces of the first and second standing portions 331 and 332, are joint surfaces with the base 51, respectively. Then, the front end surfaces 331 a and 332 a and the bottom surface of the recess 511 are bonded via the second bonding member 62, and thereby the relay substrate 3 is fixed to the base 51.

  As described above, since the first and second standing portions 331 and 332 are provided along the opposite sides 32a and 32b, the flat plate portion 32 is formed by the first and second standing portions 331 and 332, respectively. It can be supported in a stable posture from both sides. Therefore, the vibration element 2 provided on the flat plate portion 32 can be driven in a more stable state.

  Although it does not specifically limit as the 2nd joining member 62 which joins the relay substrate 3 and the base 51, For example, various conductive adhesives, various metal brazing materials, various metal bumps, etc. are mentioned. However, among these, it is preferable to use a metal bump as the second bonding member 62. According to the metal bump, outgas from the second bonding member 62 is reduced as compared with other materials, and an environmental change in the storage space S, in particular, an increase in pressure can be effectively suppressed. Therefore, it is possible to effectively suppress fluctuations in the vibration characteristics of the vibration element 2 due to environmental changes. In addition, it does not specifically limit as a constituent material of a metal bump, For example, metals, such as gold | metal | money (Au), silver (Ag), copper (Cu), aluminum (Al), platinum (Pt), or its alloy, lead-free solder And leaded solder. Further, the metal bumps can be formed by using, for example, a plating method, a bonding method, and the like, and can be joined by pressure welding, heat pressure, ultrasonic combined heat pressure welding, or the like.

  In particular, in the present embodiment, since both the first and second joining members 61 and 62 are configured by metal bumps, the above-described effect, that is, the environmental change in the storage space S can be more effectively suppressed. .

  Thus, since the board | substrate 31 has the 1st, 2nd standing part 331,332, compared with the case where it is flat shape like the past, for example, it is a vibration element from the fixing | fixed part with the base 51 of the relay substrate 3. FIG. It becomes easy to lengthen the distance to the fixing part with 2. Therefore, the stress transmission path from the base 51 to the vibration element 2 can be made longer than before, and the stress generated by the deformation of the package 5 is effectively absorbed and relaxed in the relay substrate 3. Therefore, it becomes difficult for stress to be transmitted to the vibration element 2. Accordingly, changes in the drive characteristics of the vibration element 2, particularly fluctuations in the vibration frequency are unlikely to occur, and the vibration element 2 can exhibit excellent vibration characteristics.

  In particular, in the present embodiment, the tip surfaces 331 a and 332 a of the first and second standing portions 331 and 332 are positioned below the lower surface 212 of the vibration element 2. Therefore, the height T of the first and second standing portions 331 and 332 can be sufficiently secured, and the stress transmission path from the base 51 to the vibration element 2 can be made sufficiently long. Therefore, it is possible to make it difficult for stress to be transmitted to the vibration element 2. The height T of the first and second upright portions 331 and 332 is not particularly limited. For example, when the distance between the lower surface 321 of the flat plate portion 32 and the lower surface 212 of the vibration element 2 is D, 2 ≦ T / D ≦ 10 is preferable, 2 ≦ T / D ≦ 8 is more preferable, and 2 ≦ T / D ≦ 5 is further preferable (see FIG. 1). Thereby, the stress transmission path from the base 51 to the vibration element 2 is made sufficiently long while effectively suppressing the height T from becoming excessively large and the vibrator from becoming large (high profile). can do.

  The substrate 31 as described above is made of quartz and is formed by patterning the quartz substrate by wet etching. In the present embodiment, the substrate 31 is formed of a Z-cut quartz substrate, and the normal lines of both main surfaces of the substrate 31 coincide with the Z axis (optical axis) that is the crystal axis of the quartz. Since the Z-axis is preferentially etched in comparison with the X-axis (electrical axis) and the Y-axis (mechanical axis), which are other crystal axes of quartz, etching is performed by forming the substrate 31 from a Z-cut quartz substrate Time can be shortened. Further, since the etched surface (side surface formed by etching) becomes steeper, the relay substrate 3 can be formed with excellent dimensional accuracy.

  The Z-cut quartz plate is a crystal whose cut surface is substantially perpendicular to the Z axis. The cut surface perpendicular to the Z axis is the direction from the Y axis to the Z axis when viewed from the positive side of the X axis. Those cut out in a state of rotating counterclockwise or clockwise in the range of 0 degrees to several degrees are also included. However, the substrate 31 is not particularly limited, and a quartz substrate other than the Z-cut quartz substrate, for example, an X-cut quartz substrate, a Y-cut quartz substrate, an AT-cut quartz substrate, a BT-cut quartz substrate, an SC-cut quartz substrate, or an ST-cut quartz substrate. It may be formed from a quartz substrate or the like. The substrate 31 may be made of a material other than quartz, for example, a resin material, a metal material, a glass material, or the like.

  The wiring 38 is routed across the flat plate portion 32 and the first upright portion 331, one end thereof is a terminal 381 positioned on the lower surface 321 of the flat plate portion 32, and the other end is provided in the first upright portion. The terminal 382 is located on the tip surface 331 a of the portion 331. On the other hand, the wiring 39 is routed across the flat plate portion 32 and the second upright portion 332, one end thereof is a terminal 391 located on the lower surface 321 of the flat plate portion 32, and the other end is the second. The terminal 392 is located on the front end surface 332 a of the standing portion 332. The terminals 381 and 391 are electrically connected to the vibration element 2 via the first bonding member 61, respectively, and the terminals 382 and 392 are respectively connected to the inside of the base 51 via the second bonding member 62. The terminal 53 is electrically connected.

[Vibration element]
As shown in FIGS. 4 and 5, the vibration element 2 includes a vibration substrate 21 formed of a quartz substrate and an electrode 22 disposed on the vibration substrate 21. The vibration substrate 21 has a thickness shear vibration as a main vibration, and is formed of an AT-cut quartz substrate in the present embodiment. As shown in FIG. 6, the AT-cut quartz substrate is a “rotated Y-cut quartz substrate” cut out along a plane obtained by rotating the XZ plane around the X axis by an angle θ (= 35 ° 15 ′). Since the AT-cut quartz substrate has a third-order frequency temperature characteristic, the vibration element 2 having excellent temperature characteristics can be obtained by forming the vibration substrate 21 from the AT-cut quartz substrate. Hereinafter, the Y axis and the Z axis rotated around the X axis corresponding to the angle θ are referred to as a Y ′ axis and a Z ′ axis. That is, the vibration substrate 21 has a thickness in the Y′-axis direction and a spread in the XZ ′ plane direction.

  Such a vibration substrate 21 has a rectangular shape in plan view. In the present embodiment, the vibration substrate 21 is a rectangle whose longitudinal direction is the X-axis direction, but is not limited thereto, and may be a rectangle whose longitudinal direction is the Z′-axis direction or a square. Also good. The planar view shape of the vibration substrate 21 is not limited to a rectangle, and may be, for example, a circle, an oval, an ellipse, a rectangle other than a rectangle, or a polygon that is a pentagon or more.

  The electrode 22 includes an excitation electrode 221 disposed on the upper surface 211 of the vibration substrate 21 and an excitation electrode 222 disposed on the lower surface 212 so as to face the excitation electrode 221. The electrode 22 has an electrode pad 223 and an electrode pad 224 that are disposed on the upper surface 211 of the vibration substrate 21. The electrode 22 includes a wiring 225 that electrically connects the electrode pad 223 and the excitation electrode 221, and a wiring 226 that electrically connects the electrode pad 224 and the excitation electrode 222. Then, by applying a drive signal between the excitation electrodes 221 and 222 via the electrode pads 223 and 224, the vibration substrate 21 undergoes thickness shear vibration.

  Such a vibration element 2 is fixed to the flat plate portion 32 of the relay substrate 3 via a pair of first joining members 61. In addition, the electrode pad 223 of the vibration element 2 and the terminal 382 of the relay substrate 3 are electrically connected via one first bonding member 61, and the electrode pad 224 of the vibration element 2 and the terminal 392 of the relay substrate 3 are connected. Are electrically connected via the other first joining member 61. Therefore, the vibration element 2 is electrically connected to the internal terminal 53 of the base 51 via the wirings 38 and 39 of the relay substrate 3. As described above, the mechanical connection and the electrical connection between the vibration element 2 and the relay substrate 3 are performed by the first bonding member 61, whereby the number of components of the vibrator 1 can be reduced. 1 can be miniaturized.

  Here, the vibration element 2 has spurious vibrations (unnecessary vibrations) such as bending vibration, torsional vibration, and contour vibration in addition to the thickness-shear vibration that is the main vibration, as the vibration mode. If these spurious vibrations have a vibration frequency close to the vibration frequency of the main vibration, the spurious vibration may be coupled to the main vibration. That is, spurious vibrations may be excited together with the main vibration. Then, due to the difference in displacement distribution in the vibration element plane between the main vibration and the spurious vibration, the vibration characteristics of the vibration element 2 deteriorate due to the vibration caused by the spurious vibration leaking to the vicinity of the first joining member 61.

  As described above, the vibration element 2 has spurious vibration that leads to deterioration of vibration characteristics. However, by using the metal bump as the first bonding member 61, for example, compared to the case of using a resin-based conductive adhesive. In addition, it is possible to suppress variations in the vibration frequency of spurious vibrations. That is, the vibration frequency of spurious vibration can be controlled with high accuracy. This is because the vibration frequency of spurious vibration varies depending on the portion where the vibration element 2 is fixed, that is, the arrangement and size of the first bonding member 61, but by using metal bumps as the first bonding member 61, This is because the arrangement and the diameter of the first joining member 61 can be controlled with higher accuracy than in the case of using a resin-based conductive adhesive. Thus, if the vibration frequency of the spurious vibration can be controlled with high accuracy, the vibration frequency of the spurious vibration can be sufficiently separated from the vibration frequency of the main vibration, and the coupling of the spurious vibration can be reduced more effectively. Can do.

  Although the vibration element 2 has been described above, the configuration of the vibration element 2 is not limited to the above-described configuration. For example, the vibration element 2 may be a mesa type in which the vibration region of the vibration substrate 21 protrudes from the periphery thereof, or conversely, may be a reverse mesa type in which the vibration region is recessed from the periphery thereof. . Further, bevel processing for grinding the periphery of the vibration substrate 21 and convex processing for making the upper surface 211 and the lower surface 212 convex surfaces may be performed.

  Further, the vibration element 2 is not limited to one that vibrates due to thickness-shear vibration. For example, the vibration element 2 may be a vibration element in which a plurality of vibration arms flexurally vibrate (tuning fork vibration), or a plurality of vibration A vibration element in which the arm bends and vibrates in the out-of-plane direction (walk vibration) may be used. That is, the vibration substrate 21 is not limited to the AT cut crystal substrate, and may be, for example, an X cut crystal substrate, a Y cut crystal substrate, a Z cut crystal substrate, a BT cut crystal substrate, an SC cut crystal substrate, an ST cut crystal substrate, or the like. May be.

  In addition, the constituent material of the vibration substrate 21 is not limited to quartz, but, for example, a piezoelectric single crystal (single material such as lithium niobate, lithium tantalate, lithium tetraborate, langalite, potassium niobate, gallium phosphate) (A piezoelectric material of a crystal body) or a piezoelectric single crystal other than these.

  Here, as described above, the substrate 31 included in the relay substrate 3 and the vibration substrate 21 included in the vibration element 2 are each made of quartz. That is, the relay substrate 3 and the vibration element 2 have a substrate made of quartz that is the same material. Thereby, the thermal expansion coefficients of the relay substrate 3 and the vibration element 2 become substantially equal, and it is possible to effectively reduce the stress caused by the difference in the thermal expansion coefficient from being applied to the vibration element 2. Therefore, it is possible to effectively reduce the deterioration of the vibration characteristics of the vibration element 2.

  Further, as shown in FIG. 7, the crystal axis of the substrate 31 and the crystal axis of the vibration substrate 21 are shifted from each other. Specifically, the X axis of the substrate 31 extends in a direction different from the X axis of the vibration substrate 21, the Y axis of the substrate 31 extends in a direction different from the Y axis of the vibration substrate 21, and the Z axis of the substrate 31 is The vibration substrate 21 extends in a direction different from the Z-axis. Thereby, compared with the case where the crystal axes of the vibration board | substrate 21 and the board | substrate 31 correspond, for example, the mechanical resonance point of the vibration board | substrate 21 and the board | substrate 31 can be spaced apart. Therefore, it is possible to suppress an unintended resonance mode from being excited in the relay substrate 3 so as to resonate with the vibration of the vibration element 2, and the vibration characteristics of the vibration element 2 are degraded by the resonance mode of the relay substrate 3. Can be effectively suppressed.

  In particular, in this embodiment, the X axis of the substrate 31 is inclined about both the Y axis and the Z axis with respect to the X axis of the vibration substrate 21, and the Y axis of the substrate 31 is the Y axis of the vibration substrate 21. The Z axis of the substrate 31 is inclined about both the X axis and the Y axis with respect to the Z axis of the vibration substrate 21. That is, the crystal axis of the substrate 31 and the crystal axis of the vibration substrate 21 are in a twisted relationship. Therefore, the above-described effect becomes more prominent, and the mechanical resonance point between the vibration substrate 21 and the substrate 31 can be further separated. Therefore, the unintended vibration of the relay board 3 can be more effectively suppressed, and the deterioration of the vibration characteristics of the vibration element 2 due to the vibration of the relay board 3 can be more effectively suppressed.

  In the present embodiment, as described above, the cut angle of the vibration substrate 21 and the cut angle of the substrate 31 are different. Specifically, since the vibration substrate 21 of the vibration element 2 is formed from an AT cut crystal substrate, the substrate 31 of the relay substrate 3 is formed from a Z cut crystal substrate different from the AT cut crystal substrate. Thus, by making the cut angle of the vibration substrate 21 and the cut angle of the substrate 31 different, the crystal axis of the substrate 31 and the crystal axis of the vibration substrate 21 can be shifted from each other easily and reliably.

  In the present embodiment, the X-axis, Y-axis, and Z-axis of the substrate 31 are inclined with respect to the X-axis, Y-axis, and Z-axis of the vibration substrate 21, respectively. As long as two of the X-axis, Y-axis, and Z-axis of the substrate 31 are inclined with respect to the corresponding axes of the vibration substrate 21, the remaining one axis may be coincident. In addition, the X axis, Y axis, and Z axis of the substrate 31 may coincide with the X axis, Y axis, and Z axis of the vibration substrate 21, respectively.

  The vibrator 1 has been described above. As described above, the vibrator 1 includes the vibration element 2, the flat plate portion 32 on which the vibration element 2 is attached to the lower surface 321 side which is one main surface, and the flat plate portion 32 from the flat surface portion 32 to the lower surface 321 side. A relay substrate 3 provided with a standing portion 33 composed of first and second standing portions 331 and 332 provided outside the vibration element 2 when viewed from the thickness direction of the flat plate portion 32. And the package 5 in which the vibration element 2 and the relay substrate 3 are accommodated, and the relay substrate 3 is attached to the distal ends of the first and second standing portions 331 and 332. As described above, since the relay substrate 3 includes the first and second standing portions 331 and 332, the relay substrate 3 is vibrated from the fixing portion of the relay substrate 3 with the package 5 as compared with a conventional flat plate shape. It is easy to increase the distance to the fixing portion with the element 2. Therefore, the stress transmission path from the package 5 to the vibration element 2 can be made longer than before, and the stress generated by the deformation of the package 5 is effectively absorbed and relaxed in the relay substrate 3. Therefore, it becomes difficult for stress to be transmitted to the vibration element 2. Accordingly, changes in the drive characteristics of the vibration element 2, particularly fluctuations in the vibration frequency are unlikely to occur, and the vibration element 2 can exhibit excellent vibration characteristics.

  Further, as described above, the standing portion 33 protrudes from the vibration element 2 in the thickness direction of the flat plate portion 32. That is, the distal end portion of the standing portion 33 is located on the opposite side of the flat plate portion 32 from the vibration element 2. That is, the front end surfaces 331 a and 332 a of the first and second standing portions 331 and 332 are located on the bottom surface side of the recess 511 of the base 51 with respect to the lower surface 212 of the vibration element 2. Therefore, the height T of the first and second standing portions 331 and 332 can be sufficiently secured, and the stress transmission path from the base 51 to the vibration element 2 can be made sufficiently long. Therefore, it is possible to make it difficult for stress to be transmitted to the vibration element 2.

  Further, as described above, the flat plate portion 32 has a rectangular shape when viewed in the thickness direction, and the standing portion 33 is the first side of the flat plate portion 32, the side 32a and the second side facing the side 32a. It is provided along a certain side 32b. Specifically, the standing portion 33 includes a first standing portion 331 provided along the side 32a and a second standing portion 332 provided along the side 32b. As described above, the first and second standing portions 331 and 332 are provided along the opposing sides 32 a and 32 b of the flat plate portion 32, so that the flat plate portion 32 is formed by the first and second standing portions 331 and 332. It can be supported in a stable posture from both sides. Therefore, the vibration element 2 provided on the flat plate portion 32 can be driven in a more stable state.

  In addition, as described above, the relay substrate 3 includes the wirings 38 and 39 that are arranged across the flat plate portion 32 and the standing portion 33 and are electrically connected to the vibration element 2. Specifically, the relay substrate 3 includes a wiring 38 disposed across the flat plate portion 32 and the first standing portion 331 and a wiring 39 disposed across the flat plate portion 32 and the second standing portion 332. And having. As described above, since the relay substrate 3 includes the wirings 38 and 39, the electrode 22 of the vibration element 2 can be easily drawn out to the package 5.

  Further, as described above, the relay substrate 3 and the vibration element 2 include the substrate 31 and the vibration substrate 21 which are substrates made of the same material. As a result, the thermal expansion coefficients of the relay substrate 3 and the vibration element 2 are substantially equal, so that the relay substrate 3 and the vibration element 2 are hardly affected by distortion due to a change in ambient temperature. Therefore, it is difficult for stress to be applied to the vibration element 2, and a reduction in vibration characteristics of the vibration element 2 can be reduced. In particular, in this embodiment, the material of the substrate 31 and the vibration substrate 21 is quartz. Thereby, the vibration element 2 having excellent temperature characteristics is obtained.

<Second Embodiment>
Next, a resonator according to the second embodiment of the invention will be described.

  FIG. 8 is a perspective view of a relay board included in the vibrator according to the second embodiment of the invention.

  The vibrator according to the present embodiment is the same as the vibrator according to the first embodiment described above except that the configuration of the relay substrate 3 is different. In the following description, the vibrator of the second embodiment will be described focusing on the differences from the first embodiment described above, and the description of the same matters will be omitted. Moreover, in FIG. 8, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  As shown in FIG. 8, in the relay substrate 3 of the present embodiment, the standing portion 33 includes a columnar first standing portion 331, a second standing portion 332, standing from four corners of the flat plate portion 32. It has the 3rd standing part 333 and the 4th standing part 334. A terminal 382 is provided on the distal end surface 331 a of the first standing portion 331, and a terminal 392 is provided on the distal end surface 332 a of the second standing portion 332. In addition, dummy terminals 37 for increasing the bonding strength with the second bonding member 62 are provided on the tip surface 333 a of the third standing portion 333 and the tip surface 334 a of the fourth standing portion 334, respectively. The relay substrate 3 is bonded to the bottom surface of the recess 511 of the base 51 via the second bonding member 62 at the tip surfaces 331a to 334a of the first to fourth standing portions 331 to 334.

  According to such a configuration, for example, the first to fourth standing portions 331 to 334 are easily deformed as compared with the configuration of the first embodiment described above, and thus stress is applied from the package 5 to the vibration element 2. It becomes harder to communicate. Therefore, a change in driving characteristics of the vibration element 2, in particular, a fluctuation in vibration frequency hardly occurs, and the vibration element 2 can exhibit excellent vibration characteristics.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
Next, a vibrator according to a third embodiment of the invention will be described.

  FIG. 9 is a perspective view of a relay board included in the vibrator according to the third embodiment of the invention.

  The vibrator according to the present embodiment is the same as the vibrator according to the first embodiment described above except that the configuration of the relay substrate 3 is different. In the following description, the vibrator of the third embodiment will be described focusing on the differences from the first embodiment described above, and the description of the same matters will be omitted. Moreover, in FIG. 9, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  As shown in FIG. 9, in the relay board 3 of the present embodiment, the standing portion 33 has a frame shape standing from the entire periphery of the outer edge portion of the flat plate portion 32. According to such a configuration, for example, the rigidity of the standing portion 33 is increased as compared with the configuration of the first embodiment described above, and thus the mechanical strength of the vibrator 1 is improved.

  Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
Next, a vibrator according to a fourth embodiment of the invention will be described.

  FIG. 10 is a perspective view of a relay board included in the vibrator according to the fourth embodiment of the invention.

  The vibrator according to the present embodiment is the same as the vibrator according to the first embodiment described above except that the configuration of the relay substrate 3 is different. In the following description, the vibrator of the fourth embodiment will be described focusing on the differences from the first embodiment described above, and the description of the same matters will be omitted. Moreover, in FIG. 10, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  As shown in FIG. 10, in the relay substrate 3 of the present embodiment, the inner side surface 331b of the first standing portion 331 is an inclined surface inclined with respect to the lower surface 321 of the flat plate portion 32, and the inner side surface 331b The angle θ1 formed with the lower surface 321 is larger than 90 °. A wiring 38 is provided across the lower surface 321 and the inner side surface 331b. Thus, by setting θ1> 90 °, the connection portion between the lower surface 321 and the inner side surface 331b becomes smooth, and disconnection of the wiring 38 at the connection portion can be effectively reduced. Similarly, the inner surface 332b of the second upright portion 332 is an inclined surface inclined with respect to the lower surface 321 of the flat plate portion 32, and the angle θ2 formed by the inner surface 332b and the lower surface 321 is greater than 90 °. . A wiring 39 is provided across the lower surface 321 and the inner side surface 332b. Thus, by setting θ2> 90 °, the connection portion between the lower surface 321 and the inner surface 332b becomes smooth, and disconnection of the wiring 39 at the joint portion can be effectively reduced.

  Θ1 and θ2 are not particularly limited. For example, 95 ° ≦ θ1, θ2 ≦ 130 ° are preferable, 100 ° ≦ θ1, and θ2 ≦ 120 ° are more preferable, and 100 ° ≦ θ1. , Θ2 ≦ 110 ° is more preferable. Thereby, disconnection of the wirings 38 and 39 can be effectively reduced while sufficiently increasing the size of the first and second standing portions 331 and 332 due to the excessive increase of θ1 and θ2.

  Thus, in the relay substrate 3 in the present embodiment, the inner side surfaces 331 b and 332 b of the standing portion 33 form an obtuse angle with the lower surface 321 of the flat plate portion 32. That is, in the relay substrate 3 in the present embodiment, the inner side surfaces 331b and 332b of the standing portion 33 are inclined surfaces having an angle formed with the lower surface 321 of the flat plate portion 32 that is greater than 90 °. The wirings 38 and 39 are arranged across the lower surface 321 and the inner side surfaces 331b and 332b. Thereby, the disconnection of the wirings 38 and 39 at the connection portion between the lower surface 321 and the inner side surfaces 331b and 332b can be effectively reduced.

  According to the fourth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Fifth Embodiment>
Next, a resonator according to a fifth embodiment of the invention will be described.

  FIG. 11 is a cross-sectional view showing a vibrator according to the fifth embodiment of the invention. 12 is a perspective view of a relay substrate included in the vibrator shown in FIG.

  The vibrator according to the present embodiment is the same as the vibrator according to the first embodiment described above except that the configuration of the relay substrate 3 is different. In the following description, the vibrator of the fifth embodiment will be described with a focus on the differences from the first embodiment described above, and description of similar matters will be omitted. 11 and 12, the same reference numerals are given to the same configurations as those in the above-described embodiment.

  As shown in FIGS. 11 and 12, in the relay board 3 of this embodiment, the second standing portion 332 is omitted from the configuration of the first embodiment described above. That is, the relay substrate 3 includes a flat plate portion 32 and a first upright portion 331 that is erected along the side 32 a of the flat plate portion 32. Further, terminals 382 and 392 are provided on the tip surface 331a of the first standing portion 331. Then, the tip surface 331 a of the first standing portion 331 is joined to the base 51 via the second joining member 62. As described above, by forming the relay substrate 3 in such a shape as to support the flat plate portion 32 on one side, stress is not easily transmitted from the package 5 to the vibration element 2 as compared with the configuration of the first embodiment described above. Become. Therefore, a change in driving characteristics of the vibration element 2, in particular, a fluctuation in vibration frequency hardly occurs, and the vibration element 2 can exhibit excellent vibration characteristics.

  In addition, for example, the vibrator 1 can be downsized or the vibration element 2 can be upsized as compared with the first embodiment described above. That is, if the size of the vibration element 2 is the same, the flat plate portion 32 can be reduced in size by the amount that the second standing portion 332 is omitted. As a result, the overall size of the vibrator 1 can be reduced. Can be planned. On the other hand, if the size of the flat plate portion 32 (the size of the entire vibrator 1) is the same, the vibration element 2 can be enlarged by the amount that the second standing portion 332 is omitted.

  In particular, in the present embodiment, the joining position of the vibration element 2 and the flat plate portion 32, that is, the first joining member 61 is biased to the side 32 b side and is separated as much as possible from the first standing portion 331. Has been placed. Thereby, the stress transmission path from the base 51 to the vibration element 2 can be made longer. Therefore, it is possible to make it difficult for stress to be transmitted to the vibration element 2.

  Thus, in the relay substrate 3 of the present embodiment, the flat plate portion 32 has a rectangular shape when viewed from the thickness direction. And the standing part 33 has the 1st standing part 331 provided along the edge | side 32a which is the 1st edge | side of the flat plate part 32, and the attachment position of the vibration element 2 and the flat plate part 32 is the edge | side 32a. Rather than the side 32b which is the second side facing the side 32a. Therefore, it becomes difficult for stress to be transmitted from the package 5 to the vibration element 2. As a result, changes in the drive characteristics of the vibration element 2, particularly fluctuations in the vibration frequency hardly occur, and the vibration element 2 can exhibit excellent vibration characteristics.

  According to the fifth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Sixth Embodiment>
Next, a resonator according to a sixth embodiment of the invention will be described.

  FIG. 13 is a top view of the relay substrate included in the vibrator according to the sixth embodiment of the invention. 14 is a cross-sectional view taken along line AA in FIG. FIG. 15 is a cross-sectional view for explaining the frequency adjustment method of the vibration element.

  The vibrator according to this embodiment is the same as the vibrator according to the fifth embodiment described above except that the configuration of the relay substrate 3 is different. In the following description, the vibrator of the sixth embodiment will be described with a focus on differences from the above-described fifth embodiment, and description of similar matters will be omitted. 13 to 15, the same reference numerals are given to the same configurations as those in the above-described embodiment.

  As shown in FIGS. 13 and 14, in the relay substrate 3 of the present embodiment, a through hole 329 is formed in the flat plate portion 32. The through hole 329 is disposed so as to overlap the excitation electrode 221 of the vibration element 2 when viewed from the thickness direction of the flat plate portion 32, and the excitation electrode 221 is exposed in the through hole 329 when the flat plate portion 32 is viewed from above. To do. Thus, by forming the through hole 329 that overlaps the excitation electrode 221 in the flat plate portion 32, the drive frequency of the vibration element 2 can be adjusted in a state where the relay substrate 3 is bonded to the base 51.

  More specifically, as shown in FIG. 15, the relay substrate 3 is fixed to the base 51, and the recess 511 is not closed by the lid 52, and excitation is performed from the opening side of the recess 511 through the relay substrate 3. The frequency of the vibration element 2 is adjusted by irradiating the electrode 221 with the ion beam IB and removing a part of the excitation electrode 221 (thinning the film thickness). At this time, the relay substrate 3 functions as a mask, and the portion other than the excitation electrode 221 is irradiated with the ion beam IB, so that unintended damage to the vibration element 2 can be reduced. Further, since the wirings 38 and 39 are not routed on the upper surface of the flat plate portion 32 of the relay substrate 3, it is possible to reduce the damage of the wirings 38 and 39 due to the ion beam IB.

  In this way, the drive frequency of the vibration element 2 can be adjusted in a state where the relay substrate 3 is bonded to the base 51, that is, in a state closer to the finished product, so that the drive frequency of the vibration element 2 can be adjusted more accurately. Can do. In the present embodiment, the entire region of the excitation electrode 221 is exposed in the through hole 329 and the entire region of the excitation electrode 221 is irradiated with the ion beam IB. However, the present invention is not limited to this, and the through hole 329 is not limited thereto. Only a part of the excitation electrode 221 may be exposed, and only the exposed part of the excitation electrode 221 may be irradiated with the ion beam IB.

  As described above, in the vibrator 1 of the present embodiment, the vibration element 2 includes the vibration substrate 21 and the excitation electrode 221 disposed on the vibration substrate 21, and the flat plate portion 32 has a thickness thereof. A through hole 329 is provided at a position overlapping the excitation electrode 221 when viewed from the direction. Accordingly, the drive frequency of the vibration element 2 can be adjusted in a state where the relay substrate 3 is bonded to the base 51, that is, in a state closer to the finished product, so that the drive frequency of the vibration element 2 can be adjusted more accurately. it can.

  Also according to the sixth embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Seventh embodiment>
Next, an oscillator according to a seventh embodiment of the invention will be described.

  FIG. 16 is a sectional view showing an oscillator according to the seventh embodiment of the invention.

  The vibrator according to the present embodiment is the same as the vibrator according to the first embodiment described above, except that the circuit element 4 is provided between the base 51 and the relay substrate 3. In the following description, the oscillator according to the seventh embodiment will be described with a focus on the differences from the first embodiment described above, and description of similar matters will be omitted. Moreover, in FIG. 6, the same code | symbol is attached | subjected about the structure similar to embodiment mentioned above.

  An oscillator 10 illustrated in FIG. 16 includes a vibration element 2, a relay substrate 3, a circuit element 4, and a package 5 that stores them. The vibration element 2 is supported by the relay board 3, the relay board 3 is supported by the circuit element 4, and the circuit element 4 is supported by the base 51. Thus, by interposing the relay substrate 3 between the vibration element 2 and the circuit element 4, for example, stress due to thermal deflection of the package 5 or the circuit element 4 is difficult to be transmitted to the vibration element 2, and vibration is generated. A decrease in the vibration characteristics of the element 2 can be suppressed.

  The concave portion 511 of the base 51 includes a first concave portion 511a that opens to the upper surface 51a of the base 51, and a second concave portion 511b that opens to the bottom surface of the first concave portion 511a. A plurality of internal terminals 53 are arranged on the bottom surface of the first recess 511a.

  The circuit element 4 is, for example, a semiconductor circuit board in which various circuit elements are formed on a silicon substrate, and includes, for example, an oscillation circuit 48 that oscillates the vibration element 2 and a temperature compensation circuit 49. Further, as shown in FIG. 16, the circuit element 4 is disposed in the package 5 with the active surface 40 facing downward, that is, the bottom surface of the recess 511. The circuit element 4 is bonded to the bottom surface of the first recess 511a via the third bonding member 63. Further, the circuit element 4 has a plurality of terminals 41 and 42 disposed on the active surface 40, and among these, the plurality of terminals 41 are electrically connected to a predetermined internal terminal 53 via a third bonding member 63. It is connected.

  Although it does not specifically limit as the 3rd joining member 63 which joins the circuit element 4 and the base 51, For example, various conductive adhesives, various metal brazing materials, various metal bumps etc. are mentioned. However, among these, it is preferable to use metal bumps as the third bonding member 63. According to the metal bump, outgas from the third bonding member 63 is reduced as compared with other materials, and an environmental change in the storage space S, in particular, an increase in pressure can be effectively suppressed. Therefore, it is possible to effectively suppress fluctuations in the vibration characteristics of the vibration element 2 due to environmental changes. In addition, it does not specifically limit as a constituent material of a metal bump, For example, metals, such as gold | metal | money (Au), silver (Ag), copper (Cu), aluminum (Al), platinum (Pt), or its alloy, lead-free solder And leaded solder. Further, the metal bumps can be formed by using, for example, a plating method, a bonding method, and the like, and can be joined by pressure welding, heat pressure, ultrasonic combined heat pressure welding, or the like.

  The relay substrate 3 is disposed between the circuit element 4 and the bottom surface of the recess 511, and is disposed upside down with respect to the first embodiment described above. In other words, the relay substrate 3 includes a flat plate portion 32 and first and second upright portions 331 and 332 that stand upward from the upper surface 322 of the flat plate portion 32. The vibration element 2 is joined via the first joining member 61. The relay substrate 3 is bonded to the active surface 40 of the circuit element via the second bonding member 62 at the front end surfaces 331 a and 332 a of the first and second standing portions 331 and 332. Although not shown, the terminals 382 and 392 of the relay substrate 3 are electrically connected to the terminals 42 of the circuit element 4 via the first bonding members 61, respectively.

  As described above, the oscillator 10 includes the vibration element 2, the flat plate portion 32 to which the vibration element 2 is attached on the upper surface 322 side which is one main surface, and the flat plate portion 32 erected on the upper surface 322 side. A relay board 3 provided with a standing portion 33 provided outside the vibration element 2 when viewed from the thickness direction of 32, and an oscillation that causes the vibration element 2 to oscillate when the relay board 3 is attached at the standing portion 33 A circuit element 4 including a circuit 48 and a package 5 that houses the vibration element 2, the relay substrate 3, and the circuit element 4 and to which the circuit element 4 is attached. As described above, since the relay substrate 3 includes the first and second standing portions 331 and 332, the relay substrate 3 is vibrated from the fixing portion of the relay substrate 3 with the package 5 as compared with a conventional flat plate shape. It is easy to increase the distance to the fixing portion with the element 2. Therefore, the stress transmission path from the package 5 to the vibration element 2 can be made longer than before, and the stress generated by the deformation of the package 5 is effectively absorbed and relaxed in the relay substrate 3. Therefore, it becomes difficult for stress to be transmitted to the vibration element 2. Accordingly, changes in the drive characteristics of the vibration element 2, particularly fluctuations in the vibration frequency are unlikely to occur, and the vibration element 2 can exhibit excellent vibration characteristics.

  Such an oscillator 10 can also exhibit the same effects as those of the first embodiment described above. In the present embodiment, the relay board 3 of the first embodiment described above is used as the relay board 3. However, the present invention is not limited to this, and the relay board 3 of the second to sixth embodiments described above may be used. Alternatively, other relay boards 3 may be used. Even in this case, the same effect as the present embodiment can be exhibited.

<Eighth Embodiment>
Next, an electronic apparatus according to an eighth embodiment of the invention will be described.

  FIG. 17 is a perspective view showing an electronic apparatus according to the eighth embodiment of the present invention.

  A mobile (or notebook) personal computer 1100 shown in FIG. 17 is an application of an electronic device including the vibrator of the present invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. In such a personal computer 1100, for example, the vibrator 1 is built in a state where the personal computer 1100 is applied to the oscillator 10.

  Such a personal computer 1100 (electronic device) includes the vibrator 1. Therefore, the effect of the vibrator 1 described above can be enjoyed and high reliability can be exhibited.

<Ninth Embodiment>
Next, an electronic apparatus according to a ninth embodiment of the invention will be described.

  FIG. 18 is a perspective view showing an electronic apparatus according to the ninth embodiment of the present invention.

  A cellular phone 1200 (including PHS) illustrated in FIG. 18 is obtained by applying an electronic device including the vibrator of the present invention. A cellular phone 1200 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display portion 1208 is disposed between the operation buttons 1202 and the earpiece 1204. . Such a cellular phone 1200 incorporates the vibrator 1 in a state where it is applied to the oscillator 10, for example.

  Such a cellular phone 1200 (electronic device) includes the vibrator 1. Therefore, the effect of the vibrator 1 described above can be enjoyed and high reliability can be exhibited.

<Tenth Embodiment>
Next, an electronic apparatus according to a tenth embodiment of the invention will be described.

  FIG. 19 is a perspective view showing an electronic apparatus according to the tenth embodiment of the present invention.

  A digital still camera 1300 shown in FIG. 19 applies an electronic device including the vibrator of the present invention. A display unit 1310 is provided on the back surface of the case (body) 1302, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 functions as a finder that displays an object as an electronic image. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302. When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. Such a digital still camera 1300 includes the vibrator 1 in a state where the digital still camera 1300 is applied to the oscillator 10, for example.

  Such a digital still camera 1300 (electronic device) includes the vibrator 1. Therefore, the effect of the vibrator 1 described above can be enjoyed and high reliability can be exhibited.

  In addition to the personal computer, mobile phone, and digital still camera described above, the electronic device of the present invention includes, for example, a smartphone, a tablet terminal, a watch (including a smart watch), an inkjet discharge device (for example, an inkjet printer), Wearable terminals such as laptop personal computers, TVs, HMDs (head-mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices , Word processors, workstations, videophones, crime prevention TV monitors, electronic binoculars, POS terminals, medical equipment (eg electronic thermometers, blood pressure monitors, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic devices, electronic endoscopes), Group detector, various measuring instruments, mobile terminal the base station equipment, instruments (e.g., gages for vehicles, aircraft, and ships), a flight simulator, a network server or the like.

<Eleventh embodiment>
Next, a mobile unit according to an eleventh embodiment of the present invention is described.

  FIG. 20 is a perspective view showing a moving body according to the eleventh embodiment of the present invention.

  An automobile 1500 shown in FIG. 20 is an automobile to which a moving body including the vibrator of the present invention is applied. The automobile 1500 includes the vibrator 1 in a state where it is applied to the oscillator 10, for example. The vibrator 1 includes, for example, a keyless entry, an immobilizer, a car navigation system, a car air conditioner, an antilock brake system (ABS), an air bag, a tire pressure monitoring system (TPMS), an engine control, and a hybrid. The present invention can be widely applied to electronic control units (ECUs) such as battery monitors for automobiles and electric vehicles, and vehicle body attitude control systems.

  Such an automobile 1500 (moving body) includes the vibrator 1. Therefore, the effect of the vibrator 1 described above can be enjoyed and high reliability can be exhibited.

  The moving body is not limited to the automobile 1500, and can be applied to, for example, an unmanned airplane such as an airplane, a ship, an AGV (automated guided vehicle), a bipedal walking robot, and a drone.

  As described above, the vibrator, the oscillator, the electronic device, and the moving body of the present invention have been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each unit is an arbitrary function having the same function. It can be replaced with the configuration of In addition, any other component may be added to the present invention. Further, the present invention may be a combination of any two or more configurations of the above embodiments.

  DESCRIPTION OF SYMBOLS 1 ... Vibrator, 10 ... Oscillator, 2 ... Vibration element, 21 ... Vibrating substrate, 211 ... Upper surface, 212 ... Lower surface, 22 ... Electrode, 221, 222 ... Excitation electrode, 223, 224 ... Electrode pad, 225, 226 ... Wiring 3 ... Relay board, 31 ... Board, 32 ... Flat plate part, 32a-32d ... Side, 321 ... Lower surface, 322 ... Upper surface, 329 ... Through hole, 33 ... Standing part, 331 ... First standing part, 331a ... Tip surface, 331b ... inside surface, 332 ... second standing portion, 332a ... tip surface, 332b ... inside surface, 333 ... third standing portion, 333a ... tip surface, 334 ... fourth standing portion, 334a ... tip Surface, 37 ... Dummy terminal, 38, 39 ... Wiring, 381, 391 ... Terminal, 382,392 ... Terminal, 4 ... Circuit element, 40 ... Active surface, 41 ... Terminal, 42 ... Terminal, 48 ... Oscillator circuit, 49 ... Temperature compensation circuit, 5 ... package, 51 Base, 51a ... Upper surface, 51b ... Lower surface, 511 ... Recess, 511a ... First recess, 511b ... Second recess, 52 ... Lid, 53 ... Internal terminal, 54 ... External terminal, 61 ... First joining member, 62 ... First 2 joining members, 63 ... 3rd joining member, 1100 ... personal computer, 1102 ... keyboard, 1104 ... main body, 1106 ... display unit, 1108 ... display unit, 1200 ... mobile phone, 1202 ... operation button, 1204 ... earpiece, DESCRIPTION OF SYMBOLS 1206 ... Mouthpiece, 1208 ... Display part, 1300 ... Digital still camera, 1302 ... Case, 1304 ... Light receiving unit, 1306 ... Shutter button, 1308 ... Memory, 1310 ... Display part, 1500 ... Car, IB ... Ion beam, S Storage space, T ... Height, θ ... Angle, θ1, θ2 ... Angle

Claims (12)

A vibrating element;
A flat plate portion on which the vibration element is attached on one main surface side, and is provided upright on the one main surface side from the flat plate portion and provided outside the vibration element when viewed from the thickness direction of the flat plate portion. A relay board comprising:
A vibrator comprising: the vibration element and the relay substrate; and a package to which the relay substrate is attached at a tip portion of the standing portion.   The vibrator according to claim 1, wherein the standing portion protrudes from the vibration element in the thickness direction. The flat plate portion is rectangular when viewed from the thickness direction,
The vibrator according to claim 1, wherein the standing portion is provided along a first side of the flat plate portion and a second side facing the first side. The flat plate portion is rectangular when viewed from the thickness direction,
The standing portion is provided along the first side of the flat plate portion,
The vibrator according to claim 1, wherein an attachment position of the vibration element and the flat plate portion is closer to a second side opposite to the first side than to the first side. The vibration element has a vibration substrate and an excitation electrode disposed on the vibration substrate,
5. The vibrator according to claim 1, wherein the flat plate portion is provided with a through hole at a position overlapping with the excitation electrode when viewed from the thickness direction thereof.   6. The vibrator according to claim 1, wherein the relay substrate includes a wiring that is disposed across the flat plate portion and the standing portion and is electrically connected to the vibration element. The inner surface of the standing portion is an inclined surface that forms an obtuse angle with the one main surface,
The vibrator according to claim 6, wherein the wiring is disposed across the one main surface and the inner surface.   The vibrator according to any one of claims 1 to 7, wherein the relay substrate and the vibration element include a substrate made of the same material.   The vibrator according to claim 8, wherein the material is quartz. A vibrating element;
A flat plate portion on which the vibration element is attached on one main surface side, and is provided upright on the one main surface side from the flat plate portion and provided outside the vibration element when viewed from the thickness direction of the flat plate portion. A relay board comprising:
A circuit element including an oscillation circuit to which the relay substrate is attached in the upright portion and oscillates the vibration element;
An oscillator comprising: the vibration element, the relay substrate, and the circuit element, and a package to which the circuit element is attached.   An electronic apparatus comprising the vibrator according to claim 1.   A moving body comprising the vibrator according to claim 1.

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