JP2017085264A - Vibrating piece, vibrator, oscillator, electronic device, and moving object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration piece in which connection pads (pad electrodes) connected to a package are provided on front and back surfaces of a support section and conductive layers such as wiring can be provided on side surfaces of the support section.SOLUTION: A vibration piece 2a comprises: vibration arms 20 and 22 serving as vibration sections; a support section 14 connected to the vibration arms; side surface electrodes 15 provided on side surfaces connecting a front surface and a back surface of the support section and serving as conductive layers; and insulator layers 16 covering the side surface electrodes. The support section has a first pad electrode 18 having first electrical potential on one of the front surface and the back surface, and has second pad electrodes 17a and 17b each having second electrical potential on one of the front surface and the back surface.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resonator element, a vibrator, an oscillator, an electronic device, and a moving body.

  In recent years, along with the downsizing of electronic devices such as portable devices, the vibrators used for the electronic devices and the vibrator elements used for the vibrators are also required to be small and thin. In order to cope with this, for example, Patent Document 1 discloses a base, a vibrating arm extending from the base and having an excitation electrode, and a connection pad extending from the base and electrically connected to the excitation electrode. A vibrating piece including a support portion disposed on the back surface is disclosed. In Patent Document 2, as the size of the resonator element is reduced, the distance between the two excitation electrodes having different potentials provided on the front and back surfaces of the resonator element is reduced. In order to make it easy to short-circuit and suppress this short-circuit, a resonator element is disclosed in which an insulating protective film is provided so as to cover the excitation electrodes on the front and back surfaces.

JP 2006-345519 A JP 2001-144581 A

  However, in the configuration of the resonator element described in Patent Document 1, the connection pads (pad electrodes) provided on either of the front and back surfaces of the support portion and the connection terminals provided on the package are electrically bonded. When electrically connected via an agent or the like, there is a possibility that the conductive adhesive wraps around the side surface of the support portion. If the conductive adhesive wraps around the side surface of the support portion, for example, when a wiring electrically connected to the excitation electrode is provided on the side surface, the connection terminal and the wiring may be short-circuited. Had the problem of being. In the configuration of the resonator element described in Patent Document 2, an insulating protective film that covers the excitation electrode is provided on the front and back surfaces of the resonator element. Therefore, even if connection pads that are connected to connection terminals or the like provided on the package are provided on the front and back surfaces of the resonator element, they are insulated by the protective film, and electrical connection cannot be obtained. That is, there has been a problem that connection pads cannot be provided on the front and back surfaces of the support portion of the resonator element.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A resonator element according to this application example includes a vibrating part, a support part connected to the vibrating part, a conductive layer provided on a side surface connecting the front surface and the back surface of the support part, and the conductive layer. And an insulating layer covering the support, wherein the support portion has a first pad electrode having a first potential on either the front surface or the back surface, and on at least one of the front surface and the back surface, A second pad electrode having a potential of 2 is provided.

  According to this application example, the first pad electrode or the second pad electrode provided on either the front surface or the back surface of the support portion is connected by the insulating layer covering the conductive layer provided on the side surface of the support portion. Even if the conductive bonding material to be turned around the side surface, occurrence of a short circuit between the first pad electrode or the second pad electrode and the conductive layer can be suppressed. Accordingly, it is possible to provide a wiring (conductive layer) on the side surface of the support portion, and the wiring routing efficiency can be improved. Therefore, the vibration piece can be reduced in size.

  Application Example 2 In the resonator element according to the application example described above, it is preferable that the first pad electrode and the second pad electrode are provided on the same surface of the front surface or the back surface.

  According to this application example, since the first pad electrode and the second pad electrode are provided in the same plane, for example, electrical connection with a package or the like can be performed on the same plane of the support portion. Connection efficiency can be increased.

  Application Example 3 In the resonator element according to the application example described above, it is preferable that the insulating layer extends on a part of the front surface or the back surface.

  According to this application example, since the insulating layer extends to a part of the front surface or the back surface, the surface area of the insulating layer is increased, and the bonding strength between the insulating layer and the support portion can be improved. This makes it possible to suppress problems such as peeling of the insulating layer that may occur due to temperature changes.

  Application Example 4 In the resonator element according to the application example described above, the resonator element includes a base portion, the vibration portion extends from the base portion, and the support portion is connected to the vibration portion via the base portion. It is preferable.

  According to this application example, since the vibration part extends from the base and the vibration part and the support part are connected via the base, the support part and the vibration part can be moved away, and the vibration of the vibration part is supported. Propagation to the part can be reduced, and a decrease in the performance of the resonator element can be suppressed.

  Application Example 5 In the resonator element according to the application example described above, it is preferable that the support portion is extended from the base portion along a direction in which the vibration portion extends.

  According to this application example, since the vibrating portion and the support portion are extended in the same direction from the base portion, the length dimension of the vibrating piece (the length dimension in the extending direction of the vibrating portion) can be reduced. The size of the resonator element can be reduced.

  Application Example 6 In the resonator element according to the application example described above, the vibrating portion includes a first region having a first width as a width in a direction intersecting with a direction extending from the base portion, and the first region. And a second region having a second width wider than the first width, which is located on the more distal side.

  According to this application example, due to the weight effect of the second region having the second width wider than the first width provided on the tip side of the first region of the vibration unit, the extending direction of the vibration unit is increased. The length dimension can be shortened. As a result, the length dimension of the vibrating piece (the length dimension in the extending direction of the vibrating portion) can be reduced, and the size of the vibrating piece can be reduced.

Application Example 7 In the resonator element according to the application example described above, it is preferable that the resonator element includes a pair of the vibration portions, and the support portion is disposed between the pair of vibration portions in a plan view.
In addition, the “plan view” in the present specification refers to a case of viewing from a direction facing a plane on which a pair of vibrating portions are arranged.

  According to this application example, since the support portion is provided between the vibration portion and the vibration portion, the resonator element can be connected in a smaller space (connection region), and a smaller and thinner vibration can be achieved. It becomes possible to be a child.

  Application Example 8 In the resonator element according to the application example described above, the resonator element includes a pair of the vibration portions and a pair of the support portions, and the pair of vibration portions is between the pair of support portions in a plan view. It is preferable that they are arranged.

  According to this application example, since the support unit is a pair and the vibration unit is disposed between the support unit and the support unit, the connection state of the vibration unit can be further stabilized. As a result, the vibration characteristics can be further stabilized.

  Application Example 9 A vibrator according to this application example includes the resonator element according to any one of the application examples described above and a substrate to which the resonator element is connected, and the support portion of the resonator element includes The substrate is connected to the substrate through a bonding member.

  According to this application example, the resonator element reduced in size by improving the wiring routing efficiency or the like is used by being bonded to the substrate, and a small vibrator can be provided.

  Application Example 10 An oscillator according to this application example includes the resonator element according to any one of the above application examples, a circuit unit that oscillates the resonator element, a substrate that connects the resonator element and the circuit unit, The support portion of the vibrating piece is connected to the substrate via a bonding member.

  According to this application example, the vibration piece support portion reduced in size by improving the wiring routing efficiency and the circuit portion that oscillates the vibration piece are connected to one substrate. Therefore, it is possible to provide a small oscillator in which the resonator element and the circuit unit are integrated.

  Application Example 11 An electronic apparatus according to this application example includes the resonator element according to any one of the application examples described above.

  According to this application example, since the vibration piece having a small size and stable characteristics is provided, an electronic device capable of realizing a small size and stable operation can be provided.

  Application Example 12 A moving body according to this application example includes the resonator element according to any one of the application examples described above.

  According to this application example, since the vibration piece having a small size and stable characteristics is provided, it is possible to provide a moving body capable of realizing a small and stable operation.

FIG. 3 is a plan view (top view) schematically showing the structure of the resonator element according to the first embodiment of the invention. FIG. 6 is a bottom view (perspective view) schematically showing the structure of the resonator element according to the first embodiment. Sectional drawing in the AA line of FIG. 1 which shows the support part of the vibration piece which concerns on 1st Embodiment. Sectional drawing in the position which shows the modification of a support part and corresponds to the AA line of FIG. The top view (top view) which shows roughly the structure of the vibration piece which concerns on 2nd Embodiment of this invention. The bottom view (perspective view) schematically showing the structure of the resonator element according to the second embodiment. Sectional drawing in the BB line of FIG. 5 which shows the support part of the vibration piece which concerns on 2nd Embodiment. The top view (top view) which shows roughly the structure of the vibration piece which concerns on 3rd Embodiment of this invention. FIG. 10 is a bottom view (perspective view) schematically showing the structure of a resonator element according to a third embodiment. The top view (top view) which shows roughly the structure of the vibration piece which concerns on 4th Embodiment of this invention. FIG. 10 is a bottom view (perspective view) schematically showing the structure of a resonator element according to a fourth embodiment. The top view (top view) which shows roughly the structure of the vibration piece which concerns on 5th Embodiment of this invention. FIG. 10 is a front sectional view showing a schematic structure of a vibrator according to a sixth embodiment of the invention. The top view which shows schematic structure of the oscillator which concerns on 7th Embodiment of this invention. Sectional drawing in the CC line | wire of FIG. 14 which shows schematic structure of an oscillator. 1 is a perspective view illustrating a schematic configuration of a mobile (or notebook) personal computer as an electronic apparatus including a vibrator according to an embodiment of the invention. The perspective view which shows schematic structure of a mobile telephone (PHS is also included) as an electronic device provided with the vibrator | oscillator which concerns on embodiment of this invention. 1 is a perspective view illustrating a schematic configuration of a digital camera as an electronic apparatus including a vibrator according to an embodiment of the invention. The perspective view which shows schematic structure of the motor vehicle as a moving body provided with the vibrator | oscillator which concerns on embodiment of this invention.

  Hereinafter, embodiments of a resonator element, a vibrator, an oscillator, an electronic device, and a moving body according to the present invention will be described in detail with reference to the drawings. In addition, in each figure, for convenience of explanation, there are some which show an X axis, a Y axis, and a Z axis as three axes orthogonal to each other. In this specification, among the three axes, the Y-axis and the Z-axis are illustrated as the Y′-axis and the Z′-axis in consideration of the cut-out angle of the resonator element in each embodiment. In the following description, for the sake of convenience of explanation, the plan view when viewed from the Z′-axis direction in the drawing is also simply referred to as “plan view”. Furthermore, for convenience of explanation, in the plan view when viewed from the Z′-axis direction in the drawing, the surface in the + Z′-axis direction may be described as the upper surface and the surface in the −Z′-axis direction may be described as the lower surface.

(First embodiment)
The resonator element according to the first embodiment of the invention will be described with reference to FIGS. FIG. 1 is a plan view (top view) schematically showing the structure of the resonator element according to the first embodiment of the invention. FIG. 2 is a bottom view schematically showing the structure of the resonator element according to the first embodiment, and is a perspective view in which the resonator element is transmitted from the + Z′-axis direction in the drawing. FIG. 3 is a cross-sectional view taken along line AA in FIG. 1, showing the support portion of the resonator element according to the first embodiment. FIG. 4 is a cross-sectional view at a position corresponding to the line AA in FIG.

  A schematic configuration of the resonator element will be described with reference to FIGS. 1 and 2. The vibrating piece 2 a is located between the base 12, the pair of vibrating arms 20 and 22 and the hammer heads 24 and 26, which are vibrating portions extending from the base 12, and the pair of vibrating arms 20 and 22. And an extended support portion 14. In other words, in the resonator element 2 a, the pair of vibrating arms 20 and 22 that are the vibrating portions and the support portion 14 are connected via the base portion 12. In this way, the vibrating arms 20 and 22 and the support portion 14 are connected via the base portion 12, whereby the vibrating arms 20 and 22 and the support portion 14 can be moved away from each other. Therefore, it is possible to reduce the propagation of the vibration 22 to the support portion 14 and to suppress the deterioration of the performance of the resonator element.

  The resonator element 2a is configured using, for example, a crystal, particularly a Z-cut crystal plate. Thereby, the resonator element 2a can exhibit excellent vibration characteristics. The Z-cut quartz plate is a quartz substrate whose thickness direction is the Z axis (optical axis) of quartz. The Z axis preferably coincides with the thickness direction of the vibration substrate. However, from the viewpoint of reducing the frequency temperature change in the vicinity of the normal temperature, the Z axis is slightly (for example, 15) around the X axis with respect to the thickness direction. In this specification, the axes having this inclination are defined as the Z ′ axis and the Y ′ axis. The resonator element 2a can be formed by wet-etching or dry-etching a quartz crystal substrate having such an inclination.

  The base 12 has a substantially plate shape having a spread in the XY ′ plane and having a thickness in the Z′-axis direction. The base 12 is disposed such that its width (length in the X-axis direction) is larger than between the outer side surfaces of the vibrating arms 20 and 22. The ends of the vibrating arms 20 and 22 of the base portion 12 and the protruding side of the support portion 14 (+ Y ′ direction) are arranged in a shape having a curved outline protruding in the + Y ′ direction. .

  The vibrating arms 20 and 22 as the vibrating portions are provided side by side in the X-axis direction, and extend from the base portion 12 so as to protrude in the −Y′-axis direction. The resonating arms 20 and 22 have a second width wider than the width (dimension in the X-axis direction) of the resonating arms 20 and 22 as the first region having the first width on the leading end side in each extending direction. Hammer heads (also referred to as wide portions and weight portions) 24 and 26 are provided as second regions having. By providing the hammer heads 24 and 26 as the second region, it is possible to reduce the size of the resonator element 2a due to the weight effect, and it is possible to reduce the frequency of flexural vibration of the vibrating arms 20 and 22. The hammer heads 24 and 26 have a plurality of widths in a continuous or stepped manner in the X-axis direction as necessary, or a plurality of thicknesses in a continuous or stepped manner in the Z′-axis direction. It may be provided, and the mass may be increased while maintaining the same width as the vibrating arms 20 and 22, or may be omitted.

  Further, the vibrating arm 20 includes a bottomed groove 28a that opens on one main surface (the surface on the + Z ′ side), and a bottomed groove 28b that opens on the other main surface (the back surface on the −Z ′ side). Is formed. Similarly, the vibrating arm 22 has a bottomed groove 30a that opens on one main surface (the surface on the + Z ′ side) and a bottomed groove 30b that opens on the back surface on the other main surface Z ′ side. Is formed. These concave grooves 28a, 28b, 30a, 30b are provided to extend in the Y′-axis direction and have the same shape. Therefore, the vibrating arms 20 and 22 have a cross-sectional shape having concave portions on the front and back sides. By forming such grooves 28a, 28b, 30a, 30b, it becomes difficult for the heat generated by bending vibration to diffuse (heat conduction), and the bending vibration frequency (mechanical bending vibration frequency) f is less than the thermal relaxation frequency f0. In the adiabatic region that is a large region (f> f0), thermoelastic loss can be suppressed. The grooves 28a, 28b, 30a, 30b may be provided as necessary and may be omitted. The vibrating piece 2a vibrates in a mode (X reverse phase mode) in which the two vibrating arms 20 and 22 are repeatedly separated from each other or approached in the X direction.

  The support portion 14 is disposed between the pair of vibrating arms 20 and 22 and arranged along the vibrating arms 20 and 22 in plan view, and protrudes from the base portion 12 in the −Y′-axis direction. So that it is extended. As described above, the vibrating arms 20 and 22 and the support portion 14 are extended from the base portion 12 in the same direction, whereby the length dimension of the vibrating piece 2a (the length in the extending direction of the vibrating arms 20 and 22). (Size) can be reduced, and the size of the resonator element 2a can be reduced.

  In addition, it is preferable that the front-end | tip part of the support part 14 is provided in the + Y 'side rather than the position of the hammer heads 24 and 26 of the vibrating arms 20 and 22. FIG. As described above, since the support portion 14 is provided between the vibrating arm 20 and the vibrating arm 22, it is possible to provide a connection region for the resonator element 2 a in a smaller space (connection region).

  Next, the electrode configuration of the resonator element 2a will be described. The electrodes are formed on the front and back surfaces which are the main surfaces of the resonator element 2a and the side surfaces connecting the front and back surfaces, and are formed on the excitation electrodes 41a and 41b formed on the vibrating arms 20 and 22, and on the base 12 and the hammer heads 24 and 26. And lead electrodes 42a and 42b, and connection electrodes 43a and 43b, a first pad electrode 18 and second pad electrodes 17a and 17b formed on the support portion 14, respectively. The excitation electrodes 41a and 41b are formed on the side surfaces of the vibrating arms 20 and 22 and inside the grooves 28a, 28b, 30a, and 30b. By forming excitation electrodes 41a and 41b, which are driving electrodes, on the side surfaces of the vibrating arms 20 and 22 and inside the grooves 28a, 28b, 30a, and 30b, driving in which a driving voltage is applied to the excitation electrodes 41a and 41b. Sometimes, the electric field efficiency inside each vibrating arm 20, 22 can be increased.

  A first pad electrode 18 and a second pad electrode 17a for connecting to a connection electrode (not shown) formed in the package and a first pad from the vicinity of the center of the surface of the base portion 12 of the resonator element 2a to the support portion 14 A connection electrode 43a that connects the electrode 18 and the extraction electrode 42a is formed. A second pad electrode 17b for connecting to a connection electrode (not shown) formed on the package, a second pad electrode 17b, and an extraction electrode 42b from the vicinity of the center of the back surface of the base portion 12 of the resonator element 2a to the support portion 14. Connection electrode 43b is formed. The second pad electrode 17a on the front surface side is electrically connected to the second pad electrode 17b on the rear surface side by a side electrode 15 as a conductive layer provided on the side surface connecting the front surface and the back surface of the support portion 14. Has been. The first pad electrode 18 and the second pad electrodes 17a and 17b are potentials for driving the resonator element 2a. The first pad electrode 18 has a first potential, and the second pad electrodes 17a and 17b. Has a second potential.

Further, as shown in FIG. 3, an insulating layer 16 is provided on the side electrode 15 and the side surface 14 s as conductive layers provided on the side surface of the support portion 14 so as to cover at least the side electrode 15. The insulating layer 16 in this embodiment is provided so as to cover the surface of the side electrode 15 and further cover a part of the side surface 14s where the side electrode 15 is not provided. The insulating layer 16 can be formed of, for example, a SiO ₂ film, a SiN film, or a resin that does not contain a conductive filler. Thus, a conductive bonding material (not shown) for connecting the first pad electrode 18 or the second pad electrode 17a provided on the surface 14a of the support portion 14 by the insulating layer 16 covering the side electrode 15 is used. Even if it wraps around the side surface 14s, the occurrence of a short circuit between the first pad electrode 18 or the second pad electrode 17a, in this embodiment, the first pad electrode 18 and the side electrode 15 can be suppressed. Therefore, it becomes possible to provide wiring (side electrode 15 as a conductive layer) on the side surface 14s of the support portion 14, and the wiring routing efficiency can be improved. Therefore, the vibration piece 2a can be downsized. .

  The first pad electrode 18 and the second pad electrode 17a are preferably provided on either the front surface 14a or the back surface 14r of the support portion 14. In other words, the first pad electrode 18 and the second pad electrode 17a are preferably provided on the same surface of the front surface 14a or the back surface 14r. By arranging the first pad electrode 18 and the second pad electrode 17a in this way, for example, electrical connection with a package (not shown) to which the resonator element 2a is connected is performed on the same surface of the support portion 14. Connection efficiency can be increased.

  The arrangement of the first pad electrode 18 and the second pad electrode 17a is such that the connection efficiency of the electrical connection between the resonator element 2a and the package (not shown) is lower than that in the above-described form. The first pad electrode 18 may be provided on the front surface 14a, and the second pad electrode 17b may be provided on the back surface 14r without providing the second pad electrode 17a of 14a.

  Moreover, the modification as shown in FIG. 4 can be applied to the insulating layer 16 covering the side electrode 15. The insulating layer 16 shown in FIG. 4 covers the side electrode 15 and extends from the side surface 14s to a part of the front surface 14a and the back surface 14r of the support portion 14. Thus, since the insulating layer 16 is extended to part of the front surface 14a and the back surface 14r, the surface area on which the insulating layer 16 is provided is increased, and the bonding strength between the insulating layer 16 and the support portion 14 is increased. Can be improved. Thereby, peeling of the insulating layer 16 that may occur due to a difference in thermal expansion coefficient due to temperature change, peeling of the insulating layer 16 that may occur when the adhesion between the side electrode 15 and the insulating layer 16 is low, etc. Can be suppressed.

  Returning to FIG. 1 and FIG. 2, the description will be continued. The lead electrodes 42a and 42b connected to the connection electrodes 43a and 43b wrap around the outer edge (side surface) of the base portion 12 and are provided on the front and back of the base portion 12 of the resonator element 2a, and are connected to the excitation electrodes 41a and 41b. It is connected. Thereby, a drive voltage can be applied to the excitation electrodes 41a and 41b from the first pad electrode 18 and the second pad electrodes 17a and 17b through the connection electrodes 43a and 43b and the extraction electrodes 42a and 42b. By adopting such an electrode arrangement, an electric field is appropriately formed in the vibrating arms 20 and 22 of the vibrating piece 2a so that the tip portions of the two vibrating arms 20 and 22 approach and separate from each other alternately. It is possible to vibrate at a predetermined frequency in the in-plane direction (XY ′ plane direction).

  The configurations of the excitation electrodes 41a and 41b, the extraction electrodes 42a and 42b, the connection electrodes 43a and 43b, the first pad electrode 18, and the second pad electrodes 17a and 17b are not particularly limited, and gold (Au), gold alloy, platinum (Pt), silver (Ag), silver alloy, chromium (Cr), chromium alloy, nickel (Ni), nickel alloy, titanium (Ti), titanium alloy, and other metal materials can be used. A single layer or a plurality of layers may be used. In the case where the excitation electrodes 41a and 41b, the extraction electrodes 42a and 42b, the connection electrodes 43a and 43b, the first pad electrode 18, and the second pad electrodes 17a and 17b are formed of a plurality of layers using the above-described metal material. In this case, the lowermost layer metal in contact with the resonator element 2a is made of chromium (Cr), chromium alloy, nickel (Ni), nickel alloy, titanium (Ti), titanium alloy or the like, and the upper surface of these metal materials (facing the resonator element 2a). It is preferable that gold (Au), a gold alloy, platinum (Pt), silver (Ag), a silver alloy, or the like be laminated on the surface opposite to the side.

  According to the resonator element 2a according to the first embodiment, the insulating layer 16 that covers the side electrode 15 as a conductive layer provided on the side surface 14s (see FIG. 3) of the support portion 14 causes the surface 14a of the support portion 14 or A conductive bonding material used when connecting the first pad electrode 18 or the second pad electrode 17a provided on either one of the back surface 14r (see FIG. 3) to, for example, a package (not shown) is formed on the side surface 14s. Even if it goes around, the occurrence of a short circuit between the first pad electrode 18 or the second pad electrode 17a and the side electrode 15 can be suppressed. That is, for example, when a conductive adhesive or metal bump is used as the conductive bonding material, the conductive bonding material is not only between the first pad electrode 18 or the second pad electrode 17a and the package, but also the support portion. 14 may protrude to a position covering at least a part of the 14 side surfaces 14s. According to the resonator element 2 a according to the first embodiment, the side electrode 15 is covered with the insulating layer 16 even when the conductive bonding material protrudes to a position covering at least a part of the side surface 14 a of the support portion 14. The possibility that the first pad electrode 18 or the second pad electrode 17a and the side surface electrode 15 are electrically connected through the conductive bonding material can be reduced. As a result, the potential 18 for driving the resonator element 2a is applied 18 or the second pad electrode 17a is short-circuited via the side electrode 15, or the first potential for applying the potential for driving the resonator element 2a is applied. Since the possibility that the pad electrode 18 or the second pad electrode 17a and an electrode having another potential are short-circuited is reduced, the possibility that the electrical characteristics of the resonator element 2a fluctuate can be reduced. Therefore, it is possible to provide a wiring (side electrode 15 as a conductive layer) on the side surface 14s of the support portion 14 and to improve the wiring routing efficiency. Therefore, it is possible to reduce the size of the resonator element 2a. .

In addition, although it does not specifically limit as an electroconductive joining material, For example, you may use metal bumps, such as Au bump. In addition, when a bonding material in which a conductive filler is mixed with a silicon-based, epoxy-based, acrylic-based, polyimide-based, bismaleimide-based, polyester-based, or polyurethane-based resin is used as the conductive adhesive, the resin is cured. Since the previous fluidity is high, the effect of the present invention is great.
Further, the side electrode 15 is, for example, a wiring electrically connected to the first pad electrode 18 or the second pad electrode 17a, a shield electrode having an electromagnetic shielding effect, the first pad electrode 18 or the second pad electrode. Wiring for electrically connecting other electrodes that are not electrically connected to 17a, a residual metal film that remains without being peeled off from the metal film used in manufacturing the resonator element 2a, and the like may be used.

(Second Embodiment)
Next, the resonator element according to the second embodiment of the invention will be described with reference to FIGS. 5, 6, and 7. FIG. 5 is a plan view (top view) schematically showing the structure of the resonator element according to the second embodiment of the invention. FIG. 6 is a bottom view schematically showing the structure of the resonator element according to the second embodiment, and is a perspective view in which the resonator element is transmitted from the + Z′-axis direction in the drawing. FIG. 7 is a cross-sectional view taken along line BB in FIG. 5, showing the support portion of the resonator element according to the second embodiment. The vibrating piece 2b according to the second embodiment shown in FIGS. 5, 6, and 7 is different from the vibrating piece 2a according to the first embodiment described above in the configuration of the support portion. Hereinafter, in the description of the second embodiment, components that are different from those of the first embodiment described above will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

  A vibrating piece 2b according to the second embodiment shown in FIGS. 5, 6, and 7 is a pair of a base portion 12 and a vibrating portion extending from the base portion 12, similarly to the vibrating piece 2 a of the first embodiment. Vibration arms 20 and 22 and hammer heads 24 and 26, and a support portion 14 b that extends between the pair of vibration arms 20 and 22 and extends from the base 12.

  The support portion 14b of the resonator element 2b according to the second embodiment is arranged between the pair of vibrating arms 20 and 22 and arranged along the vibrating arms 20 and 22 in a plan view. 12 so as to protrude in the −Y′-axis direction. And the through-hole 19 which penetrates the front and back of the support part 14b is provided in the front end side of the support part 14b. A through electrode 44 is provided on the inner surface of the through hole 19. The through hole 19 shows a rectangular planar shape as an example, but the planar shape is not limited as long as it penetrates the front and back surfaces. For example, the planar shape is circular, elliptical, polygonal, etc. Also good. Further, the through electrode 44 does not have to be formed on the entire inner surface of the through hole 19, and the lead electrode 42b and the second pad electrode 17f only need to be electrically connected. The inner surface of the through hole 19 may be formed parallel to the Z′-axis direction as shown in FIG. 7, but is inclined with respect to the Z′-axis direction in order to facilitate the formation of the electrode material. It is good to include an area. Preferably, all the inner surfaces are inclined with respect to the Z ′ direction. By doing so, the lead electrode 42b and the second pad electrode 17f can be electrically connected more reliably.

  The electrode configuration of the resonator element 2b according to the second embodiment is the same as that of the electrode of the resonator element 2a of the first embodiment except that the configuration of the support portion 14b is different. Here, the configuration of the support portion 14b having a different configuration will be mainly described, and the same configuration as that of the resonator element 2a of the first embodiment is denoted by the same reference numeral, and the description thereof is omitted.

  The electrodes of the vibrating piece 2b are formed on the front and back surfaces and the side surfaces, which are the main surfaces of the vibrating piece 2b, and are formed on the excitation electrodes 41a and 41b formed on the vibrating arms 20 and 22, and on the base 12 and the hammer heads 24 and 26. And lead electrodes 42a and 42b, and connection electrodes 43a and 43b, a first pad electrode 18 and a second pad electrode 17f formed on the support portion 14b.

  A first pad electrode 18 and a second pad electrode 17f for connecting to a connection electrode (not shown) formed on the package from the vicinity of the center of the surface of the base portion 12 of the resonator element 2b to the support portion 14b, and a first pad A connection electrode 43a that connects the electrode 18 and the extraction electrode 42a is formed. A connection electrode 43b that connects the extraction electrode 42b and the through electrode 44 is formed from the vicinity of the center of the back surface of the base 12 of the resonator element 2b to the support portion 14b. The second pad electrode 17f on the front surface is electrically connected to the connection electrode 43b on the back surface by a through electrode 44 provided on the inner surface of the through hole 19 that penetrates the front surface and the back surface of the support portion 14b. The first pad electrode 18 and the second pad electrode 17f are potentials for driving the resonator element 2b, the first pad electrode 18 has a first potential, and the second pad electrode 17f is a second potential. have.

A side electrode 15b as a conductive layer is provided on the side surface connecting the front surface and the back surface of the support portion 14b. The side electrode 15b is provided over the entire side surface constituting the outer periphery of the support portion 14b. And the side electrode 15b provided in the side surface of the support part 14b is covered with the insulating layer 16b arrange | positioned so that this side electrode 15b may be covered. As in the first embodiment, the insulating layer 16b covers the surface of the side electrode 15b, and further covers a part of the side surface where the side electrode 15b is not provided. The insulating layer 16b can be formed of, for example, a SiO ₂ film, a SiN film, a resin that does not contain a conductive filler, or the like.

  As described above, in the second embodiment, the second pad electrode 17f on the front surface is electrically connected to the connection electrode 43b on the back surface by the through electrode 44 on the inner surface of the through hole 19 provided in the support portion 14b. ing. Accordingly, the side electrode 15b as a conductive layer provided on the side surface connecting the front surface and the back surface of the support portion 14b has a floating potential that does not have a specific potential, or other potential that is not connected to the excitation electrodes 41a and 41b. The electrode can be a (constant potential) electrode.

  According to the resonator element 2b according to the second embodiment, the insulating layer 16b that covers the side electrode 15b as a conductive layer provided on the side surface of the support portion 14b is provided on either the front surface or the back surface of the support portion 14b. Even if the conductive bonding material used for connecting the first pad electrode 18 or the second pad electrode 17f to the package (not shown), for example, wraps around the side surface, the first pad electrode 18 and the second pad electrode It can suppress that 17f short-circuits via the side surface electrode 15b. Therefore, a constant potential electrode can be provided on the side surface of the support portion 14b, and noise from the outside can be suppressed. Further, by the same effect as the first embodiment, it is possible to provide a wiring on the side surface of the support portion 14b and improve the wiring routing efficiency. Therefore, the vibration piece 2b can be reduced in size. it can.

(Third embodiment)
Next, a resonator element according to a third embodiment of the invention will be described with reference to FIGS. 8 and 9. FIG. 8 is a plan view (top view) schematically showing the structure of the resonator element according to the third embodiment of the invention. FIG. 9 is a bottom view schematically showing the structure of the resonator element according to the third embodiment, and is a perspective view in which the resonator element is transmitted from the + Z′-axis direction in the drawing. The vibrating piece 2c according to the third embodiment shown in FIGS. 8 and 9 is different from the vibrating piece 2a according to the first embodiment described above in the configuration of the support portion. Hereinafter, in the description of the third embodiment, components that are different from those of the first embodiment described above will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

  A vibrating piece 2c according to the third embodiment shown in FIGS. 8 and 9 is similar to the vibrating piece 2a of the first embodiment, and includes a base portion 12 and a pair of vibrating arms that are vibrating portions extending from the base portion 12. 20 and 22 and hammer heads 24 and 26, and a support portion 14 c extending from the base 12 on the opposite side (+ Y′-axis direction) to the protruding side of the vibrating arms 20 and 22. Further, the base 12 is provided with two through electrodes 21 penetrating the front and back surfaces.

  The support portion 14c of the resonator element 2c according to the third embodiment is on the opposite side of the base portion 12 extending between the pair of vibrating arms 20 and 22 in a plan view, and protrudes from the base portion 12 in the + Y′-axis direction. Further, the tip end portion is bent and extended in the −X axis direction so that the tip side surface 14t extends along the X axis direction. In other words, a constricted portion 48 having a smaller width dimension in the X-axis direction than the base portion 12 is provided between the base portion 12 and the support portion 14c, and the base portion 12 and the support portion 14c are connected via the constricted portion 48. Yes.

  The electrode configuration of the resonator element 2c according to the third embodiment is the same as that of the electrode of the resonator element 2a of the first embodiment except that the configurations of the base 12 and the support portion 14c are different. Here, the configuration of the base 12 and the support 14c, which are different configurations, will be mainly described, and the same configuration as that of the resonator element 2a of the first embodiment will be denoted by the same reference numerals and description thereof will be omitted.

  The electrodes of the vibrating piece 2c are formed on the front and back surfaces and the side surfaces, which are the main surfaces of the vibrating piece 2c, and are formed on the excitation electrodes 41a and 41b formed on the vibrating arms 20 and 22, and the base 12 and the hammer heads 24 and 26. And lead electrodes 42a and 42b, connection electrodes 43c, 43d, 43e and 43f formed on the support portion 14c, first pad electrodes 18c and 18d, and second pad electrodes 17c and 17d.

  A first pad electrode 18c and a second pad electrode 17c for connecting to a connection electrode (not shown) formed on the package from the vicinity of the center of the surface of the base portion 12 of the resonator element 2c to the support portion 14c, and a first pad A connection electrode 43c that connects the electrode 18c and the extraction electrode 42a and a connection electrode 43d that connects the second pad electrode 17c and the extraction electrode 42b are formed. Further, from the vicinity of the center of the back surface of the base portion 12 of the resonator element 2c to the support portion 14c, a first pad electrode 18d and a second pad electrode 17d for connecting to a connection electrode (not shown) formed on the package, A connection electrode 43e that connects the first pad electrode 18d and the extraction electrode 42a and a connection electrode 43f that connects the second pad electrode 17d and the extraction electrode 42b are formed. The front-side extraction electrode 42a and the rear-side extraction electrode 42a are electrically connected to the front-side extraction electrode 42b and the rear-side extraction electrode 42b by the through-electrodes 21, respectively.

A side surface electrode 15c as a conductive layer and an insulating layer 16c covering the side surface electrode 15c are provided on the side surface 14t on the distal end side of the support portion 14c. In this embodiment, the side electrode 15c is an electrode having the same potential as that of the extraction electrode 42b, the connection electrode 43d, and the second pad electrodes 17c and 17d connected to the excitation electrode 41b. Further, as in the first embodiment, the insulating layer 16c is provided so as to cover the surface of the side electrode 15c and to cover part of the side surface where the side electrode 15c is not provided. The insulating layer 16c can be formed of, for example, a SiO ₂ film, a SiN film, a resin not containing a conductive filler, or the like.

  According to the resonator element 2c according to the third embodiment, the first pad on the surface of the support portion 14c is covered with the insulating layer 16c that covers the side electrode 15c as the conductive layer provided on the side surface 14t on the tip side of the support portion 14c. A conductive bonding material used for connecting one of the electrode 18c and the second pad electrode 17c or the first pad electrode 18d and the second pad electrode 17d on the back surface to, for example, a package (not shown) is formed on the side surface 14t. Even if it goes around, the first pad electrodes 18c, 18d and the second pad electrodes 17c, 17d can be prevented from being short-circuited via the side electrode 15c. Therefore, by the same effect as the first embodiment, it is possible to provide wiring on the side surface 14t of the support portion 14c, and the wiring routing efficiency can be improved, so that the vibration piece 2c can be reduced in size. Can do.

(Fourth embodiment)
Next, a resonator element according to a fourth embodiment of the invention will be described with reference to FIGS. 10 and 11. FIG. 10 is a plan view (top view) schematically showing the structure of the resonator element according to the fourth embodiment of the invention. FIG. 11 is a bottom view schematically showing the structure of the resonator element according to the fourth embodiment, and is a perspective view in which the resonator element is transmitted from the + Z′-axis direction in the drawing. The vibrating piece 2d according to the fourth embodiment shown in FIGS. 10 and 11 is different from the vibrating piece 2a according to the first embodiment described above in the arrangement and configuration of the support portions. Hereinafter, in the description of the fourth embodiment, components different from those of the first embodiment described above will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

  Similar to the vibrating piece 2a of the first embodiment, the vibrating piece 2d according to the fourth embodiment shown in FIGS. 10 and 11 includes a base portion 12d and a pair of vibrating arms 20 that are vibrating portions extending from the base portion 12d. , 22 and hammer heads 24, 26, and a support portion 14 d that is located outside the vibrating arm 22 (in the + X-axis direction) and extends from the base portion 12 d.

  The support portion 14d of the resonator element 2d according to the fourth embodiment is disposed outside the vibrating arm 22 (in the + X-axis direction) and arranged along the vibrating arm 22 in a plan view, and the base portion 12d. Is extended along the direction perpendicular to the protruding direction of the vibrating arms 20 and 22, that is, along the + X-axis direction, and further toward the protruding direction (−Y′-axis direction) of the vibrating arms 20 and 22 at the extended tip. It has been extended. In other words, the support portion 14d is disposed on the opposite side of the vibrating arm 20 with respect to the vibrating arm 22 and extends in the protruding direction (−Y′-axis direction) of the vibrating arms 20 and 22. A through electrode 44d penetrating the front and back surfaces of the support portion 14d is provided on the front end 14f side of the support portion 14d. The through electrode 44d is shown as an example of a configuration provided in a through hole having a rectangular planar shape, but the shape is not limited as long as it penetrates the front and back surfaces, for example, the planar shape is circular, elliptical It may be provided in a through hole such as a shape or a polygon.

  The electrode configuration of the resonator element 2d according to the fourth embodiment is the same as that of the electrode of the resonator element 2a of the first embodiment except that the configuration of the support portion 14d is different. Here, the configuration of the support portion 14d having a different configuration will be mainly described, and the same configuration as that of the resonator element 2a of the first embodiment will be denoted by the same reference numeral and description thereof will be omitted.

  The electrodes of the vibrating piece 2d are formed on the front and back surfaces and the side surfaces, which are the main surfaces of the vibrating piece 2d, and are formed on the excitation electrodes 41a and 41b formed on the vibrating arms 20 and 22, and on the base 12d and the hammer heads 24 and 26. And lead electrodes 42a and 42b, connection electrodes 43g and 43h, a first pad electrode 18e, and second pad electrodes 17d and 17e formed on the support portion 14d.

  A first pad electrode 18e and a second pad electrode 17d for connecting to a connection electrode (not shown) formed in the package and a first pad are formed from the vicinity of the center of the surface of the base 12d of the resonator element 2d to the support 14d. A connection electrode 43g that connects the electrode 18e and the extraction electrode 42a is formed. A second pad electrode 17e and a connection electrode 43h for connecting the second pad electrode 17e and the extraction electrode 42b are formed from the vicinity of the center of the back surface of the base 12d of the resonator element 2d to the support 14d. The second pad electrode 17d on the front surface is electrically connected to the second pad electrode 17e on the rear surface by a through electrode 44d penetrating the front surface and the rear surface of the support portion 14d. The first pad electrode 18e and the second pad electrodes 17d and 17e are potentials for driving the resonator element 2d, the first pad electrode 18e has a first potential, and the second pad electrodes 17d and 17e are It has a second potential.

A side surface electrode 15d as a conductive layer is provided on the side surface connecting the front surface and the back surface of the support portion 14d. The side electrode 15d is provided over the entire side surface constituting the outer periphery of the support portion 14d. The side electrode 15d provided on the side surface of the support portion 14d covers at least a portion of the side electrode 15d located in the vicinity of the first pad electrode 18e, the second pad electrodes 17d and 17e, and the through electrode 44d. The insulating layer 16d is covered. The insulating layer 16d covers the surface of the side electrode 15d as in the first embodiment. The insulating layer 16d may further cover a side surface where the side electrode 15d is not provided or a part of the side surface. The insulating layer 16d can be formed of, for example, a SiO ₂ film, a SiN film, a resin that does not contain a conductive filler, or the like.

  As described above, in the fourth embodiment, the second pad electrode 17d on the front surface is electrically connected to the second pad electrode 17e on the rear surface by the through electrode 44d provided on the support portion 14d. Therefore, the side electrode 15d as a conductive layer provided on the side surface of the support portion 14d is a floating potential that does not have a specific potential, or another potential (constant potential) electrode that is not connected to the excitation electrodes 41a and 41b. can do.

  According to the resonator element 2d according to the fourth embodiment, the insulating layer 16d that covers the side electrode 15d as the conductive layer provided on the side surface of the support portion 14d is provided on either the front surface or the back surface of the support portion 14d. Even if the conductive bonding material used when the first pad electrode 18e or the second pad electrode 17d is connected to a package (not shown), for example, wraps around the side surface, the first pad electrode 18e and the second pad electrode It can suppress that 17d short-circuits via the side electrode 15d. Therefore, an electrode having a constant potential can be provided on the side surface of the support portion 14d, and noise from the outside can be suppressed. Further, the same effect as that of the first embodiment makes it possible to provide wiring on the side surface of the support portion 14d and improve wiring routing efficiency, so that the vibration piece 2d can be reduced in size. it can.

(Fifth embodiment)
Next, a resonator element according to a fifth embodiment of the invention will be described with reference to FIG. FIG. 12 is a plan view (top view) schematically showing the structure of the resonator element according to the fifth embodiment of the invention. A vibrating piece 2e according to the fifth embodiment shown in FIG. 12 is different from the above-described vibrating piece 2d according to the fourth embodiment in the arrangement and configuration of the support portions. Hereinafter, in the description of the fifth embodiment, components that are different from those of the above-described fourth embodiment will be described, and the same components will be denoted by the same reference numerals and description thereof will be omitted.

  A vibrating piece 2e according to the fifth embodiment shown in FIG. 12 is similar to the vibrating piece 2d of the fourth embodiment, and includes a base portion 12e and a pair of vibrating arms 20, 22 that are vibrating portions extending from the base portion 12e. Hammer heads 24 and 26, and a pair of support portions 14d and 14e extending from the base portion 12e on the outer sides (−X axis direction and + X axis direction) of the pair of vibrating arms 20 and 22, respectively. ing.

  The support portion 14d of the resonator element 2e according to the fifth embodiment is located on the outer side (+ X axis direction) of the resonator arm 22 in plan view, like the resonator element 2d of the fourth embodiment. Are arranged so as to be lined up along the direction extending perpendicularly to the protruding direction of the vibrating arms 20 and 22 from the base portion 12e, that is, along the + X-axis direction. It extends toward the protruding direction (−Y′-axis direction). Further, the support portion 14e is arranged outside the vibrating arm 20 (in the −X axis direction) in a plan view and arranged along the vibrating arm 20, and from the base portion 12e to the vibrating arms 20 and 22. A direction orthogonal to the projecting direction and the direction opposite to the extending direction of the support portion 14d, that is, extending along the −X axis direction, and further extending in the projecting direction of the vibrating arms 20 and 22 (−Y ′). Axial direction). In other words, the pair of vibrating arms 20 and 22 are disposed between the support portion 14d and the support portion 14e, which are a pair of support portions in a plan view. A through electrode 44d penetrating the front and back surfaces of the support portion 14d is provided on the front end 14f side of the support portion 14d.

  The electrode configuration of the resonator element 2e according to the fifth embodiment is the same as that of the resonator element 2e of the fourth embodiment described above, except for the electrodes provided on the support portion 14e. Here, the configuration of the support portion 14e having a different configuration will be mainly described, and the same configuration as that of the resonator element 2a of the first embodiment will be denoted by the same reference numeral and description thereof will be omitted.

  The support portion 14e is not provided with electrodes on the front and back surfaces, and a side electrode 15e as a conductive layer is provided on the side surface connecting the front surface and the back surface of the support portion 14e. The side electrode 15e is provided over the entire side surface constituting the outer periphery of the support portion 14e. The side electrode 15e may be connected to the excitation electrode 41b, for example, or may be an electrode having a floating potential that is not connected to another electrode.

  According to the resonator element 2e according to the fifth embodiment, in addition to the effect of the resonator element 2d according to the fourth embodiment described above, the vibrating arms 20 and 22 are disposed between the pair of support portions 14d and the support portion 14e. Therefore, the connection state of the vibrating arms 20 and 22 through the base portion 12e can be further stabilized. As a result, the vibration characteristics can be further stabilized.

(Sixth embodiment)
Next, a vibrator according to a sixth embodiment of the invention will be described with reference to FIG. FIG. 13 is a front sectional view schematically showing the structure of the vibrator according to the sixth embodiment. Note that the vibrator according to the sixth embodiment exemplifies a configuration using the resonator element 2a according to the first embodiment described above, but the other resonator elements 2b, 2c, and 2d described in the above embodiment. , 2e can be used.

  As shown in FIG. 13, the vibrator 3 according to the sixth embodiment includes a vibrating piece 2 a on which an electrode is formed, a package body 50 that is formed in a rectangular box shape to accommodate the vibrating piece 2 a, And a lid member 59 made of glass, ceramic, metal or the like. In addition, the inside of the cavity 70 that accommodates the resonator element 2a is a decompressed space that is almost a vacuum.

  The package body 50 is formed by laminating a first substrate 51 as a substrate, a second substrate 52, and mounting terminals 45. A plurality of mounting terminals 45 are formed on the outer bottom surface of the first substrate 51. In addition, a plurality of internal terminals 53 a and 53 b including terminals that are electrically connected to the mounting terminals 45 are provided at predetermined positions on the upper surface, which is one surface of the first substrate 51, through a not-shown through electrode and interlayer wiring. Is provided. The second substrate 52 is an annular body from which the central portion is removed, and a cavity 70 that accommodates the resonator element 2 a together with the first substrate 51 is formed.

  The first substrate 51 and the second substrate 52 are made of an insulating material. Such a material is not particularly limited, and various ceramics such as oxide ceramics, nitride ceramics, and carbide ceramics can be used. Further, for example, each of the electrodes such as the internal terminals 53a and 53b, terminals (not shown), or a wiring pattern or an in-layer wiring pattern (not shown) electrically connected to each other provided in the package body 50 is generally Specifically, a metal wiring material such as tungsten (W) or molybdenum (Mo) is screen-printed on an insulating material and fired, and then plated with nickel (Ni), gold (Au), or the like. The

  The lid member 59 is preferably made of a light transmitting material, such as borosilicate glass, and is hermetically sealed with the sealant 68 by being joined thereto. As a result, after the lid of the package body 50 is sealed (after the lid is joined), the laser beam transmitted from the outside through the lid member 59 is applied to the vicinity of the tip of the resonator element 2a, and a part of the electrode provided here is evaporated. Thus, the frequency can be adjusted by the mass reduction method. When such frequency adjustment is not performed, the lid member 59 can be formed of a metal material such as a Kovar alloy.

The resonator element 2 a housed in the cavity 70 of the package body 50 includes the first pad electrode 18 and the second pad electrode 17 a formed on the surface side of the support portion 14, and the first substrate 51 of the package body 50. The internal terminals 53 a and 53 b formed on the upper surface are aligned and connected via the joining member 54. For example, the bonding member 54 can be electrically connected and mechanically connected by using a conductive bonding member such as a conductive adhesive. At this time, an insulating layer 16 (see FIGS. 1 and 3) formed of, for example, SiO ₂ is provided and exposed on the side surface of the support portion 14 of the resonator element 2a. Even if the conductive bonding member 54 wraps around the side surface, it is possible to suppress a short circuit between the internal terminal 53a and the internal terminal 53b via the wiring provided on the side surface. Therefore, wiring can be provided on the side surface of the support portion 14 of the vibrating piece 2a.

  According to the vibrator 3 described above, the resonator element 2a reduced in size by improving the wiring routing efficiency is joined to the first substrate 51 as the substrate via the internal terminals 53a and 53b. The main body 50 can be made small, and as a result, the small vibrator 3 can be obtained.

(Seventh embodiment)
Next, an oscillator according to a seventh embodiment of the invention will be described with reference to FIGS. FIG. 14 is a plan view showing a schematic structure of an oscillator according to the seventh embodiment of the invention. FIG. 15 shows a schematic structure of the oscillator, and is a cross-sectional view taken along the line CC of FIG. In FIG. 14, the lid member 85 and the sealing material 84 shown in FIG. 15 are omitted (see through). Further, in the oscillator according to the seventh embodiment, the configuration using the resonator element 2e according to the above-described fifth embodiment is illustrated, but the other resonator elements 2a, 2b, 2c, described in the above-described embodiment are illustrated. Either 2d can be used.

  As shown in FIG. 14 and FIG. 15, the oscillator 4 includes a vibrating piece 2 e on which an electrode is formed, a package body 80 that houses the vibrating piece 2 e and the like, and an IC chip as a circuit unit for driving the vibrating piece 2 e. (Chip component) 90 and a lid member 85 made of glass, ceramic, metal or the like. In addition, the inside of the cavity 89 that accommodates the resonator element 2e and the IC chip 90 is a decompressed space that is almost close to a vacuum.

  The package body 80 is formed by laminating a first substrate 81 as a substrate, a second substrate 82, and mounting terminals 83. A plurality of mounting terminals 83 are formed on the outer bottom surface of the first substrate 81. In addition, a chip connection terminal (not shown) including a terminal electrically connected to the mounting terminal 83 via a through electrode or interlayer wiring (not shown) is provided at a predetermined position on the upper surface, which is one surface of the first substrate 81. A plurality of internal terminals 86a and 86b connected to some of the chip connection terminals are provided. The second substrate 82 is an annular body from which the central portion is removed, and a cavity 89 that accommodates the resonator element 2 e and the IC chip 90 is formed together with the first substrate 81.

  The first substrate 81 and the second substrate 82 are made of an insulating material. Such a material is not particularly limited, and various ceramics such as oxide ceramics, nitride ceramics, and carbide ceramics can be used. Further, for example, each electrode such as internal terminals 86a and 86b, terminals (not shown), or a wiring pattern or an in-layer wiring pattern (not shown) electrically connected to each other provided in the package body 80 is generally used. Specifically, a metal wiring material such as tungsten (W) or molybdenum (Mo) is screen-printed on an insulating material and fired, and then plated with nickel (Ni), gold (Au), or the like. The

  The lid member 85 is preferably made of a light-transmitting material, such as borosilicate glass, and is hermetically sealed with the package member 80 by being joined by a sealing material 84. Thereby, after the lid of the package body 80 is sealed (after the lid is joined), the laser light transmitted through the lid member 85 from the outside is irradiated to the vicinity of the tip of the vibrating piece 2e, and a part of the electrode provided here is evaporated. Thus, the frequency can be adjusted by the mass reduction method. When such frequency adjustment is not performed, the lid member 85 can be formed of a metal material such as a Kovar alloy.

  An IC chip (chip component) 90 as a circuit unit housed in the cavity 89 of the package body 80 is a bonding material such as a gold bump on an electrode pad (not shown) provided on the active surface of the IC chip 90. 91 is joined to a wiring pattern (not shown) provided on the first substrate 81 (in the package main body 80) by electrical connection. The IC chip (chip component) 90 includes an oscillation circuit that oscillates at least the resonator element 2e. In addition, the IC chip 90 can have a function of processing an oscillation signal from the input resonator element 2 e and outputting it from the mounting terminal 83.

The resonator element 2e housed in the cavity 89 of the package body 80 includes a first pad electrode 18d and a second pad electrode 17d (see FIG. 12) formed on the surface side of the support portion 14d (see FIG. 12), Internal terminals 86 a and 86 b formed on the upper surface of the first substrate 81 of the package body 80 are aligned and connected via a joining member 88. For example, the bonding member 88 can be electrically connected and mechanically connected by using a conductive bonding member such as a conductive adhesive. At this time, since the insulating layer 16d (see FIG. 12) formed of, for example, SiO ₂ is provided and exposed on the side surface of the support portion 14d of the resonator element 2e, a conductive adhesive such as a conductive adhesive is used. Even if the bonding member 88 goes around the side surface, it is possible to suppress a short circuit between the internal terminal 86a and the internal terminal 86b via the wiring provided on the side surface.

  Further, the vibrating piece 2e is arranged such that the support portion 14d connected to the internal terminals 86a and 86b is positioned on the opposite side of the IC chip 90 with respect to the vibrating arms 20 and 22 (see FIG. 12) of the vibrating piece 2e. . That is, the resonator element 2 e is connected to the first substrate 81 on the side opposite to the IC chip 90 with respect to the vibrating arms 20 and 22. With such an arrangement, by connecting the resonator element 2e to the first substrate 81, there is no need for a terminal (corresponding to the internal terminals 86a and 86b) for connecting the resonator element 2e on the IC chip 90 side. A holding terminal 87 for supporting the piece 2e is disposed. Since the holding terminal 87 does not require a space for applying the joining member 88, the arrangement space can be reduced as compared with the terminals (corresponding to the internal terminals 86a and 86b) to which the resonator element 2e is connected. Therefore, even in the vibrating piece 2e in which the support portions 14d and 14e are arranged on both sides of the vibrating arms 20 and 22, the clearance between the IC chip 90 and the vibrating piece 2e can be reduced, and the IC chip 90 And the dimension in the direction in which the vibrating pieces 2e are arranged can be reduced. As a result, the oscillator 4 can be reduced in size. In addition, when connecting the support part 14e of the vibration piece 2e and the holding terminal 87 via a joining member, since it is not necessary to electrically connect the support part 14e and the holding terminal 878, the support part 14e and the holding terminal 87 may be connected via a non-conductive bonding member. If the support portion 14e and the holding terminal 87 are connected via a non-conductive bonding member, the non-conductive bonding member that connects the support portion 14e and the holding terminal 87 may protrude to the IC chip 90 side. Since the possibility that the IC chip 90 and the resonator element 2e are electrically connected is reduced, the possibility that the performance of the oscillator 4 is lowered can also be reduced.

  According to the oscillator 4 described above, the resonator element 2e reduced in size by improving the wiring routing efficiency or the like is joined to the first substrate 81 as the substrate via the internal terminals 86a and 86b. 80 can be made small. The miniaturized resonator element 2e and the IC chip 90 are connected to a single substrate (first substrate 81). Accordingly, it is possible to provide a small oscillator 4 in which the resonator element 2e and the IC chip 90 as a circuit unit are integrally stored in the cavity 89 of the package body 80.

[Electronics]
Next, electronic devices to which the resonator elements 2a, 2b, 2c, 2d, and 2e according to the above embodiments are applied as electronic devices according to an embodiment of the present invention will be described in detail with reference to FIGS. In the description, an example in which the vibrator 3 including the tuning-fork type vibrating piece 2a is applied to an electronic device is shown. Further, an oscillator including any one of the resonator elements 2a, 2b, 2c, 2d, and 2e, for example, the oscillator 4 including the resonator element 2e can be applied to an electronic device.

  FIG. 16 is a perspective view schematically illustrating a configuration of a mobile (or notebook) personal computer as an electronic apparatus including the vibrator 3 according to the embodiment of the invention. In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1101. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 has a built-in vibrator 3.

  FIG. 17 is a perspective view schematically illustrating a configuration of a mobile phone (including PHS) as an electronic device including the vibrator 3 according to the embodiment of the invention. In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1201 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates the vibrator 3.

  FIG. 18 is a perspective view schematically illustrating a configuration of a digital camera as an electronic apparatus including the vibrator 3 according to the embodiment of the invention. In this figure, connection with an external device is also simply shown. Here, a normal camera sensitizes a silver salt photographic film with a light image of a subject, whereas a digital camera 1300 captures a light image of a subject by photoelectrically converting it with an image sensor such as a CCD (Charge Coupled Device). A signal (image signal) is generated.

  A display unit 1301 is provided on the back of a case (body) 1302 in the digital camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1301 displays a subject as an electronic image. Function as. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302.

  When the photographer confirms the subject image displayed on the display unit 1301 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308. In the digital camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation. Such a digital camera 1300 incorporates the vibrator 3.

  In addition to the personal computer (mobile personal computer) in FIG. 16, the mobile phone in FIG. 17, and the digital camera in FIG. For example, inkjet printers), laptop personal computers, tablet personal computers, storage area network devices such as routers and switches, local area network devices, mobile terminal base station devices, televisions, video cameras, video recorders, car navigation devices Real-time clock device, pager, electronic notebook (including communication function), electronic dictionary, calculator, electronic game device, word processor, workstation, videophone, security TV monitor, electronic Binoculars, POS terminal, medical equipment (eg electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, wired or wireless communication function and various data Various measuring instruments such as gas meters, water meters and watt hour meters (smart meters) that can be transmitted, instruments (for example, instruments for vehicles, aircraft, ships), flight simulators, head mounted displays, motion tracing, motion tracking, motion The present invention can be applied to electronic devices such as controllers and PDR (pedestrian position / direction measurement).

[Moving object]
Next, a moving body to which the resonator elements 2a, 2b, 2c, 2d, and 2e according to the above embodiment are applied will be described in detail with reference to FIG. In the description, an example in which the vibrator 3 including the tuning-fork type vibrating piece 2a is applied to a moving body is shown. Further, an oscillator including any one of the resonator elements 2a, 2b, 2c, 2d, and 2e, for example, the oscillator 4 including the resonator element 2e can be applied to the moving body.

  FIG. 19 is a perspective view schematically showing an automobile as an example of a moving body. An automobile 1500 is equipped with a vibrator 3 to which the resonator element 2a according to the present invention is applied. For example, as shown in the figure, an automobile 1500 as a moving body has an electronic control unit 1510 that includes a vibrator 3 and controls a tire 1504 and the like mounted on a vehicle body 1502. In addition, vibrator 3 includes keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock brake system (ABS), airbag, tire pressure monitoring system (TPMS), engine The present invention can be widely applied to electronic control units (ECUs) such as controls, battery monitors for hybrid vehicles and electric vehicles, and vehicle body attitude control systems.

  In the first to seventh embodiments described above, an example in which the vibrating pieces 2a, 2b, 2c, 2d, and 2e are configured as tuning fork type vibrating pieces having two vibrating arms has been described. A vibrating piece having one vibrating arm, a SAW (Surface Acoustic Wave) resonator piece, an AT-cut crystal vibrating piece, an SC-cut crystal vibrating piece, another piezoelectric vibrating piece, a MEMS (Micro Electro Mechanical Systems) vibrating piece, etc. May be used. Furthermore, in the first to seventh embodiments described above, an example in which the resonator elements 2a, 2b, 2c, 2d, and 2e are configured using a quartz plate is shown. However, the present invention is not limited thereto, and lithium tantalate and niobic acid are used. A piezoelectric single crystal such as lithium, a piezoelectric material such as piezoelectric ceramics such as lead zirconate titanate, or a silicon semiconductor material can also be used. As the excitation means of the resonator elements 2a, 2b, 2c, 2d, and 2e, one that uses a piezoelectric effect may be used, or electrostatic drive that uses a Coulomb force may be used.

  2a, 2b, 2c, 2d, 2e ... vibrating piece, 3 ... vibrator, 4 ... oscillator, 12 ... base part, 14 ... support part, 14a ... surface of the support part (upper surface), 14r ... back surface of the support part (lower surface) , 14s... Side surface of the support portion, 15... Side electrode as a conductive layer, 16... Insulating layer, 17a and 17b ... Second pad electrode, 18 ... First pad electrode, 20, 22. 26a hammer head 28a 28b 30a 30b groove 41a 41b excitation electrode 42a 42b lead electrode 43a 43b connection electrode 50 80 package body 54 88 joint member , 90... IC chip as a circuit unit, 1100. Mobile personal computer as an electronic device, 1200... Cellular phone as an electronic device, 1300. Mera, 1500 ... a motor vehicle as a moving body.

Claims (12)

A vibrating part;
A support part connected to the vibrating part;
A conductive layer provided on a side surface connecting the front surface and the back surface of the support portion and an insulating layer covering the conductive layer;
The support portion has a first pad electrode having a first potential on either the front surface or the back surface, and a second pad electrode having a second potential on at least one of the front surface or the back surface. A vibrating piece characterized by comprising:   2. The resonator element according to claim 1, wherein the first pad electrode and the second pad electrode are provided on the same surface of the front surface or the back surface.   The resonator element according to claim 1, wherein the insulating layer extends to a part of the front surface or the back surface. Has a base,
The vibrating portion extends from the base portion,
4. The resonator element according to claim 1, wherein the support part is connected to the vibration part via the base part. 5.   The vibrating piece according to claim 4, wherein the support portion extends from the base portion along a direction in which the vibrating portion extends.   The vibrating portion is positioned in a first region having a first width as a width in a direction intersecting with a direction extending from the base portion, and is located on a more distal side than the first region, and is more than the first width. The resonator element according to claim 4, further comprising a second region having a wide second width. A pair of the vibrating portions;
The vibrating piece according to any one of claims 4 to 6, wherein the support portion is disposed between the pair of vibrating portions in a plan view. Having a pair of vibrating parts and a pair of supporting parts,
7. The resonator element according to claim 4, wherein the pair of vibrating portions is disposed between the pair of supporting portions in a plan view. A resonator element according to any one of claims 1 to 8,
A substrate to which the resonator element is connected,
The vibrator, wherein the support portion of the vibrating piece is connected to the substrate via a bonding member. A resonator element according to any one of claims 1 to 8,
A circuit unit for oscillating the resonator element;
A board connecting the resonator element and the circuit unit,
The oscillator, wherein the support portion of the resonator element is connected to the substrate through a bonding member.   An electronic device comprising the resonator element according to claim 1.   A moving body comprising the resonator element according to claim 1.

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