JP7314562B2 - Vibration devices, oscillators, electronic devices and moving objects - Google Patents

Description

TECHNICAL FIELD The present invention relates to vibration devices, oscillators, electronic devices, and moving bodies.

The oscillator described in Patent Document 1 has a base, a pedestal supported by the base, and a vibration element supported by the pedestal. Also, the vibrating element is mechanically and electrically connected to the base using a conductive adhesive.

Japanese Unexamined Patent Application Publication No. 2006-13650

In this way, if a conductive adhesive is used to electrically connect the vibrating element and the pedestal, the electrical connection may become insufficient, which may affect the vibration characteristics of the vibrating element, and in particular, may cause the vibration characteristics to become unstable.

A vibration device according to this application example includes a base including a first base terminal and a second base terminal;
a first joint member;
an intermediate substrate bonded to the base via the first bonding member;
a second joint member;
an element substrate, a first excitation electrode arranged on the first surface of the element substrate, a second excitation electrode arranged on the second surface opposite to the first surface of the element substrate, a first terminal connected to the first excitation electrode, and a second terminal connected to the second excitation electrode, and a vibration element bonded to the intermediate substrate via the second bonding member;
the first terminal and the first base terminal are electrically connected by a first wire;
The second terminal and the second base terminal are electrically connected by a second wire.

In the vibrating device according to this application example, it is preferable that the intermediate substrate and the element substrate are each made of crystal.

In the vibration device according to this application example, it is preferable that the crystal axis of the intermediate substrate is along the crystal axis of the element substrate.

In the vibrating device according to this application example, it is preferable that the element substrate is made of an AT-cut crystal substrate.

In the vibrating device according to this application example, in plan view, a portion where the first wire is connected to the first terminal overlaps the second joint member,
It is preferable that a portion where the second wire is connected to the second terminal overlap the second joint member in a plan view.

In the vibration device according to this application example, it is preferable that the second joint member overlaps the first joint member in plan view.

In the vibrating device according to this application example, the thickness of the portion of the element substrate that is bonded to the second bonding member is T1,
When the thickness of the portion of the intermediate substrate that is bonded to the second bonding member is T2,
It is preferred that T2≧T1.

In the vibration device according to this application example, when the thickness of the portion sandwiched between the first excitation electrode and the second excitation electrode of the element substrate is T3,
It is preferred that T2≧T3.

In the vibrating device according to this application example, the element substrate is made of an AT-cut crystal substrate and has a side along the X-axis direction, which is the crystal axis of crystal,
It is preferable that the first terminal and the second terminal are arranged side by side along the side.

In the vibrating device according to this application example, when the thickness of the first portion of the element substrate bonded to the second bonding member is T1, and the thickness of the second portion sandwiched between the first excitation electrode and the second excitation electrode of the element substrate is T3,
T3>T1, and
It is preferable that the surface of the intermediate substrate on the vibration element side has a first surface that overlaps with the first portion and a second surface that overlaps with the second portion and is located on the opposite side of the first surface from the vibration element in a plan view.

The oscillator according to this application example includes the vibration device described above,
an oscillation circuit electrically connected to the vibration element and outputting an oscillation signal.

An electronic device according to this application example includes the oscillator described above,
and an arithmetic processing circuit that operates based on the oscillation signal output from the oscillator.

A moving object according to this application example includes the oscillator described above,
and an arithmetic processing circuit that operates based on the oscillation signal output from the oscillator.

1 is a cross-sectional view showing an oscillator according to a first embodiment; FIG. FIG. 2 is a plan view showing an oscillator in FIG. 1; It is a figure which shows the cut angle of AT cut. 2 is a plan view showing a modification of the oscillator of FIG. 1; FIG. FIG. 8 is a plan view of an oscillator according to a second embodiment; FIG. 11 is a partially enlarged cross-sectional view of an oscillator according to a third embodiment; FIG. 11 is a perspective view showing a personal computer according to a fourth embodiment; FIG. 11 is a perspective view showing a mobile phone according to a fifth embodiment; FIG. 11 is a perspective view showing a digital still camera according to a sixth embodiment; It is a perspective view which shows the motor vehicle which concerns on 7th Embodiment.

Hereinafter, a vibration device, an oscillator, an electronic device, and a moving body of this application example will be described in detail based on embodiments shown in the accompanying drawings.

<First embodiment>
FIG. 1 is a cross-sectional view showing the oscillator according to the first embodiment. 2 is a plan view showing the oscillator in FIG. 1. FIG. FIG. 3 is a diagram showing a cut angle of AT cut. 4 is a plan view showing a modification of the oscillator of FIG. 1. FIG. In each figure, X-axis, Y'-axis and Z'-axis, which are crystal axes of quartz and are orthogonal to each other, are shown. Further, hereinafter, the direction parallel to the X-axis is also referred to as the "X-axis direction", the direction parallel to the Y'-axis is also referred to as the "Y'-axis direction", and the direction parallel to the Z'-axis is also referred to as the "Z'-axis direction". Also, the arrow tip side of each axis is also called the "plus side", and the opposite side is also called the "minus side". A planar view from the Y'-axis direction is also simply referred to as a "planar view."

As shown in FIG. 1, the oscillator 1 is a temperature-compensated crystal oscillator (TCXO) and has a package 2, an intermediate substrate 3, a vibration element 4 and a circuit element 5 housed in the package 2. FIG. The oscillator 1 applies the vibration device 10 , and the vibration device 10 is composed of a package 2 , an intermediate substrate 3 and a vibration element 4 . However, the oscillator 1 is not limited to a temperature compensated crystal oscillator.

The package 2 has a base 21 having a recess 211 opening to the top, and a lid 22 joined to the top of the base 21 via a joining member 23 so as to close the opening of the recess 211 . An internal space S is formed inside the package 2 by a concave portion 211, and the internal space S accommodates the intermediate substrate 3, the vibration element 4, and the circuit element 5. As shown in FIG. For example, the base 21 can be made of ceramics such as alumina, and the lid 22 can be made of metal material such as Kovar. However, the constituent materials of the base 21 and the lid 22 are not particularly limited.

Further, the internal space S is airtight and is in a decompressed state, preferably in a state closer to a vacuum. Thereby, the vibration characteristics of the vibration element 4 are improved. However, the atmosphere of the internal space S is not particularly limited, and may be, for example, an atmosphere in which an inert gas such as nitrogen or Ar is enclosed, and may be in an atmospheric pressure state or a pressurized state instead of a decompressed state.

Further, the recess 211 has a recess 211a that opens to the top surface of the base 21, a recess 211b that opens to the bottom surface of the recess 211a and has a smaller opening width than the recess 211a, and a recess 211c that opens to the bottom surface of the recess 211b and has a smaller opening width than the recess 211b. The intermediate substrate 3 is bonded to the bottom surface of the recess 211a via the first bonding member B1, the vibration element 4 is bonded to the top surface of the intermediate substrate 3 via the second bonding member B2, and the circuit element 5 is bonded to the bottom surface of the recess 211c.

By interposing the intermediate substrate 3 between the vibrating element 4 and the base 21 in this way, for example, stress caused by impact or thermal deflection of the package 2 (hereinafter simply referred to as "stress from the package 2") is less likely to be transmitted to the vibrating element 4, and deterioration and fluctuation of the vibration characteristics of the vibrating element 4 can be suppressed.

The first and second joint members B1 and B2 are intended for mechanical joint and not for electrical connection. Therefore, the first and second joint members B1 and B2 may be conductive or insulating. Examples of conductive bonding members include various metal bumps such as gold bumps, silver bumps, copper bumps, and solder bumps, and conductive adhesives in which conductive fillers such as silver fillers are dispersed in various polyimide-based, epoxy-based, silicone-based, and acrylic-based adhesives. On the other hand, as the insulating joining member, for example, various resin-based adhesives such as polyimide, epoxy, silicone, and acrylic can be used. Note that the first and second joint members B1 and B2 may be of the same type or of different types.

Further, as shown in FIG. 2, the second joint member B2 overlaps the first joint member B1 in plan view. By arranging the second bonding member B2 over the first bonding member B1, the vibrating element 4 can be bonded to the intermediate substrate 3 with high accuracy. Specifically, for example, the vibration element 4 can be bonded to the intermediate substrate 3 by pressing the vibration element 4 against the second bonding member B2 arranged on the upper surface of the intermediate substrate 3 with a predetermined force. By arranging the second joint member B2 so as to overlap the first joint member B1, the second joint member B2 is supported from below by the gap-free structure composed of the laminate of the intermediate substrate 3, the first joint member B1, and the base 21. Therefore, the pressing force of the vibrating element 4 against the second joint member B2 is difficult to escape. Therefore, the vibrating element 4 can be pressed against the second bonding member B2 with a predetermined force, and the vibrating element 4 can be bonded to the intermediate substrate 3 with desired bonding strength and in a desired posture. Therefore, the vibrating element 4 can be joined to the intermediate substrate 3 with high accuracy.

In particular, in the present embodiment, the entire area of the second joint member B2 overlaps the first joint member B1 in plan view. Therefore, the effects described above can be exhibited more remarkably. However, the present invention is not limited to this, and for example, only a portion of the second joint member B2 may overlap the first joint member B1 in plan view, or the entirety may not overlap the first joint member B1.

Further, as shown in FIG. 1, a plurality of internal terminals 241 are arranged on the bottom surface of the recess 211a, a plurality of internal terminals 242 are arranged on the bottom surface of the recess 211b, and an external terminal 243 is arranged on the bottom surface of the base 21. This embodiment has two internal terminals 241: an internal terminal 241A corresponding to a first base terminal and an internal terminal 241B corresponding to a second base terminal. The internal terminals 241 and 242 and the external terminal 243 are electrically connected via internal wiring (not shown) formed inside the base 21 . The internal terminals 241A and 241B are electrically connected to the first and second terminals 423 and 424 of the vibration element 4 via first and second bonding wires BW1 and BW2, respectively, and each internal terminal 242 is electrically connected to the circuit element 5 via a third bonding wire BW3.

As shown in FIG. 2 , the vibration element 4 has an AT-cut element substrate 41 and electrodes 42 arranged on the surface of the element substrate 41 . The element substrate 41 has a thickness-shear vibration mode and a tertiary frequency-temperature characteristic. Therefore, the vibrating element 4 having excellent temperature characteristics can be obtained.

Here, briefly describing the AT-cut element substrate 41, the element substrate 41 has crystal axes X, Y, and Z orthogonal to each other. The X-, Y-, and Z-axes are called electrical, mechanical, and optical axes, respectively. As shown in FIG. 3, the element substrate 41 is a “rotated Y-cut crystal substrate” cut out along a plane in which the XZ plane is rotated by a predetermined angle θ around the X-axis, and a substrate cut out along a plane rotated by θ=35°15′ is called an “AT-cut crystal substrate”. Note that the Y-axis and Z-axis rotated around the X-axis corresponding to the angle θ are hereinafter referred to as the Y'-axis and Z'-axis. That is, the element substrate 41 has a thickness in the Y'-axis direction and a spread in the X-Z' plane direction.

As shown in FIG. 2, the outer shape of the element substrate 41 is rectangular in plan view from the Y'-axis direction. In particular, in the present embodiment, the element substrate 41 has a long side shape with long sides in the X-axis direction and short sides in the Z′-axis direction. Further, the element substrate 41 has a mesa shape, and as shown in FIG. Also, the vibrating portion 411 protrudes to both sides in the Y′-axis direction with respect to the supporting portion 412 .

However, the element substrate 41 is not limited to this, and may be a flat type in which the vibrating portion 411 and the supporting portion 412 have the same thickness, or may be an inverted mesa type in which the vibrating portion 411 is thinner than the supporting portion 412 . Further, bevel processing for grinding and chamfering the periphery of the element substrate 41 or convex processing for forming convex curved surfaces on the upper and lower surfaces may be performed. In the case of the mesa type, it may be configured to protrude only on one of the bottom side and the top side, and in the case of the inverted mesa type, it may be configured to be recessed only on the bottom side and the top side. Further, the element substrate 41 is not limited to an AT-cut crystal substrate, and may be a crystal substrate having other cut angles, such as Z-cut, SC-cut, ST-cut, BT-cut, or the like.

In addition, the constituent material of the element substrate 41 is not limited to quartz, and for example, lithium niobate (LiNbO₃), lithium tantalate (LiTaO₃), lead zirconate titanate (PZT), lithium tetraborate (Li₂B.₄O.₇), Langasite (La₃Ga₅SiO₁₄), potassium niobate (KNbO₃), gallium phosphate (GaPO₄), gallium arsenide (GaAs), aluminum nitride (AlN), zinc oxide (ZnO, Zn₂O.₃), barium titanate (BaTiO₃), lead titanate (PbPO₃), sodium potassium niobate ((K, Na) NbO₃), bismuth ferrite (BiFeO₃), sodium niobate (NaNbO₃), bismuth titanate (Bi₄Ti₃O.₁₂), sodium bismuth titanate (Na_0.5Bi_0.5TiO₃), or materials other than piezoelectric materials such as silicon.

As shown in FIG. 2, the electrode 42 has a first excitation electrode 421 arranged on the upper surface of the vibrating portion 411, and a second excitation electrode 422 arranged on the lower surface of the vibrating portion 411 and facing the first excitation electrode 421 with the vibrating portion 411 interposed therebetween. Further, the electrode 42 has a first terminal 423 and a second terminal 424 arranged on the upper surface of the support portion 412, a first lead wire 425 connecting the first excitation electrode 421 and the first terminal 423, and a second lead wire 426 connecting the second excitation electrode 422 and the second terminal 424.

As shown in FIGS. 1 and 2, the vibrating element 4 is bonded to the upper surface of the intermediate substrate 3 via the second bonding member B2 at the end of the supporting portion 412 on the negative side in the X-axis direction. In particular, since the second bonding member B2 overlaps the central portion of the element substrate 41 in the Z′-axis direction in plan view, the vibration element 4 can be bonded to the intermediate substrate 3 in a stable posture. The configuration of the second joint member B2 is not particularly limited, and for example, as shown in FIG. 4, the vibrating element 4 may be joined to the intermediate substrate 3 by two second joint members B2. In particular, in the configuration shown in FIG. 4, since the two second joint members B2 are arranged at both corners of the vibrating element 4 on the negative side in the X-axis direction, unnecessary vibration called contour vibration mode of the vibrating element 4 can be effectively suppressed. Therefore, vibration leakage is reduced, and the vibration characteristics of the vibrating element 4 are improved accordingly.

Further, as shown in FIG. 2, the first terminal 423 is electrically connected to an internal terminal 241A (first base terminal) via a first bonding wire BW1 (first wire), and the second terminal 424 is electrically connected to another internal terminal 241B (second base terminal) via a second bonding wire BW2 (second wire). Thus, by electrically connecting the internal terminals 241A and 241B and the vibration element 4 using the first and second bonding wires BW1 and BW2, the electrical connection state is stabilized, and the vibration characteristics of the vibration element 4 are stabilized.

Further, in a plan view, a portion P1 where the first bonding wire BW1 is connected to the first terminal 423 overlaps with the second bonding member B2, and a portion P2 where the second bonding wire BW2 is connected to the second terminal 424 also overlaps the second bonding member B2. These points P1 and P2 are supported from below by a gap-free structure composed of a laminate of the second joint member B2, the intermediate substrate 3, the first joint member B1, and the base 21. As shown in FIG.

Therefore, when connecting the first and second bonding wires BW1 and BW2 to the first and second terminals 423 and 424, the capillaries can be pressed against the first and second terminals 423 and 424 with sufficient force, and ultrasonic waves can be effectively applied from the capillaries to the first and second terminals 423 and 424. Therefore, a decrease in bonding strength between the first and second bonding wires BW1 and BW2 and the first and second terminals 423 and 424 can be suppressed, and the electrical connection state of the vibrating element 4 is further stabilized. Therefore, the vibration characteristics of the vibrating element 4 are further stabilized.

However, the present invention is not limited to this, and at least one of the locations P1 and P2 may not overlap the second joint member B2 in plan view.

The intermediate substrate 3 is interposed between the base 21 and the vibrating element 4 . The intermediate substrate 3 has a function of absorbing and relaxing stress from the package 2 and making it difficult for the stress to be transmitted to the vibrating element 4 . As shown in FIG. 1, the intermediate substrate 3 is plate-shaped, and its bottom surface is bonded to the bottom surface of the recess 211a via the first bonding member B1. A vibrating element 4 is bonded to the upper surface of the intermediate substrate 3 via a second bonding member B2.

Such an intermediate substrate 3 is made of the same material as the element substrate 41 . That is, in this embodiment, the intermediate substrate 3 is made of crystal. By forming the intermediate substrate 3 from the same crystal as the vibrating element 4, the thermal expansion coefficients of the intermediate substrate 3 and the vibrating element 4 can be made equal. Therefore, substantially no thermal stress is generated between the intermediate substrate 3 and the vibrating element 4 due to the difference in thermal expansion coefficients, and the vibrating element 4 is less susceptible to stress. Therefore, it is possible to more effectively suppress deterioration and fluctuation of the vibration characteristics of the vibrating element 4 .

In particular, the intermediate substrate 3 is made of a crystal substrate having the same cut angle as the element substrate 41 . As described above, since the element substrate 41 is made of the AT-cut crystal substrate, the intermediate substrate 3 is also made of the AT-cut crystal substrate. Furthermore, the crystal axis of intermediate substrate 3 is along the crystal axis of element substrate 41 . Specifically, the X-axis of the crystal axis of the intermediate substrate 3 is along the X-axis of the crystal axis of the element substrate 41, the Y-axis of the crystal axis of the intermediate substrate 3 is along the Y-axis of the crystal axis of the element substrate 41, and the Z-axis of the crystal axis of the intermediate substrate 3 is along the Z-axis of the crystal axis of the element substrate 41. Since crystal has different coefficients of thermal expansion in the X-axis direction, the Y-axis direction, and the Z-axis direction, the intermediate substrate 3 and the element substrate 41 are made to have the same cut angle and the orientations of the crystal axes are aligned with each other. Therefore, the vibrating element 4 is less likely to be subjected to stress, and deterioration and fluctuation of its vibration characteristics can be more effectively suppressed.

The thickness of the intermediate substrate 3 is not particularly limited, but when the thickness of the intermediate substrate 3 is T2, the thickness of the vibrating portion 411 of the vibrating element 4 is T3, and the thickness of the support portion 412 is T1, T2≧T1 and T2≧T3. With such a relationship, the intermediate substrate 3 can be made sufficiently thick, and the above-described effect of relaxing and absorbing the stress from the package 2 can be exhibited more remarkably. Although the upper limit of the thickness T2 is not particularly limited, for example, from the viewpoint of suppressing excessive thickening, T2/T3 ≤ 3.0 is preferable, T2/T3 ≤ 2.5 is more preferable, and T2/T3 ≤ 2.0 is further preferable. The thickness T2 of the intermediate substrate 3 more specifically refers to the average thickness of the portion of the intermediate substrate 3 that is bonded to the second bonding member B2, and the thickness T1 of the supporting portion 412 more specifically refers to the average thickness of the portion of the supporting portion 412 that is bonded to the second bonding member B2.

However, the intermediate substrate 3 is not limited to this. Further, the intermediate substrate 3 may be formed of a crystal plate having a cut angle different from that of the element substrate 41 . Further, the constituent material of the intermediate substrate 3 may not be crystal. Further, the constituent material of the intermediate substrate 3 may be different from the constituent material of the element substrate 41 . Also, the thickness T2 may be T2<T1.

The circuit element 5 has a temperature sensor 51 and an oscillator circuit 52 . The oscillation circuit 52 has a function of oscillating the vibration element 4 and generating a temperature-compensated oscillation signal based on the temperature detected by the temperature sensor 51 . That is, the oscillation circuit 52 has an oscillation circuit section that is electrically connected to the vibration element 4, amplifies the output signal of the vibration element 4, and feeds back the amplified signal to the vibration element 4 to cause the vibration element 4 to oscillate. As the oscillator circuit 52, for example, an oscillator circuit such as a Pierce oscillator circuit, an inverter type oscillator circuit, a Colpitts oscillator circuit, or a Hartley oscillator circuit can be used.

The oscillator 1 has been described above. As described above, the vibrating device 10 applied to the oscillator 1 includes the base 21 including the two internal terminals 241A and 241B as the first base terminal and the second base terminal, the first bonding member B1, the intermediate substrate 3 and the second bonding member B2 bonded to the base 21 via the first bonding member B1, the second bonding member B2, the element substrate 41, the first excitation electrode 421 arranged on the upper surface which is the first surface of the element substrate 41, and the upper surface of the element substrate 41. a second excitation electrode 422 arranged on the lower surface which is the second surface opposite to the second excitation electrode 421, a first terminal 423 connected to the first excitation electrode 421, and a second terminal 424 connected to the second excitation electrode 422; The first terminal 423 and one internal terminal 241A are connected by a first bonding wire BW1 as a first wire, and the second terminal 424 and the other internal terminal 241B are connected by a second bonding wire BW2 as a second wire.

By interposing the intermediate substrate 3 between the base 21 and the vibrating element 4 in this manner, the intermediate substrate 3 absorbs and relaxes the stress from the package 2 , making it difficult for the stress to be transmitted to the vibrating element 4 . Therefore, the hysteresis of the temperature characteristic is reduced, and the vibration characteristic of the vibrating element 4 is stabilized. In particular, in the present embodiment, the vibration element 4 is cantilever supported, particularly supported at one point, by one second joint member B2, so stress is less likely to be transmitted to the vibration element 4, and the vibration characteristics of the vibration element 4 are further stabilized. In addition to these effects, by electrically connecting the base 21 and the vibration element 4 with the first and second bonding wires BW1 and BW2, the electrical connection between them is stabilized, and the vibration characteristics of the vibration element are stabilized. Therefore, the vibration device 10 can stably exhibit excellent vibration characteristics.

Further, as described above, the intermediate substrate 3 and the element substrate 41 are each made of crystal. By forming the intermediate substrate 3 and the element substrate 41 from the same material as described above, the thermal expansion coefficients of the intermediate substrate 3 and the element substrate 41 can be made equal. Therefore, substantially no thermal stress is generated between the intermediate substrate 3 and the element substrate 41 due to the difference in thermal expansion coefficients, and the vibration element 4 is less susceptible to stress. Therefore, it is possible to more effectively suppress deterioration and fluctuation of the vibration characteristics of the vibrating element 4 .

Moreover, as described above, the crystal axis of the intermediate substrate 3 is along the crystal axis of the element substrate 41 . Since crystal has different coefficients of thermal expansion in the X-axis direction, the Y-axis direction, and the Z-axis direction, the intermediate substrate 3 and the element substrate 41 are made to have the same cut angle and the orientations of the crystal axes are aligned with each other. Therefore, the vibrating element 4 is less likely to be subjected to stress, and deterioration and fluctuation of its vibration characteristics can be more effectively suppressed.

Further, as described above, the element substrate 41 is made of an AT-cut crystal substrate. The AT-cut crystal substrate has a thickness-shear vibration mode and a tertiary frequency-temperature characteristic. Therefore, by using an AT-cut crystal substrate as the element substrate 41, the vibration element 4 can have excellent temperature characteristics.

Further, as described above, the location P1 where the first bonding wire BW1 is connected to the first terminal 423 overlaps the second bonding member B2 in plan view, and the location P2 where the second bonding wire BW2 is connected to the second terminal 424 overlaps the second bonding member B2 in plan view. As a result, when connecting the first and second bonding wires BW1 and BW2 to the first and second terminals 423 and 424, the capillaries can be pressed against the first and second terminals 423 and 424 with sufficient force, and ultrasonic waves can be effectively applied from the capillaries to the first and second terminals 423 and 424. Therefore, a decrease in bonding strength between the first and second bonding wires BW1 and BW2 and the first and second terminals 423 and 424 can be suppressed, and the electrical connection state of the vibrating element 4 is further stabilized.

Further, as described above, the second joint member B2 overlaps the first joint member B1 in plan view. As a result, the second bonding member B2 is supported from below by the first bonding member B1, the vibration element 4 can be pressed against the second bonding member B2 with a predetermined force, and the vibration element 4 can be bonded to the intermediate substrate 3 with desired bonding strength and in a desired posture. Therefore, the vibrating element 4 can be joined to the intermediate substrate 3 with high accuracy.

Further, as described above, when the thickness of the supporting portion 412, which is the portion of the element substrate 41 joined to the second joining member B2, is T1, and the thickness of the portion of the intermediate substrate 3 joined to the second joining member B2 is T2, T2≧T1. Furthermore, when the thickness of the vibrating portion 411 sandwiched between the first excitation electrode 421 and the second excitation electrode 422 of the element substrate 41 is T3, T2≧T3. With such a relationship, the intermediate substrate 3 can be sufficiently thick, and the effect of relaxing and absorbing the stress from the package 2 can be exhibited more remarkably.

Further, as described above, the oscillator 1 includes the vibration device 10 and the oscillation circuit 52 electrically connected to the vibration element 4 and outputting an oscillation signal. Therefore, the oscillator 1 can enjoy the effects of the vibrating device 10 described above, and can exhibit high reliability.

<Second embodiment>
FIG. 5 is a plan view of the oscillator according to the second embodiment.

The oscillator 1 according to this embodiment is the same as the oscillator 1 according to the first embodiment described above, except that the configuration of the vibrating element 4 is different. In the following description, regarding the oscillator 1 of the second embodiment, the differences from the above-described first embodiment will be mainly described, and the description of the same items will be omitted. Moreover, in FIG. 5, the same code|symbol is attached|subjected about the structure similar to embodiment mentioned above.

The element substrate 41 of the vibrating element 4 shown in FIG. 5 is composed of an AT-cut crystal substrate as in the first embodiment described above. The element substrate 41 has a rectangular shape in plan view, and has two sides 41a and 41b along the X-axis direction. In this embodiment, the first terminal 423 and the second terminal 424 are arranged side by side along the side 41a. Further, when a region Q1 is defined by extending the vibrating portion 411 in the X-axis direction in plan view, the second bonding member B2 is positioned outside the region Q1, and bonds the vibration element 4 and the intermediate substrate 3 outside the region Q1. Further, in a plan view, the second joint member B2 overlaps the locations P1 and P2.

Here, since thickness-shear vibration occurs along the X-axis direction in the vibrating portion 411, if the vibrating element 4 is bonded to the intermediate substrate 3 via the second bonding member B2 in the region Q1, for example, the CI (crystal impedance) value of the vibrating element 4 may increase, which may affect the vibration characteristics. Therefore, in this embodiment, the occurrence of such a problem is suppressed by arranging the second bonding member B2 outside the region Q1.

As described above, in this embodiment, the element substrate 41 is made of an AT-cut crystal substrate and has sides 41a and 41b along the X-axis direction, which is the crystal axis of crystal. The first terminal 423 and the second terminal 424 are arranged side by side along the side 41a. By arranging the first and second terminals 423 and 424 in this way, it becomes easier to position the second joint member B2 outside the region Q1 in plan view. Therefore, an increase in the CI (crystal impedance) value of the vibrating element 4 as described above is suppressed, and the vibrating element 4 can exhibit stable vibration characteristics.

According to the second embodiment as described above, the same effects as those of the above-described first embodiment can be exhibited.

<Third Embodiment>
FIG. 6 is a partially enlarged sectional view of the oscillator according to the third embodiment.

The oscillator 1 according to this embodiment is the same as the oscillator 1 according to the first embodiment described above, except that the configuration of the intermediate substrate 3 is different. In the following description, the oscillator 1 of the third embodiment will be described with a focus on differences from the above-described first embodiment, and the description of the same items will be omitted. Moreover, in FIG. 6, the same code|symbol is attached|subjected about the structure similar to embodiment mentioned above.

As shown in FIG. 6, the vibrating element 4 of this embodiment has a mesa shape as in the first embodiment. That is, the thickness T3 of the vibrating portion 411 is thicker than the thickness T1 of the support portion 412 . Further, the intermediate substrate 3 is arranged so as to overlap not only the supporting portion 412 but also the vibrating portion 411 in plan view. As a result, for example, the application area of the first bonding member B1 is increased compared to the first embodiment described above, and the bonding strength between the base 21 and the intermediate substrate 3 is increased. Further, the intermediate substrate 3 has a notch in a portion overlapping with the vibrating portion 411 in plan view. Therefore, the upper surface 31 of the intermediate substrate 3 has a first surface 311 that overlaps the support portion 412 and is bonded to the vibration element 4 via the second bonding member B2, and a second surface 312 that overlaps the vibration portion 411 and is located below the first surface 311. By displacing the second surface 312 below the first surface 311 in this manner, a sufficient gap can be secured between the upper surface 31 and the vibrating portion 411, and contact between the vibrating element 4 and the intermediate substrate 3 can be effectively suppressed.

As described above, in the present embodiment, T3>T1, where T1 is the thickness of the supporting portion 412 that is the first portion of the element substrate 41 that is bonded to the second bonding member B2, and T3 is the thickness of the vibrating portion 411 that is the second portion that is sandwiched between the first excitation electrode 421 and the second excitation electrode 422 of the element substrate 41. Further, the upper surface 31, which is the surface of the intermediate substrate 3 on the vibration element 4 side, has a first surface 311 that overlaps with the support portion 412 and a second surface 312 that overlaps with the vibration portion 411 and is positioned below the first surface 311, i.e., on the opposite side of the vibration element 4 in plan view. Thereby, the bonding strength between the intermediate substrate 3 and the base 21 can be increased while suppressing the contact between the intermediate substrate 3 and the vibration element 4 .

According to the third embodiment as described above, the same effects as those of the above-described first embodiment can be exhibited.

<Fourth Embodiment>
FIG. 7 is a perspective view showing a personal computer according to the fourth embodiment.

A personal computer 1100 as an electronic device shown in FIG. 7 includes a main body 1104 having a keyboard 1102 and a display unit 1106 having a display 1108. The display unit 1106 is rotatably supported by the main body 1104 via a hinge structure. Such a personal computer 1100 incorporates the oscillator 1 . The personal computer 1100 also includes an arithmetic processing circuit 1110 that performs arithmetic processing related to control of the keyboard 1102, the display unit 1108, and the like. Arithmetic processing circuit 1110 operates based on the oscillation signal output from oscillator 1 .

As described above, the personal computer 1100 as an electronic device includes the oscillator 1 and the arithmetic processing circuit 1110 that operates based on the oscillation signal output from the oscillator 1 . Therefore, the effect of the oscillator 1 described above can be enjoyed, and high reliability can be exhibited.

<Fifth Embodiment>
FIG. 8 is a perspective view showing a mobile phone according to the fifth embodiment.

A mobile phone 1200 as an electronic device shown in FIG. 8 includes an antenna (not shown), a plurality of operation buttons 1202, an earpiece 1204 and a mouthpiece 1206, and a display unit 1208 is arranged between the operation button 1202 and the earpiece 1204. Such a mobile phone 1200 incorporates the oscillator 1 . The mobile phone 1200 also includes an arithmetic processing circuit 1210 that performs arithmetic processing related to control of the operation buttons 1202 and the like. Arithmetic processing circuit 1210 operates based on the oscillation signal output from oscillator 1 .

As described above, the mobile phone 1200 as an electronic device includes the oscillator 1 and the arithmetic processing circuit 1210 that operates based on the oscillation signal output from the oscillator 1 . Therefore, the effect of the oscillator 1 described above can be enjoyed, and high reliability can be exhibited.

<Sixth embodiment>
FIG. 9 is a perspective view showing a digital still camera according to the sixth embodiment.

A digital still camera 1300 shown in FIG. 9 has a body 1302, and a display section 1310 is provided on the rear surface of the body 1302 to perform display based on an imaging signal from a CCD. Display unit 1310 functions as a viewfinder that displays an electronic image of a subject. A light receiving unit 1304 including an optical lens and a CCD is provided on the front side (rear side in the figure) of the body 1302 . When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306 , the CCD imaging signal at that time is transferred and stored in the memory 1308 . Such a digital still camera 1300 incorporates an oscillator 1, for example. The digital still camera 1300 also includes an arithmetic processing circuit 1312 that performs arithmetic processing related to control of the display section 1310, the light receiving unit 1304, and the like. Arithmetic processing circuit 1312 operates based on the oscillation signal output from oscillator 1 .

As described above, the digital still camera 1300 as an electronic device includes the oscillator 1 and the arithmetic processing circuit 1312 that operates based on the oscillation signal output from the oscillator 1 . Therefore, the effect of the oscillator 1 described above can be enjoyed, and high reliability can be exhibited.

In addition to the personal computers, mobile phones, and digital still cameras described above, the electronic devices of this application example include, for example, smartphones, tablet terminals, watches (including smart watches), inkjet ejection devices (e.g., inkjet printers), laptop personal computers, televisions, wearable terminals such as HMDs (head-mounted displays), video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, video phones, security television monitors, and electronic twins. Eyeglasses, POS terminals, medical equipment (e.g., electronic thermometers, sphygmomanometers, blood glucose meters, electrocardiogram measuring devices, ultrasonic diagnostic equipment, electronic endoscopes), fish finders, various measuring devices, mobile terminal base station equipment, instruments (e.g., vehicles, aircraft, ship instruments), flight simulators, network servers, etc.

<Seventh embodiment>
FIG. 10 is a perspective view showing an automobile according to the seventh embodiment.

An automobile 1500 shown in FIG. 10 incorporates an oscillator 1 and an arithmetic processing circuit 1510 that operates based on an oscillation signal output from the oscillator 1 . Such oscillator 1 and arithmetic processing circuit 1510, for example, keyless entry, immobilizer, car navigation system, car air conditioner, anti-lock braking system (ABS), air bag, tire pressure monitoring system (TPMS: Tire Pressure Monitoring System), engine control, battery monitor of hybrid and electric vehicles, electronic control unit (ECU: electronic control unit) such as a vehicle attitude control system can be widely applied.

As described above, the automobile 1500 as a moving object includes the oscillator 1 and the arithmetic processing circuit 1510 that operates based on the oscillation signal output from the oscillator 1 . Therefore, the effect of the oscillator 1 described above can be enjoyed, and high reliability can be exhibited.

The mobile object is not limited to the automobile 1500, and can be applied to, for example, airplanes, ships, AGVs (automated guided vehicles), bipedal robots, and unmanned airplanes such as drones.

The vibration device, the oscillator, the electronic device, and the moving body of this application example have been described above based on the illustrated embodiments, but this application example is not limited to this, and the configuration of each part can be replaced with any configuration having similar functions. In addition, other arbitrary components may be added to this application example. Further, this application example may be a combination of any two or more configurations of the above embodiments.

Reference Signs List 1 oscillator 10 vibration device 2 package 21 base 211, 211a, 211b, 211c concave portion 22 lid 23 joining member 241, 241A, 241B, 242 internal terminal 243 external terminal 3 intermediate substrate 31 upper surface 311 first surface 312 second surface 4 vibration element 41 element substrate 41a, 41b... Side 411... Vibration part 412... Support part 42... Electrode 421... First excitation electrode 422... Second excitation electrode 423... First terminal 424... Second terminal 425... First lead wire 426... Second lead wire 5... Circuit element 51... Temperature sensor 52... Oscillation circuit 1100... Personal computer 1102... Keyboard 1104... Body part 1106 DESCRIPTION OF SYMBOLS Display unit 1108 Display section 1110 Arithmetic processing circuit 1200 Mobile phone 1202 Operation button 1204 Earpiece 1206 Mic mouthpiece 1208 Display section 1210 Arithmetic processing circuit 1300 Digital still camera 1302 Body 1304 Light receiving unit 1306 Shutter button 1308 Memory 1310 Display section 1312 Arithmetic processing circuit 1500 Automobile 1510 Arithmetic processing circuit B1 First bonding member B2 Second bonding member BW1 First bonding wire BW2 Second bonding wire BW3 Third bonding wire P1, P2 Part Q1 Region S Internal space X, Y, Y', Z, Z' Crystal axis θ Angle

Claims (12)

a base including a first base terminal and a second base terminal;
a first joint member;
an intermediate substrate bonded to the base via the first bonding member;
a second joint member;
an element substrate, a first excitation electrode arranged on the first surface of the element substrate, a second excitation electrode arranged on the second surface opposite to the first surface of the element substrate, a first terminal connected to the first excitation electrode, and a second terminal connected to the second excitation electrode, and a vibration element bonded to the intermediate substrate via the second bonding member;
the first terminal and the first base terminal are electrically connected by a first wire;
the second terminal and the second base terminal are electrically connected by a second wire,
In plan view, a portion where the first wire is connected to the first terminal overlaps the second joint member,
The vibrating device according to claim 1, wherein a portion where the second wire is connected to the second terminal overlaps the second joint member in plan view. a base including a first base terminal and a second base terminal;
a first joint member;
an intermediate substrate bonded to the base via the first bonding member;
a second joint member;
an element substrate, a first excitation electrode arranged on the first surface of the element substrate, a second excitation electrode arranged on the second surface opposite to the first surface of the element substrate, a first terminal connected to the first excitation electrode, and a second terminal connected to the second excitation electrode, and a vibration element bonded to the intermediate substrate via the second bonding member;
the first terminal and the first base terminal are electrically connected by a first wire;
the second terminal and the second base terminal are electrically connected by a second wire,
The vibrating device according to claim 1, wherein the second joint member overlaps the first joint member in plan view . a base including a first base terminal and a second base terminal;
a first joint member;
an intermediate substrate bonded to the base via the first bonding member;
a second joint member;
an element substrate, a first excitation electrode arranged on the first surface of the element substrate, a second excitation electrode arranged on the second surface opposite to the first surface of the element substrate, a first terminal connected to the first excitation electrode, and a second terminal connected to the second excitation electrode, and a vibration element bonded to the intermediate substrate via the second bonding member;
the first terminal and the first base terminal are electrically connected by a first wire;
the second terminal and the second base terminal are electrically connected by a second wire,
T1 is the thickness of the portion of the element substrate that is bonded to the second bonding member,
When the thickness of the portion of the intermediate substrate that is bonded to the second bonding member is T2,
A vibrating device characterized in that T2≧T1 . When the thickness of the portion sandwiched between the first excitation electrode and the second excitation electrode of the element substrate is T3,
4. The vibrating device according to claim 3 , wherein T2≧T3. a base including a first base terminal and a second base terminal;
a first joint member;
an intermediate substrate bonded to the base via the first bonding member;
a second joint member;
an element substrate, a first excitation electrode arranged on the first surface of the element substrate, a second excitation electrode arranged on the second surface opposite to the first surface of the element substrate, a first terminal connected to the first excitation electrode, and a second terminal connected to the second excitation electrode, and a vibration element bonded to the intermediate substrate via the second bonding member;
the first terminal and the first base terminal are electrically connected by a first wire;
the second terminal and the second base terminal are electrically connected by a second wire,
When the thickness of the first portion of the element substrate bonded to the second bonding member is T1, and the thickness of the second portion sandwiched between the first excitation electrode and the second excitation electrode of the element substrate is T3,
T3>T1, and
A vibrating device, wherein the surface of the intermediate substrate on the vibrating element side has a first surface that overlaps with the first portion and a second surface that overlaps with the second portion and is located on the opposite side of the first surface to the vibrating element in plan view. 6. The vibrating device according to claim 1, wherein said intermediate substrate and said element substrate are each made of crystal. the intermediate substrate has X-axis, Y-axis and Z-axis, which are crystal axes orthogonal to each other;
The element substrate has X-axis, Y-axis and Z-axis, which are crystal axes orthogonal to each other,
7. The vibration device according to claim 6 , wherein the X-axis of the crystal axis of the intermediate substrate is along the X-axis of the crystal axis of the element substrate, the Y -axis of the crystal axis of the intermediate substrate is along the Y-axis of the crystal axis of the element substrate, and the Z-axis of the crystal axis of the intermediate substrate is along the Z-axis of the crystal axis of the element substrate. 8. The vibrating device according to claim 6 , wherein said element substrate is composed of an AT-cut crystal substrate. The element substrate is composed of an AT-cut crystal substrate and has a side along the X-axis direction, which is the crystal axis of crystal,
The vibration device according to any one of claims 1 to 7 , wherein the first terminal and the second terminal are arranged side by side along the side. a vibration device according to any one of claims 1 to 9 ;
An oscillator, comprising: an oscillator circuit electrically connected to the vibrating element and outputting an oscillation signal. an oscillator according to claim 10 ;
and an arithmetic processing circuit that operates based on the oscillation signal output from the oscillator. an oscillator according to claim 10 ;
and an arithmetic processing circuit that operates based on the oscillation signal output from the oscillator.

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