JP2010097682A - 光メディア用スパッタリングターゲット、その製造方法、ならびに、光メディア、およびその製造方法 - Google Patents
光メディア用スパッタリングターゲット、その製造方法、ならびに、光メディア、およびその製造方法 Download PDFInfo
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- 229910052715 tantalum Inorganic materials 0.000 claims abstract description 20
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- C—CHEMISTRY; METALLURGY
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
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- C22C1/0416—Aluminium-based alloys
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C—CHEMISTRY; METALLURGY
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
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- G11B7/243—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of recording layers comprising inorganic materials only, e.g. ablative layers
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Abstract
【解決手段】Alを主成分とし、Ta及びNbからなる群より選択される1又は2種の元素を1〜10at%、及び、Agを0.1〜10at%含む光メディア用スパッタリングターゲットである。基板10と、Alを主成分とし、Ta及びNbからなる群より選択される1又は2種の元素を1〜10at%、及び、Agを0.1〜10at%含む組成を有し基板10上に設けられた反射層20A,20Bと、を備える光メディア100である。
【選択図】図1
Description
なお、本明細書では、主成分とは最大原子比成分のことであり、at%とは原子パーセントのことである。
本実施形態に係る光メディア用スパッタリングターゲットは、Alを主成分とし、Ta及びNbからなる群より選択される1又は2種の元素を1〜10at%、及び、Agを0.1〜10at%含む組成を有する。
続いて、上述の光メディア用スパッタリングターゲットの製造方法の一例について説明する。
続いて、光メディア用スパッタリングターゲットを用いて製造される光メディアの一例として光ディスク100の製造方法について説明する。
図2を参照して、第2の光ディスク200について説明する。ここでは、第1の光ディスク100と異なる点のみ説明する。
このような光ディスク200でも光ディスク100と同様の作用効果を奏する。
320メッシュ以下であり、かつ、純度99.9質量%の、Al粉、Ag粉、Ta粉、Nb粉、Cr粉を用い、各粉を表1に示す組成となるように秤量し、乾式で混合し、各実施例及び比較例について混合粉体をそれぞれ得た。そして、各混合粉体を、真空中で焼成した。焼成条件は、圧力200kgf/cm2、温度プロファイルは、720℃まで30分で急速加熱し、720℃に30分維持し、その後、660℃に下げて、660℃に30分維持し、その後、室温まで徐冷した。
まず、厚さ:1.1mm、直径:120mmのポリカーボネート製の支持基板をスパッタリング装置にセットし、この支持基板上に、アルミニウム(Al)を主成分としこれに6at%のタンタル(Ta)および5at%の銀(Ag)が添加された材料からなる反射層(層厚:80nm)、ZnSとSiO2の混合物(モル比80:20)からなる誘電体層(層厚:30nm)、銅(Cu)を主成分としこれにアルミニウム(Al)が23at%添加された反応層24b(層厚:6nm)、シリコン(Si)からなる反応層24a(層厚:5nm)、ZnSとSiO2の混合物(モル比80:20)からなる誘電体層(層厚:20nm)を順次スパッタ法により形成した。
Claims (9)
- Alを主成分とし、Ta及びNbからなる群より選択される1又は2種の元素を1〜10at%、及び、Agを0.1〜10at%含む光メディア用スパッタリングターゲット。
- 基板と、
Alを主成分とし、Ta及びNbからなる群より選択される1又は2種の元素を1〜10at%、及び、Agを0.1〜10at%含む組成を有し前記基板上に設けられた反射層と、
を備える光メディア。 - 前記反射層上に、少なくとも2つの反応層を有する記録層をさらに備え、一の前記反応層の構成元素及び他の前記反応層の構成元素は、書込用のレーザビームの照射により互いに混合しうるものである請求項2に記載の光メディア。
- 前記反射層上に、Cu,Al,Zn及びAgからなる群から選択される1の元素を主成分とする第1反応層と、Si,Ge及びSnからなる群から選択される1の元素を主成分とする第2反応層と、を有する記録層をさらに備える、請求項2記載の光メディア。
- 前記反射層と前記記録層との間に誘電体層を有し、前記誘電体層の屈折率をn[−]、前記誘電体層の膜厚をd(nm)とした場合に、66<nd<76である請求項3又は4記載の光メディア。
- 前記反射層の成膜終了面側から読取用又は書込用のレーザビームが照射される請求項2〜5の何れかに記載の光メディア。
- Alを主成分とし、Ta及びNbからなる群より選択される1又は2種の元素を1〜10at%、及び、Agを0.1〜10at%含むメディア用スパッタリングターゲットを用いて、反射層を成膜する工程を備える光メディアの製造方法。
- Alを主成分とし、Ta及びNbからなる群より選択される1又は2種の元素を1〜10at%、及び、Agを0.1〜10at%含む組成を有する原料粉体を焼成する工程を備える光メディア用スパッタリングターゲットの製造方法。
- 前記原料粉体は、Alを主成分とし、Ta及びNbからなる群より選択される1又は2種の元素を1〜10at%、及び、Agを0.1〜10at%含む組成を有する合金の粉である請求項5記載の光メディア用スパッタリングターゲットの製造方法。
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US12/555,349 US8105673B2 (en) | 2008-09-22 | 2009-09-08 | Sputtering target for optical media, method of manufacturing same, optical medium, and method of manufacturing same |
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CN110408806B (zh) * | 2019-08-22 | 2020-12-18 | 承德天大钒业有限责任公司 | 一种铝铌钽中间合金及其制备方法 |
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JP2004284241A (ja) * | 2003-03-24 | 2004-10-14 | Tdk Corp | 光記録媒体及び光記録媒体用スパッタリングターゲット |
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US20100075099A1 (en) | 2010-03-25 |
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US8105673B2 (en) | 2012-01-31 |
CN101684544B (zh) | 2012-11-28 |
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