JP2007039325A - 低温焼結用ガラス組成物、ガラスフリット、誘電体組成物及びこれを用いた積層セラミックコンデンサー - Google Patents
低温焼結用ガラス組成物、ガラスフリット、誘電体組成物及びこれを用いた積層セラミックコンデンサー Download PDFInfo
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- JP2007039325A JP2007039325A JP2006205741A JP2006205741A JP2007039325A JP 2007039325 A JP2007039325 A JP 2007039325A JP 2006205741 A JP2006205741 A JP 2006205741A JP 2006205741 A JP2006205741 A JP 2006205741A JP 2007039325 A JP2007039325 A JP 2007039325A
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- multilayer ceramic
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- 239000011521 glass Substances 0.000 title claims abstract description 89
- 239000000203 mixture Substances 0.000 title claims abstract description 63
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 37
- 238000009766 low-temperature sintering Methods 0.000 title abstract description 8
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 8
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000005245 sintering Methods 0.000 abstract description 22
- 239000010410 layer Substances 0.000 description 38
- 229910004298 SiO 2 Inorganic materials 0.000 description 15
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 15
- 229910018068 Li 2 O Inorganic materials 0.000 description 10
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 9
- 238000010304 firing Methods 0.000 description 9
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 8
- 239000000292 calcium oxide Substances 0.000 description 8
- 239000002002 slurry Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- 229910000272 alkali metal oxide Inorganic materials 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 238000007496 glass forming Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 230000003313 weakening effect Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000009770 conventional sintering Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 description 1
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000010299 mechanically pulverizing process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 239000003607 modifier Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Abstract
【解決手段】本発明によるガラス組成物は、aLi2O−bK2O−cCaO−dBaO−eB2O3−fSiO2から成り、前記a、b、c、d、e及びfはa+b+c+d+e+f=100、2≦a≦10、2≦b≦10、0≦c≦25、0≦d≦25、5≦e≦20及び50≦f≦80とを満足する。
【選択図】図2
Description
本発明のガラス組成物は、酸化リチウム(Li2O)、酸化カリウム(K2O)、酸化ボロン(B2O3) 及び酸化ケイ素(SiO2)とを含み、必要に応じて酸化カルシウム(CaO) 及び酸化バリウム(BaO)の1種以上を含むことができる。
本発明のガラスフリットは、本発明による前記ガラス組成物から成り、100乃至300nmの粒度を有する超微粒球形形態の粉末となっている。3μm以下の厚さの誘電体薄層を形成するためには、誘電体スラリーに用いられるBaTiO3母材は150〜300nm程度の粒度を有し、焼結助剤以外の副成分も数百nm以下の粒度を有する。したがって、誘電体スラリーに添加されるガラスフリットの粒度が1μm以上であると、2〜3μm厚さの誘電体薄層を均一に焼結させにくい。また、ガラスフリットの形状が針状や塊状である場合、焼結のバラツキを引き起こす恐れがあるので球形のガラスフリットを用いるのが有利である。本発明のガラスフリットは、例えば、前記ガラス組成物から成るガラスフレーク(glass flake)を機械的に粉砕した後、気象熱処理を行うことにより得られる。
本発明の誘電体組成物は、主成分であるBaTiO3と、副成分として前述したガラス組成物、MgCO3、希土類酸化物(Y2O3、Ho2O3、Dy2O3及びYb2O3から成る群より1種以上選択される)、及びMnOとを含む。前記副成分の含量は、前記主成分(BaTiO3) 100モルに対して、前記ガラス組成物が1.0〜3.0モル、 MgCO3が0.5〜2.0モル、前記希土類酸化物が0.3〜1.0モル及びMnOが0.05〜1.0モルである。
図1は、本発明の一実施形態による積層セラミックコンデンサーを示す断面図である。図1を参照すると、積層セラミックコンデンサー100は誘電体層102と内部電極層101、103が交互に積層された構成のコンデンサー本体110を有する。このコンデンサー本体110の外面には外部電極104、105が設けられており、外部電極104、105は対応する内部電極103、101にそれぞれ電気的に接続されている。
101、103 内部電極
102 誘電体層
104、105 外部電極
110 コンデンサー本体
Claims (13)
- aLi2O−bK2O−cCaO−dBaO−eB2O3−fSiO2から成り、前記a、b、c、d、e及びfはa+b+c+d+e+f=100、2≦a≦10、2≦b≦10、0≦c≦25、0≦d≦25、5≦e≦20及び50≦f≦80とを満足することを特徴とするガラス組成物。
- 前記a、b、c、d、e及びfは、3≦a≦8、2≦b≦5、0≦c≦15、0≦d≦15、10≦e≦20、55≦f≦75とを満足することを特徴とする請求項1に記載のガラス組成物。
- 前記a、b、c、d、e及びfは、3≦a≦8、2≦b≦5、0≦c≦15、5≦d≦15、12.5≦e≦17.5、60≦f≦75とを満足することを特徴とする請求項1に記載のガラス組成物。
- 組成式、aLi2O−bK2O−cCaO−dBaO−eB2O3−fSiO2(a+b+c+d+e+f=100、2≦a≦10、2≦b≦10、0≦c≦25、0≦d≦25、5≦e≦20及び50≦f≦80)で表示されるガラス組成物から成り、
100乃至300nmの粒度を有する超微粒球形粉体形態となっていることを特徴とするガラスフリット。 - 前記a、b、c、d、e及びfは、3≦a≦8、2≦b≦5、0≦c≦15、0≦d≦15、10≦e≦20、55≦f≦75を満足することを特徴とする請求項4に記載のガラスフリット。
- 前記a、b、c、d、e及びfは、3≦a≦8、2≦b≦5、0≦c≦15、5≦d≦15、12.5≦e≦17.5、60≦f≦75とを満足することを特徴とする請求項4に記載のガラスフリット。
- 主成分であるBaTiO3と、
組成式、aLi2O−bK2O−cCaO−dBaO−eB2O3−fSiO2(a+b+c+d+e+f=100、2≦a≦10、2≦b≦10、0≦c≦25、0≦d≦25、5≦e≦20及び50≦f≦80)で表示されるガラス組成物を含む副成分を含み、
前記副成分は、前記主成分100モルに対して、前記ガラス組成物1.0〜3.0モル、MgCO30.5〜2.0モル、希土類酸化物(前記希土類酸化物は、Y2O3、Ho2O3、Dy2O3及びYb2O3とから成る群より1種以上選択される)0.3〜1.0モル及びMnO0.05〜1.0モルを含むことを特徴とする誘電体組成物。 - 前記a、b、c、d、e及びfは、3≦a≦8、2≦b≦5、0≦c≦15、0≦d≦15、10≦e≦20、55≦f≦75とを満足することを特徴とする請求項7に記載の誘電体組成物。
- 前記a、b、c、d、e及びfは、3≦a≦8、2≦b≦5、0≦c≦15、5≦d≦15、12.5≦e≦17.5、60≦f≦75とを満足することを特徴とする請求項7に記載の誘電体組成物。
- 複数の誘電体層と、前記誘電体層の間に設けられた複数の内部電極と、前記内部電極に電気的に接続された外部電極とを含む積層セラミックコンデンサーにおいて、
前記誘電体層は、主成分であるBaTiO3と、組成式aLi2O−bK2O−cCaO−dBaO−eB2O3−fSiO2(a+b+c+d+e+f=100、2≦a≦10、2≦b≦10、0≦c≦25、0≦d≦25、5≦e≦20及び50≦f≦80)で表示されるガラス組成物を含む副成分とを含み、
前記副成分は、前記主成分100モルに対して、前記ガラス組成物1.0〜3.0モル、MgCO30.5〜2.0モル、希土類酸化物(前記希土類酸化物は、Y2O3、Ho2O3、Dy2O3及びYb2O3とから成る群より1種以上選択される)0.3〜1.0モル及びMnO0.05〜1.0モルを含むことを特徴とする積層セラミックコンデンサー。 - 前記a、b、c、d、e及びfは、3≦a≦8、2≦b≦5、0≦c≦15、0≦d≦15、10≦e≦20、55≦f≦75とを満足することを特徴とする請求項10に記載の積層セラミックコンデンサー。
- 前記a、b、c、d、e及びfは、3≦a≦8、2≦b≦5、0≦c≦15、5≦d≦15、12.5≦e≦17.5、60≦f≦75とを満足することを特徴とする請求項10に記載の積層セラミックコンデンサー。
- 前記内部電極は、導電材料としてNiまたはNi合金を含有することを特徴とする請求項10に記載の積層セラミックコンデンサー。
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JP2004203626A (ja) * | 2002-10-29 | 2004-07-22 | Kyocera Corp | 誘電体組成物 |
JP2004182582A (ja) * | 2002-12-03 | 2004-07-02 | Samsung Electro Mech Co Ltd | 低温焼成誘電体磁器組成物とこれを用いた積層セラミックキャパシター |
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JP2010006690A (ja) * | 2008-06-26 | 2010-01-14 | Korea Inst Of Science & Technology | 低温焼成用低誘電率誘電体セラミック組成物 |
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Also Published As
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KR100632001B1 (ko) | 2006-10-09 |
TWI333938B (en) | 2010-12-01 |
US7851393B2 (en) | 2010-12-14 |
CN1903764A (zh) | 2007-01-31 |
US20090258231A1 (en) | 2009-10-15 |
US20100069222A1 (en) | 2010-03-18 |
TW200712023A (en) | 2007-04-01 |
CN1903764B (zh) | 2011-01-19 |
US20070027020A1 (en) | 2007-02-01 |
JP4794385B2 (ja) | 2011-10-19 |
US7605104B2 (en) | 2009-10-20 |
US7691762B2 (en) | 2010-04-06 |
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