JP2002373951A - Method for manufacturing hermetically sealed ic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a hermetically sealed IN package with enhanced productivity and reduced manufacturing cost. SOLUTION: A large number of chips are mounted in a substrate and after the internal electrode wiring of the substrate is connected to the electrodes of the IC chip through wires, the substrate is coated entirely with a photosensitive substance and the region of the IC chip other than the region to be exposed is surrounded by the frame of the photosensitive substance using photoetching before being bonded with a lid. Finally, the substrate is cut at an intermediate position of the photosensitive substance thus producing individual IC packages.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a hermetically sealed IC package.

[0002]

2. Description of the Related Art As shown in FIG. 1, a conventional hermetically sealed IC package has an IC chip 45 mounted on an individual substrate 41 having a frame 47 and a wire 46 mounted thereon. 49 was on it.

[0003]

The conventional hermetically sealed IC packages are manufactured individually and individually, resulting in extremely low productivity and, therefore, very expensive.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention uses a substrate on which a plurality of IC chips are mounted, a photosensitive substance is formed thick between the IC chips, and a plate-shaped lid is provided. And then cut the board to remove
Make one IC package. At this time, a portion other than the surface of the IC chip to be exposed to protect the wire region and the electrode wiring in the substrate is covered with a photosensitive material.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a method for manufacturing a gas-sealed package in which the surface of an IC chip is surrounded by a gas such as air. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of an IC package showing a process sequence of a manufacturing method of the present invention.

As shown in FIG. 1A, a substrate 11 having external electrodes 12 and internal electrode wirings 13 is prepared. Many or more IC chips are mounted on this board,
Finally, it is singulated. Therefore, the size of the substrate is large, and the external electrode 12 and the internal electrode wiring 13 have a repeating pattern. The material of the substrate 11 includes ceramic, glass epoxy, polyimide, glass, and the like.

[0007] Next, as shown in FIG.
5 is bonded to a desired position of the internal electrode wiring. In some cases, the internal electrode wiring 13 may not be provided at the position where the IC chip 15 is bonded. For example, there is a case where the surface of the IC chip needs to be as low as possible, a case where there is no need to electrically conduct the IC chip, and a case where there is little need to radiate the heat of the IC chip. Next, the electrodes on the surface of the IC chip 15 and the internal electrode wiring are connected by wires 16.
As a material of the wire, a metal such as gold (Au), a gold alloy, aluminum (Al), an aluminum alloy, copper (Cu), or a copper alloy is used.

Next, as shown in FIG.
Is applied. Since the photosensitive substance 17 is in a liquid state when applied, the IC chip 15 is moved or the IC chip 1 is moved.
5, wire 16 is bent, wire is damaged, wire and electrode wiring and IC
There is no damaging to the place where it adheres. The photosensitive material 17 includes a negative resist, a positive resist, and a photosensitive polyimide. Also, the thickness of the photosensitive material 17 to be applied must be designed so as to be finally higher than the highest point of the wire 16.

Next, as shown in FIG.
Light is applied using a mask 18 formed so that only the region 5 to be exposed is exposed. In the case of a negative-type photosensitive material, a portion exposed to light cures. In the case of the positive type, on the other hand, the area where no light is irradiated cures. Next, as shown in FIG.
By the development, the photosensitive material 17 in the area where the IC chip 15 is to be exposed is eliminated, and in the other area, the thick wall-shaped photosensitive substance 17 is formed. By subjecting this to a heat treatment, the photosensitive substance 17 is further strengthened. Although the photosensitive material 17 may be reduced by this heat treatment, the photosensitive material 17 must be higher than the highest point of the wire 16 so that the wire is not exposed even when the photosensitive material 17 is reduced and the height is reduced. Also, the photosensitive substance 17 and the substrate 1
The distance between the IC chips 15 can be reduced because there is no need to consider the positional relationship with the internal electrode wirings and wires in the device 1. This leads to a smaller IC package.

Next, as shown in FIG.
9 is adhered. In this case, a method of bonding the lid 19 after attaching an adhesive material on the photosensitive substance 17 or applying an adhesive to a position where the photosensitive substance 17 comes to the lid 19 and then bonding the lid 19 is applied. Or a method of bonding the photosensitive substance 17 and the lid 19 by heat treatment. If it is necessary to transmit light, the plate-shaped lid 19 is made of a material made of a substance transparent to the light, such as glass or transparent plastic. If it is not necessary to transmit light, a material such as ceramic, glass epoxy, or polyimide can be used. Also, a tape-shaped sheet can be used depending on the application.

Next, as shown in FIG.
The substrate is cut at the midpoint of 7. Examples of the cutting method include a method using a dicing device, a method using a wire saw, and a method using a laser or high-pressure water. Further, in the case of dicing, a method of preventing a crack from entering a cut surface by first cutting shallowly with a relatively wide blade and then cutting with a narrow blade can be used. In this way,
As shown in FIG. 1H, an IC package in which the IC chip 15 is sealed with a gas is obtained.

Now, as a method of measuring the electrical characteristics of an IC package, it is of course possible to measure the electrical characteristics of a single package after the package has been formed as in the conventional case. In addition, Figure 1
It can also be measured before cutting the substrate in (g). That is, a probe card can be prepared in accordance with the electrodes of the substrate, and measurement can be performed in the same manner as in the case of wafer measurement. Therefore many ICs
It is also possible to measure the package in one probing.

FIG. 2 shows a plan view of FIG. Substrate 2
Many IC chips 25 are mounted in one. Only a part of the surface of the IC chip 25 is exposed. The other area is covered with the photosensitive substance 27. In particular, the electrodes and wires of the IC chip and the wiring 23 of the substrate electrode are also made of a photosensitive substance 27.
It is covered with. Since the photolithography method is used, the photosensitive material is accurately patterned. FIG.
(g) shows a plan view. It is cut at the position shown by the dotted line. The photosensitive material 37 is cut at a substantially intermediate position. Note that the image sensor such as an image sensor or a CCD only needs to partially expose the sensor of the IC chip to light, so that the present invention can be used most effectively.

[0014]

As described above, as described above, a large number of I
Make C package all at once, cut at the end
Since individual IC packages are used, productivity is greatly improved and manufacturing costs are significantly reduced. The area other than the area to be exposed on the surface of the IC chip is covered with a photosensitive material. Especially I
The area connected to the electrodes and wires of the C-chip and the wires and the internal electrode wiring inside the board are covered with a photosensitive material and are mechanically protected from the environment such as humidity. Reliability and quality have improved. Further, since there is no need to consider the interval between the region to be cut into the IC package and the internal electrode wiring, the distance between the IC packages can be reduced. Therefore, the size of the IC package can be reduced, and the number of IC packages that can be obtained from one substrate can be increased. Further, since the thickness of the photosensitive material can be precisely controlled, an IC package having an accurate size can be obtained. In addition, since electrical characteristics can be measured when a single substrate is cut before cutting, the electrical characteristics of a large number of ICs can be measured all at once with the same concept as a wafer prober, greatly reducing the cost required for testing. Can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing a method of manufacturing an IC package according to the present invention.

FIG. 2 is a plan view of FIG. 1 (e).

FIG. 3 is a diagram showing a plan view of FIG. 1 (g).

FIG. 4 is a diagram showing a conventional IC package.

[Explanation of symbols]

 11, 21, 31, 41 Semiconductor substrate 12, 42 External electrode 13, 23, 33, 43 Internal electrode wiring 15, 25, 35, 45 IC chip 16, 26, 36, 46 Wire 17, 27, 37 Photosensitive material 18 Mask 19, 49 Lid 47 frame

Claims (10)

[Claims] 1. A step of mounting an IC chip on a substrate having external electrodes and internal electrode wiring, connecting an electrode in the IC chip to the internal electrode wiring with a wire, applying a photosensitive substance, and performing photolithography. Forming a photosensitive material in a region other than a region to be exposed on the surface of an IC chip by using a method, bonding a plate-shaped lid to a thick film of the photosensitive material, and an intermediate point of the photosensitive material And a method of manufacturing a hermetically sealed IC package. 2. A step of mounting an IC chip on a substrate having external electrodes and internal electrode wirings, connecting electrodes in the IC chip and the internal electrode wirings with wires, applying a photosensitive substance, and performing photolithography. Forming a photosensitive material in a region excluding a region to be exposed on the surface of the IC chip by using a method, performing a heat treatment to cure the photosensitive material, and removing a plate-shaped lid from the photosensitive material thick film And a step of cutting at an intermediate point of the photosensitive material. 3. The substrate having an external electrode and an internal electrode wiring is made of a glass epoxy material.
Or the method for manufacturing an IC package according to 2. 4. The method for manufacturing an IC package according to claim 1, wherein the substrate having the external electrodes and the internal electrode wiring is made of a ceramic material. 5. The method for manufacturing an IC package according to claim 1, wherein the plate-like lid is a glass plate. 6. The method for manufacturing an IC package according to claim 1, wherein the plate-shaped lid is a ceramic plate. 7. The method for manufacturing an IC package according to claim 1, wherein the plate-like lid is a tape-like sheet. 8. The method for manufacturing an IC package according to claim 1, wherein the area covered with the photosensitive material on the surface of the IC chip includes an area connected to the electrode of the IC chip by a wire. 9. The method for manufacturing an IC package according to claim 1, further comprising a step of measuring electric characteristics of the IC package using the whole substrate before cutting the substrate. 10. The method for manufacturing an IC package according to claim 9, wherein the electrical characteristics are measured using a probe card-shaped jig.