JP2001352105A - Surface mount type light emitting device - Google Patents

Abstract

(57) [Problem] To provide a surface-mounted light emitting device on which a large number of LED chips are mounted, in a conventional structure, in a direction transverse to the mounting substrate, that is, in a direction parallel to the mounting substrate. When attached, it was difficult to obtain a good electrical connection. According to the present invention, when an insulating substrate is formed in a substantially rectangular shape, a through hole is formed at a corner of the insulating substrate, and when the insulating substrate is mounted on a mounting substrate, an electrode terminal which does not come close to the mounting substrate is the insulating substrate. By providing a surface-mounted light-emitting element that is guided to an end portion close to the mounting substrate by a conductive pattern provided on the back surface of the light-emitting device, electrical connection becomes possible and the problem is solved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface-mounted light emitting device which has a large number of LED chips mounted thereon and can be mounted in a direction transverse to a mounting substrate, that is, in a direction in which an optical axis is parallel to the mounting substrate. It is about structure.

[0002]

2. Description of the Related Art Conventionally, as a surface mount type light emitting element, a light emitting element having a structure as shown in FIG. 7 is known. In FIG. 7, a surface mount type light emitting element 80 is provided at an end of an insulating substrate 81 and has a through hole 83 provided with a conductive layer 82 on the inner surface.
Accordingly, the conductive pattern 84 formed on the surface of the insulating substrate 81 is connected to the conductive layer 82, and a plurality of LED chips 85 are die-bonded to the conductive pattern 84 on the surface of the insulating substrate 81. Electrode 8
5a and another conductive pattern 84 are wire-bonded, and then transfer-molded with a resin using a predetermined mold to form a sealing portion 86.

According to the surface-mounted light emitting device 80 configured as described above, the LED chip 85 mounted on the insulating substrate 81 is separated from the conductive layer 82 by the conductive pattern 84.
The conductive layer 82 is connected to the electrode terminals 87a and 87b.
The electrode terminals 87a and 87b are not only exposed on the surface of the surface mount type light emitting element 80,
The surface mounting type light emitting element 80 is also exposed on the side surface thereof, and thus the surface mount type light emitting element 80 is disposed on the mounting substrate so that the sealing portion 86 faces upward, and the electrode terminals 87a and 87b are connected to the conductive portion of the mounting substrate. By soldering, light can be emitted in a direction perpendicular to the mounting substrate.

[0004]

However, when the surface-mounted light emitting device 80 thus configured is mounted so as to emit light in a direction parallel to the mounting substrate 90, FIG. As shown, the insulating substrate 81 is arranged vertically on the mounting substrate 90 and connected to the mounting substrate 90. In this case, if the surface-mounted light-emitting element 80 is composed of only one LED chip 85, electrical connection is possible by connecting two electrode terminals 87a close to the mounting substrate 90. LED for purposes such as color emission
In the case where two or three chips 85 are mounted on the surface mounting type light emitting element 80, electrical connection is not completed only by connection of the electrode terminals 87a close to the mounting substrate 90, and the chip 85 is located above the chip. The electrode terminal 87b also needs to be connected, but the electrode terminal 87b located above cannot be connected as it is in the surface-mounted light-emitting element 80 having the above-described structure. There were problems such as the necessity of connection.

Further, the electrode terminals 8 close to the mounting substrate 90
7a is also formed away from the corners of the insulating substrate 81, so that the mounting method described above may cause difficulty in connection with the conductive portion 90a formed on the mounting substrate 90.

[0006]

According to the present invention, as a specific means for solving the above-mentioned conventional problems, a through hole with a conductive layer is provided on an insulating substrate, and the conductive layer and the conductive layer formed on the insulating substrate are provided. In a surface-mounted light-emitting device, a pattern is connected, a plurality of LED chips are mounted on the conductive pattern, the conductive layer is used as an electrode terminal, and the light-emitting element can be mounted so as to emit light in parallel to a mounting substrate. The insulating substrate has a substantially rectangular shape, the through-hole is formed at a corner of the insulating substrate, and the electrode terminal which is not close to the mounting substrate when attached to the mounting substrate is the insulating substrate. The problem is solved by providing a surface-mounted light-emitting element characterized in that the light-emitting element is guided to an end portion close to the mounting substrate by a conductive pattern provided on a back surface of the light-emitting device. A through hole with a conductive layer is provided on an insulating substrate, the conductive layer and a conductive pattern formed on the insulating substrate are connected, and a plurality of LED chips are mounted on the conductive pattern, and the conductive layer is used as an electrode terminal. In a surface-mounted light-emitting element capable of being mounted so as to emit light in parallel to a mounting substrate, the insulating substrate has a substantially rectangular shape, and the through-hole is formed at a corner of the insulating substrate, When attached to a mounting substrate, the electrode terminals that are not close to the mounting substrate are guided to an end portion close to the mounting substrate by a conductive pattern provided on a back surface of the insulating substrate. Surface-mounted light emitting device.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail based on an embodiment shown in the drawings. FIGS. 1 to 3 show a first embodiment of the present invention. A reference numeral 1 denotes a surface-mounted light emitting device according to the present invention, 2 denotes an insulating substrate made of a heat-resistant material, and 3 denotes A conductive layer provided on the inner surface of the through hole 4, 5 a is a conductive pattern printed on the surface of the insulating substrate 2, 6 is an LED chip, and 7 is a connection between one electrode 6 a of the LED chip 6 and the conductive pattern 5 a. A wire 8 is a sealing portion made of a resin that protects the LED chip 6 and the wire 7 and serves as a lens. FIG.
As shown in the figure, a plurality of the LED chips 6 are mounted on the conductive pattern 5a by die bonding.
The other electrode 6a is wire-bonded to the other conductive pattern 5a by the wire 7.

The above structure is the same as that of the prior art. However, in the present invention, the through hole 4 is further formed at the corner of the insulating substrate 2 which is formed in a substantially quadrangular shape, and the inner surface is electrically conductive. Layer 3 is provided. In the present invention, the through hole 4 forms a hole in a manufacturing process,
This shows a configuration similar to the conventional one in which the conductive layer 3 is provided on the inner surface. Since the through hole 4 is finally cut and used, the conductive layer 3 is simply provided as a concave portion on the exposed surface. However, for convenience of explanation, the same expression is used. Therefore, the through-hole 4 simply needs to be formed with a concave portion and the conductive layer 3 is formed on the concave surface.

By connecting the conductive layer 3 of the through hole 4 to the conductive pattern 5a printed on the insulating substrate 2, the electrode terminals 9a, 9 near the through hole 4 are formed.
b.

In the first embodiment, two LED chips 6 are mounted. Since one electrode terminal is used as a common electrode, the number of required electrode terminals is three.
Therefore, although one electrode terminal among the four corners is unnecessary for this reason, it is of course also possible to change the conductive pattern and use four electrode terminals.

FIG. 2 is a perspective view of the surface mount type light emitting device 1 as viewed from the back side. On the back surface, one of the four electrode terminals 9a and 9b at the corners is provided. 9b is led to the other end on the electrode terminal 9a side by the conductive pattern 5b. In the first embodiment, as described above, one of the two electrode terminals 9b is unnecessary, so that only the other one is formed with the conductive pattern 5b up to the end on the electrode terminal 9a side.

According to the first embodiment, the optical axis of the surface mount type light emitting element 1 is mounted in a direction parallel to the mounting substrate 10 as shown in FIG. ,
That is, it is arranged at a predetermined position on the conductive portion 10a formed on the mounting substrate 10 so that the electrode terminal 9a side of the surface mount type light emitting element 1 is in contact with the light emitting element 1. Two places of the electrode terminal 9a and the conductive pattern 5b The electrical connection is completed by soldering to the conductive portion 10a by reflow or the like. At this time, since the electrode terminals 9a and the conductive patterns 5b are provided at positions close to the mounting substrate 10, soldering is performed reliably.

Next, FIG. 4 shows a second embodiment according to the present invention, which specifically has three LED chips 6. The first embodiment in which an appropriate wiring pattern 5a is formed on the insulating substrate 2 and one of them is a common electrode and is formed at four corners of the insulating substrate 2 formed in a substantially quadrangular shape. Is connected to one of the same electrode terminals 9a, and the other three electrode terminals 9a, 9b
Are connected to the upper surface electrode 6a of the LED chip 6. Note that the configurations of the through hole 4 and the sealing portion 8 are the same as those in the first embodiment, and a detailed description thereof will be omitted.

FIG. 5 is a perspective view of the surface mount type light emitting device 1 of the second embodiment as viewed from the back surface side.
On this back surface, of the four electrode terminals 9a and 9b at the corners, two of the electrode terminals 9b at one end are led to the other end on the electrode terminal 9a side by the electrode pattern 5b.

As shown in FIG. 6, the surface-mounted light-emitting device 1 constructed as described above is
The insulating substrate 2 of the surface mount type light emitting element 1 is placed vertically at a predetermined position on the conductive portion 10a formed on the mounting substrate 10 and the optical axis is placed in a direction parallel to the mounting substrate 10, and the electrode terminals 9a
The connection is made by soldering the conductive pattern 5b to the conductive portion 10a.

As described above, according to the present invention, even in the case where the number of the LED chips 6 is two or three, the surface mount type light emitting element 1 is mounted so that the optical axis is parallel to the mounting substrate 10. Is possible, and a reliable electrical connection is made. Even if two or three LED chips 6 are provided with the same color, two or three LED chips 6 having different colors are provided.
It is naturally possible to provide one, and the combination does not limit the present invention.

The electrode terminals 9b which do not approach the mounting substrate 10 need not necessarily be formed at corners, but may be formed on one side of the mounting substrate 10.

[0018]

As described above, according to the present invention, the terminal capable of arranging the insulating substrate 2 perpendicular to the mounting substrate 10 so that the optical axis is parallel to the mounting substrate 10 is provided. It is possible to provide the surface mounted light emitting device 1 having two or three LED chips 6 having a structure.

[Brief description of the drawings]

FIG. 1 is a perspective view of a surface-mounted light emitting device according to a first embodiment of the present invention as viewed from above.

FIG. 2 is a perspective view of the surface mounted light emitting device according to the first embodiment of the present invention as viewed from the back surface side.

FIG. 3 is a perspective view showing a state in which the surface-mounted light emitting device according to the first embodiment of the present invention is mounted on a mounting substrate.

FIG. 4 is a perspective view of a surface-mounted light-emitting device according to a second embodiment of the present invention as viewed from above.

FIG. 5 is a perspective view of a surface mount type light emitting device according to a second embodiment of the present invention as viewed from the back side.

FIG. 6 is a perspective view showing a state in which a surface-mounted light emitting device according to a second embodiment of the present invention is mounted on a mounting substrate.

FIG. 7 is a perspective view of a conventional surface-mounted light-emitting device as viewed from the upper surface side.

FIG. 8 is a side view showing a state in which a conventional surface mount type light emitting element is mounted on a mounting substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Surface mount type light emitting element 2 ... Insulating substrate 3 ... Conductive layer 4 ... Through hole 5a, 5b ... Conductive pattern 6 ... LED chip 6a ... Top electrode 7 ... Wire 8 ... Sealing part 9a, 9b: electrode terminal 10: mounting substrate 10a: conductive part 11: solder

Claims (1)

[Claims] An insulating substrate provided with a through hole with a conductive layer, connecting the conductive layer with a conductive pattern formed on the insulating substrate, and mounting a plurality of LED chips on the conductive pattern; In a surface-mount type light-emitting element in which a layer is an electrode terminal and is attachable so as to emit light in parallel to a mounting substrate, the insulating substrate has a substantially square shape, and the through-hole is formed at a corner of the insulating substrate. When mounted on the mounting substrate, the electrode terminals that are not in proximity to the mounting substrate are guided to an end in proximity to the mounting substrate by a conductive pattern provided on a back surface of the insulating substrate. A surface-mounted light emitting device.