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IT1172862B - Dispositivo a semiconduttore e procedimento per la sua fabbricazione - Google Patents

Dispositivo a semiconduttore e procedimento per la sua fabbricazione

Info

Publication number
IT1172862B
IT1172862B IT68603/81A IT6860381A IT1172862B IT 1172862 B IT1172862 B IT 1172862B IT 68603/81 A IT68603/81 A IT 68603/81A IT 6860381 A IT6860381 A IT 6860381A IT 1172862 B IT1172862 B IT 1172862B
Authority
IT
Italy
Prior art keywords
semiconductor device
support
procedure
manufacture
resin
Prior art date
Application number
IT68603/81A
Other languages
English (en)
Other versions
IT8168603A0 (it
Inventor
Inayoshi Hideo
Suzuki Akira
Tsubosaki Kunihiro
Ueda Toyoichi
Makino Daisuke
Ichimura Nobuo
Suzuki Kazunari
Original Assignee
Hitachi Ltd
Hitachi Microcumputer Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcumputer Eng filed Critical Hitachi Ltd
Publication of IT8168603A0 publication Critical patent/IT8168603A0/it
Application granted granted Critical
Publication of IT1172862B publication Critical patent/IT1172862B/it

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    • H01L23/293—Organic, e.g. plastic
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/013—Alloys
    • H01L2924/0133—Ternary Alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
IT68603/81A 1980-12-10 1981-12-09 Dispositivo a semiconduttore e procedimento per la sua fabbricazione IT1172862B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55173287A JPS57111034A (en) 1980-12-10 1980-12-10 Semiconductor device and its manufacture

Publications (2)

Publication Number Publication Date
IT8168603A0 IT8168603A0 (it) 1981-12-09
IT1172862B true IT1172862B (it) 1987-06-18

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IT68603/81A IT1172862B (it) 1980-12-10 1981-12-09 Dispositivo a semiconduttore e procedimento per la sua fabbricazione

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US (1) US4803543A (it)
JP (1) JPS57111034A (it)
KR (1) KR850001975B1 (it)
DE (1) DE3148786A1 (it)
FR (1) FR2496984B1 (it)
GB (1) GB2089126B (it)
IT (1) IT1172862B (it)
MY (1) MY8600414A (it)
SG (1) SG94185G (it)

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Also Published As

Publication number Publication date
JPS634701B2 (it) 1988-01-30
FR2496984A1 (fr) 1982-06-25
KR830008396A (ko) 1983-11-18
SG94185G (en) 1986-07-25
FR2496984B1 (fr) 1985-11-08
MY8600414A (en) 1986-12-31
IT8168603A0 (it) 1981-12-09
KR850001975B1 (ko) 1985-12-31
JPS57111034A (en) 1982-07-10
DE3148786A1 (de) 1982-07-29
GB2089126A (en) 1982-06-16
US4803543A (en) 1989-02-07
GB2089126B (en) 1985-03-13

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