HK1109708A2 - Interface card and apparatus and process for the formation thereof - Google Patents
Interface card and apparatus and process for the formation thereofInfo
- Publication number
- HK1109708A2 HK1109708A2 HK07104374A HK07104374A HK1109708A2 HK 1109708 A2 HK1109708 A2 HK 1109708A2 HK 07104374 A HK07104374 A HK 07104374A HK 07104374 A HK07104374 A HK 07104374A HK 1109708 A2 HK1109708 A2 HK 1109708A2
- Authority
- HK
- Hong Kong
- Prior art keywords
- formation
- interface card
- card
- interface
- Prior art date
Links
- 230000015572 biosynthetic process Effects 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/5317—Laminated device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Credit Cards Or The Like (AREA)
- Details Of Aerials (AREA)
Priority Applications (28)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK07104374A HK1109708A2 (en) | 2007-04-24 | 2007-04-24 | Interface card and apparatus and process for the formation thereof |
ES07827351T ES2377220T3 (es) | 2007-04-24 | 2007-11-08 | Tarjeta de chip, procedimiento y sistema para la fabricación de una tarjeta de chip |
PCT/IL2007/001378 WO2008129526A2 (en) | 2007-04-24 | 2007-11-08 | Electronic interface apparatus and method and system for manufacturing same |
US12/596,893 US9038913B2 (en) | 2007-04-24 | 2007-11-08 | Electronic interface apparatus and method and system for manufacturing same |
AT07827351T ATE540378T1 (de) | 2007-04-24 | 2007-11-08 | Chipkarte, verfahren und vorrichtung zur herstellung einer chipkarte |
PL07827351T PL2143046T3 (pl) | 2007-04-24 | 2007-11-08 | Karta procesorowa, sposób i układ do wytwarzania karty procesorowej |
BRPI0721672A BRPI0721672B1 (pt) | 2007-04-24 | 2007-11-08 | aparelho de interface eletrônico e seu método e sistema de fabricação |
CN2007800534702A CN101689249B (zh) | 2007-04-24 | 2007-11-08 | 电子接口装置及其制造方法和系统 |
PT07827351T PT2143046E (pt) | 2007-04-24 | 2007-11-08 | Instrumento de interface electrónica e método e sistema para o seu fabrico |
EP07827351A EP2143046B1 (en) | 2007-04-24 | 2007-11-08 | Chip card, method and system for manufacturing a chip card |
KR1020097024350A KR101285907B1 (ko) | 2007-04-24 | 2007-11-08 | 전자식 인터페이스 장치 및 그 제조 방법과 시스템 |
TW096142616A TWI452523B (zh) | 2007-04-24 | 2007-11-09 | 電子介面裝置及其製造方法與系統 |
CL200800113A CL2008000113A1 (es) | 2007-04-24 | 2008-01-15 | Metodo de fabricacion de una tarjeta de interfaz electronica que comprende definir un par de aperturas en la capa de substrato, asociar una antena con dicha capa tal que extremos opuestos de la antena terminen en dichas aperturas, ubicar un elemento |
BRPI0811086-7A2A BRPI0811086A2 (pt) | 2007-04-24 | 2008-04-17 | Método e sistema para fabricação de um cartão de interface eletrônica e um cartão fabricado usando os mesmos |
KR1020097024341A KR20100017257A (ko) | 2007-04-24 | 2008-04-17 | 전자식 인터페이스 카드의 제조 방법 및 시스템과 이를 이용하여 제조된 카드 |
CN200880021562.7A CN101816066B (zh) | 2007-04-24 | 2008-04-17 | 制造电子接口卡的方法和系统以及使用该方法和系统制造的卡 |
PCT/IL2008/000538 WO2008129547A2 (en) | 2007-04-24 | 2008-04-17 | Method and system for manufacture of an electronic interface card and a card manufactured using same |
TW097114420A TWI426836B (zh) | 2007-04-24 | 2008-04-18 | 用於製造電子介面卡之方法及系統及使用其製造的卡 |
ARP080101717A AR066272A1 (es) | 2007-04-24 | 2008-04-23 | Aparato de interfaz electronica y su metodo y sistema de fabricacion |
RU2010121963/07A RU2461105C2 (ru) | 2007-04-24 | 2008-10-23 | Устройство с электронным интерфейсом, система и способ его изготовления |
EP08847977A EP2212975B1 (en) | 2007-04-24 | 2008-10-23 | Electronic interface apparatus and method and system for manufacturing same |
US12/742,013 US8333004B2 (en) | 2007-04-24 | 2008-10-23 | Electronic interface apparatus and method and system for manufacturing same |
JP2010532705A JP5249341B2 (ja) | 2007-04-24 | 2008-10-23 | 電子インターフェース装置、並びにその製造方法及び製造システム |
CN2008801152733A CN101904060B (zh) | 2007-04-24 | 2008-10-23 | 电子接口装置及其制造方法和制造系统 |
BRPI0818708-8A BRPI0818708B1 (pt) | 2007-04-17 | 2008-10-23 | Aparelho de interface eletrônica e método e sistema para produção do mesmo |
TW097141043A TWI457836B (zh) | 2007-04-24 | 2008-10-24 | 電子介面裝置及其製造方法及系統 |
US13/625,287 US8689428B2 (en) | 2007-04-24 | 2012-09-24 | Method and system for manufacturing an electronic interface apparatus |
US14/694,430 US9773201B2 (en) | 2007-04-24 | 2015-04-23 | Electronic interface apparatus and method and system for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK07104374A HK1109708A2 (en) | 2007-04-24 | 2007-04-24 | Interface card and apparatus and process for the formation thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1109708A2 true HK1109708A2 (en) | 2008-06-13 |
Family
ID=41129289
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK07104374A HK1109708A2 (en) | 2007-04-17 | 2007-04-24 | Interface card and apparatus and process for the formation thereof |
Country Status (16)
Country | Link |
---|---|
US (4) | US9038913B2 (xx) |
EP (2) | EP2143046B1 (xx) |
JP (1) | JP5249341B2 (xx) |
KR (2) | KR101285907B1 (xx) |
CN (3) | CN101689249B (xx) |
AR (1) | AR066272A1 (xx) |
AT (1) | ATE540378T1 (xx) |
BR (3) | BRPI0721672B1 (xx) |
CL (1) | CL2008000113A1 (xx) |
ES (1) | ES2377220T3 (xx) |
HK (1) | HK1109708A2 (xx) |
PL (1) | PL2143046T3 (xx) |
PT (1) | PT2143046E (xx) |
RU (1) | RU2461105C2 (xx) |
TW (3) | TWI452523B (xx) |
WO (2) | WO2008129526A2 (xx) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080179404A1 (en) * | 2006-09-26 | 2008-07-31 | Advanced Microelectronic And Automation Technology Ltd. | Methods and apparatuses to produce inlays with transponders |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
MX2010008213A (es) * | 2008-02-22 | 2010-09-30 | Toppan Printing Co Ltd | Transpondedor y cuaderno. |
FR2942561B1 (fr) * | 2009-02-20 | 2011-04-22 | Oberthur Technologies | Support pour carte a microcircuit, carte a microcircuit comprenant un tel support. |
FR2947392B1 (fr) | 2009-06-29 | 2019-05-10 | Idemia France | Procede de raccordement electrique de deux organes entre eux |
US8186603B2 (en) | 2009-09-22 | 2012-05-29 | On Track Innovation Ltd. | Contactless smart sticker |
US8195236B2 (en) | 2010-06-16 | 2012-06-05 | On Track Innovations Ltd. | Retrofit contactless smart SIM functionality in mobile communicators |
FR2963139B1 (fr) | 2010-07-20 | 2012-09-14 | Oberthur Technologies | Dispositif a microcircuit comprenant des moyens d'amplification du gain d'une antenne |
US8424757B2 (en) | 2010-12-06 | 2013-04-23 | On Track Innovations Ltd. | Contactless smart SIM functionality retrofit for mobile communication device |
DE102011114635A1 (de) | 2011-10-04 | 2013-04-04 | Smartrac Ip B.V. | Chipkarte und Verfahren zur Herstellung einer Chipkarte |
CN102426659B (zh) * | 2011-11-03 | 2014-12-10 | 北京德鑫泉物联网科技股份有限公司 | 同时具有两种读写模式基体的智能卡及其生产方法 |
US8649820B2 (en) | 2011-11-07 | 2014-02-11 | Blackberry Limited | Universal integrated circuit card apparatus and related methods |
FR2986372B1 (fr) * | 2012-01-31 | 2014-02-28 | Commissariat Energie Atomique | Procede d'assemblage d'un element a puce micro-electronique sur un element filaire, installation permettant de realiser l'assemblage |
US9178265B2 (en) | 2012-02-09 | 2015-11-03 | Hid Global Gmbh | Anti-crack means for wire antenna in transponder |
USD703208S1 (en) * | 2012-04-13 | 2014-04-22 | Blackberry Limited | UICC apparatus |
US8936199B2 (en) | 2012-04-13 | 2015-01-20 | Blackberry Limited | UICC apparatus and related methods |
USD701864S1 (en) * | 2012-04-23 | 2014-04-01 | Blackberry Limited | UICC apparatus |
CN103632186B (zh) * | 2012-08-23 | 2017-01-25 | 东莞市锐祥智能卡科技有限公司 | 双界面卡芯片碰焊及封装的方法及其装置 |
EP2711874B1 (en) | 2012-09-21 | 2015-04-15 | Oberthur Technologies | A chip module support and a method of incorporating such a chip module support in a data carrier card |
WO2014082401A1 (zh) * | 2012-11-30 | 2014-06-05 | Xue Yuan | 双界面智能卡及其制造方法 |
HK1193540A2 (en) * | 2013-07-26 | 2014-09-19 | Cardmatix Co Ltd | A method of manufacturing a smart card |
KR101762778B1 (ko) | 2014-03-04 | 2017-07-28 | 엘지이노텍 주식회사 | 무선 충전 및 통신 기판 그리고 무선 충전 및 통신 장치 |
FR3023419B1 (fr) * | 2014-07-01 | 2016-07-15 | Oberthur Technologies | Support d'antenne destine a etre integre dans un document electronique |
US10318852B2 (en) * | 2014-11-10 | 2019-06-11 | Golden Spring Internet Of Things Inc. | Smart card simultaneously having two read/write modes and method for producing same |
EP3317821B1 (de) * | 2015-06-23 | 2019-07-17 | Linxens Holding | Smartcard-rohling mit mindestens einer schnittstelle zur berührungslosen übertragung von informationen |
US10622700B2 (en) * | 2016-05-18 | 2020-04-14 | X-Celeprint Limited | Antenna with micro-transfer-printed circuit element |
US10033901B1 (en) * | 2017-06-27 | 2018-07-24 | Xerox Corporation | System and method for using a mobile camera as a copier |
TWI634902B (zh) * | 2017-10-28 | 2018-09-11 | 醫療財團法人徐元智先生醫藥基金會亞東紀念醫院 | Use of glucosamine peptide compounds for the treatment of abnormal liver metabolism |
FR3073307B1 (fr) * | 2017-11-08 | 2021-05-28 | Oberthur Technologies | Dispositif de securite tel qu'une carte a puce |
FR3079645B1 (fr) * | 2018-04-03 | 2021-09-24 | Idemia France | Document electronique dont une liaison electrique entre un port de puce et une plage externe de contact electrique est etablie via un inlay |
US11282357B2 (en) | 2018-05-22 | 2022-03-22 | Tyco Fire & Security Gmbh | Elongate flexible tag |
US12223814B2 (en) | 2019-09-16 | 2025-02-11 | Sensormatic Electronics, LLC | Security tag for textiles using conductive thread |
US10970613B1 (en) | 2019-09-18 | 2021-04-06 | Sensormatic Electronics, LLC | Systems and methods for providing tags adapted to be incorporated with or in items |
US11443160B2 (en) | 2019-09-18 | 2022-09-13 | Sensormatic Electronics, LLC | Systems and methods for laser tuning and attaching RFID tags to products |
US11055588B2 (en) | 2019-11-27 | 2021-07-06 | Sensormatic Electronics, LLC | Flexible water-resistant sensor tag |
JP7562965B2 (ja) * | 2020-03-10 | 2024-10-08 | 富士電機株式会社 | 製造方法、製造装置、治具アセンブリ、半導体モジュールおよび車両 |
US11755874B2 (en) | 2021-03-03 | 2023-09-12 | Sensormatic Electronics, LLC | Methods and systems for heat applied sensor tag |
US11869324B2 (en) | 2021-12-23 | 2024-01-09 | Sensormatic Electronics, LLC | Securing a security tag into an article |
CN115319416A (zh) * | 2022-08-19 | 2022-11-11 | 中国电子科技集团公司第三十八研究所 | 一种高效率毫米波多层天线低温钎焊方法 |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2616995A1 (fr) * | 1987-06-22 | 1988-12-23 | Ebauchesfabrik Eta Ag | Procede de fabrication de modules electroniques |
US6336269B1 (en) * | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
US5519201A (en) * | 1994-04-29 | 1996-05-21 | Us3, Inc. | Electrical interconnection for structure including electronic and/or electromagnetic devices |
DE4416697A1 (de) * | 1994-05-11 | 1995-11-16 | Giesecke & Devrient Gmbh | Datenträger mit integriertem Schaltkreis |
DE4431605C2 (de) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten |
US5682143A (en) * | 1994-09-09 | 1997-10-28 | International Business Machines Corporation | Radio frequency identification tag |
JPH11510625A (ja) * | 1995-08-01 | 1999-09-14 | オーストリア カード プラスティッカルテン ウント アウスヴァイスジステーム ゲゼルシャフト ミット ベシュレンクテル ハフツング | 構成部品と非接触使用のための伝送デバイスとを持つ非接触使用のためのカード形データ担体、及びそのようなカード形データ担体並びにそのためのモジュールの製造方法 |
KR100480522B1 (ko) * | 1995-08-01 | 2005-08-31 | 오스트리아 카드 플라스틱카르텐 운트 아우스바이스시스템게젤샤프트 엠베하 | 컴포넌트보유모듈및코일을갖는데이터캐리어와이데이터캐리어의제조방법 |
WO1997034247A2 (de) * | 1996-03-14 | 1997-09-18 | Pav Card Gmbh | Chipkarte, verbindungsanordnung und verfahren zum herstellen einer chipkarte |
US5786626A (en) * | 1996-03-25 | 1998-07-28 | Ibm Corporation | Thin radio frequency transponder with leadframe antenna structure |
DE19632813C2 (de) * | 1996-08-14 | 2000-11-02 | Siemens Ag | Verfahren zur Herstellung eines Chipkarten-Moduls, unter Verwendung dieses Verfahrens hergestellter Chipkarten-Modul und diesen Chipkarten-Modul enthaltende Kombi-Chipkarte |
JP3960645B2 (ja) * | 1996-12-27 | 2007-08-15 | ローム株式会社 | 回路チップ搭載カードおよび回路チップモジュール |
US5837153A (en) | 1997-01-15 | 1998-11-17 | Kawan; Joseph C. | Method and system for creating and using a logotype contact module with a smart card |
DE19710144C2 (de) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Verfahren zur Herstellung einer Chipkarte und nach dem Verfahren hergestellte Chipkarte |
KR100330651B1 (ko) * | 1997-06-23 | 2002-03-29 | 사토 게니치로 | Ic카드용 모듈, ic카드, 및 ic카드용 모듈의 제조방법 |
FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
WO1999026195A1 (fr) * | 1997-11-14 | 1999-05-27 | Toppan Printing Co., Ltd. | Module ci composite et carte ci composite |
FR2775810B1 (fr) * | 1998-03-09 | 2000-04-28 | Gemplus Card Int | Procede de fabrication de cartes sans contact |
US6481621B1 (en) * | 1999-01-12 | 2002-11-19 | International Business Machines Corporation | System method and article of manufacture for accessing and processing smart card information |
JP2000207521A (ja) * | 1999-01-18 | 2000-07-28 | Toppan Printing Co Ltd | 複合icカ―ドとその製造方法 |
FR2788646B1 (fr) * | 1999-01-19 | 2007-02-09 | Bull Cp8 | Carte a puce munie d'une antenne en boucle, et micromodule associe |
JP2001043336A (ja) * | 1999-07-29 | 2001-02-16 | Sony Chem Corp | Icカード |
FR2801708B1 (fr) | 1999-11-29 | 2003-12-26 | A S K | Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux |
FR2801707B1 (fr) | 1999-11-29 | 2002-02-15 | A S K | Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux |
DE50015958D1 (de) * | 2000-05-05 | 2010-08-26 | Infineon Technologies Ag | Chipkarte |
US6923378B2 (en) * | 2000-12-22 | 2005-08-02 | Digimarc Id Systems | Identification card |
GB2371264A (en) * | 2001-01-18 | 2002-07-24 | Pioneer Oriental Engineering L | Smart card with embedded antenna |
JP4803884B2 (ja) * | 2001-01-31 | 2011-10-26 | キヤノン株式会社 | 薄膜半導体装置の製造方法 |
FR2824939B1 (fr) * | 2001-05-16 | 2003-10-10 | A S K | Procede de fabrication d'une carte a puce sans contact a l'aide de papier transfert et carte a puce obtenue a partir de ce procede |
FR2826153B1 (fr) * | 2001-06-14 | 2004-05-28 | A S K | Procede de connexion d'une puce a une antenne d'un dispositif d'identification par radio-frequence du type carte a puce sans contact |
ES2649545T3 (es) * | 2001-09-18 | 2018-01-12 | Nagravision S.A. | Procedimiento de fabricación de una etiqueta electrónica fina |
TW565916B (en) | 2002-06-20 | 2003-12-11 | Ist Internat Semiconductor Tec | Chip module for a smart card and method of making the same |
KR20040049981A (ko) * | 2002-12-06 | 2004-06-14 | (주)제이티 | 호일 적층을 통한 ic카드 제조방법 |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
FR2853115B1 (fr) | 2003-03-28 | 2005-05-06 | A S K | Procede de fabrication d'antenne de carte a puce sur un support thermoplastique et carte a puce obtenue par ledit procede |
JP4241147B2 (ja) * | 2003-04-10 | 2009-03-18 | ソニー株式会社 | Icカードの製造方法 |
US6857552B2 (en) * | 2003-04-17 | 2005-02-22 | Intercard Limited | Method and apparatus for making smart card solder contacts |
DE102004011702B4 (de) * | 2004-03-10 | 2006-02-16 | Circle Smart Card Ag | Verfahren zur Herstellung eines Kartenkörpers für eine kontaktlose Chipkarte |
US20060005050A1 (en) * | 2004-06-10 | 2006-01-05 | Supercom Ltd. | Tamper-free and forgery-proof passport and methods for providing same |
US7237724B2 (en) | 2005-04-06 | 2007-07-03 | Robert Singleton | Smart card and method for manufacturing a smart card |
JP2006301691A (ja) | 2005-04-15 | 2006-11-02 | Nippon Engineering Kk | Icカード及びicカード製造方法 |
CN100555589C (zh) * | 2005-06-29 | 2009-10-28 | 皇家飞利浦电子股份有限公司 | 制造半导体组件的方法 |
US7621043B2 (en) | 2005-11-02 | 2009-11-24 | Checkpoint Systems, Inc. | Device for making an in-mold circuit |
HK1109708A2 (en) * | 2007-04-24 | 2008-06-13 | On Track Innovations Ltd | Interface card and apparatus and process for the formation thereof |
US7980477B2 (en) * | 2007-05-17 | 2011-07-19 | Féinics Amatech Teoranta | Dual interface inlays |
EP2001077A1 (fr) * | 2007-05-21 | 2008-12-10 | Gemplus | Procédé de réalisation d'un dispositif comportant une antenne de transpondeur connectée à des plages de contact et dispositif obtenu |
US8186603B2 (en) * | 2009-09-22 | 2012-05-29 | On Track Innovation Ltd. | Contactless smart sticker |
-
2007
- 2007-04-24 HK HK07104374A patent/HK1109708A2/xx not_active IP Right Cessation
- 2007-11-08 EP EP07827351A patent/EP2143046B1/en not_active Not-in-force
- 2007-11-08 PL PL07827351T patent/PL2143046T3/pl unknown
- 2007-11-08 KR KR1020097024350A patent/KR101285907B1/ko active IP Right Grant
- 2007-11-08 AT AT07827351T patent/ATE540378T1/de active
- 2007-11-08 PT PT07827351T patent/PT2143046E/pt unknown
- 2007-11-08 CN CN2007800534702A patent/CN101689249B/zh active Active
- 2007-11-08 WO PCT/IL2007/001378 patent/WO2008129526A2/en active Application Filing
- 2007-11-08 BR BRPI0721672A patent/BRPI0721672B1/pt not_active IP Right Cessation
- 2007-11-08 ES ES07827351T patent/ES2377220T3/es active Active
- 2007-11-08 US US12/596,893 patent/US9038913B2/en not_active Expired - Fee Related
- 2007-11-09 TW TW096142616A patent/TWI452523B/zh not_active IP Right Cessation
-
2008
- 2008-01-15 CL CL200800113A patent/CL2008000113A1/es unknown
- 2008-04-17 KR KR1020097024341A patent/KR20100017257A/ko not_active Application Discontinuation
- 2008-04-17 WO PCT/IL2008/000538 patent/WO2008129547A2/en active Application Filing
- 2008-04-17 BR BRPI0811086-7A2A patent/BRPI0811086A2/pt not_active Application Discontinuation
- 2008-04-17 CN CN200880021562.7A patent/CN101816066B/zh not_active Expired - Fee Related
- 2008-04-18 TW TW097114420A patent/TWI426836B/zh not_active IP Right Cessation
- 2008-04-23 AR ARP080101717A patent/AR066272A1/es not_active Application Discontinuation
- 2008-10-23 JP JP2010532705A patent/JP5249341B2/ja not_active Expired - Fee Related
- 2008-10-23 CN CN2008801152733A patent/CN101904060B/zh active Active
- 2008-10-23 EP EP08847977A patent/EP2212975B1/en not_active Not-in-force
- 2008-10-23 RU RU2010121963/07A patent/RU2461105C2/ru not_active IP Right Cessation
- 2008-10-23 US US12/742,013 patent/US8333004B2/en not_active Expired - Fee Related
- 2008-10-23 BR BRPI0818708-8A patent/BRPI0818708B1/pt not_active IP Right Cessation
- 2008-10-24 TW TW097141043A patent/TWI457836B/zh not_active IP Right Cessation
-
2012
- 2012-09-24 US US13/625,287 patent/US8689428B2/en not_active Expired - Fee Related
-
2015
- 2015-04-23 US US14/694,430 patent/US9773201B2/en active Active
Also Published As
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1109708A2 (en) | Interface card and apparatus and process for the formation thereof | |
GB0818193D0 (en) | Apparatus and method | |
GB0717150D0 (en) | Apparatus and method | |
HK1122106A1 (en) | Nano-imprinting apparatus and method | |
ZA201003528B (en) | Data process device and data process method | |
GB0720420D0 (en) | Method and apparatus | |
HK1112564A2 (en) | Heating apparatus and method for making the same | |
GB0711979D0 (en) | Method and apparatus | |
GB0717433D0 (en) | Apparatus and method | |
GB0610606D0 (en) | Process and apparatus | |
TWI368990B (en) | Display apparatus and method for making the same | |
GB0715846D0 (en) | Apparatus and method | |
GB0712430D0 (en) | Wirelaying apparatus and wirelaying method | |
GB0714530D0 (en) | New apparatus and method | |
EP2141737A4 (en) | POLISHING APPARATUS AND PROGRAM FOR THE SAME | |
GB2455384B (en) | Receiving apparatus and receiving method | |
GB0811824D0 (en) | Apparatus and method | |
PL1989117T3 (pl) | Zbiornik oraz urządzenie do jego wytwarzania | |
GB0716554D0 (en) | Apparatus and method | |
GB0705015D0 (en) | Apparatus and method | |
GB0704558D0 (en) | Assay method and apparatus | |
GB2459627B (en) | Apparatus for molding proppants and method | |
GB0806605D0 (en) | Apparatus and Method | |
GB0721651D0 (en) | Apparatus and method | |
GB0721506D0 (en) | Method and apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PEU | Short-term patents expired |
Effective date: 20150423 |