GB872879A - Electrolytic copper-plating baths - Google Patents
Electrolytic copper-plating bathsInfo
- Publication number
- GB872879A GB872879A GB11122/60A GB1112260A GB872879A GB 872879 A GB872879 A GB 872879A GB 11122/60 A GB11122/60 A GB 11122/60A GB 1112260 A GB1112260 A GB 1112260A GB 872879 A GB872879 A GB 872879A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- plating baths
- lustring
- agent
- compounds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
872,879. Copper-plating baths. DEHYDAG DEUTSCHE HYDRIERWERKE G.m.b.H. March 30, 1960 [May 6, 1959], No. 11122/60. Class 41. Copper-plating baths include as levelling- agent (1) an alkyl or aryl thiourea containing a carboxy group linked to N, together with (2) a lustring agent. Compounds (1) include N- phenyl-N<1>-carboxymethyl thiourea, and the corresponding N - butyl - N<1> - 4 - carboxyphenyl derivative. Lustring agents (2) preferred, contain one or more C atoms linked solely to hetero atoms, a short alkyl group linked to an S atom, and a sulphonic group, e.g. N,N-pentamethylene dithiocarbamic acid-n-propyl-ester sodium sulphonate. The ductility of the copper coating may be improved by adding amino compounds free of carboxy groups, e.g. 1 : 3-propylene diamine, or their derivatives containing sulphonic acid or sulphuric ester groups, or halogen compounds of tertiary amines, e.g. 2 - diethylamino - 3 - chloro - propanol-2.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DED35441A DE1142741B (en) | 1961-02-20 | 1961-02-20 | Acid galvanic copper baths |
Publications (1)
Publication Number | Publication Date |
---|---|
GB872879A true GB872879A (en) | 1961-07-12 |
Family
ID=7042639
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB11122/60A Expired GB872879A (en) | 1961-02-20 | 1960-03-30 | Electrolytic copper-plating baths |
GB44559/61A Expired GB919272A (en) | 1961-02-20 | 1961-12-13 | Electrolytic copper plating baths |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB44559/61A Expired GB919272A (en) | 1961-02-20 | 1961-12-13 | Electrolytic copper plating baths |
Country Status (3)
Country | Link |
---|---|
US (2) | US3023152A (en) |
DE (1) | DE1142741B (en) |
GB (2) | GB872879A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB872879A (en) * | 1961-02-20 | 1961-07-12 | Dehydag Gmbh | Electrolytic copper-plating baths |
JPS544329B2 (en) * | 1973-03-20 | 1979-03-06 | ||
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
EP1477588A1 (en) * | 2003-02-19 | 2004-11-17 | Rohm and Haas Electronic Materials, L.L.C. | Copper Electroplating composition for wafers |
DE102014208733A1 (en) | 2014-05-09 | 2015-11-12 | Dr. Hesse Gmbh & Cie Kg | Process for the electrolytic deposition of copper from water-based electrolytes |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2563360A (en) * | 1941-05-24 | 1951-08-07 | Gen Motors Corp | Electrodeposition of copper |
US2696467A (en) * | 1952-01-04 | 1954-12-07 | Gen Motors Corp | Copper plating bath and process |
US2738318A (en) * | 1954-12-28 | 1956-03-13 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
BE565994A (en) * | 1957-04-16 | |||
US2954331A (en) * | 1958-08-14 | 1960-09-27 | Dayton Bright Copper Company | Bright copper plating bath |
GB872879A (en) * | 1961-02-20 | 1961-07-12 | Dehydag Gmbh | Electrolytic copper-plating baths |
-
1960
- 1960-03-30 GB GB11122/60A patent/GB872879A/en not_active Expired
- 1960-04-28 US US25242A patent/US3023152A/en not_active Expired - Lifetime
-
1961
- 1961-02-20 DE DED35441A patent/DE1142741B/en active Pending
- 1961-12-13 GB GB44559/61A patent/GB919272A/en not_active Expired
-
1962
- 1962-01-25 US US168796A patent/US3179578A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
GB919272A (en) | 1963-02-20 |
US3023152A (en) | 1962-02-27 |
DE1142741B (en) | 1963-01-24 |
US3179578A (en) | 1965-04-20 |
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