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GB1220703A - An improved process of preparing thermosetting laminates - Google Patents

An improved process of preparing thermosetting laminates

Info

Publication number
GB1220703A
GB1220703A GB2760568A GB2760568A GB1220703A GB 1220703 A GB1220703 A GB 1220703A GB 2760568 A GB2760568 A GB 2760568A GB 2760568 A GB2760568 A GB 2760568A GB 1220703 A GB1220703 A GB 1220703A
Authority
GB
United Kingdom
Prior art keywords
assembly
thermosetting resin
laminating
improved process
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2760568A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB1220703A publication Critical patent/GB1220703A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

1,220,703. Laminating. PHOTOCIRCUITS CORP. 11 June, 1968 [6 Nov., 1967], No. 27605/68. Heading B5N. An improvement in a process for laminating an assembly comprising a thermosetting resin comprises measuring the electrical impedance of the thermosetting resin while applying heat, to ascertain its lowest point and applying full laminating pressure at or immediately subsequent to the time at which the lowest electrical impedance is reached. The process may be effected in a press having an electrical sensing means e.g. a voltmeter, ammeter or ohmmeter which in use is connected to a pair of electrodes embedded in the laminate components. The assembly may comprise a plurality of sheets of paper or of glass fabric impregnated or coated with a B-stage thermosetting resin e.g. an epoxy resin. In a preferred embodiment, a sheet of copper is included in the assembly to form an outer surface of the laminate.
GB2760568A 1967-11-06 1968-06-11 An improved process of preparing thermosetting laminates Expired GB1220703A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68098367A 1967-11-06 1967-11-06

Publications (1)

Publication Number Publication Date
GB1220703A true GB1220703A (en) 1971-01-27

Family

ID=24733292

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2760568A Expired GB1220703A (en) 1967-11-06 1968-06-11 An improved process of preparing thermosetting laminates

Country Status (6)

Country Link
CH (1) CH477284A (en)
DE (1) DE1778824B1 (en)
DK (1) DK137440B (en)
FR (1) FR1579607A (en)
GB (1) GB1220703A (en)
NL (1) NL157242B (en)

Also Published As

Publication number Publication date
DK137437C (en) 1978-08-14
NL157242B (en) 1978-07-17
CH477284A (en) 1969-08-31
DK137440B (en) 1978-03-06
FR1579607A (en) 1969-08-29
DE1778824B1 (en) 1971-06-24
NL6808210A (en) 1969-05-08

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