DK137440B - Method and apparatus for making laminates of fiber-reinforced layers and suitable for making printed circuits. - Google Patents
Method and apparatus for making laminates of fiber-reinforced layers and suitable for making printed circuits.Info
- Publication number
- DK137440B DK137440B DK267468A DK267468A DK137440B DK 137440 B DK137440 B DK 137440B DK 267468 A DK267468 A DK 267468A DK 267468 A DK267468 A DK 267468A DK 137440 B DK137440 B DK 137440B
- Authority
- DK
- Denmark
- Prior art keywords
- making
- fiber
- printed circuits
- reinforced layers
- laminates
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/58—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising fillers only, e.g. particles, powder, beads, flakes, spheres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68098367A | 1967-11-06 | 1967-11-06 |
Publications (2)
Publication Number | Publication Date |
---|---|
DK137440B true DK137440B (en) | 1978-03-06 |
DK137437C DK137437C (en) | 1978-08-14 |
Family
ID=24733292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DK267468A DK137440B (en) | 1967-11-06 | 1968-06-07 | Method and apparatus for making laminates of fiber-reinforced layers and suitable for making printed circuits. |
Country Status (6)
Country | Link |
---|---|
CH (1) | CH477284A (en) |
DE (1) | DE1778824B1 (en) |
DK (1) | DK137440B (en) |
FR (1) | FR1579607A (en) |
GB (1) | GB1220703A (en) |
NL (1) | NL157242B (en) |
-
1968
- 1968-06-07 DK DK267468A patent/DK137440B/en unknown
- 1968-06-10 CH CH858368A patent/CH477284A/en not_active IP Right Cessation
- 1968-06-11 GB GB2760568A patent/GB1220703A/en not_active Expired
- 1968-06-11 FR FR1579607D patent/FR1579607A/fr not_active Expired
- 1968-06-11 NL NL6808210A patent/NL157242B/en unknown
- 1968-09-10 DE DE19681778824 patent/DE1778824B1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DK137437C (en) | 1978-08-14 |
NL157242B (en) | 1978-07-17 |
CH477284A (en) | 1969-08-31 |
FR1579607A (en) | 1969-08-29 |
DE1778824B1 (en) | 1971-06-24 |
NL6808210A (en) | 1969-05-08 |
GB1220703A (en) | 1971-01-27 |
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