[go: up one dir, main page]

FR2812563B1 - Suspension de silice colloidale - Google Patents

Suspension de silice colloidale

Info

Publication number
FR2812563B1
FR2812563B1 FR0109620A FR0109620A FR2812563B1 FR 2812563 B1 FR2812563 B1 FR 2812563B1 FR 0109620 A FR0109620 A FR 0109620A FR 0109620 A FR0109620 A FR 0109620A FR 2812563 B1 FR2812563 B1 FR 2812563B1
Authority
FR
France
Prior art keywords
suspension
colloidal silica
colloidal
silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
FR0109620A
Other languages
English (en)
Other versions
FR2812563A1 (fr
Inventor
Matsumura Shigetoyo
Okada Yuko
Manaki Tatsuo
Toyama Keiji
Sakai Masatoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuso Chemical Co Ltd
Original Assignee
Fuso Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuso Chemical Co Ltd filed Critical Fuso Chemical Co Ltd
Publication of FR2812563A1 publication Critical patent/FR2812563A1/fr
Application granted granted Critical
Publication of FR2812563B1 publication Critical patent/FR2812563B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00—Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/0004—Preparation of sols
    • B01J13/0008—Sols of inorganic materials in water
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/141—Preparation of hydrosols or aqueous dispersions
    • C01B33/1415—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water
    • C01B33/1417—Preparation of hydrosols or aqueous dispersions by suspending finely divided silica in water an aqueous dispersion being obtained
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/14—Colloidal silica, e.g. dispersions, gels, sols
    • C01B33/145—Preparation of hydroorganosols, organosols or dispersions in an organic medium
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Agricultural Chemicals And Associated Chemicals (AREA)
  • Silicon Compounds (AREA)
  • Colloid Chemistry (AREA)
FR0109620A 2000-08-04 2001-07-18 Suspension de silice colloidale Expired - Lifetime FR2812563B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000236454A JP4435391B2 (ja) 2000-08-04 2000-08-04 コロイド状シリカスラリー

Publications (2)

Publication Number Publication Date
FR2812563A1 FR2812563A1 (fr) 2002-02-08
FR2812563B1 true FR2812563B1 (fr) 2003-11-14

Family

ID=18728490

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0109620A Expired - Lifetime FR2812563B1 (fr) 2000-08-04 2001-07-18 Suspension de silice colloidale

Country Status (7)

Country Link
US (1) US6750257B2 (fr)
JP (1) JP4435391B2 (fr)
KR (1) KR100516891B1 (fr)
CN (1) CN1150290C (fr)
DE (1) DE10115327B4 (fr)
FR (1) FR2812563B1 (fr)
TW (1) TWI288659B (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200517436A (en) * 2003-10-09 2005-06-01 Nippon Kayaku Kk Resin composition for protective film
JP4852302B2 (ja) * 2004-12-01 2012-01-11 信越半導体株式会社 研磨剤の製造方法及びそれにより製造された研磨剤並びにシリコンウエーハの製造方法
US7883575B2 (en) * 2006-10-02 2011-02-08 Bowers Robert B Colloidal sealant composition
WO2008123373A1 (fr) 2007-03-27 2008-10-16 Fuso Chemical Co., Ltd. Silice colloïdale et son procédé de fabrication
US20140023814A1 (en) * 2011-12-28 2014-01-23 Frank M. Fosco, JR. Potable water containers having surfaces including heat labile component/carrier combinations and methods for their preparation
JP5905767B2 (ja) * 2012-04-17 2016-04-20 多摩化学工業株式会社 中性コロイダルシリカ分散液の分散安定化方法及び分散安定性に優れた中性コロイダルシリカ分散液
US9309442B2 (en) 2014-03-21 2016-04-12 Cabot Microelectronics Corporation Composition for tungsten buffing
US9303190B2 (en) 2014-03-24 2016-04-05 Cabot Microelectronics Corporation Mixed abrasive tungsten CMP composition
US9127187B1 (en) 2014-03-24 2015-09-08 Cabot Microelectronics Corporation Mixed abrasive tungsten CMP composition
US9944829B2 (en) 2015-12-03 2018-04-17 Treliant Fang Halite salts as silicon carbide etchants for enhancing CMP material removal rate for SiC wafer
JP7565671B2 (ja) * 2018-11-07 2024-10-11 三菱ケミカル株式会社 シリカゾルの製造方法及びシリカゾル中の中間生成物の抑制方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3816330A (en) * 1970-10-05 1974-06-11 Du Pont Method of protecting colloidal silica aquasols from bacterial degradation
US3901987A (en) * 1972-04-28 1975-08-26 Nalco Chemical Co Slip resistant composition for paper coating
US3860431A (en) * 1972-04-28 1975-01-14 Nalco Chemical Co Slip resistant composition for paper coating
DE2538855A1 (de) * 1975-09-01 1977-03-10 Wacker Chemitronic Verfahren zur herstellung von schleierfreien halbleiteroberflaechen, insbesondere schleierfreien oberflaechen von (111)-orientiertem galliumarsenid
US4352744A (en) * 1980-09-05 1982-10-05 E. I. Du Pont De Nemours And Company Protecting colloidal silica aquasols from bacterial degradation
JPS61209909A (ja) * 1985-03-15 1986-09-18 Tama Kagaku Kogyo Kk ポリッシング用コロイダルシリカの製造方法
JPH0796447B2 (ja) * 1986-06-13 1995-10-18 モ−ゼス レイク インダストリ−ズ インコ−ポレイテツド 高純度シリカの製造方法
US4973462A (en) * 1987-05-25 1990-11-27 Kawatetsu Mining Company, Ltd. Process for producing high purity silica
US5230833A (en) * 1989-06-09 1993-07-27 Nalco Chemical Company Low sodium, low metals silica polishing slurries
JP2877440B2 (ja) 1989-06-09 1999-03-31 ナルコ ケミカル カンパニー コロイド状シリカ研磨性スラリー
JPH03202269A (ja) 1989-10-12 1991-09-04 Nalco Chem Co 低ナトリウム低金属シリカ研磨スラリー
JPH03136766A (ja) * 1989-10-24 1991-06-11 Sumitomo Metal Mining Co Ltd 半導体基板の研磨方法
JP3197575B2 (ja) 1991-05-09 2001-08-13 株式会社吾妻商会 発光表示装置の取付け方法
JP3202269B2 (ja) 1991-10-04 2001-08-27 キヤノン株式会社 カラーファクシミリ装置
JP3320782B2 (ja) * 1992-08-19 2002-09-03 住友電気工業株式会社 超電導線の製造方法
US5575885A (en) * 1993-12-14 1996-11-19 Kabushiki Kaisha Toshiba Copper-based metal polishing solution and method for manufacturing semiconductor device
US5695384A (en) * 1994-12-07 1997-12-09 Texas Instruments Incorporated Chemical-mechanical polishing salt slurry
JP3605927B2 (ja) * 1996-02-28 2004-12-22 株式会社神戸製鋼所 ウエハーまたは基板材料の再生方法
US6068787A (en) * 1996-11-26 2000-05-30 Cabot Corporation Composition and slurry useful for metal CMP
DE59803338D1 (de) * 1997-04-17 2002-04-18 Merck Patent Gmbh Pufferlösungen für suspensionen, verwendbar zum chemisch-mechanischen polieren
US6159076A (en) * 1998-05-28 2000-12-12 Komag, Inc. Slurry comprising a ligand or chelating agent for polishing a surface
JP2000136375A (ja) * 1998-10-30 2000-05-16 Okamoto Machine Tool Works Ltd 研磨剤スラリ−
SG73683A1 (en) * 1998-11-24 2000-06-20 Texas Instruments Inc Stabilized slurry compositions
JP2000160139A (ja) * 1998-12-01 2000-06-13 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法
CN1803964B (zh) * 1998-12-28 2010-12-15 日立化成工业株式会社 金属研磨液材料、金属研磨液、其制造方法及使用它的研磨方法
JP2001020087A (ja) * 1999-07-05 2001-01-23 Toshiba Corp 銅の化学機械研磨用水系分散体
US20020025762A1 (en) * 2000-02-16 2002-02-28 Qiuliang Luo Biocides for polishing slurries
US6447375B2 (en) * 2000-04-19 2002-09-10 Rodel Holdings Inc. Polishing method using a reconstituted dry particulate polishing composition
KR100355176B1 (ko) * 2000-06-30 2002-10-11 학교법인 인하학원 콜로이드 실리카의 제조방법
JP2003142435A (ja) * 2001-10-31 2003-05-16 Fujimi Inc 研磨用組成物およびそれを用いた研磨方法

Also Published As

Publication number Publication date
DE10115327A1 (de) 2002-02-14
DE10115327B4 (de) 2007-12-13
TWI288659B (en) 2007-10-21
JP2002045681A (ja) 2002-02-12
KR20020011852A (ko) 2002-02-09
FR2812563A1 (fr) 2002-02-08
CN1150290C (zh) 2004-05-19
US6750257B2 (en) 2004-06-15
KR100516891B1 (ko) 2005-09-23
CN1337437A (zh) 2002-02-27
US20020037935A1 (en) 2002-03-28
JP4435391B2 (ja) 2010-03-17

Similar Documents

Publication Publication Date Title
NO20026109L (no) Blanding av silikasoler
DE60103821D1 (de) Herstellung von Oberflächenmodifitierte Kieselsäure
DE60129374D1 (de) Compensation pour buses defectueuses
DE60101803D1 (de) Fahrzeugaufhängungslenker
DE60218363D1 (de) Aufhängungslenker
DE60236569D1 (de) Siliziumoxidmembran
DE10194790T1 (de) Erdalkalifreies Boralkalisilikatglas
BR0201972B1 (pt) montante de suspensão.
DE59900400D1 (de) Fällungskieselsäure
DE60125410D1 (de) Fahrzeugaufhängungssystem
DE50012595D1 (de) Aufhängevorrichtung
TR199901464A3 (tr) Hidrofobik çökelmis silika
SE0801735L (sv) Suspensionsdränering
DK1241135T3 (da) Fældningskiselsyre med høj struktur
AU9658701A (en) Modulation of allergic response
FR2812563B1 (fr) Suspension de silice colloidale
DE50107986D1 (de) Luftfederbalg
IS2396B (is) Síprasídón sviflausn
DE60213753D1 (de) Aufhängungsstützvorrichtung
ATA19372001A (de) Federungsvorrichtung
DE60122651D1 (de) Fahrzeugaufhängungsvorrichtung
NO20020717D0 (no) Produksjon av dampavsatt silika
DE60229081D1 (de) System einer unabhängigen Radaufhängung
DE50110227D1 (de) Flurförderzeug mit einer Einzelradaufhängung
FR2832042B1 (fr) Sommier et element de suspension pour sommier

Legal Events

Date Code Title Description
PLFP Fee payment

Year of fee payment: 16

PLFP Fee payment

Year of fee payment: 17

PLFP Fee payment

Year of fee payment: 18

PLFP Fee payment

Year of fee payment: 19

PLFP Fee payment

Year of fee payment: 20