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FR2775533B1 - Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif - Google Patents

Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif

Info

Publication number
FR2775533B1
FR2775533B1 FR9802727A FR9802727A FR2775533B1 FR 2775533 B1 FR2775533 B1 FR 2775533B1 FR 9802727 A FR9802727 A FR 9802727A FR 9802727 A FR9802727 A FR 9802727A FR 2775533 B1 FR2775533 B1 FR 2775533B1
Authority
FR
France
Prior art keywords
electronic
manufacturing
whereof
thickness
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9802727A
Other languages
English (en)
Other versions
FR2775533A1 (fr
Inventor
Laurent Oddou
Ray Freeman
Stephane Ayala
Gerard Bourneix
Michael Zafrany
Philippe Patrice
David Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SCA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR9802727A priority Critical patent/FR2775533B1/fr
Application filed by Gemplus SCA filed Critical Gemplus SCA
Priority to AU24286/99A priority patent/AU2428699A/en
Priority to EP99903730A priority patent/EP1057139A1/fr
Priority to CN 99803383 priority patent/CN1292129A/zh
Priority to CA002321893A priority patent/CA2321893A1/fr
Priority to PCT/FR1999/000291 priority patent/WO1999044172A1/fr
Priority to JP2000533853A priority patent/JP2002505488A/ja
Priority to BR9907751-5A priority patent/BR9907751A/pt
Publication of FR2775533A1 publication Critical patent/FR2775533A1/fr
Application granted granted Critical
Publication of FR2775533B1 publication Critical patent/FR2775533B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)
FR9802727A 1998-02-27 1998-02-27 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif Expired - Fee Related FR2775533B1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR9802727A FR2775533B1 (fr) 1998-02-27 1998-02-27 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
EP99903730A EP1057139A1 (fr) 1998-02-27 1999-02-10 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
CN 99803383 CN1292129A (zh) 1998-02-27 1999-02-10 一种带有无接触电子存储器的电子器件及其制作方法
CA002321893A CA2321893A1 (fr) 1998-02-27 1999-02-10 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
AU24286/99A AU2428699A (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
PCT/FR1999/000291 WO1999044172A1 (fr) 1998-02-27 1999-02-10 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
JP2000533853A JP2002505488A (ja) 1998-02-27 1999-02-10 非接触式電子メモリ電子装置、およびそのような装置の製造方法
BR9907751-5A BR9907751A (pt) 1998-02-27 1999-02-10 Dispositivo eletrônico com memória eletrônica sem contato, e processo de fabricação desse dispositivo.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9802727A FR2775533B1 (fr) 1998-02-27 1998-02-27 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif

Publications (2)

Publication Number Publication Date
FR2775533A1 FR2775533A1 (fr) 1999-09-03
FR2775533B1 true FR2775533B1 (fr) 2003-02-14

Family

ID=9523715

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9802727A Expired - Fee Related FR2775533B1 (fr) 1998-02-27 1998-02-27 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif

Country Status (8)

Country Link
EP (1) EP1057139A1 (fr)
JP (1) JP2002505488A (fr)
CN (1) CN1292129A (fr)
AU (1) AU2428699A (fr)
BR (1) BR9907751A (fr)
CA (1) CA2321893A1 (fr)
FR (1) FR2775533B1 (fr)
WO (1) WO1999044172A1 (fr)

Cited By (8)

* Cited by examiner, † Cited by third party
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US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US7233498B2 (en) 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US7278203B2 (en) 2003-02-07 2007-10-09 Hallys Corporation Random-period chip transfer apparatus
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7795076B2 (en) 2003-06-12 2010-09-14 Symbol Technologies, Inc. Method, system, and apparatus for transfer of dies using a die plate having die cavities
EP3694704A1 (fr) * 2017-10-13 2020-08-19 Stora Enso Oyj Procédé et agencement de production d'une étiquette à motif électroconducteur intégré

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FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
FR2801708B1 (fr) * 1999-11-29 2003-12-26 A S K Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
GB0106082D0 (en) 2001-03-13 2001-05-02 Mat & Separations Tech Int Ltd Method and equipment for removing volatile compounds from air
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US6851617B2 (en) * 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US7102524B2 (en) 2002-08-02 2006-09-05 Symbol Technologies, Inc. Die frame apparatus and method of transferring dies therewith
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US7121456B2 (en) 2002-09-13 2006-10-17 Visa U.S.A. Inc. Method and system for managing token image replacement
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US6920611B1 (en) 2002-11-25 2005-07-19 Visa U.S.A., Inc. Method and system for implementing a loyalty merchant component
DE10304824A1 (de) * 2003-01-31 2004-08-12 Varta Microbattery Gmbh Dünne elektronische Chipkarte
JP4103653B2 (ja) * 2003-03-27 2008-06-18 株式会社デンソー Ｉｃカード
US7827077B2 (en) 2003-05-02 2010-11-02 Visa U.S.A. Inc. Method and apparatus for management of electronic receipts on portable devices
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US7104446B2 (en) 2003-09-03 2006-09-12 Visa U.S.A., Inc. Method, system and portable consumer device using wildcard values
US7051923B2 (en) 2003-09-12 2006-05-30 Visa U.S.A., Inc. Method and system for providing interactive cardholder rewards image replacement
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
CN1322467C (zh) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 一种非接触式智能低频卡制造方法
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
EP1733337A4 (fr) 2004-01-12 2008-06-25 Symbol Technologies Inc Tri d'incrustations d'etiquette d'identification par radiofrequence et ensemble
FR2868987B1 (fr) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
WO2006023620A2 (fr) 2004-08-17 2006-03-02 Symbol Technologies, Inc. Singulation d'etiquettes d'identification rf (rfid) pour l'essai et/ou la programmation
FR2877462B1 (fr) 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
DE602005024861D1 (de) 2004-12-03 2010-12-30 Hallys Corp Zwischenglied-bondierungseinrichtung
JP2006277178A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
JP4810531B2 (ja) 2005-04-06 2011-11-09 株式会社 ハリーズ 電子部品の製造装置
DE102005028066B3 (de) 2005-06-16 2006-12-07 Deutsche Exide Gmbh Polbrücke für eine Batterie
DE102006026105B4 (de) * 2005-06-28 2011-07-07 Mühlbauer AG, 93426 Verfahren und Vorrichtung zur Herstellung von selbstklebenden RFID-Transpondern
US7992781B2 (en) 2009-12-16 2011-08-09 Visa International Service Association Merchant alerts incorporating receipt data
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts
FR3049739B1 (fr) * 2016-03-30 2021-03-12 Linxens Holding Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce
CN113147094A (zh) * 2021-03-18 2021-07-23 淮安赫德兹彩色印刷包装有限公司 带装饰贴的包装纸袋加工设备

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FR2641102B1 (fr) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
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FR2724040B1 (fr) * 1994-08-25 1996-09-27 Schlumberger Ind Sa Procede de fabrication d'une carte a puce et carte ainsi obtenue
CN1159859A (zh) * 1994-09-30 1997-09-17 西门子公司 用于装入无触点芯片卡的载体装置
DE59502482D1 (de) * 1994-11-03 1998-07-16 Fela Holding Ag Basis Folie für Chip Karte
DE19509233A1 (de) * 1995-03-19 1996-09-26 Melzer Maschinenbau Gmbh Verfahren zum Herstellen von Elektronik-Komponenten enthaltenden Kunststoffkarten

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9495632B2 (en) 2001-02-02 2016-11-15 Avery Dennison Corporation RFID label technique
US8246773B2 (en) 2002-01-18 2012-08-21 Avery Dennison Corporation RFID label technique
US7361251B2 (en) 2002-01-18 2008-04-22 Avery Dennison Corporation RFID label technique
US7368032B2 (en) 2002-01-18 2008-05-06 Avery Dennison Corporation RFID label technique
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US7233498B2 (en) 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US7278203B2 (en) 2003-02-07 2007-10-09 Hallys Corporation Random-period chip transfer apparatus
US7795076B2 (en) 2003-06-12 2010-09-14 Symbol Technologies, Inc. Method, system, and apparatus for transfer of dies using a die plate having die cavities
US8020283B2 (en) 2004-09-22 2011-09-20 Avery Dennison Corporation High-speed RFID circuit placement device
US7669318B2 (en) 2004-09-22 2010-03-02 Avery Dennison Corporation High-speed RFID circuit placement method
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US8531297B2 (en) 2005-04-25 2013-09-10 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7874493B2 (en) 2005-12-22 2011-01-25 Avery Dennison Corporation Method of manufacturing RFID devices
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
EP3694704A1 (fr) * 2017-10-13 2020-08-19 Stora Enso Oyj Procédé et agencement de production d'une étiquette à motif électroconducteur intégré
EP3694704B1 (fr) * 2017-10-13 2024-11-27 Digital Tags Finland Oy Procédé et agencement de production d'une étiquette à motif électroconducteur intégré

Also Published As

Publication number Publication date
AU2428699A (en) 1999-09-15
CA2321893A1 (fr) 1999-09-02
JP2002505488A (ja) 2002-02-19
EP1057139A1 (fr) 2000-12-06
BR9907751A (pt) 2000-10-17
CN1292129A (zh) 2001-04-18
FR2775533A1 (fr) 1999-09-03
WO1999044172A1 (fr) 1999-09-02

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Effective date: 20091030