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FR2775533B1 - ELECTRONIC DEVICE WITH NON-CONTACT ELECTRONIC MEMORY, AND METHOD FOR MANUFACTURING SUCH A DEVICE - Google Patents

ELECTRONIC DEVICE WITH NON-CONTACT ELECTRONIC MEMORY, AND METHOD FOR MANUFACTURING SUCH A DEVICE

Info

Publication number
FR2775533B1
FR2775533B1 FR9802727A FR9802727A FR2775533B1 FR 2775533 B1 FR2775533 B1 FR 2775533B1 FR 9802727 A FR9802727 A FR 9802727A FR 9802727 A FR9802727 A FR 9802727A FR 2775533 B1 FR2775533 B1 FR 2775533B1
Authority
FR
France
Prior art keywords
electronic
manufacturing
whereof
thickness
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9802727A
Other languages
French (fr)
Other versions
FR2775533A1 (en
Inventor
Laurent Oddou
Ray Freeman
Stephane Ayala
Gerard Bourneix
Michael Zafrany
Philippe Patrice
David Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus SCA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to FR9802727A priority Critical patent/FR2775533B1/en
Application filed by Gemplus SCA filed Critical Gemplus SCA
Priority to CN 99803383 priority patent/CN1292129A/en
Priority to PCT/FR1999/000291 priority patent/WO1999044172A1/en
Priority to AU24286/99A priority patent/AU2428699A/en
Priority to EP99903730A priority patent/EP1057139A1/en
Priority to JP2000533853A priority patent/JP2002505488A/en
Priority to BR9907751-5A priority patent/BR9907751A/en
Priority to CA002321893A priority patent/CA2321893A1/en
Publication of FR2775533A1 publication Critical patent/FR2775533A1/en
Application granted granted Critical
Publication of FR2775533B1 publication Critical patent/FR2775533B1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)

Abstract

The invention concerns a contactless electronic device (10) such as a card, a label, a ticket or a token, comprising at least an electronic microcircuit (20) arranged in the thickness of a rigid or semirigid support and comprising pads (26) connected to an interface antenna (24) arranged in the thickness of the support, the latter comprising at least two opposite, lower (12) and upper (14), protective sheets. The invention is characterised in that it comprises a stack: of a lower protective sheet (12) whereof the inner face (22) bears at least one electronic microcircuit and at least one interface antenna (24); of an intermediate bonding sheet (14) whereof the two opposite faces lower and upper are provided with adhesive; and of an upper protective sheet (16).
FR9802727A 1998-02-27 1998-02-27 ELECTRONIC DEVICE WITH NON-CONTACT ELECTRONIC MEMORY, AND METHOD FOR MANUFACTURING SUCH A DEVICE Expired - Fee Related FR2775533B1 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FR9802727A FR2775533B1 (en) 1998-02-27 1998-02-27 ELECTRONIC DEVICE WITH NON-CONTACT ELECTRONIC MEMORY, AND METHOD FOR MANUFACTURING SUCH A DEVICE
PCT/FR1999/000291 WO1999044172A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
AU24286/99A AU2428699A (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
EP99903730A EP1057139A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
CN 99803383 CN1292129A (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same
JP2000533853A JP2002505488A (en) 1998-02-27 1999-02-10 Non-contact electronic memory electronic device and method of manufacturing such device
BR9907751-5A BR9907751A (en) 1998-02-27 1999-02-10 Electronic device with non-contact electronic memory, and manufacturing process for that device.
CA002321893A CA2321893A1 (en) 1998-02-27 1999-02-10 Electronic device with contactless electronic memory, and method for making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9802727A FR2775533B1 (en) 1998-02-27 1998-02-27 ELECTRONIC DEVICE WITH NON-CONTACT ELECTRONIC MEMORY, AND METHOD FOR MANUFACTURING SUCH A DEVICE

Publications (2)

Publication Number Publication Date
FR2775533A1 FR2775533A1 (en) 1999-09-03
FR2775533B1 true FR2775533B1 (en) 2003-02-14

Family

ID=9523715

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9802727A Expired - Fee Related FR2775533B1 (en) 1998-02-27 1998-02-27 ELECTRONIC DEVICE WITH NON-CONTACT ELECTRONIC MEMORY, AND METHOD FOR MANUFACTURING SUCH A DEVICE

Country Status (8)

Country Link
EP (1) EP1057139A1 (en)
JP (1) JP2002505488A (en)
CN (1) CN1292129A (en)
AU (1) AU2428699A (en)
BR (1) BR9907751A (en)
CA (1) CA2321893A1 (en)
FR (1) FR2775533B1 (en)
WO (1) WO1999044172A1 (en)

Cited By (8)

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US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US7233498B2 (en) 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US7278203B2 (en) 2003-02-07 2007-10-09 Hallys Corporation Random-period chip transfer apparatus
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7795076B2 (en) 2003-06-12 2010-09-14 Symbol Technologies, Inc. Method, system, and apparatus for transfer of dies using a die plate having die cavities
EP3694704B1 (en) * 2017-10-13 2024-11-27 Digital Tags Finland Oy Method and arrangement for producing a label with integrated electrically conductive pattern

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FR2801708B1 (en) * 1999-11-29 2003-12-26 A S K METHOD OF MANUFACTURING A CONTACTLESS CHIP CARD WITH AN ANTENNA SUPPORT OF FIBROUS MATERIAL
FR2801709B1 (en) * 1999-11-29 2002-02-15 A S K CONTACTLESS OR CONTACT-FREE HYBRID CHIP CARD TO REDUCE THE RISK OF FRAUD
FR2801707B1 (en) * 1999-11-29 2002-02-15 A S K METHOD FOR MANUFACTURING A CONTACT-FREE CONTACT HYBRID CHIP CARD WITH AN ANTENNA SUPPORT OF FIBROUS MATERIAL
GB0106082D0 (en) 2001-03-13 2001-05-02 Mat & Separations Tech Int Ltd Method and equipment for removing volatile compounds from air
FR2824018B1 (en) 2001-04-26 2003-07-04 Arjo Wiggins Sa COVER INCORPORATING A RADIOFREQUENCY IDENTIFICATION DEVICE
US6851617B2 (en) 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US6848162B2 (en) 2002-08-02 2005-02-01 Matrics, Inc. System and method of transferring dies using an adhesive surface
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US7121456B2 (en) 2002-09-13 2006-10-17 Visa U.S.A. Inc. Method and system for managing token image replacement
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US6920611B1 (en) 2002-11-25 2005-07-19 Visa U.S.A., Inc. Method and system for implementing a loyalty merchant component
DE10304824A1 (en) * 2003-01-31 2004-08-12 Varta Microbattery Gmbh Thin electronic chip card
JP4103653B2 (en) * 2003-03-27 2008-06-18 株式会社デンソー IC card
US7827077B2 (en) 2003-05-02 2010-11-02 Visa U.S.A. Inc. Method and apparatus for management of electronic receipts on portable devices
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US7104446B2 (en) 2003-09-03 2006-09-12 Visa U.S.A., Inc. Method, system and portable consumer device using wildcard values
US7051923B2 (en) 2003-09-12 2006-05-30 Visa U.S.A., Inc. Method and system for providing interactive cardholder rewards image replacement
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
CN1322467C (en) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 Manufacturing method of non contact type intelligent low frequency card
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
WO2005070143A2 (en) 2004-01-12 2005-08-04 Symbol Technologies, Inc. Radio frequency identification tag inlay sortation and assembly
FR2868987B1 (en) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc STRUCTURE COMPRISING AN ELECTRONIC DEVICE, IN PARTICULAR FOR THE MANUFACTURE OF A SECURITY OR VALUE DOCUMENT
WO2006023620A2 (en) 2004-08-17 2006-03-02 Symbol Technologies, Inc. Singulation of radio frequency identification (rfid) tags for testing and/or programming
FR2877462B1 (en) 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A STRUCTURE COMPRISING AN ELECTRONIC DEVICE FOR THE MANUFACTURE OF A SAFETY DOCUMENT.
WO2006059732A1 (en) 2004-12-03 2006-06-08 Hallys Corporation Interposer bonding device
JP2006277178A (en) * 2005-03-29 2006-10-12 Aruze Corp Game cards
US8025086B2 (en) 2005-04-06 2011-09-27 Hallys Corporation Electronic component manufacturing apparatus
DE102005028066B3 (en) 2005-06-16 2006-12-07 Deutsche Exide Gmbh Pole bridge for a battery
DE102006026105B4 (en) * 2005-06-28 2011-07-07 Mühlbauer AG, 93426 Method and device for the production of self-adhesive RFID transponders
US20110145082A1 (en) 2009-12-16 2011-06-16 Ayman Hammad Merchant alerts incorporating receipt data
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts
FR3049739B1 (en) * 2016-03-30 2021-03-12 Linxens Holding METHODS OF MANUFACTURING CHIP CARDS AND ANTENNA BRACKETS FOR CHIP CARDS
CN113147094A (en) * 2021-03-18 2021-07-23 淮安赫德兹彩色印刷包装有限公司 Packaging paper bag processing equipment with decorative sticker

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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9495632B2 (en) 2001-02-02 2016-11-15 Avery Dennison Corporation RFID label technique
US8246773B2 (en) 2002-01-18 2012-08-21 Avery Dennison Corporation RFID label technique
US7361251B2 (en) 2002-01-18 2008-04-22 Avery Dennison Corporation RFID label technique
US7368032B2 (en) 2002-01-18 2008-05-06 Avery Dennison Corporation RFID label technique
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US7233498B2 (en) 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US7278203B2 (en) 2003-02-07 2007-10-09 Hallys Corporation Random-period chip transfer apparatus
US7795076B2 (en) 2003-06-12 2010-09-14 Symbol Technologies, Inc. Method, system, and apparatus for transfer of dies using a die plate having die cavities
US8020283B2 (en) 2004-09-22 2011-09-20 Avery Dennison Corporation High-speed RFID circuit placement device
US7669318B2 (en) 2004-09-22 2010-03-02 Avery Dennison Corporation High-speed RFID circuit placement method
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
US8531297B2 (en) 2005-04-25 2013-09-10 Avery Dennison Corporation High-speed RFID circuit placement method and device
US7874493B2 (en) 2005-12-22 2011-01-25 Avery Dennison Corporation Method of manufacturing RFID devices
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
EP3694704B1 (en) * 2017-10-13 2024-11-27 Digital Tags Finland Oy Method and arrangement for producing a label with integrated electrically conductive pattern

Also Published As

Publication number Publication date
CN1292129A (en) 2001-04-18
CA2321893A1 (en) 1999-09-02
EP1057139A1 (en) 2000-12-06
JP2002505488A (en) 2002-02-19
BR9907751A (en) 2000-10-17
FR2775533A1 (en) 1999-09-03
WO1999044172A1 (en) 1999-09-02
AU2428699A (en) 1999-09-15

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Legal Events

Date Code Title Description
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Effective date: 20091030