[go: up one dir, main page]

FR2877462B1 - Structure comportant un dispositif electronique pour la fabrication d'un document de securite. - Google Patents

Structure comportant un dispositif electronique pour la fabrication d'un document de securite.

Info

Publication number
FR2877462B1
FR2877462B1 FR0452488A FR0452488A FR2877462B1 FR 2877462 B1 FR2877462 B1 FR 2877462B1 FR 0452488 A FR0452488 A FR 0452488A FR 0452488 A FR0452488 A FR 0452488A FR 2877462 B1 FR2877462 B1 FR 2877462B1
Authority
FR
France
Prior art keywords
manufacture
electronic device
safety document
document
safety
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0452488A
Other languages
English (en)
Other versions
FR2877462A1 (fr
Inventor
Paolo Pepori
Pierre Doublet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ArjoWiggins Security SAS
Original Assignee
ArjoWiggins Security SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ArjoWiggins Security SAS filed Critical ArjoWiggins Security SAS
Priority to FR0452488A priority Critical patent/FR2877462B1/fr
Priority to US11/666,218 priority patent/US8079519B2/en
Priority to BRPI0518077-5A priority patent/BRPI0518077A/pt
Priority to CA002585335A priority patent/CA2585335A1/fr
Priority to PCT/FR2005/050914 priority patent/WO2006048577A1/fr
Priority to EP05815663A priority patent/EP1805696A1/fr
Publication of FR2877462A1 publication Critical patent/FR2877462A1/fr
Application granted granted Critical
Publication of FR2877462B1 publication Critical patent/FR2877462B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G06K19/025—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine the material being flexible or adapted for folding, e.g. paper or paper-like materials used in luggage labels, identification tags, forms or identification documents carrying RFIDs
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/05644—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
FR0452488A 2004-10-29 2004-10-29 Structure comportant un dispositif electronique pour la fabrication d'un document de securite. Expired - Fee Related FR2877462B1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
FR0452488A FR2877462B1 (fr) 2004-10-29 2004-10-29 Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
US11/666,218 US8079519B2 (en) 2004-10-29 2005-10-28 Structure including an electronic device for making a security document
BRPI0518077-5A BRPI0518077A (pt) 2004-10-29 2005-10-28 processo de fabricação de uma estrutura destinada à obtenção de um documento de segurança e/ou de valor ou para o aumento de segurança de um artigo e respectiva estrutura
CA002585335A CA2585335A1 (fr) 2004-10-29 2005-10-28 Structure comportant un dispositif electronique pour la fabrication d'un document de securite
PCT/FR2005/050914 WO2006048577A1 (fr) 2004-10-29 2005-10-28 Structure comportant un dispositif electronique pour la fabrication d'un document de securite
EP05815663A EP1805696A1 (fr) 2004-10-29 2005-10-28 Structure comportant un dispositif electronique pour la fabrication d'un document de securite

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0452488A FR2877462B1 (fr) 2004-10-29 2004-10-29 Structure comportant un dispositif electronique pour la fabrication d'un document de securite.

Publications (2)

Publication Number Publication Date
FR2877462A1 FR2877462A1 (fr) 2006-05-05
FR2877462B1 true FR2877462B1 (fr) 2007-01-26

Family

ID=34951047

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0452488A Expired - Fee Related FR2877462B1 (fr) 2004-10-29 2004-10-29 Structure comportant un dispositif electronique pour la fabrication d'un document de securite.

Country Status (6)

Country Link
US (1) US8079519B2 (fr)
EP (1) EP1805696A1 (fr)
BR (1) BRPI0518077A (fr)
CA (1) CA2585335A1 (fr)
FR (1) FR2877462B1 (fr)
WO (1) WO2006048577A1 (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008096576A1 (fr) * 2007-02-06 2008-08-14 Murata Manufacturing Co., Ltd. Matériau d'emballage pourvu d'un module couplé de façon électromagnétique
FR2922342B1 (fr) 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
FR2935060B1 (fr) * 2008-08-12 2010-09-10 Arjowiggins Licensing Sas E-document comportant un element de perturbation electromagnetique
FR2948796A1 (fr) * 2009-07-28 2011-02-04 Ask Sa Support de dispositif d'identification radiofrequence pour carte hybride et son procede de fabrication
FR2963137B1 (fr) * 2010-07-20 2016-02-19 Oberthur Technologies Insert a transpondeur et dispositif comprenant un tel insert
JP2012032931A (ja) * 2010-07-29 2012-02-16 Hitachi Ltd Ｒｆｉｄタグ及びｒｆｉｄタグの製造方法
DE202010014862U1 (de) 2010-10-28 2010-12-30 Beta Layout Gmbh Leiterplatte mit integriertem RFID-Mikrochip
US9790390B2 (en) 2010-11-02 2017-10-17 Standard Register, Inc. Thermochromic ink and document printed therewith
MX2013006604A (es) * 2010-12-21 2013-07-29 Merck Patent Gmbh Elemento coloreado de seguridad magnetizable.
US8720776B2 (en) * 2011-11-10 2014-05-13 Paul Llewellyn Greene X-ray security system
WO2013155268A1 (fr) * 2012-04-11 2013-10-17 Universal Surveillance Systems, Llc Étiquette hybride
CN104077697B (zh) * 2013-03-29 2021-12-07 优品保有限公司 移动式现场物品鉴别的系统和方法
JP6196463B2 (ja) * 2013-04-30 2017-09-13 トッパン・フォームズ株式会社 情報媒体およびその製造方法
CA2944388A1 (fr) 2014-04-04 2015-10-08 Visa International Service Association Dispositif de paiement avec element de securite holographique
WO2018019787A1 (fr) * 2016-07-27 2018-02-01 Philip Morris Products S.A. Récipient modifié d'articles de consommation comprenant un élément à épaisseur perceptible
FI3584091T3 (fi) * 2017-02-16 2024-03-21 Dainippon Printing Co Ltd Informaatiosivu
FR3063414B1 (fr) * 2017-02-27 2021-07-23 Linxens Holding Procede de fabrication d’un circuit electrique, circuit electrique obtenu par ce procede et carte a puce comportant un tel circuit electrique.
SE1751265A1 (en) * 2017-10-13 2019-03-12 Stora Enso Oyj Method and arrangement for producing a label with integrated electrically conductive pattern
US11376882B2 (en) * 2018-10-16 2022-07-05 Idemia Identity & Security USA LLC Fused polyester identification documents
EP3726415A1 (fr) * 2019-04-18 2020-10-21 Thales Dis France SA Élément de sécurité sur module

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3019207A1 (de) 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
FR2691563B1 (fr) 1992-05-19 1996-05-31 Francois Droz Carte comprenant au moins un element electronique et procede de fabrication d'une telle carte.
GB2279907B (en) 1993-07-02 1996-11-06 Gec Avery Ltd An integrated circuit card
US5528222A (en) 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US5975420A (en) * 1995-04-13 1999-11-02 Dai Nippon Printing Co., Ltd. Apparatus and method of manufacturing an integrated circuit (IC) card with a protective IC module
DE19602821C1 (de) 1996-01-26 1997-06-26 Siemens Ag Verfahren zur Herstellung einer Datenkarte
EP0880754B1 (fr) 1996-02-12 2000-05-17 David Finn Procede et dispositif pour la connexion d'un conducteur electrique
US6116298A (en) * 1996-10-28 2000-09-12 Hi-G-Tek Ltd. Fueling system
GB2328836A (en) 1997-08-27 1999-03-03 Norprint Int Ltd Security Tag
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
FR2775533B1 (fr) 1998-02-27 2003-02-14 Gemplus Sca Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
US6262692B1 (en) 1999-01-13 2001-07-17 Brady Worldwide, Inc. Laminate RFID label and method of manufacture
US6353420B1 (en) * 1999-04-28 2002-03-05 Amerasia International Technology, Inc. Wireless article including a plural-turn loop antenna
JP2001092934A (ja) 1999-09-20 2001-04-06 Toshiba Corp 無線情報記憶媒体、無線情報記憶媒体の製造方法、無線情報記憶媒体を備えた冊子体、無線情報記憶媒体を用いた身分確認システム、および無線情報記憶媒体の発行システム
FR2802684B1 (fr) * 1999-12-15 2003-11-28 Gemplus Card Int Dispositif a puce de circuit integre jetable et procede de fabrication d'un tel procede
US7095324B2 (en) * 2001-03-06 2006-08-22 Intermec Ip Corp Tamper evident smart label with RF transponder
FR2826154B1 (fr) * 2001-06-14 2004-07-23 A S K Carte a puce sans contact avec un support d'antenne et un support de puce en materiau fibreux
FR2832354B1 (fr) * 2001-11-20 2004-02-20 Arjo Wiggins Sa Procede de fabrication d'un article comportant une feuille et au moins un element rapporte sur cette feuille
FR2844621A1 (fr) * 2002-09-13 2004-03-19 A S K Procede de fabrication d'une carte a puce sans contact ou hybride contact-sans contact a planeite renforcee
FI20022094A0 (fi) * 2002-11-25 2002-11-25 Rafsec Oy Transponderi ja menetelmä sen valmistamiseksi

Also Published As

Publication number Publication date
CA2585335A1 (fr) 2006-05-11
US8079519B2 (en) 2011-12-20
BRPI0518077A (pt) 2008-10-28
WO2006048577A1 (fr) 2006-05-11
US20090294534A1 (en) 2009-12-03
EP1805696A1 (fr) 2007-07-11
FR2877462A1 (fr) 2006-05-05

Similar Documents

Publication Publication Date Title
FR2877462B1 (fr) Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
FR2868987B1 (fr) Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
EP1716643A4 (fr) Dispositif electronique a touche captant l'effort
DE60217444D1 (de) Sprachgesteuertes elektronisches Gerät
EP1744383A4 (fr) Dispositif electrique avec revetement de film, element d"armature, et systeme de logement pour dispositif electrique avec revetement de film
EP1782301A4 (fr) Dispositif neuromimetique mobile comportant un systeme nerveux simule base sur l'hippocampe
EP1782165A4 (fr) Commande d'un dispositif electronique
FR2917566B1 (fr) Boitier constitue de coquilles assemblees entre elles pour la protection d'un dispositif electronique.
FR2841809B1 (fr) Dispositif flexible pour la construction de structures
FR2880192B1 (fr) Systeme a deux etats pour la regulation thermique d'un dispositif electronique
FR2925776B1 (fr) Agencement pour le raccordement securise d'un dispositif electronique
FR2860124B1 (fr) Dispositif de desherbage mecanique
FR2892843B1 (fr) Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur.
FR2833979B1 (fr) Dispositif broyeur pour wc
FR2878432B1 (fr) Dispositif de maintien en flexion du pied d'une personne
FR2869706B1 (fr) Entite electronique securisee, telle qu'un passeport.
FR2844815B3 (fr) Couvercle de surete pour bouches d'egouts
FR2889552B3 (fr) Element de coffrage perdu et module pour la realisation d'un tel element.
FR2859067B1 (fr) Dispositif d'enfouissement mecanique de dechets vegetaux
FR2836999B1 (fr) Dispositif audiophonique panoramique pour sonar passif
FR2888832B1 (fr) Conditionnement d'un composant electronique
FR2852701B1 (fr) Dispositif horaire pour indiquer l'heure legale
FR2859029B3 (fr) Structure de boitier pour dispositif electronique portable
FR2836263B1 (fr) Document de securite a circuit integre
ES1053669Y (es) Intercomunicador de alarma electronico.

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20140630