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FR2700041B1 - Procédé de fabrication d'un substrat pour carte à circuit intégré. - Google Patents

Procédé de fabrication d'un substrat pour carte à circuit intégré.

Info

Publication number
FR2700041B1
FR2700041B1 FR9315644A FR9315644A FR2700041B1 FR 2700041 B1 FR2700041 B1 FR 2700041B1 FR 9315644 A FR9315644 A FR 9315644A FR 9315644 A FR9315644 A FR 9315644A FR 2700041 B1 FR2700041 B1 FR 2700041B1
Authority
FR
France
Prior art keywords
substrate
manufacturing
integrated circuit
circuit card
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9315644A
Other languages
English (en)
Other versions
FR2700041A1 (fr
Inventor
Isao Yabe
Kazuo Sato
Hajime Omata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Electronics Co Ltd
Publication of FR2700041A1 publication Critical patent/FR2700041A1/fr
Application granted granted Critical
Publication of FR2700041B1 publication Critical patent/FR2700041B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/5675—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding for making orifices in or through the moulded article
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
FR9315644A 1992-12-25 1993-12-24 Procédé de fabrication d'un substrat pour carte à circuit intégré. Expired - Fee Related FR2700041B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35793792 1992-12-25

Publications (2)

Publication Number Publication Date
FR2700041A1 FR2700041A1 (fr) 1994-07-01
FR2700041B1 true FR2700041B1 (fr) 1996-04-26

Family

ID=18456708

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9315644A Expired - Fee Related FR2700041B1 (fr) 1992-12-25 1993-12-24 Procédé de fabrication d'un substrat pour carte à circuit intégré.

Country Status (2)

Country Link
US (1) US5476629A (fr)
FR (1) FR2700041B1 (fr)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5628031A (en) * 1993-07-19 1997-05-06 Elonex Ip Holdings Ltd. Personal digital assistant module implemented as a low-profile printed circuit assembly having a rigid substrate wherein IC devices are mounted within openings wholly between opposite plane surfaces of the rigid substrate
JPH0885285A (ja) * 1994-07-21 1996-04-02 Hitachi Maxell Ltd セキュリティカード用基板の製造方法、およびセキュリティカード用基板
JPH0890600A (ja) * 1994-09-22 1996-04-09 Rhythm Watch Co Ltd Ｉｃカード製造金型
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
US6001295A (en) * 1995-03-31 1999-12-14 Toyoda Gosei Co., Ltd Manufacturing method of an air bag cover
JPH08268205A (ja) * 1995-03-31 1996-10-15 Toyoda Gosei Co Ltd パッドの製造方法
JPH09156267A (ja) * 1995-12-06 1997-06-17 Watada Insatsu Kk プラスチックカード
WO1997042598A1 (fr) * 1996-05-09 1997-11-13 Atmel Corporation Carte a puce faite de deux feuilles contrecollees
DE19639678B4 (de) * 1996-09-26 2007-08-23 Mitsubishi Materials Corp. Formwerkzeug für den Einsatz in einer Spritzgussmaschine und Verfahren
DE19854986A1 (de) * 1998-11-27 2000-05-31 Giesecke & Devrient Gmbh Verfahren zur Herstellung ein- oder mehrschichtiger Karten mit in geschäumtem Kunststoff eingebetteten elektronischen Bauelementen
JP4397988B2 (ja) 1998-12-25 2010-01-13 ノキア コーポレイション 多点薄肉部圧縮成形方法及びこの方法に用いる多点薄肉部圧縮成形金型
DE19948665C2 (de) * 1999-10-08 2003-08-21 Bayerische Motoren Werke Ag Verfahren zur Erzeugung einer gratfreien Hinterschnitt-Ausbildung in einem durch Spritzgießen hergestellten Kunststoff-Bauteil
JP3394516B2 (ja) * 2000-10-06 2003-04-07 エヌイーシーセミコンダクターズ九州株式会社 樹脂封止金型
DE10219705A1 (de) * 2002-05-02 2003-11-13 Orga Kartensysteme Gmbh Spritzgusswerkzeug zur Herstellung einer Chipkarte sowie ein Verfahren zur Herstellung einer Chipkarte
EP1607206A4 (fr) * 2003-01-21 2006-11-29 Techno Polymer Co Ltd Matrice de moulage par injection, procede de moulage par injection, et produit moule sans soudure
US6994355B2 (en) * 2003-10-01 2006-02-07 Infiltrator Systems Inc. Pipe seal
US7687003B2 (en) * 2004-12-08 2010-03-30 Visteon Global Technologies, Inc. Method of forming plastic part having hidden thin walled section
JP4733733B2 (ja) * 2008-11-28 2011-07-27 日本写真印刷株式会社 ２色成形用金型装置および２色成形品
AT514828B1 (de) * 2013-09-24 2015-06-15 Hoerbiger Kompressortech Hold Verfahren und Form zur Herstellung von Dichtplatten im Spritzguss sowie entsprechend hergestellte Dichtplatten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4073610A (en) * 1976-02-05 1978-02-14 Cox Bernard K Apparatus for producing a foldable plastic strip
CA1072285A (fr) * 1977-01-14 1980-02-26 Edward A. Ruhl Article a charniere en plastique moule monopiece et methode de fabrication
FR2605144B1 (fr) * 1986-10-14 1989-02-24 Flonic Sa Procede de realisation de cartes a memoire electronique et cartes obtenues par la mise en oeuvre dudit procede
FR2624999B1 (fr) * 1987-12-22 1990-04-06 Sgs Thomson Microelectronics Procede de fabrication de cartes a puce
JPH03254919A (ja) * 1990-03-06 1991-11-13 Takata Kk エアバッグのモジュールカバーの製造方法
ES2082470T5 (es) * 1991-05-10 2003-12-16 Gao Ges Automation Org Procedimiento y dispositivo para la fabricacion de piezas moldeadas de material plastico con espesor de paredes reducido por zonas.

Also Published As

Publication number Publication date
FR2700041A1 (fr) 1994-07-01
US5476629A (en) 1995-12-19

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20060831