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FR2660092B1 - Procede de fabrication d'une carte a circuit integre. - Google Patents

Procede de fabrication d'une carte a circuit integre.

Info

Publication number
FR2660092B1
FR2660092B1 FR9103590A FR9103590A FR2660092B1 FR 2660092 B1 FR2660092 B1 FR 2660092B1 FR 9103590 A FR9103590 A FR 9103590A FR 9103590 A FR9103590 A FR 9103590A FR 2660092 B1 FR2660092 B1 FR 2660092B1
Authority
FR
France
Prior art keywords
manufacturing
integrated circuit
circuit card
card
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9103590A
Other languages
English (en)
Other versions
FR2660092A1 (fr
Inventor
Kobayashi Makoto
Kodai Syojiro
Ochi Katsunori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ryoden Kasei Co Ltd
Original Assignee
Ryoden Kasei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ryoden Kasei Co Ltd filed Critical Ryoden Kasei Co Ltd
Publication of FR2660092A1 publication Critical patent/FR2660092A1/fr
Application granted granted Critical
Publication of FR2660092B1 publication Critical patent/FR2660092B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/914—Transfer or decalcomania
    • Y10S428/915—Fraud or tamper detecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/916—Fraud or tamper detecting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24322—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24826—Spot bonds connect components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
FR9103590A 1990-03-26 1991-03-25 Procede de fabrication d'une carte a circuit integre. Expired - Fee Related FR2660092B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2078295A JP2687661B2 (ja) 1990-03-26 1990-03-26 Ｉｃカードの製造方法

Publications (2)

Publication Number Publication Date
FR2660092A1 FR2660092A1 (fr) 1991-09-27
FR2660092B1 true FR2660092B1 (fr) 1993-07-16

Family

ID=13657939

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9103590A Expired - Fee Related FR2660092B1 (fr) 1990-03-26 1991-03-25 Procede de fabrication d'une carte a circuit integre.

Country Status (4)

Country Link
US (2) US5250341A (fr)
JP (1) JP2687661B2 (fr)
DE (1) DE4109959C2 (fr)
FR (1) FR2660092B1 (fr)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4132720A1 (de) * 1991-10-01 1993-04-08 Gao Ges Automation Org Chipkarte und verfahren zur herstellung derselben
DE9113601U1 (de) * 1991-10-31 1993-03-04 Schneider, Edgar, 8057 Günzenhausen Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten
GB2267682B (en) * 1992-06-09 1996-04-10 Gec Avery Ltd An integrated circuit card
DE4224994A1 (de) * 1992-07-29 1994-02-03 Ruhlamat Automatisierungstechn Vorrichtung zum flächenbündigen Eindrücken eines Moduls
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
CH688696A5 (fr) * 1993-03-17 1998-01-15 François Droz Procédé de fabrication d'une carte comprenant au moins un élément électronique.
DK0760986T3 (da) * 1994-05-27 1999-05-25 Ake Gustafson Fremgangsmåde til fremstilling af et elektronisk modul og elektronisk modul frembragt ved fremgangsmåden
DE19502398A1 (de) * 1995-01-26 1996-08-01 Giesecke & Devrient Gmbh Verfahren zur Montage eines elektronischen Moduls in einem Kartenkörper
DE29502080U1 (de) * 1995-02-09 1995-03-23 Interlock Ag, Schlieren Vorrichtung zur Herstellung von Ausweiskarten und danach hergestellte Ausweiskarte
DE19528730A1 (de) * 1995-08-04 1997-02-06 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Datenträgers
US6441736B1 (en) 1999-07-01 2002-08-27 Keith R. Leighton Ultra-thin flexible durable radio frequency identification devices and hot or cold lamination process for the manufacture of ultra-thin flexible durable radio frequency identification devices
US6036099A (en) 1995-10-17 2000-03-14 Leighton; Keith Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom
US5817207A (en) * 1995-10-17 1998-10-06 Leighton; Keith R. Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
BR9804917A (pt) * 1997-05-19 2000-01-25 Hitachi Maxell Ltda Módulo de circuito integrado flexìvel e processos para produzir um módulo de circuito integrado flexìvel e um portador de informação.
US7273234B1 (en) 1997-12-30 2007-09-25 Bank Of America Corporation Card with increased gripability
US6022051A (en) 1998-08-31 2000-02-08 Casagrande; Charles L. Self-laminating integrated card and method
US6404643B1 (en) 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
US6421013B1 (en) 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
FI112288B (fi) * 2000-01-17 2003-11-14 Rafsec Oy Menetelmä älytarrasyöttörainan valmistamiseksi
FI112287B (fi) * 2000-03-31 2003-11-14 Rafsec Oy Menetelmä tuoteanturin muodostamiseksi ja tuoteanturi
FI111881B (fi) * 2000-06-06 2003-09-30 Rafsec Oy Älykorttiraina ja menetelmä sen valmistamiseksi
US6471127B2 (en) 2000-07-06 2002-10-29 Bank Of America Corporation Data card
US20030222153A1 (en) * 2000-07-06 2003-12-04 Jamily Pentz Data card
US6592043B1 (en) * 2000-08-17 2003-07-15 Rick A. Britton Fixture to mount a miniature proximity transponder to another article
FI112121B (fi) * 2000-12-11 2003-10-31 Rafsec Oy Älytarraraina, menetelmä sen valmistamiseksi, menetelmä kantorainan valmistamiseksi ja älytarrarainan älytarran rakenneosa
FI112550B (fi) * 2001-05-31 2003-12-15 Rafsec Oy Älytarra ja älytarraraina
FI117331B (fi) * 2001-07-04 2006-09-15 Rafsec Oy Menetelmä ruiskuvaletun tuotteen valmistamiseksi
FI119401B (fi) * 2001-12-21 2008-10-31 Upm Raflatac Oy Älytarraraina ja menetelmä sen valmistamiseksi
US20040062016A1 (en) * 2002-09-27 2004-04-01 Eastman Kodak Company Medium having data storage and communication capabilites and method for forming same
JP2004185208A (ja) * 2002-12-02 2004-07-02 Sony Corp Ｉｃカード
US20050017371A1 (en) * 2003-07-22 2005-01-27 Zhiyong Wang Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same
JP4066929B2 (ja) * 2003-10-08 2008-03-26 株式会社日立製作所 電子装置及びその製造方法
US7571862B2 (en) * 2005-06-02 2009-08-11 Avery Dennison Corporation RFID tag that provides a flat print area and a pinch roller that enables the same
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
US9647997B2 (en) 2013-03-13 2017-05-09 Nagrastar, Llc USB interface for performing transport I/O
USD759022S1 (en) 2013-03-13 2016-06-14 Nagrastar Llc Smart card interface
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD758372S1 (en) * 2013-03-13 2016-06-07 Nagrastar Llc Smart card interface
US9888283B2 (en) 2013-03-13 2018-02-06 Nagrastar Llc Systems and methods for performing transport I/O
USD780763S1 (en) 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
USD864968S1 (en) 2015-04-30 2019-10-29 Echostar Technologies L.L.C. Smart card interface
CN114330626A (zh) * 2020-09-30 2022-04-12 上海伯乐电子有限公司 用于承载芯片模块的卡片基材及其智能卡

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3512286A (en) * 1967-09-07 1970-05-19 Dubow Chem Corp Identifying credit card
US4245035A (en) * 1979-01-22 1981-01-13 Eastman Kodak Company Photo-identification card
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
JPS5983285A (ja) * 1982-11-04 1984-05-14 Toppan Printing Co Ltd カ−ド製造法
JPH0751390B2 (ja) * 1985-07-10 1995-06-05 カシオ計算機株式会社 Ｉｃカ−ド
US4841134A (en) * 1985-07-27 1989-06-20 Dai Nippon Insatsu Kabushika Kaisha IC card
DE3528686A1 (de) * 1985-08-09 1987-02-12 Oldenbourg Graphik R Verfahren und herstellung einer ausweiskarte und ausweiskarte
JPS63141790A (ja) * 1986-12-03 1988-06-14 菱電化成株式会社 識別カ−ド
JPH0696357B2 (ja) * 1986-12-11 1994-11-30 三菱電機株式会社 Ｉｃカードの製造方法
JPS6488298A (en) * 1987-09-30 1989-04-03 Toshiba Corp Digital wide range monitor
JPH01108095A (ja) * 1987-10-20 1989-04-25 Ryoden Kasei Co Ltd Ｉｃカード
US4943708A (en) * 1988-02-01 1990-07-24 Motorola, Inc. Data device module having locking groove
JP2510669B2 (ja) * 1988-04-15 1996-06-26 大日本印刷株式会社 Ｉｃカ―ド
JPH07121632B2 (ja) * 1988-04-15 1995-12-25 大日本印刷株式会社 Ｉｃカード
JP2869072B2 (ja) * 1988-08-30 1999-03-10 大日本印刷株式会社 ホログラフィックステレオグラムの作製方法
JPH02188298A (ja) * 1989-01-18 1990-07-24 Dainippon Printing Co Ltd Ｉｃモジュールおよびｉｃカード
JPH0687484B2 (ja) * 1989-04-06 1994-11-02 三菱電機株式会社 Ｉｃカード用モジュール

Also Published As

Publication number Publication date
JP2687661B2 (ja) 1997-12-08
DE4109959C2 (de) 1998-02-12
FR2660092A1 (fr) 1991-09-27
JPH03275394A (ja) 1991-12-06
DE4109959A1 (de) 1991-10-02
US5346576A (en) 1994-09-13
US5250341A (en) 1993-10-05

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Legal Events

Date Code Title Description
TP Transmission of property
D6 Patent endorsed licences of rights
ST Notification of lapse