FR2624999B1 - Procede de fabrication de cartes a puce - Google Patents
Procede de fabrication de cartes a puceInfo
- Publication number
- FR2624999B1 FR2624999B1 FR8717901A FR8717901A FR2624999B1 FR 2624999 B1 FR2624999 B1 FR 2624999B1 FR 8717901 A FR8717901 A FR 8717901A FR 8717901 A FR8717901 A FR 8717901A FR 2624999 B1 FR2624999 B1 FR 2624999B1
- Authority
- FR
- France
- Prior art keywords
- chip cards
- manufacturing chip
- manufacturing
- cards
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8717901A FR2624999B1 (fr) | 1987-12-22 | 1987-12-22 | Procede de fabrication de cartes a puce |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8717901A FR2624999B1 (fr) | 1987-12-22 | 1987-12-22 | Procede de fabrication de cartes a puce |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2624999A1 FR2624999A1 (fr) | 1989-06-23 |
FR2624999B1 true FR2624999B1 (fr) | 1990-04-06 |
Family
ID=9358143
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR8717901A Expired - Lifetime FR2624999B1 (fr) | 1987-12-22 | 1987-12-22 | Procede de fabrication de cartes a puce |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2624999B1 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE35578E (en) * | 1988-12-12 | 1997-08-12 | Sgs-Thomson Microelectronics, Inc. | Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
FR2695854B1 (fr) * | 1992-09-22 | 1994-12-09 | Leroux Ets Gilles | Dispositif de fraisage de cavités dans des cartes en matière plastique et d'encartage de circuits intégrés dans lesdites cavités. |
US5476629A (en) * | 1992-12-25 | 1995-12-19 | Citizen Watch Co. Ltd. | Method for manufacturing IC card substrate |
FR2745929B1 (fr) * | 1996-03-11 | 1998-04-10 | Solaic Sa | Carte a circuit integre comportant une zone desolidarisee et procede de desolidarisation d'une zone d'une carte a circuit integre |
FR2756954B1 (fr) * | 1996-12-05 | 1999-01-15 | Solaic Sa | Carte a circuit integre comportant une couche de rigidification |
DE19854986A1 (de) * | 1998-11-27 | 2000-05-31 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung ein- oder mehrschichtiger Karten mit in geschäumtem Kunststoff eingebetteten elektronischen Bauelementen |
DE102013011060A1 (de) * | 2013-07-02 | 2015-01-08 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines tragbaren Datenträgers mit Chip |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2920012C2 (de) * | 1979-05-17 | 1988-09-29 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
FR2548409B1 (fr) * | 1983-06-29 | 1985-11-15 | Sligos | Procede pour la fabrication de cartes a memoire, installation et cartes a memoire obtenues |
CH661808A5 (fr) * | 1985-01-21 | 1987-08-14 | Lupa Finances | Carte munie d'un microprocesseur et/ou d'au moins une memoire electronique. |
FR2599165A1 (fr) * | 1986-05-21 | 1987-11-27 | Michot Gerard | Objet associe a un element electronique et procede d'obtention |
-
1987
- 1987-12-22 FR FR8717901A patent/FR2624999B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2624999A1 (fr) | 1989-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse | ||
RN | Application for restoration | ||
CA | Change of address | ||
CD | Change of name or company name | ||
CJ | Change in legal form | ||
TP | Transmission of property | ||
FC | Favourable decision of inpi director general on an application for restauration. |